INTEGRATED CIRCUITS DATA SHEET TDA1016 Recording/playback and 2 W audio power amplifier Product specification File under Integrated Circuits, IC01 August 1987 Philips Semiconductors Product specification Recording/playback and 2 W audio power amplifier TDA1016 GENERAL DESCRIPTION The TDA1016 is a monolithic integrated audio power amplifier, preamplifier and A.L.C. circuit designed for applications in radio-recorders and recorders. The wide supply voltage range makes this circuit very suitable for d.c. and a.c. apparatus. The circuit incorporates the following features: Features • Power amplifier/monitor amplifier • Preamplifier/record and playback amplifier • Automatic Level Control (A.L.C.) circuit • Voltage stabilizer • Short-circuit (up to 12 V a.c.) and thermal protection. QUICK REFERENCE DATA Supply voltage range 3,6 to 15 V VP Supply current; total quiescent at VP = 6 V Itot Operating ambient temperature range Tamb typ. 10 mA −25 to 150 °C Power amplifier Output power at dtot = 10% VP = 6 V; RL = 4 Ω Po typ. 1W VP = 9 V; RL = 4 Ω Po typ. 2W Gc typ. 36 dB Go min. 70 dB Minimum closed loop voltage gain Gc min min. 35 dB Output voltage at dtot = 1% Vo min. 1V ∆Gv typ. 2 dB V5-16 typ. Closed loop gain Preamplifier Open loop gain Automatic Level Control (A.L.C.) Gain variation for ∆Vi = 40 dB Stabilized supply voltage Output voltage PACKAGE OUTLINE 16-lead DIL; plastic, with internal heat spreader (SOT38); SOT38-1; 1996 July 23. August 1987 2 2,6 V Philips Semiconductors Product specification Recording/playback and 2 W audio power amplifier TDA1016 Fig.1 Block diagram with external components; also used as test circuit. August 1987 3 Philips Semiconductors Product specification Recording/playback and 2 W audio power amplifier TDA1016 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 3) VP max. 18 V Repetitive peak output current IORM max. 1A Non-repetitive peak output current (pin 1) IOSM max. 2A Total power dissipation see derating curve Fig.2 A.C. short-circuit duration of load during tsc max. 100 hours Crystal temperature sinewave drive; VP = 12 V Tc max. 150 °C Storage temperature range Tstg −55 to + 150 °C Operating ambient temperature range Tamb −25 to + 150 °C THERMAL RESISTANCE The power derating curve (Fig.2) is based on the following data From junction to ambient Rth j-a Fig.2 Power derating curve. August 1987 4 = 55 K/W Philips Semiconductors Product specification Recording/playback and 2 W audio power amplifier TDA1016 CHARACTERISTICS VP = 6 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measured in test circuit Fig.1; unless otherwise specified SYMBOL PARAMETER MIN. TYP. MAX. UNIT Supply (pin 3) VP Supply voltage 3,6 6 15 V − 10 − mA Supply current; total quiescent Itot at VP = 6 V Power amplifier Output power at dtot = 10%; see note 1 Po VP = 6 V − 1 − W Po VP = 9 V − 2 − W Gc Closed loop voltage gain − 36 − dB dtot Total harmonic distortion at Po = 0,5 W − − 1 % |Zi| Input impedance 0,5 − − MΩ Ripple rejection at f = 100 Hz (RS = 0 Ω) 40 50 − dB − 90 200 µV − 8 − µV RR Noise output voltage (r.m.s. value) Vn(rms) RS = 0 Ω; B = 60 Hz to 15 kHz Noise output voltage at 500 kHz Vn RS = 0 Ω; B = 5 kHz Preamplifier Go Open loop voltage gain at f = 10 kHz 70 78 − dB Gc Closed loop voltage gain − 52 − dB Minimum closed loop voltage gain Gc min Vo (when changing Rf) Output voltage at dtot = 1% 35 − − dB 1 − − V 0,45 0,5 0,55 V Output voltage with A.L.C. Vo Vi = 2 mV Total harmonic distortion with A.L.C. dtot Vi = 2 mV − − 1 % dtot Vi = 360 mV − − 3 % − 60 − dB 100 − − kΩ 50 54 − dB − − 50 Ω Signal-to-noise ratio related to Vi = 1,2 mV; S/N |Zi| RS = 1 kΩ; B = 60 Hz to 15 kHz Input impedance Ripple rejection RR at f = 100 Hz; RS = 0 Ω |Zo| Output impedance; see note 2 August 1987 5 Philips Semiconductors Product specification Recording/playback and 2 W audio power amplifier SYMBOL TDA1016 PARAMETER MIN. TYP. MAX. UNIT Automatic Level Control (A.L.C.) (see Fig.3); see note 4 ∆Gv Gain variation for ∆Vi = 45 dB − 2 3 dB tl Limiting time; see note 3 − − 50 ms ts Level setting time; see note 3 − − 50 ms tr Recovery time; see notes 3 and 5 − 100 − s V11-15 Output voltage − 2,6 − V l11 Load current − − 1,5 mA RR Ripple rejection at f = 100 Hz 40 − − dB Voltage stabilizer Notes 1. Measured with an ideal coupling capacitor connected to the speaker load. 2. lP (effective value) must not exceed 1 mA. 3. At ∆Vi = dB with respect to Vi = 1,2 mV. 4. The A.L.C. tracking in stereo has a typical spread of 1 dB if pins 6 of both ICs are connected to the same RC network. 5. Without a shunt resistor across A.L.C. With 1 MΩ or 2,2 MΩ across A.L.C. recovery time becomes 22 or 50 seconds. August 1987 6 Philips Semiconductors Product specification Recording/playback and 2 W audio power amplifier TDA1016 Fig.3 Typical A.L.C. curve with RS = 10 kΩ. August 1987 7 Philips Semiconductors Product specification Recording/playback and 2 W audio power amplifier TDA1016 PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE August 1987 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 8 Philips Semiconductors Product specification Recording/playback and 2 W audio power amplifier TDA1016 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1987 9