plastic, thermal enhanced very thin small outline package; no leads; 14 terminals

SOT1086-2
plastic, thermal enhanced very thin small outline package; no
leads; 14 terminals
10 June 2016
Package information
1. Package summary
Terminal position code
D (double)
Package type descriptive code
HVSON14
Package type industry code
HVSON14
Package style descriptive code
HVSON (thermal enhanced very thin small
outline; no leads)
Package body material type
P (plastic)
IEC package outline code
---
JEDEC package outline code
MO-229
JEITA package outline code
---
Mounting method type
S (surface mount)
Issue date
15-7-2010
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
4.4
-
4.5
4.6
mm
E
package width
2.9
-
3
3.1
mm
A
seated height
0.8
-
0.85
1
mm
A2
package height
-
-
-
-
e
nominal pitch
-
-
0.65
-
n2
actual quantity of termination
-
-
14
-
mm
SOT1086-2
NXP Semiconductors
plastic, thermal enhanced very thin small outline package; no leads; 14 terminals
2. Package outline
HVSON14: plastic, thermal enhanced very thin small outline package; no leads;
14 terminals; body 3 x 4.5 x 0.85 mm
SOT1086-2
X
B
D
A
E
A
A1
c
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1
7
C
C A B
C
y1 C
y
L
k
Eh
14
8
Dh
0
2.5
Dimensions
Unit
mm
5 mm
scale
A
A1
b
max 1.00 0.05 0.35
nom 0.85 0.03 0.32
min 0.80 0.00 0.29
c
D
Dh
E
Eh
0.2
4.6
4.5
4.4
4.25
4.20
4.15
3.1
3.0
2.9
e
e1
1.65
1.60 0.65
1.55
3.9
k
L
0.35 0.45
0.30 0.40
0.25 0.35
v
0.1
w
y
0.05 0.05
y1
0.1
sot1086-2
References
Outline
version
IEC
JEDEC
JEITA
SOT1086-2
---
MO-229
---
European
projection
Issue date
10-07-14
10-07-15
Fig. 1. Package outline HVSON14 (SOT1086-2)
SOT1086-2
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT1086-2
NXP Semiconductors
plastic, thermal enhanced very thin small outline package; no leads; 14 terminals
3. Soldering
Footprint information for reflow soldering of HVSON14 package
SOT1086-2
Gx
D
P
C
nSPx
Hy
Gy
SPx
SPy tot
SPy
nSPy
1.05
SLy
By
Ay
SPx tot
X
3.65
SLx
solder land
0.6
solder paste deposit
0.3
solder land plus solder paste
detail X
occupied area
DIMENSIONS in mm
P
Ay
By
C
D
SLx
SLy
SPx tot
SPy tot
SPx
SPy
Gx
Gy
Hy
nSPx
nSPy
0.65
3.95
2.2
0.875
0.35
4.25
1.65
2.35
0.65
1.0
0.65
4.75
3.25
4.2
2
1
Issue date
12-02-09
12-02-29
sot1086-2_fr
Fig. 2. Reflow soldering footprint for HVSON14 (SOT1086-2)
SOT1086-2
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT1086-2
NXP Semiconductors
plastic, thermal enhanced very thin small outline package; no leads; 14 terminals
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT1086-2
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT1086-2
NXP Semiconductors
plastic, thermal enhanced very thin small outline package; no leads; 14 terminals
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 10 June 2016
SOT1086-2
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5
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