INTEGRATED CIRCUITS DATA SHEET UAA3201T UHF/VHF remote control receiver Product specification Supersedes data of 1995 May 18 File under Integrated Circuits, IC18 2000 Apr 18 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T FEATURES APPLICATIONS • Oscillator with external Surface Acoustic Wave Resonator (SAWR) • Car alarm systems • Wide frequency range from 150 to 450 MHz • Security systems • Remote control systems • High sensitivity • Gadgets and toys • Low power consumption • Telemetry. • Automotive temperature range • Superheterodyne architecture GENERAL DESCRIPTION • Applicable to fulfil FTZ 17 TR 2100 (Germany) The UAA3201T is a fully integrated single-chip receiver, primarily intended for use in VHF and UHF systems employing direct AM Return-to-Zero (RZ) Amplitude Shift Keying (ASK) modulation. • High integration level, few external components • Inexpensive external components • IF filter bandwidth determined by application. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC supply voltage 3.5 − 6.0 V ICC supply current − 3.4 4.8 mA Pref input reference sensitivity − − −105 dBm Tamb ambient temperature −40 − +85 °C fi(RF) = 433.92 MHz; data rate = 250 bits/s; BER ≤ 3 × 10−2 ORDERING INFORMATION TYPE NUMBER UAA3201T 2000 Apr 18 PACKAGE NAME SO16 DESCRIPTION plastic small outline package; 16 leads; body width 3.9 mm 2 VERSION SOT109-1 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T BLOCK DIAGRAM handbook, full pagewidth VCC IF FILTER RF_IN C12 C17 R1 C19 VEM 15 MIXIN FA LIN LFB CPC 14 16 13 12 11 CPO 10 IF AMPLIFIER × BUFFER MIXER LIMITER COMPARATOR 9 data BUFFER VCC OSCILLATOR BAND GAP REFERENCE Vref UAA3201T 4 5 1 2 3 6 OSC OSE MON MOP VCC VEE 7 CPB C14 8 CPA MHB679 C13 C7 Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION MON 1 negative mixer output MOP 2 positive mixer output VCC 3 positive supply voltage MON 1 16 FA OSC 4 oscillator collector MOP 2 15 VEM OSE 5 oscillator emitter 14 MIXIN 6 negative supply voltage VCC 3 VEE CPB 7 comparator input B OSC 4 CPA 8 comparator input A DATA 9 CPO 13 LIN UAA3201T OSE 5 12 LFB data output VEE 6 11 CPC 10 comparator offset adjustment CPB 7 10 CPO CPC 11 comparator input C CPA 8 9 LFB 12 limiter feedback LIN 13 limiter input MIXIN 14 mixer input VEM 15 negative supply voltage for mixer FA 16 IF amplifier output 2000 Apr 18 DATA DATA MED897 Fig.2 Pin configuration. 3 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T FUNCTIONAL DESCRIPTION Limiter The RF signal is fed directly into the mixer stage where it is mixed down to nominal 500 kHz IF by the integrated oscillator controlled by an external SAWR (see Fig.1). The IF signal is then passed to the IF amplifier which increases the level. A 5th-order elliptic low-pass filter acts as main IF filtering. The output voltage of that filter is demodulated by a limiter that rectifies the incoming IF signal. The demodulated signal passes two RC filter stages and is then limited by a data comparator which makes it available at the data output. The limiting amplifier consists of three DC coupled amplifier stages with a total gain of 60 dB. A Received Signal Strength Indicator (RSSI) signal is generated by rectifying the IF signal. The limiter has a lower frequency limit of 100 kHz which can be controlled by capacitors C12 and C19. The upper frequency limit is 3 MHz. Comparator The 2 × IF component in the RSSI signal is removed by the first order low-pass capacitor C17. After passing a buffer stage the signal is split into two paths, leading via RC filters to the inputs of a voltage comparator. The time constant of one path (C14) is compared to the bit duration. Consequently the potential at the negative comparator input represents the average magnitude of the RSSI signal. The second path with a short time constant (C13) allows the signal at the positive comparator input to follow the RSSI signal instantaneously. This results in a variable comparator threshold, depending on the strength of the incoming signal. Hence the comparator output is switched on, when the RSSI signal exceeds its average value, i.e. when an ASK ‘on’ signal is received. Mixer The mixer is a single balanced emitter coupled pair with internally set bias current. The optimum impedance is 320 Ω at 430 MHz. Capacitor C5 (see Fig.9) is used to transform a 50 Ω generator impedance to the optimum value. Oscillator The oscillator consists of a transistor in common base configuration and a tank circuit including the SAWR. Resistor R2 (see Fig.9) is used to control the bias current through the transistor. Resistor R3 is required to reduce unwanted responses of the tank circuit. The low-pass filter capacitor C13 rejects the unwanted 2 × IF component and reduces the noise bandwidth of the data filter. IF amplifier The resistor R1 is used to set the current of an internal source. This current is drawn from the positive comparator input, thereby applying an offset and driving the output into the ‘off’ state during the absence of an input signal. This offset can be increased by lowering the value of R1 yielding a higher noise immunity at the expense of reduced sensitivity. The IF amplifier is a differential input, single-ended output emitter coupled pair. It is used to decouple the first and the second IF filter and to provide some additional gain in order to reduce the influence of the noise of the limiter on the total noise figure. IF filters Band gap reference The first IF filter is an RC filter formed by internal resistors and an external capacitor C7 (see Fig.1). The band gap reference controls the biasing of the whole circuit. In this block currents are generated that are constant over the temperature range and currents that are proportional to the absolute temperature. The second IF filter is an external elliptic filter. The source impedance is 1.4 kΩ and the load is high-impedance. The bandwidth of the IF filter in the application and test circuit (see Fig.9) is 800 kHz due to the centre frequency spread of the SAWR. It may be reduced when SAWRs with less tolerances are used or temperature range requirements are lower. A smaller bandwidth of the filter will yield a higher sensitivity of the receiver. As the RF signal is mixed down to a low IF signal there is no image rejection possible. 2000 Apr 18 The current consumption of the receiver rises with increasing temperature, because the blocks with the highest current consumption are biased by currents that are proportional to the absolute temperature. 4 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage −0.3 +8.0 V Tamb ambient temperature −40 +85 °C Tstg storage temperature −55 +125 °C Ves electrostatic handling voltage pins OSC and OSE −2000 +1500 V pins LFB and MIXIN −1500 +2000 V all other pins −2000 +2000 V note 1 Note 1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient in free air VALUE UNIT 105 K/W DC CHARACTERISTICS VCC = 3.5 V; all voltages referenced to VEE; Tamb = −40 to +85 °C; typical value for Tamb = 25 °C; for test circuit see Fig.9; SAWR disconnected; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. 3.5 − R2 = 680 Ω − 3.4 IDATA = −10 µA; note 1 VCC − 0.5 − VCC supply voltage ICC supply current VOH(DATA) HIGH-level output voltage at pin DATA VOL(DATA) LOW-level output voltage at pin DATA IDATA = +200 µA; note 1 0 Note 1. IDATA is defined to be positive when the current flows into pin DATA. 2000 Apr 18 TYP. 5 − MAX. 6.0 UNIT V 4.8 mA VCC V 0.6 V Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T AC CHARACTERISTICS VCC = 3.5 V; Tamb = 25 °C; for test circuit see Fig.9; R1 disconnected; for AC test conditions see Section “AC test conditions”; unless otherwise specified. SYMBOL PARAMETER CONDITIONS BER ≤ 3 × 10−2; note 1 input reference sensitivity Pref MIN. 10−2 TYP. MAX. UNIT − − −105 dBm − − −30 dBm Pi(max) maximum input power BER ≤ 3 × Pspur spurious radiation note 2 − − −60 dBm IP3mix interception point (mixer) −20 −17 − dBm IP3IF interception point (mixer plus IF amplifier) −38 −35 − dBm P1dB 1 dB compression point (mixer) −38 −35 − dBm ton(RX) receiver turn-on time − − 10 ms note 3 Notes 1. Pref is the maximum available power at the input of the test board. The Bit Error Rate (BER) is measured using the test facility shown in Fig.8. 2. Valid only for the reference PCB (see Figs 10 and 11). Spurious radiation is strongly dependent on the PCB layout. 3. The supply voltage VCC is pulsed as explained in Fig.3. INTERNAL PIN CONFIGURATION PIN SYMBOL 1 MON 2 MOP EQUIVALENT CIRCUIT VP 1.5 kΩ 1.5 kΩ 1 from oscillator buffer MHB680 2 3 VCC 3 VCC MHB681 4 OSC 5 OSE VP 4 5 6 kΩ 1.2 V MHB682 2000 Apr 18 6 Philips Semiconductors Product specification UHF/VHF remote control receiver PIN 6 UAA3201T SYMBOL EQUIVALENT CIRCUIT VEE 6 MHB683 7 CPB 8 CPA VP 150 kΩ 7 150 kΩ 8 MHB684 9 DATA VP 1 kΩ 9 MHB686 10 CPO VP 10 MHB685 11 CPC VP 30 kΩ 11 2000 Apr 18 7 MHB704 Philips Semiconductors Product specification UHF/VHF remote control receiver PIN SYMBOL 12 LFB 13 LIN UAA3201T EQUIVALENT CIRCUIT VP 50 kΩ 12 13 MHB687 14 MXIN 15 VEM 14 15 16 MHB688 FA VP 1.4 kΩ 16 MHB689 TEST INFORMATION Tuning procedure for AC tests 1. Turn on the signal generator: fi(RF) = 433.92 MHz, no modulation and RF input level = 1 mV. 2. Tune capacitor C6 (RF stage input) to obtain a maximum voltage on pin LIN. 3. Check that data is appearing on pin DATA and proceed with the AC tests. AC test conditions The reference signal level Pref for the following tests is defined as the minimum input level in dBm to give a BER ≤ 3 × 10−2 (e.g. 7.5 bit errors per second for 250 bits/s). 2000 Apr 18 8 Philips Semiconductors Product specification UHF/VHF remote control receiver Table 1 UAA3201T Test signals TEST SIGNAL FREQUENCY (MHz) 1 433.92 250 bits/s (square wave) RZ signal with duty cycle of 66% for logic 1; RZ signal with duty cycle of 33% for logic 0 100% 2 434.02 − no modulation − 3 433.92 − no modulation − DATA SIGNAL MODULATION INDEX MODULATION Test results P1 is the maximum available power from signal generator 1 at the input of the test board; P2 is the maximum available power from signal generator 2 at the input of the test board. Table 2 Test results GENERATOR TEST RESULT 1 2 Maximum input power; see Fig.4 test signal 1; P1 = −30 dBm (minimum Pmax) − BER ≤ 3 × 10−2 (e.g. 7.5 bit errors per second for 250 bits/s) Receiver turn-on time; see Fig.4 and note 1 test signal 1; P1 = Pref + 10 dB − check that the first 10 bits are correct; error counting is started 10 ms after VCC is switched on Interception point (mixer); see Fig.5 and note 2 test signal 3; P1 = −50 dBm test IP3 = P1 + 1⁄2 × IM3 (dB); signal 2; minimum value: IP3mix ≥ −20 dBm P2 = P1 Interception point (mixer plus IF amplifier); see Fig.5 and note 3 test signal 3; P1 = −50 dBm test IP3 = P1 + 1⁄2 × IM3 (dB); signal 2; minimum value: IP3IF ≥ −38 dBm P2 = P1 Spurious radiation; see Fig.6 and note 4 − − no spurious radiation (25 MHz to 1 GHz) with level higher than −60 dBm (maximum Pspur) 1 dB compression point (mixer); see Fig.7 and note 5 test signal 3; P11 = −70 dBm; P12 = −38 dBm (minimum P1dB) − (Po1 + 70 dB) − [Po2 + 38 dB (minimum P1dB)] ≤ 1 dB, where Po1 is the output power for test signal with P11 and Po2 is the output power for test signal with P12 Notes 1. The supply voltage VCC of the test circuit alternates between ‘on’ (100 ms) and ‘off’ (100 ms); see Fig.3. 2. Differential probe of spectrum analyser connected to pins MOP and MON. 3. Probe of spectrum analyser connected to pin LIN. 4. Spectrum analyser connected to the input of the test board. 5. Probe of spectrum analyser connected to either pin MOP or pin MON. 2000 Apr 18 9 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T MED899 - 1 VCC (V) 3.5 0 0 100 200 300 t (ms) Fig.3 Timing diagram for pulsed supply voltage. GENERATOR 1 50 Ω BER TEST FACILITY (2) TEST CIRCUIT (1) MED900 (1) For test circuit see Fig.9. (2) For BER test facility see Fig.8. Fig.4 Test configuration (single generator). GENERATOR 1 50 Ω 50 Ω 2-SIGNAL POWER COMBINER TEST CIRCUIT SPECTRUM ANALYZER WITH PROBE (1) GENERATOR 2 50 Ω IM3 ∆f ∆f ∆f ∆f = 100 kHz MED901 (1) For test circuit see Fig.9. Fig.5 Test configuration (interception point). 2000 Apr 18 10 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T SPECTRUM ANALYZER INPUT IMPEDANCE 50 Ω TEST CIRCUIT (1) MED902 (1) For test circuit see Fig.9. Fig.6 Test configuration (spurious radiation). GENERATOR 1 50 Ω TEST CIRCUIT SPECTRUM ANALYZER WITH PROBE (1) MED903 (1) For test circuit see Fig.9. Fig.7 Test configuration (1 dB compression point). TX data SIGNAL GENERATOR MASTER CLOCK DEVICE UNDER TEST RX data BIT PATTERN GENERATOR PRESET DELAY delayed TX data DATA COMPARATOR INTEGRATE AND DUMP to error counter BER TEST BOARD MED904 Fig.8 BER test facility. 2000 Apr 18 11 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T APPLICATION INFORMATION RF_IN handbook, full pagewidth C8 C9 C20 C11 C10 C5 +3.5 V L1 C4 C15 C6 L2 L3 VEM 15 FA 16 C12 C17 R1 data C19 MIXIN 14 LIN 13 LFB 12 CPC 11 CPO 10 DATA 9 LIMITER BUFFER BUFFER VCC Vref 1 COMPARATOR MIXER IF AMP 2 MON UAA3201T BAND GAP REFERENCE OSCILLATOR 3 VCC MOP 4 5 OSC OSE 6 VEE 8 CPA C18 C7 L4 C16 R2 C21 (1) 3.5 V C1 C2 C3 R3 SAWR (1) Stray inductance. Fig.9 Application and test circuit. 2000 Apr 18 7 CPB 12 C14 C13 MED896 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T Components and layout of printed circuit board of test circuit for fi(RF) = 433.92 MHz Table 3 Components list for Fig.9 COMPONENT VALUE TOLERANCE DESCRIPTION R1 27 kΩ ±2% TC = +50 ppm/K R2 680 Ω ±2% TC = +50 ppm/K R3 220 Ω ±2% TC = +50 ppm/K C1 4.7 µF ±20% − C2 150 pF ±10% TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz C3 1 nF ±10% TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz C4 820 pF ±10% TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz C5 3.3 pF ±10% TC = 0 ±150 ppm/K; tan δ ≤ 30 × 10−4; f = 1 MHz C6 2.5 to 6 pF − TC = 0 ±300 ppm/K; tan δ ≤ 20 × 10−4; f = 1 MHz C7 56 pF ±10% TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz C8 150 pF ±10% TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz C9 220 pF ±10% TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz C10 27 pF ±10% TC = 0 ±30 ppm/K; tan δ ≤ 20 × 10−4; f = 1 MHz C11 150 pF ±10% TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz C12 100 nF ±10% tan δ ≤ 25 × 10−3; f = 1 kHz C13 2.2 nF ±10% tan δ ≤ 25 × 10−3; f = 1 kHz C14 33 nF ±10% tan δ ≤ 25 × 10−3; f = 1 kHz C15 150 pF ±10% TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz C16 3.9 pF ±10% TC = 0 ±150 ppm/K; tan δ ≤ 30 × 10−4; f = 1 MHz C17 10 nF ±10% tan δ ≤ 25 × 10−3; f = 1 kHz C18 3.3 pF ±10% TC = 0 ±150 ppm/K; tan δ ≤ 30 × 10−4; f = 1 MHz C19 68 pF ±10% TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz C20 6.8 pF ±10% TC = 0 ±150 ppm/K; tan δ ≤ 30 × 10−4; f = 1 MHz C21 47 pF ±5% TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz L1 10 nH ±10% Qmin = 50 to 450 MHz; TC = 25 to 125 ppm/K L2 330 µH ±10% Qmin = 45 to 800 kHz; Cstray ≤ 1 pF L3 330 µH ±10% Qmin = 45 to 800 kHz; Cstray ≤ 1 pF L4 33 nH ±10% Qmin = 45 to 450 MHz; TC = 25 to 125 ppm/K SAWR − − see Table 4 Table 4 SAWR data DESCRIPTION SPECIFICATION Type one-port (e.g. RFM R02112) Centre frequency 433.42 MHz ±75 kHz Maximum insertion loss 1.5 dB Typical loaded Q 1600 (50 Ω load) Temperature drift 0.032 ppm/K2 Turnover temperature 43 °C 2000 Apr 18 13 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T MBE589 RF_IN data n.c. UAA3201T H4ACS15 Fig.10 Layout top side. MBE591 PCALH/H4ACS15 51SCA4H Fig.11 Layout bottom side. 2000 Apr 18 14 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T MBE590 RF_IN C5 C4 L3 C15 L1 L2 DATA R1 C19 C6 C12 C17 data IC1 C13 C14 n.c. SAWR supply UAA3201T H4ACS15 Fig.12 Fig.12 Top Top side side with with components. components. MBE592 C11 C10 C9 C8 C21 C20 C2 R2 C16 C18 L4 C7 C1 C3 R3 PCALH/H4ACS15 51SCA4H Fig.13 Bottom side with components. 2000 Apr 18 15 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.041 0.228 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 2000 Apr 18 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 16 o 8 0o Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 2000 Apr 18 17 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(1) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 Apr 18 18 Philips Semiconductors Product specification UHF/VHF remote control receiver UAA3201T DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS (1) Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2000 Apr 18 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com SCA 69 © Philips Electronics N.V. 2000 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 03/pp20 Date of release: 2000 Apr 18 Document order number: 9397 750 06929