INTEGRATED CIRCUITS DATA SHEET UBA2050(A); UBA2051(A;C) One-chip telephone ICs with speech, dialler and ringer functions Product specification Supersedes data of 1998 Mar 24 File under Integrated Circuits, IC03 2000 May 19 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) • [∗/T] key (for mixed mode dialling) or separate [P → T] key FEATURES Speech/transmission part • Repertory memory integrity check • Low DC line voltage; operates down to 1.45 V (excluding voltage drop over external polarity guard) • Keytone generation (only UBA2050, UBA2050A and UBA2051C) • Line voltage regulator with adjustable DC voltage • Dial Mode Output (DMO) function during pulse dialling and flash function (only UBA2050 and UBA2051) • Regulated 3.3 V supply (VDD) for the dialler part and peripherals compatible with: – Speech mode • LED output for DTMF dialling indication (only UBA2050A and UBA2051A) – Ringer mode • Function keys: – Trickle mode. – [LNR/P], [R] and [P → T] • Unregulated supply (VCC) for the transmission part and peripherals – [STORE], [MEM], [M1], [M2] and [M3] (only UBA2051, UBA2051A and UBA2051C). • Transmit stage with: • Resistor options: – Microphone amplifier with symmetrical high-impedance inputs – [∗/T] key definition (MMS) – Pulse or Tone mode Selection (PTS) – DTMF input with confidence tone on receive output. – Flash Time Selection (FTSA and FTSB) • Receive stage with: – Make/Break ratio Selection (MBS) – Receive amplifier with asymmetrical output – Pulses Per Second (PPS) – Earpiece amplifier with adjustable gain (and gain boost facility) for all types of earpieces. – Access Pause Time (APT). • 13 repertory numbers (only UBA2051, UBA2051A and UBA2051C): • AGC: line loss compensation for microphone and receive amplifiers. – 3 direct memories (21 digits) Dialler part – 10 indirect memories (21 digits). • Last Number Redial (LNR) (32 digits) • Supply and temperature independent tone output • Pulse dialling: • On-chip DTMF filtering for low output distortion (“CEPT CS 203” compatible) – 10 PPS and 20 PPS (resistor option) • On-chip oscillator suitable for low-cost 3.579545 MHz quartz crystal or ceramic resonator – M/B 2 : 3 and 1 : 2 (resistor option). • DTMF timing: • Uses standard single-contact keyboard – Manual dialling with minimum duration for bursts and pauses (85/85 ms) • Keyboard entries fully debounced. – Calibrated timing during redialling (85/85 ms). Ringer part • Pulse or tone mode select at start-up (resistor option) • Ringer input frequency discrimination • Flash function (600, 300, 98 and 80 ms) (resistor options) • 3-tone ringer with 4 programmable melodies (selectable via keyboard by keys [1] to [4]) • Access pause time 2.0 and 3.6 s (resistor option); access pauses in series are possible 2000 May 19 • 4-level volume control (selectable via keyboard by keys [5] to [8]). 2 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) When the line current is high enough, a fixed amount of current is derived from pin LN in order to create a supply point at pin VDD. The voltage at pin VDD is regulated at 3.3 V to supply the dialler and ringer parts and peripheral circuits. GENERAL DESCRIPTION The ICs UBA2050, UBA2050A, UBA2051, UBA2051A and UBA2051C contain all the functions needed to build a fully electronic telephone set. In many places in the text, figures and tables, the description is not applicable for all the five types, but only for one or two or for a combination. These combinations will be referred to by means of short denotations as given in Table 1. Table 1 Dialler part The dialler and ringer parts of the IC are responsible for the system control, system settings and the generation and detection of various signals. Denotations of types DENOTATION The dialler offers a 32-digit last number redial function. The UBA2051x offers in addition 13 memories (3 direct + 10 indirect) of 21 digits. TYPES UBA2050x UBA2050; UBA2050A UBA2051x UBA2051; UBA2051A; UBA2051C UBA205x UBA2050; UBA2051 UBA205xA UBA2050A; UBA2051A UBA205xx all five types During pulse dialling the DMO output of the UBA205x can be used to decrease the line voltage. During tone dialling the LED output of the UBA205xA is used to indicate DTMF dialling. A keytone is available if a valid key is pressed for the types UBA2050x and UBA2051C. Ringer part The devices incorporate a speech/transmission part, a dialler part and a ringer part. By offering a wide range of possible adaptations for each part, the UBA205xx applications can be easily adapted to meet different requirements. The ringer part offers a discriminator input which enables the MDY/TONE output as soon as a valid ring frequency is detected. It offers a choice of 4 different 3-tone melodies and a 4-level volume control, both programmable via the keyboard. An external very low cost ringer output stage for a buzzer is needed. Stabilized supply (VDD) during ringer mode for dialler and ringer part is included. Speech/transmission part The speech/transmission part performs all transmission and line interface functions required in fully electronic telephone sets. It performs electronic switching between transmission and dialling. The IC operates at a DC voltage down to 1.45 V (with reduced performance) to facilitate the use of telephone sets connected in parallel. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION UBA2050T SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 UBA2050AT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 UBA2051T SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 UBA2051AT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 UBA2051CT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 2000 May 19 3 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Speech/transmission part 11 − 140 mA with reduced performance 1 − 11 mA Iline = 15 mA 4.05 4.35 4.65 V internal current consumption VCC = 3.6 V − 1.25 1.5 mA VCC supply voltage for internal circuitry (unregulated) IP = 0 mA − 3.6 − V VDD regulated supply voltage for peripherals speech mode; IDD = −2.6 mA 3.0 3.3 3.6 V ringer mode; IDD = 75 mA 3.0 3.3 3.6 V Iline line current operating range VLN DC line voltage ICC normal operation IDD available supply current for peripherals − − −2.6 mA Gv(TX) typical voltage gain for microphone amplifier VMIC = 4 mV (RMS) 43.2 44.2 45.2 dB Gv(RX) typical voltage gain for receiving amplifier VIR = 4 mV (RMS) 32.4 33.4 34.4 dB ∆Gv(QR) gain setting range for earpiece amplifier RE1 = 100 kΩ −14 − +12 dB ∆Gv(trx) gain control range for microphone and receive amplifiers Iline = 85 mA; referenced to − Iline = 15 mA 6.0 − dB ∆Gv(trx)(m) gain reduction for microphone and receive amplifiers in DTMF mode − 80 − dB VHG(LN)(rms) high group frequency voltage (RMS value) RDTMF1 = 20 kΩ; on line RDTMF2 = 2.74 kΩ 353 435 536 mV VLG(LN)(rms) low group frequency voltage (RMS value) on line 277 341 420 mV GV pre-emphasis of group 1.5 2.0 2.5 dB THD total harmonic distortion − −25 − dB ringer detection frequency 13 − − Hz Dialler part RDTMF1 = 20 kΩ; RDTMF2 = 2.74 kΩ Ringer part fring 2000 May 19 4 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... VDD DTMF DIALLER PART LN IR VDD SPEECH/TRANSMISSION PART GAR REGULATOR FLASH PULSE DTMF INDICATION EARPIECE AMPLIFIER VCC QR R1 R2 R3 R4 C1 KEYBOARD DETECTOR MUTE KEYTONE RECEIVE AMPLIFIER RX C2 C3 dB MDY C4 TONE GENERATOR AGC AGC DTMF/ RINGER Philips Semiconductors LED One-chip telephone ICs with speech, dialler and ringer functions DMO BLOCK DIAGRAM DP/FL ull pagewidth 2000 May 19 KT 5 SLPE TRANSMIT AMPLIFIER XTAL CE/CSI REG RINGER PART DETECTOR/ GENERATOR SUPPLY VCC UBA205xx FCA138 MDY/TONE Fig.1 Block diagram. GND SLPE Product specification UBA2050 and UBA2050A: C4 output not available. UBA2051 and UBA2051A: KT output not available. UBA2050 and UBA2051: DMO output available, LED output not available. UBA2050A and UBA2051A: LED output available, DMO output not available. UBA2051C: KT output available, DMO and LED outputs not available. MIC+ MIC− UBA2050(A); UBA2051(A;C) CE/FDI TIMING/ CONTROL Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) PINNING PIN SYMBOL LN DESCRIPTION UBA2050 UBA2050A UBA2051 1 1 1 UBA2051A UBA2051C 1 1 positive line terminal SLPE 2 2 2 2 2 slope (DC resistance) adjustment REG 3 3 3 3 3 line voltage regulator decoupling IR 4 4 4 4 4 receive amplifier input AGC 5 5 5 5 5 automatic gain control and line-loss compensation DTMF 6 6 6 6 6 DTMF transmit input VDD 7 7 7 7 7 stabilized supply for dialler and ringer parts XTAL 8 8 8 8 8 oscillator input DP/FL 9 9 9 9 9 dial pulse/flash output (active LOW) DMO 10 − 10 − − dial mode output LED − 10 − 10 − DTMF mode indication output CE/CSI 11 11 11 11 11 chip enable/cradle switch input; note 1 CE/FDI 12 12 12 12 12 chip enable/frequency discrimination input MDY/TONE 13 13 13 13 13 melody (ringer) output/DTMF generator output KT 14 14 − − 10 keytone output C4 − − 14 14 14 keyboard input/output C4 C3 15 15 15 15 15 keyboard input/output C3 C2 16 16 16 16 16 keyboard input/output C2 C1 17 17 17 17 17 keyboard input/output C1 R4 18 18 18 18 18 keyboard input/output R4 R3 19 19 19 19 19 keyboard input/output R3 R2 20 20 20 20 20 keyboard input/output R2 R1 21 21 21 21 21 keyboard input/output R1 GND 22 22 22 22 22 negative line terminal QR 23 23 23 23 23 earpiece amplifier output GAR 24 24 24 24 24 gain adjustment earpiece amplifier RX 25 25 25 25 25 receive amplifier output MIC+ 26 26 26 26 26 non-inverting microphone amplifier input MIC− 27 27 27 27 27 inverting microphone amplifier input VCC 28 28 28 28 28 supply for speech/transmission part and peripherals Note 1. The cradle switch and the two positions ‘handset on the cradle’ and ‘handset lifted’ are further on in this document referred to as ‘hook-switch’, respectively ‘on-hook’ and ‘off-hook’ position. 2000 May 19 6 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions handbook, halfpage LN 1 28 VCC SLPE 2 REG 3 IR 4 UBA2050(A); UBA2051(A;C) handbook, halfpage LN 1 28 VCC 27 MIC− SLPE 2 27 MIC− 26 MIC+ REG 3 26 MIC+ IR 4 25 RX AGC 5 AGC 5 24 GAR 23 QR DTMF 6 VDD 7 25 RX 24 GAR 23 QR DTMF 6 VDD 7 22 GND UBA2050T 22 GND UBA2050AT XTAL 8 21 R1 XTAL 8 21 R1 DP/FL 9 20 R2 DP/FL 9 20 R2 DMO 10 19 R3 LED 10 19 R3 CE/CSI 11 18 R4 CE/CSI 11 18 R4 CE/FDI 12 17 C1 CE/FDI 12 17 C1 MDY/TONE 13 16 C2 MDY/TONE 13 16 C2 KT 14 15 C3 KT 14 15 C3 MGT042 MGT043 Fig.2 Pin configuration (UBA2050T). handbook, halfpage LN 1 28 VCC SLPE 2 REG 3 IR 4 Fig.3 Pin configuration (UBA2050AT). handbook, halfpage LN 1 28 VCC 27 MIC− SLPE 2 27 MIC− 26 MIC+ REG 3 26 MIC+ IR 4 25 RX AGC 5 AGC 5 24 GAR 23 QR DTMF 6 VDD 7 25 RX 24 GAR 23 QR DTMF 6 VDD 7 22 GND UBA2051T 22 GND UBA2051AT XTAL 8 21 R1 XTAL 8 21 R1 DP/FL 9 20 R2 DP/FL 9 20 R2 DMO 10 19 R3 LED 10 19 R3 CE/CSI 11 18 R4 CE/CSI 11 18 R4 CE/FDI 12 17 C1 CE/FDI 12 17 C1 MDY/TONE 13 16 C2 MDY/TONE 13 16 C2 C4 14 15 C3 C4 14 15 C3 MGT044 MGT045 Fig.4 Pin configuration (UBA2051T). 2000 May 19 Fig.5 Pin configuration (UBA2051AT). 7 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions handbook, halfpage LN 1 28 VCC SLPE 2 27 MIC− REG 3 26 MIC+ IR 4 UBA2050(A); UBA2051(A;C) The reference voltage can be increased by connecting the resistor RVA between pins REG and SLPE or decreased by connecting the resistor RVA between pins REG and LN. The voltage at pin REG is used by the internal regulator to generate Vref and is decoupled by capacitor CREG connected between pins REG and GND. This capacitor, converted into an equivalent inductance (see Section “Set impedance”), realizes the set impedance conversion from its DC value (RSLPE) to its AC value (RCC in the audio frequency range). 25 RX AGC 5 24 GAR 23 QR DTMF 6 VDD 7 The voltage at pin SLPE is proportional to the line current, and the voltage VLN at pin LN can be calculated as follows: 22 GND UBA2051CT XTAL 8 21 R1 DP/FL 9 20 R2 KT 10 19 R3 CE/CSI 11 18 R4 CE/FDI 12 17 C1 MDY/TONE 13 16 C2 C4 14 15 C3 VLN = Vref + RSLPE × ISLPE ISLPE = Iline − ICC − IP − ISUP where: Iline = line current ICC = internal current consumption IP = supply current for peripheral circuits ISUP = current consumed by the VDD regulator from pin LN. FCA128 Resistor RSLPE is an external resistor connected between pins SLPE and GND. The preferred value for RSLPE is 20 Ω. Changing the value of RSLPE will affect more than the DC characteristics: it also influences the microphone and DTMF gains, the gain control characteristics, the sidetone level and the maximum output swing on the line. Fig.6 Pin configuration (UBA2051CT). FUNCTIONAL DESCRIPTION The values given in the functional description are typical values unless otherwise specified. The DC current flowing into the set is determined by the exchange supply voltage (Vexch), the feeding bridge resistance (Rexch), the DC resistance of the telephone line (Rline) and the reference voltage (Vref). The excess current is shunted via pin LN to pin SLPE when the line current (Iline) is greater than the sum of the supply current of the speech/transmission part (ICC), the current drawn by the peripheral circuitry connected to VCC (IP) and the input current of the VDD regulator (ISUP). With line currents below Ilow (9 mA), the internal reference voltage (generating Vref) is automatically adjusted to a lower value. For numbering of components, refer to Figs 7, 37 and 38. Voltage levels are referenced to the negative line terminal GND, except when otherwise specified. Speech/transmission part SUPPLY The supply for the IC and its peripheral circuits is obtained from the telephone line (see Fig.7). This means that more sets can operate in parallel with DC line voltages (excluding the polarity guard) down to an absolute minimum voltage of 1.45 V. At line currents below Ilow, the circuit has limited sending and receiving levels. This is called the low voltage area. Line interface (pins LN, SLPE and REG) The IC generates a stabilized reference voltage Vref between pins LN and SLPE. This reference voltage is 4.15 V, is temperature compensated and can be adjusted by means of an external resistor RVA. 2000 May 19 8 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) Internal supply (pin VCC) The voltage VCC (see Fig.9) depends on the current consumed by the transmission part and the peripheral circuits: The internal transmission part circuitry is supplied from VCC. This supply voltage is derived from the voltage on pin LN by means of resistor RCC and must be decoupled by capacitor CVCC connected between pins VCC and GND. This supply point may also be used to supply peripheral circuits e.g. an electret microphone taking into account the supply possibilities according to Fig.8. handbook, full pagewidth VCC = VCC0 − RCC × (IP + IREC) where: VCC0 = VLN − ICC × RCC IREC = the current consumed by the output stage of the earpiece amplifier. Iline Rline RCC IP VCC LN 100 µF CVCC supply electret microphone SUPPLY TRANSMISSION PART ISUP from preamp Rexch ICC VDD IDD VDD REGULATOR DIALLER/ RINGER Vexch REG CREG 4.7 µF SLPE ISLPE GND RSLPE 20 Ω ringerinterface/ peripherals UBA205xx CVDD 220 µF FCA129 Fig.7 Supply configuration. 2000 May 19 9 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) MGL827 3 handbook, halfpage IP (mA) 1.9 mA 2 1.6 mA handbook, halfpage RCC VCC 1 (2) (1) VCC0 0 Irec GND 0 1 2 3 VCC (V) PERIPHERAL CIRCUITS IP FCA130 4 VCC ≥ 2.5 V; VLN = 4.35 V at Iline = 15 mA; RCC = 619 Ω; RSLPE = 20 Ω. (1) This curve is valid when the receiving amplifier is not loaded. (2) This curve is valid when the receiving amplifier is loaded; Vo(rms) = 150 mV; RL = 150 Ω. Fig.8 Typical current IP available from VCC for peripheral circuitry. Fig.9 Regulated supply point (pin VDD) Output VDD follows the DC voltage at pin LN (with typically 0.35 V difference) up to VDD = 3.3 V. The input current of the regulator is constant while the output (source) current is determined by the consumption of the peripherals. The difference between input and output current is shunted by the internal VDD stabilizer. The VDD regulator delivers a stabilized voltage to supply the internal dialler and ringer parts and peripheral circuits in transmission mode (nominal VLN) and in ringer mode (VLN = 0 V). The maximum supply current for peripherals is 1.9 mA in dialling mode (DTMF generator on) and 2.6 mA in speech mode (DTMF generator off). The supply conditions in ringer and trickle (on-hook condition) modes must not be disturbed by the peripheral supply currents. • Ringer mode: The regulator operates as a shunt stabilizer to keep VDD at 3.3 V. The input voltage VLN equals 0 V while the input current into pin VDD is delivered by the ringing signal. The regulator (see Fig.7) consists of a sense input circuitry (pin LN), a current switch and a VDD output stabilizer (pin VDD). VDD is decoupled by capacitor CVDD. • Trickle mode: When VDD is below typically 2 V, the regulator is inhibited. The current consumption of the VDD regulator in trickle mode is very low to save most of the trickle current for memory retention of the dialler and ringer parts. The regulator function depends on the transmission, ringer and trickle modes as follows: • Transmission mode: The regulator operates as a current source at the LN input; it takes a constant current of ISUP = 4.5 mA (at nominal conditions) from pin LN. The current switch reduces the distortion on the line at large signal swings. 2000 May 19 VCC used as supply voltage for peripheral circuits. 10 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions handbook, full pagewidth Rline UBA2050(A); UBA2051(A;C) RCC Iline ICC ILN LN CVCC VCC 100 µF VDD Rexch ISUP IDD SWITCH SENSE Vexch peripherals VDD regulator CVDD UBA205xx 220 µF GND FCA131 Fig.10 VDD regulator configuration. SET IMPEDANCE In the audio frequency range, the dynamic impedance is mainly determined by resistor RCC. The equivalent impedance of the circuit is illustrated in Fig.11. LN handbook, halfpage LEQ RP RCC 619 Ω Vref REG VCC RSLPE 20 Ω CREG 4.7 µF SLPE GND CVCC 100 µF FCA132 LEQ = CREG × RSLPE × Rp. Internal resistance RP = 17.5 kΩ. Fig.11 Equivalent impedance between LN and GND. 2000 May 19 11 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) TRANSMIT STAGES In speech mode, the voltage gain from pins MIC+ and MIC− to pin LN is set at 44.2 dB at 600 Ω line load. Microphone arrangements are illustrated in Fig.12. Microphone signal amplification (pins MIC+ and MIC−) The UBA205xx has symmetrical microphone inputs. The input impedance between pins MIC+ and MIC− is 64 kΩ (2 × 32 kΩ). Automatic gain control is provided on this amplifier for line loss compensation. handbook, full pagewidth (2) VCC MIC− MIC− MIC− (1) MIC+ MIC+ MIC+ MGT052 GND a. Magnetic or dynamic microphone. b. Electret microphone. c. Piezoelectric microphone. (1) This resistor may be connected to reduce the terminating impedance. (2) Extra decoupling capacitor for the microphone supply. Fig.12 Microphone arrangements. DTMF amplification (pin DTMF) The automatic gain control has no effect on the DTMF amplifier. When the DTMF amplifier is enabled, dialling tones may be sent on the line. These tones are generated at pin MDY/TONE and their amplitude can be adjusted by means of an attenuator and filter network (see Fig.35) before being applied to the DTMF amplifier at pin DTMF. These tones are also sent to the receive output RX at a low level (confidence tone). RECEIVE STAGES The receive part consists of a receive amplifier and an earpiece amplifier. Receive amplifier (pins IR and RX) The UBA205xx has an asymmetrical DTMF input. The input impedance between pins DTMF and GND is 20 kΩ. The voltage gain from pin DTMF to pin LN is set at 26 dB at 600 Ω line load. The DC voltage between pins DTMF and GND is 0 V. So, when an external attenuator/filter network is used, there is no need for a second decoupling capacitor. 2000 May 19 The receive amplifier transfers the received signal from input IR to output RX. The input impedance between pins IR and GND is 20 kΩ. The voltage gain from pin IR to pin RX is fixed at 33.4 dB. The RX output is intended to drive high ohmic (real) loads. Automatic gain control is provided on the receive amplifier. 12 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) Earpiece amplifier (pins GAR and QR) R GAR1 + R GAR2 V QR The initial gain is defined by: ---------= – ---------------------------------------- R E1 V RX The earpiece amplifier is an operational amplifier having its output QR and inverting input GAR available. It can be used in conjunction with two resistors to get some extra gain or attenuation. which corresponds to Rgb = ∞. The gain boost is realised by a defined value of Rgb and is defined by: R GAR1 × R GAR2 ------------------------------------------ + R R R V QR GAR1 GAR2 GAR1 + R GAR2 ---------- = – ---------------------------------------- × 1 + ------------------------------------------ R E1 V RX R gb Arrangements of the receive and earpiece amplifier are illustrated in Fig.13. Earpiece connections are shown in Fig.14. In the basic configuration (see Fig.13), output RX drives the earpiece amplifier by means of RE1 connected between pins RX and the inverting input GAR. Feedback resistor RGAR of the earpiece amplifier is connected between pins QR and GAR. Output QR drives the earpiece via a series capacitor Cear. External capacitors CGAR (connected between pins QR and GAR) and CGARS (connected between pins GAR and GND) ensure stability. The capacitor CGAR provides a first-order low-pass filter. The cut-off frequency corresponds to the time constant CGAR × RGAR. The value of CGARS must be 10 times the value of CGAR to ensure stability. The gain of the earpiece amplifier (from RX to QR) can be set between +12 and −14 dB by means of resistor RGAR. The preferred value of RE1 is 100 kΩ. The output voltages of the earpiece amplifier and the DTMF amplifier are specified for continuous wave drive. The maximum output voltage swing depends on the DC line voltage VLN, the DC resistance RCC of the set-impedance network between pins LN and VCC, the current consumption ICC and IP from pin VCC and the load impedance at pin QR. The earpiece amplifier offers a gain boost facility relative to the initial gain. Resistor RGAR has to be replaced by the network of RGAR1, RGAR2 and Rgb and a series capacitor Cgb as shown in Fig.13. Cear handbook, full pagewidth Iline Rline RCC earpiece RGAR CGAR ICC LN CGARS RE1 VCC QR GAR RX CVCC Rexch 100 µF EARPIECE AMPLIFIER Rgb CGARS Cgb RGAR2 Vexch RGAR1 RE1 0.5VCC UBA205xx CGAR GND QR GAR RX Addition for gain boost of earpiece amplifier FCA133 Fig.13 Receive and earpiece amplifier configuration. 2000 May 19 13 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) handbook, full pagewidth (1) (2) QR QR QR GND GND GND MGT051 a. Dynamic earpiece. b. Magnetic earpiece. (1) This resistor may be connected to prevent distortion due to the inductive load. (2) This resistor is required to increase the phase margin due to the capacitive load. Fig.14 Earpiece connections. 2000 May 19 14 c. Piezoelectric earpiece. Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) AUTOMATIC GAIN CONTROL (PIN AGC) The IC can be used with different configurations of exchange supply voltage and feeding bridge resistance by connecting an external resistor RAGC between pins AGC and GND (see Fig.15). This resistor enables the Istart and Istop line currents to be increased (the ratio between Istart and Istop is not affected by the resistor). The UBA205xx performs automatic line loss compensation. The automatic gain control varies the gain of the microphone amplifier and the gain of the receive amplifier in accordance with the DC line current. The control range is 6.0 dB. This corresponds approximately to the loss for a cable length of 5 km with an 0.5 mm diameter twisted copper-pair, a DC resistance of 176 Ω/km and an average attenuation of 1.2 dB/km). The AGC function is disabled when pin AGC is left open-circuit. handbook, full pagewidth RAGC = ∞ 0 ∆Gv (dB) −2 −4 0 −6 0 10 20 30 40 50 60 10 20 30 kΩ 70 80 90 Iline (mA) 100 MGT049 Fig.15 Variation of gain as a function of line current with RAGC as parameter. 2000 May 19 15 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) The suppression also depends on the accuracy of the match between Zbal and the impedance of the average line. SIDETONE SUPPRESSION The anti-sidetone network for the UBA205xx, comprising RCC in parallel with Zline, Rast1, Rast2, Rast3, RSLPE and Zbal (see Fig.16), suppresses the transmitted signal in the earpiece. Maximum compensation is obtained when the following conditions are fulfilled: The anti-sidetone network for the UBA205xx attenuates the received signal from the line by 32 dB before it enters the receive stage. The attenuation is almost constant over the whole audio frequency range. RSLPE × Rast1 = RCC × (Rast2 + Rast3) R ast2 × ( R ast3 + R SLPE ) k = ---------------------------------------------------------R ast1 × R SLPE A Wheatstone bridge configuration (see Fig.17) may also be used. Zbal = k × Zline More information on the balancing of an anti-sidetone bridge can be obtained in our publication “Application Handbook for Wired Telecom Systems, IC03b”. The scale factor k is chosen to meet the compatibility with a standard capacitor from the E6 or E12 range for Zbal. In practice, Zline varies considerably with the line type and the line length. Therefore, the value of Zbal should be chosen for an average line length, which gives satisfactory sidetone suppression with short and long lines. LN handbook, full pagewidth Zline RCC Rast1 Im GND IR Zir Rast2 RSLPE Rast3 Z bal SLPE MGT046 Fig.16 Equivalent circuit of UBA205xx anti-sidetone bridge. 2000 May 19 16 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) LN handbook, full pagewidth Zline RCC Z bal IR Im GND RSLPE Zir Rast1 RA SLPE MGT047 Fig.17 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration. Dialler and ringer parts By connecting a capacitor with a value of a few pico-farad in parallel with the resonator, the oscillator frequency can be decreased. By connecting a capacitor with a value of a few ten pico-farad in series with the resonator, the oscillator frequency can be increased. The oscillator starts when VDD reaches the operating voltage level VPOR and pin CE/FDI or pin CE/CSI goes HIGH. SUPPLY VOLTAGE (PIN VDD) The power supply must be maintained for repertory memory retention (standby supply voltage) and may drop down to 1.0 V, being the minimum value of the memory retention voltage VMR. Applying a large capacitor across the supply terminals can retain the memory when power connections are broken. Recommended resonator types: Murata CSA 3.58MG300FGA or CSAC 3.58MGC300FGA. The minimum operating voltage is 2.0 V (the Power-on reset voltage VPOR has its maximum value). Below this value, the internal Power-on reset disables the IC. A memory integrity check is performed at each start-up. In the event of a failing check, the memory is cleared. OSCILLATOR (PIN XTAL) The UBA205xx uses an on-chip oscillator as the master timing source. It needs to be completed by an external 3.579545 MHz quartz crystal or ceramic resonator connected between pins XTAL and GND. When using an external ceramic resonator, additional components may be required depending upon the ceramic resonator specifications (refer to the product type specification). 2000 May 19 17 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) INTERNAL RESET CIRCUIT (PINS CE/FDI AND CE/CSI) CHIP ENABLE/CRADLE SWITCH INPUT (PIN CE/CSI) A reset signal is internally generated to initialize the UBA205xx as follows (see Fig.18): To distinguish between different operating states an extra CE/CSI input is used. Comparable to the CE/FDI input, the CE/CSI activates the dialler part. From that moment the dialler part polls this input and the CE/FDI input regularly for line power breaks during on-line states. When pins CE/CSI and CE/FDI are set LOW for a time greater than tRD, the standby state is entered. Pin CE/CSI is set HIGH during the off-hook situation (basic application). The basic states are shown in Table 2. • By the on-chip Power-On Reset (POR) circuit as long as VDD is lower than VPOR • When the voltage on pin CE/CSI and on pin CE/FDI are both LOW for a time greater than the reset delay time tRD. When reset conditions are fulfilled, pins MDY/TONE and DP/FL are set to high-impedance; pins DMO, KT, LED, R1 to R4 and C1 to C4 are set to LOW. Table 2 UBA205xx basic states INPUT CE/CSI handbook, halfpage VDD POR OR CE/CSI CE/FDI reset STATE LOW LOW standby HIGH X; note 1 handset LOW HIGH ringer; note 2 Notes 1. Don’t care. NOR MGM334 2. AC signal at pin CE/FDI. Fig.18 Internal reset. During switching (on-hook/off-hook and pulse dialling) this pin is protected by its ESD diodes. The maximum input current on these diodes should be below 1 mA. CHIP ENABLE AND FREQUENCY DISCRIMINATOR INPUT (PIN CE/FDI) RINGER MELODY (PIN MDY/TONE) This input is used to activate and initialize part of the system. This pin together with the pin CE/CSI determines which mode to enter (see Table 2) and detects line power breaks during on-line states. To prevent the dialler from reacting on voltage disturbances on the telephone line, a time-out is active. The dialler returns to the standby state if the voltage on both pins CE/CSI and CE/FDI is LOW for a time greater than tRD. When an incoming ringer signal at pin CE/FDI is valid, the UBA205xx starts generating a melody via the MDY/TONE output ringer hardware (see Fig.35). The signal at pin MDY/TONE is a square wave signal (see Fig.19). This melody follows the cadence of the ringer signal. Both the melody and the volume can be selected via the keyboard. In the exchange, several AC signals can be superimposed on the DC signal, e.g. dialling tone, busy tone, disturbances (such as line power breaks) and ringer signal. The ringer signal is evaluated and checked if its frequency is above a specified ringer frequency fring. It is assumed that the frequency at pin CE/FDI is the same as the ringer frequency present on the telephone line. The melody frequencies and the duration are given in Table 3. Table 8 shows how a melody can be selected by pressing a key during ringing. The melody setting will be stored in the memory. The volume of the ringer circuit can be controlled by changing the amplitude of the square wave. The voltage level at pin MDY/TONE can be changed as shown in Table 9. The volume setting will be stored in the memory. The signal at this pin is half-wave rectified so that the dialler can easily detect zero-crossing, especially at high frequency. MDY/TONE is a push-pull output. MDY/TONE is high-impedance when VDD < VPOR. During switching (on-hook/off-hook and pulse dialling) this pin is protected by its ESD diodes. The maximum input current on these diodes should be below 1 mA. 2000 May 19 INPUT CE/FDI 18 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions Table 3 UBA2050(A); UBA2051(A;C) Ringer melodies NAME FREQUENCIES (Hz) DURATION (ms) Bell 1 (default) 770 + 943 + 1341 28 + 28 + 28 Bell 2 852 + 943 + 1206 28 + 28 + 28 Bell 3 943 + 1206 + 1341 28 + 28 + 28 Bell 4 1206 + 1341 + 1482 28 + 28 + 28 VDD handbook, full pagewidth CE/FDI GND sync time sample time MDY/TONE MGT050 Fig.19 Ringer frequency detection. PULSE DIALLER (PINS DP/FL, DMO AND LED) Pin DMO of the UBA205x is used to enable external hardware (see Fig.37) which decreases the DC voltage over the A and B network exchange terminals during pulse dialling. Several countries require this feature. Pin DMO is a push-pull output and is LOW when VDD < VPOR. The pulse dialling system uses line current interruptions to signal the digits dialled to the exchange. The number of line current interruptions corresponds to the digit dialled except for the digit [0] which is characterized by 10 interruptions. After each digit there is an inter-digit pause time (tidp). Figure 20 shows the timing diagram in pulse dialling mode for the UBA205x when keys [3], [3], [LNR/P] and [4] are pressed. When dialling, the transmission part is muted. Figure 20 is also valid for the UBA2051C, with the exception of the DMO signal. The [∗/T] key definition, the dialling mode, the make/break ratio, repetition rate (pulse dialling), the flash time and the access pause time depend on the resistor options: MMS, PTS, MBS, PPS, FTSA, FTSB and APT (see Fig.25 and Table 7). Valid keys are the digits [0] to [9], [R], [LNR/P], [P → T] and [∗/T] (when MMS resistor option is off). In pulse dialling mode, pin LED of the UBA205xA is set LOW after off-hook and becomes HIGH when the first DTMF code is sent after switching over to DTMF dialling. Pin LED is a push-pull output and is LOW when VDD < VPOR. To allow start-up from CVDD discharged, no ESD diode is implemented between pin DP/FL and pin VDD. Figure 21 shows the timing diagram in pulse dialling mode for the UBA205xA when keys [3], [3], [P → T] and [4] are pressed. Pin DP/FL is an open-drain output and is set HIGH (via an external pull-up resistor) when VDD < VPOR. 2000 May 19 19 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) handbook, full pagewidth KEYS [3]......... [3] ......... [LNR/P] ......... [4] internal MUTE tm tidp tm tidp tb tm tidp tap tmho DP/FL tpdp tm tpdp tpdp DMO MGU139 tb = break time. tm = make time. tidp = interdigit pause time. tap = access pause time. tmho = mute holdover time. tpdp = pre-digit pause. Fig.20 Timing diagram in pulse dialling mode for the UBA205x. handbook, full pagewidth KEYS internal MUTE ....[3] .............. [3] ......... [P->T] ................... [4] tm tidp tb tm tidp DP/FL tmho tap tt tpdp tm tpdp tp MDY/TONE LED MGU140 tb = break time. tmho = mute holdover time. tm = make time. tidp = interdigit pause time. tap = access pause time. tpdp = pre-digit pause. tt = burst time. tp = pause time. Fig.21 Timing diagram in pulse dialling mode for the UBA205xA. 2000 May 19 20 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) Valid keys are the digits [0] to [9], [∗/T], [#], [R], [LNR/P] and [P → T]. TONE DIALLER (PINS MDY/TONE AND LED) The digits are transmitted as two simultaneously generated tones: the Dual-Tone Multi-Frequency (DTMF) system. These dual tones which are provided at the MDY/TONE output are internally generated with two digital sine wave synthesizers together with digital-to-analog converters. Their amplitudes are precisely scaled according to a band gap voltage reference. This ensures tone output levels independent of the supply voltage and temperature. The two sine waves are summed and then filtered by an on-chip switched capacitor filter, followed by an active RC low-pass filter. These guarantee that all DTMF tones generated fulfil the CEPT CS203 recommendations with respect to amplitude, frequency deviation, total harmonic distortion and suppression of unwanted frequency components. Tone digits are separated by a pause time (tp). The dialling mode, the flash time and the access pause time depend on the resistor options: PTS, FTSA, FTSB and APT (see Fig.25 and Table 7). Figure 22 shows the timing diagram in tone dialling mode when keys [3], [3], [LNR/P], [4], [R] and [2] are pressed. In DTMF dialling mode, pin LED of the UBA205xA is set LOW after the hook-switch changes to off-hook and becomes HIGH as soon as a key is pressed and the first DTMF code is sent. Pin LED is a push-pull output and is LOW when VDD < VPOR. The DTMF standard frequencies are implemented as shown in Table 4. At dialling, the DTMF input of the transmission part is enabled while the microphone and receive amplifier inputs are disabled. The signal at the DTMF input is sent to the receive output at a low level [see Section “DTMF amplification (pin DTMF)”]. handbook, full pagewidth KEYS .....[3] ......[3] ..............[LNR/P].......................[4].............. [R] ....................... [2] internal MUTE DP/FL tt tp tp tap tt tp tfl tifp tmho tp tfho MDY/TONE high impedance (1) LED MGU141 tt = burst time. tp = pause time. tap = access pause time. tfl = flash time. tmho = mute holdover time. tfho = flash holdover time. Note: the maximum tone burst and pause times are equal to the real key press/release time. (1) pin LED only available inUBA205xA. tifp = interflash pause time. Fig.22 Timing diagram in tone dialling mode. 2000 May 19 21 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions Table 4 UBA2050(A); UBA2051(A;C) DTMF standard frequencies and their implementation DTMF FREQUENCY (Hz) FREQUENCY AT MDY/TONE (Hz)(1) DEVIATION (%) DEVIATION (Hz) 697 697.90 0.13 0.90 770 770.46 0.06 0.46 852 850.45 −0.18 −1.55 941 943.23 0.24 2.23 1209 1206.45 −0.21 −2.55 1336 1341.66 0.42 5.66 1477 1482.21 0.35 5.21 Note 1. Assuming fxtal = 3.579545 MHz. FLASH FUNCTION (PINS DP/FL AND DMO) The duration of the flash time depends on the resistor options FTSA and FTSB (see Fig.25 and Table 7). Pressing the flash function key [R] results in a calibrated pulse which drives the electronic line current interrupter via pin DP/FL. The DMO output is also activated during pulse production (see Fig.23). After a flash pulse, an interflash pause time tifp of 800 ms is inserted to recover the power supply for the dialler part. During tfl + tfho, the reset delay time is inhibited. handbook, full pagewidth KEYS [R] ............................ [R] .......................... internal MUTE tfl tifp tfl tifp DP/FL DMO(1) tfho tfho MGU142 (1) pin DMO available only on UBA205x. tfl = flash time. tfho = flash holdover time. tifp = interflash pause time. Fig.23 Flash timing diagram. 2000 May 19 22 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) KEYBOARD DETECTOR (PINS C1 TO C4 AND R1 TO R4) A key entry becomes valid when the depress debounce time tdd has elapsed (see Fig.24). After the release of a valid key, the scanning is frozen when the release debounce time trd has elapsed. The pins are directly connected to a traditional single contact keyboard. The keyboard is normally static with outputs R1 to R4 at LOW level and inputs C1 to C4 with internal pull-up resistors. When any key is pressed, scanning is done to detect which key has been pressed. A second key entry will be valid after having released the first key entry. Simultaneously pressing several keys will result in no action. The pins R1 to R4 are LOW and pull-down resistors replace pull-up resistors at pins C1 to C4 when VDD < VPOR. handbook, full pagewidth key entry trd tdd key valid MGM341 tdd = depress debounce time. trd = release debounce time. Fig.24 Timing diagram debouncing. 2000 May 19 23 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) Keyboard structure The UBA205xx supports the keyboard structure given in Fig.25. Pin C4 is not available in the UBA2050x. For key definitions, see Table 5. MBS handbook, full pagewidth 1 2 3 MEM R1 4 5 6 M1 R2 7 8 9 M2 R3 */T 0 # M3 R4 APT PPS PTS MMS P->T C1 LNR/P C2 R C3 STORE C4 FTSA FTSB GND FCA139 Fig.25 Keyboard structure. Table 5 Key definitions KEYS [0] to [9] and [∗/T](2); [#](1); DEFINITION [∗/T](1) [P → T] digits; see Table 6 switch over to DTMF dialling (mixed mode dialling) [LNR/P] last number redial if this key is the first key pressed after going off-hook; access pause if this key is not the first key pressed after going off-hook [M1] to [M3] direct memories [MEM] indirect memory recall [R] recall (flash function) [STORE] memory programming Notes 1. In tone dialling mode. 2. In pulse dialling mode, when MMS resistor option is off (see Table 7). 2000 May 19 24 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions Table 6 Resistor options Digits keypad activation and corresponding DTMF frequency pairs GENERATED DTMF FREQUENCIES fL (Hz) fH (Hz) NUMBER OF PULSES [0] 941 1336 10 [1] 697 1209 1 [2] 697 1336 2 [3] 697 1477 3 [4] 770 1209 4 [5] 770 1336 5 [6] 770 1477 6 [7] 852 1209 7 [8] 852 1336 8 [9] 852 1477 9 DIGIT KEYS [#] 941 1477 − [∗/T] 941 1209 − Table 7 UBA2050(A); UBA2051(A;C) The resistors are connected between the pins of the keyboard (C1 to C3 and R1 to R4) and pin GND. One resistor connection is shown in Fig.26. The resistor options are read after each reset of the dialler. MBS handbook, halfpage R1 MGT048 Fig.26 Resistor connection. Resistor functions RESISTOR FTSA MMS TO PIN C2 C1 FUNCTION flash time select ON(1) CONDITIONS OFF(1) FTSB = off; note 2 300 ms 98 ms FTSB = on; note 2 80 ms 600 ms [∗/T] becomes [∗] [∗/T] becomes [P → T] [∗/T] key definition MBS R1 make/break ratio select 33/66 40/60 APT R2 access pause time select 3.6 s 2.0 s PPS R3 pulses per second 20 pps 10 pps PTS R4 pulse/tone select pulse mode DTMF mode Notes 1. On = option resistor present; off = option resistor not present. 2. Pin C3 belongs to resistor option FTSB. 2000 May 19 25 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) KEY TONE (PIN KT) A keytone with a frequency fkt = 597 Hz and a duration tkt = 30 ms (see Fig.27) is generated each time a valid key is pressed resulting in the expected action, digit keys in tone dialling mode excepted. Pin KT is a push-pull output and is set LOW when VDD < VPOR. handbook, full pagewidth fkt fkt keytone tkt = keytone time. fkt = keytone frequency. tkt tkt MGM344 Fig.27 Keytones via KT output. Key sequences The UBA205xx leaves the standby state if: • The set goes off-hook (lift handset) The behaviour of the UBA205xx can be represented as a State Transition Diagram (STD). • A ringer signal is available on the line. The STD contains the states (rectangles in Fig.28) and state transitions (arrows) of the set. The upper arrow in the figure pointing to the standby state means that the set is initially in the standby state. When, for instance, an incoming call is detected, the set enters the ringer state, waiting for end of a ringer signal or off-hook. If the set goes off-hook, the UBA205xx enters the on-line state. The UBA205xx returns to the standby state if: • The set goes on-hook (handset on-hook) • A line-break occurs with a duration greater than tRD • The ringer signal becomes invalid. RINGER STATE The UBA205xx has 3 basic states: If the set is in standby state, a ringer signal can be received from the line. After evaluating the incoming ringer signal (and the ringer signal is valid), the UBA205xx starts a melody via the MDY/TONE output and ringer hardware; this melody is stopped when the ringer signal is no longer valid. After going off-hook, the ringer signal stops and the set is in the conversation (on-line) state. • Standby state • Ringer state • On-line state. Each state with its own functional requirements is described in the following sections. While ringing, the melody can be changed according to Table 8 and the volume according to Table 9. STANDBY STATE In the standby state the UBA205xx is inactive. The current drawn is for memory retention; the loads on the inputs/outputs of the dialler have influence on the retention current. 2000 May 19 As long as memory retention conditions are fulfilled, melody and volume are stored. 26 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) power-on handbook, full pagewidth ringer signal off-hook STANDBY ringer invalid on-hook/line break RINGER ON-LINE off-hook MGU186 Fig.28 UBA205xx standby, ringer and on-line states. Table 8 Melody selection during ringer state MELODY Ringer volume setting during ringing KEY Bell 1 [1] (default) Bell 2 [2] Bell 3 [3] Bell 4 [4] 2000 May 19 Table 9 KEY 27 VOLUME ATTENUATION [8] (default) highest 0 dB [7] high −6 dB [6] low −12 dB [5] lowest −18 dB AMPLITUDE OF MDY/TONE VDD V DD – 0.7 ------------------------- + 0.7 2 V DD – 0.7 ------------------------- + 0.7 4 V DD – 0.7 ------------------------- + 0.7 8 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) ON-LINE STATE The on-line state contains a number of sub-states (see Fig.29): This section describes all the actions of the UBA205xx during the on-line state. This state starts with making output DP/FL HIGH (external pull-up resistor), which makes line current flow possible. • Conversation state • Dialling state • Memory recall state • Program state. handbook, full pagewidth STANDBY RINGER off-hook off-hook on-hook/line break ON-LINE [LNR/P], [M1 to M3], [MEM] + [0] to [9] [M1 to M3], [MEM] + [0] to [9] end of recall CONVERSATION [STORE] dial keys MEMORY RECALL end DIALLING PROGRAM MGU187 Fig.29 On-line states. Conversation state However when more than 32 digits are dialled the LNR memory will overflow and the last number redial function will be inhibited. In this state, conversation is possible. Dialling state There are two dial modes: pulse dialling and tone dialling. The initial dialling mode is determined by resistor option PTS. During the dial-key entries the UBA205xx starts immediately with transmission of the digit(s); the minimum transmission time is unaffected by the speed of the entry. Transmission continues as long as further dial-key entries have to be processed. 2000 May 19 The state machine which controls the dialling mode is illustrated in Fig.30. 28 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) handbook, full pagewidth CONVERSATION dial keys end PTS = on PTS = off PULSE DIALLING [*/T] or [P->T] TONE DIALLING [R] + PTS = on DIALLING MGM347 Fig.30 Dialling mode state machine. • Pulse dialling • Access pause In this mode all valid keys are dialled by the pulse dialler. When, during pulse dialling, either [∗/T] when MMS is off or [P → T] is pressed, the UBA205xx switches over to tone dialling (mixed mode dialling). After the switch over, valid keys are dialled by the tone dialler. The temporary tone mode is terminated by going on-hook or flash (Recall). When the [LNR/P] button is not the first key pressed, an access pause is entered for repertory or redialling procedures. • Last number redial If the first key pressed is [LNR/P], the number stored in the LNR memory is dialled and sent. A maximum number of 32 digits can be stored in the LNR memory. If this maximum is exceeded the redial function is inhibited. Pauses, which are stored in the LNR memory, are also dialled. • Tone dialling The UBA205xx converts valid key entries into data for the on-chip DTMF generator. Tones are transmitted via output MDY/TONE with a minimum tone burst/pause duration. The maximum tone burst duration is equal to the key pressing time. The tone switch keys [∗/T] (when MMS is off) and [P → T] are also stored in the LNR memory. When a [∗/T] key (when MMS is on) or [#] key occurs during pulse dialling, its code is not stored in the LNR memory. • Flash function The [R] key will result in pin DP/FL being set to LOW to generate a flash (line current interruption) with a selected time (FTSA and FTSB resistor options). Pressing one digit after [R] key is pressed clears the LNR memory. When going on-hook after the [R] key is pressed, then digits previously dialled in the LNR memory are kept. 2000 May 19 The LNR memory is always cleared when the [STORE] key is pressed. Its content may also be programmed (see Section “Program state (only UBA2051x)”). 29 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) Memory recall state (only UBA2051x) – Press [STORE]; the LNR memory is cleared Repertory numbers can be dialled out after or before entering manual dialling, last number redial and by entering the memory locations in successive order. Repertory recall is not possible as long as a dial out is pending. The three direct memory locations are numbered [M1] to [M3] and the ten indirect memory locations [MEM] [1] to [MEM] [0]. – Press the sequence of digits that must be stored; the keys [0] to [9], [#], [LNR/P], [∗/T], [P → T] or [R] may be used – Store the number in the memory. • Memory overflow The stored numbers can be dialled by using one of the following procedures: If more than 21 digits are entered the old memory contents is kept and the LNR memory is cleared. All the following digits are ignored, except the [STORE] key. The memory overflow state can be left: Press one of the direct memory keys [M1] to [M3] – By going on-hook or – By pressing the [STORE] key again to restart the program sequence. Press [MEM], followed by one of the numeric keys [1] to [0], corresponding to the memory locations 1 to 10. • Clear repertory numbers Clearing a memory location is possible by using the same procedure as for storing a number, except that no telephone number is entered: In case [R] is included in one memory location, when the LNR capacity is exceeded by using it, the LNR function is inhibited. – Press [STORE]; the LNR memory will be cleared Program state (only UBA2051x) – Press one of the memory keys. • Notepad function The program state can be entered from the conversation mode (on-line) when no dial out is pending. Pressing the [STORE] key in this state puts the UBA2051x in the program state and also clears the LNR memory. Pressing the [STORE] key again in the program state will restart the program sequence. In the conversation state it is possible to store a 21 digit number into the LNR memory, which may be dialled after an on-hook/off-hook action. The procedure is as follows: – Press [STORE], the LNR memory will be cleared • Leaving the program state – Press the sequence of digits that must be stored; the keys [0] to [9], [#], [LNR/P], [∗/T], [P → T] or [R] may be used The program state can be left in one of the following ways: – By going on-hook; the entered digits are stored in the LNR memory – Go on-hook/off-hook. – By ending the store procedures properly (see below), resulting in a proper store of the programmed item. • Programming repertory numbers A maximum number of 32 digits can be stored in the memory of repertory numbers (including access pauses, tone switch and flash) and can be achieved by using the following procedure: 2000 May 19 30 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MAX. UNIT − 625 mW ambient temperature −25 +75 °C Tstg storage temperature −40 +125 °C Tj junction temperature − 125 °C Ptot total power dissipation Tamb RSLPE = 20 Ω; note 1 MIN. Speech/transmission part VLN positive continuous voltage on pin LN GND − 0.4 12 V VLN(R) repetitive voltage on pin LN during switch-on or line interruption GND − 0.4 13.2 V ILN line current − mA VCC supply voltage for the speech/transmission part and peripherals VDD stabilized supply voltage for the dialler and ringer parts IDD input current at pin VDD for the dialler and ringer parts Vn voltage on pins SLPE, IR, REG, AGC, DTMF, RX, QR, GAR, MIC+ and MIC− RSLPE = 20 Ω; note 2 140 GND − 0.4 12 V IDD ≤ 75 mA GND − 0.4 3.6 V Iline = 0 mA − mA 75 GND − 0.4 VCC + 0.4 V Dialler and ringer parts Vn voltage on pins 8 to 21 GND − 0.4 VDD + 0.4 V In DC sink/source current for pins 8 to 21 −10 mA +10 Notes 1. Calculated for Tamb = 75 °C and Tj = 125 °C. 2. Mostly dependent on the maximum required ambient temperature and on the voltage between pins LN and SLPE (see Fig.31). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient Note 1. Mounted on glass epoxy board 28.5 × 19.1 × 1.5 mm. 2000 May 19 31 CONDITIONS VALUE UNIT in free air; note 1 70 K/W Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) FCA134 150 handbook, halfpage ILN (mA) 110 (1) (2) (3) 70 (4) 30 (1) Tamb = 45 °C; Ptot = 1.000 W. (2) Tamb = 55 °C; Ptot = 0.875 W. (3) Tamb = 65 °C; Ptot = 0.750 W. (4) Tamb = 75 °C; Ptot = 0.625 W. 2 4 6 8 10 12 VLN −VSLPE (V) Fig.31 Safe operating area. 2000 May 19 32 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) CHARACTERISTICS Iline = 15 mA; GND = 0 V; RSLPE = 20 Ω; pin AGC connected to GND; Zline = 600 Ω; f = 1 kHz; fxtal = 3.579545 MHz; Tamb = 25 °C; measured according to the test circuits of Figs 32, 33 and 34; see also Figs 37 and 38; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies LINE INTERFACE (PIN LN) Iline line current operating range Vref stabilized reference voltage between pins LN and SLPE VLN DC line voltage normal operation 11 − 140 mA reduced performance 1 − 11 mA 3.9 4.15 4.4 V Iline = 1 mA − 1.45 − V Iline = 4 mA − 2.0 − V Iline = 15 mA 4.05 4.35 4.65 V Iline = 140 mA − 7.1 7.55 V VLN(Rext) DC line voltage with external resistor external resistor RVA = 44.2 kΩ (between pins LN and REG) − 3.6 − V ∆VLN(T) DC line voltage variation with temperature Tamb = −25 to +75 °C; − referenced to Tamb = 25 °C ±40 − mV − 1.25 1.5 mA − 3.6 − V INTERNAL SUPPLY VOLTAGE (PIN VCC) ICC internal current consumption VCC = 3.6 V VCC supply voltage for IP = 0 mA speech/transmission part and peripherals REGULATED SUPPLY VOLTAGE (PIN VDD) ISUP VDD 2000 May 19 input current of the VDD regulator regulated supply voltage current from pin LN not flowing through pin SLPE Iline = 1 mA − 0 − mA Iline = 4 mA − 2.15 − mA Iline ≥ 11 mA − 4.5 − mA 3.3 3.6 V speech mode; 3.0 IDD = −2.6 mA; VLN > 3.6 V + 0.25 V (typ.); Iline ≥ 11 mA speech mode at reduced performance; Iline = 4 mA − VLN − 0.35 − V ringer mode; Iline = 0 mA; IDD = 75 mA 3.0 3.3 V 33 3.6 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions SYMBOL IDD PARAMETER available supply current for peripherals in on-line mode IDD(MR) memory retention current (internal consumption on VDD) VDD(MR) memory retention voltage VDD(POR) Power-on reset trip level UBA2050(A); UBA2051(A;C) CONDITIONS MIN. TYP. MAX. UNIT Iline ≥ 11 mA; DTMF generator on; no AC signal on the line − − −1.9 mA Iline ≥ 11 mA; DTMF generator off; no AC signal on the line − − −2.6 mA Iline = 0 mA; VCC discharging; VDD = 1.2 V − − 300 nA 1.0 − 3.6 V 1.3 1.65 2.0 V differential between pins MIC+ and MIC− − 68 − kΩ single-ended between pin MIC+ or MIC− and GND − 34 − kΩ note 1 Transmit stages MICROPHONE AMPLIFIER (PINS MIC+ AND MIC− AND LN) Zi input impedance Gv(TX) voltage gain from pins MIC+ or MIC− to LN VMIC = 4 mV (RMS) 43.2 44.2 45.2 dB ∆Gv(TX) voltage gain reduction of microphone amplifier internal MUTE active − 80 − dB ∆Gv(TX)(f) voltage gain variation with frequency f = 300 to 3400 Hz; referenced to f = 1 kHz − ±0.2 − dB ∆Gv(TX)(T) voltage gain variation with temperature Tamb = −25 to +75 °C; − referenced to Tamb = 25 °C ±0.3 − dB CMRR common mode rejection ratio 80 − dB Iline = 15 mA; THD = 2% 1.8 2.15 − V Iline = 4 mA; THD = 10% − 0.35 − V noise output voltage at pin LN psophometrically weighted − (P53 curve); pins MIC+ and MIC− shorted through 200 Ω −78 − dBmp − 21 − kΩ VLN(max)(rms) maximum sending signal voltage level (RMS value) Vn(LN) − DTMF AMPLIFIER (PIN DTMF) Zi input impedance Gv(DTMF) voltage gain from pin DTMF to pin LN in tone dialling mode; VDTMF = 20 mV (RMS) − 26 − dB ∆Gv(DTMF) voltage gain reduction of DTMF amplifier internal MUTE inactive − 80 − dB ∆Gv(DTMF)(f) voltage gain variation with frequency f = 300 to 3400 Hz; referenced to f = 1 kHz − ±0.2 − dB 2000 May 19 34 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions SYMBOL PARAMETER UBA2050(A); UBA2051(A;C) CONDITIONS MIN. TYP. MAX. UNIT ∆Gv(DTMF)(T) voltage gain variation with temperature Tamb = −25 to +75 °C; − referenced to Tamb = 25 °C ±0.4 − dB Gv(ct) in tone dialling mode; VDTMF = 20 mV (RMS); RL2 = 10 kΩ; − −9.2 − dB − 21.5 − kΩ voltage gain from pin DTMF to pin RX (confidence tone) Receive stages RECEIVE AMPLIFIER (PINS IR AND RX) Zi input impedance Gv(RX) voltage gain from pin IR to pin RX VIR = 4 mV (RMS) 32.4 33.4 34.4 dB ∆Gv(RX) voltage gain reduction of receive amplifier internal MUTE active − 80 − dB ∆Gv(RX)(f) voltage gain variation with frequency f = 300 to 3400 Hz; referenced to f = 1 kHz − ±0.2 − dB ∆Gv(RX)(T) voltage gain variation with temperature Tamb = −25 to +75 °C; − referenced to Tamb = 25 °C ±0.3 − dB Io(RX)(max) maximum source and sink current on pin RX (peak value) IP = 0 mA; sine wave drive 50 − − µA IP = 0 mA; sine wave drive; 0.4 without RL2; THD = 2% − − V −86 − dBVp VRX(max)(rms) maximum receiving signal on pin RX (RMS value) Vn(RX)(rms) noise output voltage at pin RX pin IR open-circuit; − (RMS value) RL2 = 10 kΩ; psophometrically weighted (P53 curve) EARPIECE AMPLIFIER (PINS GAR AND QR) Gv(QR) voltage gain from pin RX to pin QR VIR = 4 mV (RMS); RE1 = RGAR = 100 kΩ − 0 − dB ∆Gv(QR) voltage gain setting range RE1 = 100 kΩ −14 − +12 dB IP = 0 mA; sine wave drive; 0.3 RL1 = 150 Ω; THD = 2% 0.38 − V IP = 0 mA; sine wave drive; 0.46 RL1 = 450 Ω; THD = 2% 0.56 − V IR open-circuit; − RL1 = 150 Ω; RE1 = RGAR = 100 kΩ; psophometrically weighted (P53 curve) −86 − dBVp − −98 − dBVp VQR(max)(rms) maximum receiving signal on pin QR (RMS value) Vn(QR)(rms) noise output voltage at pin QR (RMS value) RE1 = 100 kΩ; RGAR = 25 kΩ 2000 May 19 35 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions SYMBOL PARAMETER UBA2050(A); UBA2051(A;C) CONDITIONS MIN. TYP. MAX. UNIT Automatic gain control (pin AGC) Iline = 85 mA; referenced to − Iline = 15 mA 6.0 − dB highest line current for maximum gain − 23 − mA lowest line current for minimum gain − 59 − mA − 0.5VDD − V − −6 − kΩ 0.2VDD V ∆Gv(trx) voltage gain control range for microphone and receive amplifiers Istart Istop Oscillator (pin XTAL) VXTAL DC voltage level Re(Zi) real part of input impedance of pin XTAL VXTAL = 100 mV (RMS); fxtal = 3.57 MHz Control inputs (pins CE/CSI and CE/FDI) VIL LOW-level input voltage GND − 0.4 − VIH HIGH-level input voltage 0.8VDD − VDD + 0.4 V ILI input leakage current −500 − +500 nA GND < Vi < VDD Keyboard inputs/outputs (pins C1 to C4, R1 to R4); note 2 VIL LOW-level input voltage 0 − 0.2VDD V VIH HIGH-level input voltage 0.8VDD − VDD V IOL port sink current LOW VOL = 0.15 V 0.7 1.6 − mA IOH1 port pull-up source 1 current HIGH VOH = VIH(min) 15 35 − µA VOL = VIL(max) − 70 140 µA port pull-up source 2 current HIGH VOH = VIH(min) 30 80 − nA VOL = VIL(max) − 150 300 nA IOH2 Control output (pin DP/FL) ILI input leakage current GND < Vi < VDD −500 − +500 nA IOL port sink current LOW Vo = 0.15 V 1 2.5 − mA Control outputs (pins DMO, KT and LED) IOL port sink current LOW Vo = 0.4 V 1.5 4 − mA IOH port source current HIGH Vo = VDD − 0.15 V −1 −2 − mA DTMF/ringer output TONE GENERATOR (PIN MDY/TONE); note 3 Io maximum output current 70 100 − µA VHG(rms) high group frequency voltage (RMS value) DTMF mode − 181 − mV VLG(rms) low group frequency voltage (RMS value) DTMF mode − 142 − mV GV pre-emphasis of group 1.5 2.0 2.5 dB VDC DC voltage level − 0.5VDD − V 2000 May 19 36 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions SYMBOL PARAMETER Zo output impedance THD total harmonic distortion UBA2050(A); UBA2051(A;C) CONDITIONS MIN. TYP. MAX. UNIT − 100 500 Ω note 4 − −25 − dB TRANSMIT CHANNEL (PIN LN) VHG(LN)(rms) high group frequency voltage (RMS value) RDTMF1 = 20 kΩ; RDTMF2 = 2.74 kΩ 353 435 536 mV VLG(LN)(rms) low group frequency voltage (RMS value) RDTMF1 = 20 kΩ; RDTMF2 = 2.74 kΩ 277 341 420 mV Key [8] − 3.2 − V Key [7] − 2.0 − V Key [6] − 1.4 − V Key [5] − 1.1 − V MDY output (pin MDY/TONE) Vo(p-p) ringer volume output voltage (peak-to-peak value) VDD = 3.3 V; note 5 Notes 1. When this level is reached at rising VDD, the internal reset signal is deactivated. There is no hysteresis in the switching level, only hysteresis in the time domain. 2. At start-up the output has a pull-up source IOH2 for detection of the resistor options. After initializing the output pull-up source will be IOH1. 3. MDY/TONE has three modes: a) In speech mode or DTMF mode: 0.5VDD output. b) In ringer mode: push-pull output stage. c) In standby mode: high-impedance output. 4. Related to the low group frequency component (CEPT CS203 compatible). 5. In the event of a valid ringer signal present at pin CE/FDI. 2000 May 19 37 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) TIMING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Timing KEYBOARD INPUTS/OUTPUTS (PINS C1 TO C4 AND R1 TO R4) tdd keyboard depress debounce time − 20 − ms trd keyboard release debounce time − 20 − ms KEY TONE OUTPUT (PIN KT) tkt keytone time − 30 − ms fkt keytone frequency − 597 − Hz dialling rate 10 pps − 800 − ms dialling rate 20 pps − 500 − ms DIAL PULSE/FLASH OUTPUT (PIN DP/FL) tidp interdigit pause time tfho flash holdover time − 40 − ms tmho mute holdover time − 15 − ms tap access pause time resistor APT is not present − 2.0 − s resistor APT is present − 3.6 − s tifp interflash pause time − 800 − ms tpdp pre-digit pause − 40 − ms tm make time resistor MBS is not present − 40 − ms resistor MBS is present − 33 − ms resistor MBS is not present − 20 − ms resistor MBS is present − 16 − ms dialling rate 10 pps dialling rate 20 pps 2000 May 19 38 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions SYMBOL tb PARAMETER brake time UBA2050(A); UBA2051(A;C) CONDITIONS MIN. TYP. MAX. UNIT dialling rate 10 pps resistor MBS is not present − 60 − ms resistor MBS is present − 66 − ms resistor MBS is not present − 30 − ms resistor MBS is present − 33 − ms resistor FTSA is not present − 98 − ms resistor FTSA is present − 300 − ms resistor FTSA is not present − 600 − ms resistor FTSA is present − 80 − ms dialling rate 20 pps tfl flash time resistor FTSB is not present resistor FTSB is present DIAL TONE OUTPUT (PIN MDY/TONE) tt burst time − 85 − ms tp pause time − 85 − ms reset delay time − 280 − ms fring ringer detection frequency 13 − − Hz td(res)(ring) ringer response delay − − 150 ms CHIP ENABLE INPUTS (PINS CE/CSI AND CE/FDI) tRD Timing 2000 May 19 <1.5 frequency cycle; VDD > VPOR 39 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) TEST AND APPLICATION INFORMATION CVDD handbook, full pagewidth VLN Iline 220 µF RCC 619 Ω CE/CSI LN ICC C2 C3 R2 R3 VCC R4 IR 100 µF VDD DP/FL RGAR UBA205xx CE/FDI MDY/TONE RE1 RX REG VDTMF CGAR 100 kΩ DTMF 600 Ω R L1 CGARS GAR MIC+ Zline Cear QR VMIC VO 100 µF IDD MIC− Iline CVCC AGC SLPE CREG 4.7 µF GND RSLPE 20 Ω R1 C1 XTAL S1 X1 3.58 MHz 100 nF RL2 10 kΩ FCA135 V Voltage gain defined as Gv = 20 log ------O- ; VI = VMIC or VDTMF. VI Microphone gain: S1 = open. DTMF gain and confidence tone: S1 = closed. Inputs not being tested should be open-circuit. Only pins common to UBA205xx are represented. Pin 4 must be open-circuit. Fig.32 Test circuit for defining transmit gains. 2000 May 19 40 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) CVDD handbook, full pagewidth 220 µF C VCC RCC VLN Iline 619 Ω ICC CE/CSI LN C2 C3 R2 R3 IR 100 µF 600 Ω VQR Cear VDD RGAR 100 nF RDTMF1 20 kΩ CE/FDI MDY/TONE CGAR CGARS GAR UBA205xx MIC+ CDTMF R L1 QR MIC− VI Zline VCC 100 µF DP/FL 220 nF Iline R4 IDD RE1 100 kΩ RX DTMF REG RDTMF2 2.74 kΩ AGC SLPE CREG GND RSLPE 4.7 µF 20 Ω R1 C1 XTAL S1 X1 3.58 MHz 100 nF R L2 10 kΩ FCA136 V Voltage gain defined as Gv = 20 log ------O- ; VO = VQR or VRX. VI Receive and earpiece gains: S1 = open. Inputs not being tested should be open-circuit. Only pins common to UBA205xx are represented. Pin R4 must be open-circuit. Fig.33 Test circuit for defining receive gains and DTMF dialling levels. 2000 May 19 41 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions handbook, full pagewidth UBA2050(A); UBA2051(A;C) RCC 619 Ω C2 C3 R2 R3 R4 LN VCC IR VDD QR MIC− GAR MIC+ VCC CE/CSI UBA205xx DTMF CE/FDI VDD 10 µF MDY/TONE RX DP/FL REG AGC CREG 4.7 µF SLPE GND C1 R1 RSLPE XTAL X1 3.58 MHz 20 Ω FCA137 Inputs not being tested should be open-circuit. Only pins common to UBA205xx are represented. Pin R4 must be open-circuit. Fig.34 Test circuit for defining regulated supply (VDD) performance in ringer and trickle mode. 2000 May 19 42 IDD Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) TR1 BSP254A handbook, full pagewidth Rprot 3.9 Ω TR2 Z1 BC558 Z2 RCC A 620 Ω BZD23C (10 V) or BZV85C (10 V) R ast1 130 kΩ Cir 100 nF BZX79C (8.2 V) R2 R ast2 3.92 kΩ Rast3 R bal1 130 Ω R bal2 820 Ω 470 kΩ 392 Ω R1 RSLPE 20 Ω 470 kΩ TR3 BF420 R3 S1-2 470 kΩ RCSI LN SLPE Cbal 220 nF REG C 1 2 3 470 kΩ S1-1 CREG C 4.7 µF (25 V) IR Rtrickle AGC 4 5 15 MΩ Cring Rring DTMF A/B 1 µF D1 2.2 kΩ (2 W) BR211 (220 V) D2 BAS11 D3 BAS11 VDD B/A CVDD D4 BAS11 D5 BAS11 IC1 X1 RFDI BZX79C (18 V) DMO R4 8 3.58 MHz DP/FL 470 kΩ 7 220 µF (16 V) XTAL Z4 6 9 10 220 kΩ CE/CSI 11 R6 100 kΩ Z5 R5 H1 ringer Cvrr 22 µF (35 V) + BZX79C 100 kΩ (16 V) TR4 BC547 CE/FDI D6 BAS45 Rdtmf2 TR5 BC557 Rmdy TR6 BC547 Rvol Rdtmf1 Cdtmf 20 kΩ 100 nF MDY/TONE 13 2.74 kΩ KT H2 keytone + 14 100 kΩ MGT053 12 kΩ Fig.35 Application of the UBA2050 (continued in Fig.36). 2000 May 19 12 43 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions handbook, full pagewidth UBA2050(A); UBA2051(A;C) A R feed 1 kΩ 100 µF (10 V) CVCC 47 µF (25 V) C feed Rmicp 28 27 25 24 MIC+ R tx1 18 nF 8.2 kΩ C tx2 22 kΩ 18 nF 22 kΩ RX 100 kΩ 1 nF 20 Rmicm 1 kΩ RGAR GAR 47 kΩ 100 pF QR GND IC1 21 MIC1 RE1 10 µF (16 V) Cear 22 + R tx2 CGARS CGAR 23 C tx1 MIC− R tx3 26 1 kΩ VCC earpiece 1 2 3 4 5 6 7 8 9 */T 0 # R1 R2 R3 19 R4 P->T 17 C1 LNR/P 16 1 2 3 4 5 6 7 8 18 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 RMBS RAPT RPPS RPTS RMMS RFTSA RFTSB MBS APT PPS PTS MMS FTSA FTSB 1 MΩ (7×) C2 R 15 C3 MGT054 Fig.36 Application of the UBA2050 (continued from Fig.35). 2000 May 19 44 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions handbook, full pagewidth UBA2050(A); UBA2051(A;C) TR1 BSP254A Rprot 3.9 Ω TR2 RCC BZD23C (10 V) or BZV85C (10 V) Z1 BC558 Z2 BZX79C (4.3 V) Z3 R ast1 130 kΩ Cir TR7 BSN254A BZX79C (8.2 V) R2 3.92 kΩ Rast3 DMO R1 100 nF R ast2 RDMO 470 kΩ 470 kΩ 392 Ω R bal1 130 Ω R bal2 820 Ω RSLPE 20 Ω 470 kΩ TR3 BF420 R3 A 620 Ω LN Cbal 220 nF SLPE 1 2 220 kΩ RCSI S1-2 C REG 3 470 kΩ S1-1 IR CREG C Rtrickle AGC 4 5 15 MΩ Cring A/B 1 µF D1 Rring DTMF 2.2 kΩ (2 W) BR211 (220 V) D2 BAS11 VDD D3 BAS11 B/A CVDD D4 BAS11 D5 BAS11 IC1 X1 BZX79C (15 V) 470 kΩ DMO R4 8 3.58 MHz DP/FL RFDI 7 220 µF (16 V) XTAL Z4 6 DMO 9 10 220 kΩ CE/CSI 11 R6 100 kΩ R5 H1 ringer Cvrr 22 µF (35 V) + 100 kΩ CE/FDI Z5 D6 BZX79C (16 V) BAS45 TR4 BC547 Rdtmf2 Rdtmf1 Cdtmf 20 kΩ 100 nF MDY/TONE 14 Rmdy TR6 BC547 Rvol 13 2.74 kΩ C4 TR5 BC557 12 100 kΩ B 12 kΩ MGT055 Fig.37 Application of the UBA2051 (continued in Fig.38). 2000 May 19 45 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions handbook, full pagewidth UBA2050(A); UBA2051(A;C) A R feed 1 kΩ 100 µF (10 V) C VCC C feed 47 µF (25 V) Rmicp 28 27 MIC− 8.2 kΩ R tx3 26 25 24 MIC+ RX C tx1 R tx1 18 nF 22 kΩ C tx2 R tx2 18 nF 22 kΩ RE1 CGARS 100 kΩ 1 nF MEM 20 Rmicm 1 kΩ 100 pF RGAR1 Cgb 22.1 kΩ 1 µF (50 V) RGAR2 10 µF (16 V) 22.1 kΩ S3 earpiece GND IC1 21 MIC1 QR Cear 22 + GAR CGAR 23 1 kΩ VCC 1 2 3 R1 M1 4 5 6 M2 7 8 9 M3 */T 0 # Rgb1 18.2 kΩ Rgb3 3.65 kΩ Rgb2 7.15 kΩ R2 GAIN BOOST R3 19 R4 P->T 17 C1 LNR/P 16 1 2 3 4 5 6 7 8 18 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 RMBS RAPT RPPS RPTS RMMS RFTSA RFTSB MBS APT PPS PTS MMS FTSA FTSB 1 MΩ (7×) C2 R 15 C3 STORE C4 MGT056 B Fig.38 Application of the UBA2051 (continued from Fig.37). 2000 May 19 46 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) PACKAGE OUTLINE SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 28 15 Q A2 A (A 3) A1 pin 1 index θ Lp L 14 1 e w M bp 0 detail X 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013 2000 May 19 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 47 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 2000 May 19 48 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(1) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 May 19 49 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS (1) Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2000 May 19 50 Philips Semiconductors Product specification One-chip telephone ICs with speech, dialler and ringer functions UBA2050(A); UBA2051(A;C) NOTES 2000 May 19 51 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 403502/02/pp52 Date of release: 2000 May 19 Document order number: 9397 750 06723