PHILIPS TEA1094AT

INTEGRATED CIRCUITS
DATA SHEET
TEA1094; TEA1094A
Hands free IC
Product specification
Supersedes data of 1996 Mar 11
File under Integrated Circuits, IC03
1996 Jul 15
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
FEATURES
APPLICATIONS
• Low power consumption
• Mains, battery or line-powered telephone sets with
hands-free/listening-in functions
• Power-down function (TEA1094A only)
• Cordless telephones
• Microphone channel with:
– externally adjustable gain
• Answering machines
– microphone mute function.
• Fax machines.
• Loudspeaker channel with:
– externally adjustable gain
GENERAL DESCRIPTION
– dynamic limiter to prevent distortion
The TEA1094 and TEA1094A are bipolar circuits intended
for use in mains, battery or line-powered telephone sets,
cordless telephones, answering machines and Fax
machines. In conjunction with a member of the TEA106X,
TEA111X families of transmission circuits, the devices
offer a hands-free function. They incorporate a
microphone amplifier, a loudspeaker amplifier and a
duplex controller with signal and noise monitors on
both channels.
– rail-to-rail output stage for single-ended load drive
– logarithmic volume control via linear potentiometer
– loudspeaker mute function.
• Duplex controller consisting of:
– signal envelope and noise envelope monitors for both
channels with:
externally adjustable sensitivity
externally adjustable signal envelope time constant
externally adjustable noise envelope time constant
– decision logic with:
externally adjustable switch-over timing
externally adjustable idle mode timing
externally adjustable dial tone detector in
receive channel
– voice switch control with:
adjustable switching range
constant sum of gain during switching
constant sum of gain at different volume settings.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
TEA1094
DIP28
plastic dual in-line package; 28 leads (600 mil)
SOT117-1
TEA1094A
DIP24
plastic dual in-line package; 24 leads (600 mil)
SOT101-1
TEA1094T
SO28
plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
TEA1094AT
SO24
plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
TEA1094AM
SSOP24
plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
1996 Jul 15
2
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
QUICK REFERENCE DATA
VBB = 5 V; VGND = 0 V; f = 1 kHz; Tamb = 25 °C; MUTET = LOW; PD = LOW (TEA1094A only); RL = 50 Ω; RVOL = 0 Ω;
measured in test circuit of Fig.12; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VBB
supply voltage
3.3
−
12.0
V
IBB
current consumption from pin VBB
−
3.1
4.4
mA
Gvtx
voltage gain from pin MIC to
pin MOUT in transmit mode
13
15.5
18
dB
∆Gvtxr
voltage gain adjustment with RGAT
−15.5
−
+15.5
dB
Gvrx
voltage gain in receive mode; the
difference between RIN1 and RIN2
to LSP
16
18.5
21
dB
∆Gvrxr
voltage gain adjustment with RGAR
VO(p-p)
output voltage (peak-to-peak value)
SWRA
VMIC = 1 mV (RMS);
RGAT = 30.1 kΩ
VRIN = 20 mV (RMS);
RGAR = 66.5 kΩ;
RL = 50 Ω
−18.5
−
+14.5
dB
−
7.5
−
V
switching range
−
40
−
dB
∆SWRA
switching range adjustment with RSWR
referenced to RSWR = 365 kΩ
−40
−
+12
dB
Tamb
operating ambient temperature
−25
−
+75
°C
VRIN = 150 mV (RMS);
RGAR = 374 kΩ;
RL = 33 Ω; VBB = 9.0 V;
note 1
Note
1. Corresponds to 200 mW output power.
1996 Jul 15
3
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
BLOCK DIAGRAM
handbook, full pagewidth
10
(7)
(13)
VBB
TEA1094
TEA1094A
VBB
PD(1)
19
(15) MUTET
CMIC
GND
MICROPHONE CHANNEL
22
(18) MIC
V
I
I
V
RMIC
RTSEN
28
(24)
TSEN
8
(6)
GAT
21
(17)
MOUT
20
(16)
MICGND
18
(14)
IDT
16
(12)
SWT
14
(11)
RGAT
to TEA106x
RIDT
LOG
DUPLEX
CONTROLLER
CTSEN
Vref
BUFF
CSWT
27
(23) TENV
CTENV
BUFF
26
(22)
CTNOI
13 mV
ATTENUATOR
TNOI
23
(19) RNOI
CRNOI
LOGIC
STAB
13
(10)
RSTAB
SWR
12
(9)
RSWR
RIN1
2
(2)
RIN2
3
(3)
VOICE
SWITCH
BUFF
24
(20) RENV
CRENV
13 mV
BUFF
RRSEN
25
(21) RSEN
LOG
CRSEN
RGAR
5
(4)
6
(5)
Vdt
GAR
2
VBB
LSP
V
I
I
CLSP
1
(1)
DLC/MUTER
V
VOLUME VOL
CONTROL
DYNAMIC
LIMITER
CDLC
11
(8)
RVOL
LOUDSPEAKER CHANNEL
MGE436
The pin numbers given in parenthesis are for the TEA1094A.
(1) TEA1094A only.
Fig.1 Block diagram.
1996 Jul 15
4
from
TEA106x
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
PINNING
PINS
SYMBOL
DESCRIPTION
TEA1094
TEA1094A
DLC/MUTER
1
1
dynamic limiter timing adjustment; receiver channel mute input
RIN1
2
2
receiver amplifier input 1
RIN2
3
3
receiver amplifier input 2
n.c.
4
−
not connected
GAR
5
4
receiver gain adjustment
LSP
6
5
loudspeaker amplifier output
n.c.
7
−
not connected
GND
8
6
ground reference
n.c.
9
−
not connected
VBB
10
7
supply voltage
VOL
11
8
receiver volume adjustment
SWR
12
9
switching range adjustment
STAB
13
10
reference current adjustment
SWT
14
11
switch-over timing adjustment
n.c.
15
−
not connected
IDT
16
12
idle mode timing adjustment
PD
−
13
power-down input
n.c.
17
−
not connected
MICGND
18
14
ground reference for the microphone amplifier
MUTET
19
15
transmit channel mute input
MOUT
20
16
microphone amplifier output
GAT
21
17
microphone gain adjustment
MIC
22
18
microphone input
RNOI
23
19
receive noise envelope timing adjustment
RENV
24
20
receive signal envelope timing adjustment
RSEN
25
21
receive signal envelope sensitivity adjustment
TNOI
26
22
transmit noise envelope timing adjustment
TENV
27
23
transmit signal envelope timing adjustment
TSEN
28
24
transmit signal envelope sensitivity adjustment
1996 Jul 15
5
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
handbook, halfpage
handbook, halfpage
DLC/MUTER
1
28 TSEN
DLC/MUTER
1
24 TSEN
RIN1
2
27 TENV
RIN1
2
23 TENV
RIN2
3
26 TNOI
RIN2
3
22 TNOI
n.c.
4
25 RSEN
GAR
4
21 RSEN
GAR
5
24 RENV
LSP
5
20 RENV
LSP
6
23 RNOI
GND
6
n.c.
7
19 RNOI
TEA1094A
22 MIC
VBB
7
18 MIC
VOL
8
17 GAT
9
16 MOUT
TEA1094
GND
8
21 GAT
n.c.
9
20 MOUT
SWR
VBB 10
19 MUTET
STAB 10
15
MUTET
VOL 11
18 MICGND
SWT 11
14
MICGND
IDT 12
13
PD
SWR 12
17 n.c.
STAB 13
16 IDT
SWT 14
15 n.c.
MGE435
MGE434
Fig.2 Pin configuration (TEA1094).
Fig.3 Pin configuration (TEA1094A).
has to be decreased to avoid howling. This is achieved by
the duplex controller. The duplex controller of the
TEA1094 and TEA1094A detects which channel has the
‘largest’ signal and then controls the gain of the
microphone amplifier and the loudspeaker amplifier so that
the sum of the gains remains constant.
As a result, the circuit can be in three stable modes:
FUNCTIONAL DESCRIPTION
General
The values given in the functional description are typical
values unless otherwise specified.
A principle diagram of the TEA106X is shown on the left
side of Fig.4. The TEA106X is a transmission circuit of the
TEA1060 family intended for hand-set operation.
It incorporates a receiving amplifier for the earpiece, a
transmit amplifier for the microphone and a hybrid.
For more details on the TEA1060 family, please refer to
“data Handbook IC03”. The right side of Fig.4 shows a
principle diagram of the TEA1094 and TEA1094A,
hands-free add-on circuits with a microphone amplifier, a
loudspeaker amplifier and a duplex controller.
1. Transmit mode (Tx mode).
The gain of the microphone amplifier is at its maximum
and the gain of the loudspeaker amplifier is at its
minimum.
2. Receive mode (Rx mode).
The gain of the loudspeaker amplifier is at its
maximum and the gain of the microphone amplifier is
at its minimum.
As can be seen from Fig.4, a loop is formed via the
sidetone network in the transmission circuit and the
acoustic coupling between loudspeaker and microphone
of the hands-free circuit. When this loop gain is greater
than 1, howling is introduced. In a full duplex application,
this would be the case.
The loop-gain has to be much lower than 1 and therefore
1996 Jul 15
3. Idle mode.
The gain of the amplifiers is halfway between their
maximum and minimum value.
The difference between the maximum gain and minimum
gain is called the switching range.
6
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
handbook, full pagewidth
acoustic
coupling
telephone
line
DUPLEX
CONTROL
HYBRID
sidetone
TEA1094
TEA1094A
TEA106x
MGE438
Fig.4 Hands-free telephone set principles.
Switch-over from one mode to the other is smooth and
click-free. The output capability at pin MOUT is
20 µA (RMS).
Supply: pins VBB, GND and PD
The TEA1094 and TEA1094A must be supplied with an
external stabilized voltage source between pins VBB and
GND. In the idle mode, without any signal, the internal
supply current is 3.1 mA at VBB = 5 V.
In the transmit mode, the overall gain of the microphone
amplifier (from pins MIC to MOUT) can be adjusted from
0 dB up to 31 dB to suit specific application requirements.
The gain is proportional to the value of RGAT and equals
15.5 dB with RGAT = 30.1 kΩ.
To reduce the current consumption during pulse dialling or
register recall (flash), the TEA1094A is provided with a
power-down (PD) input. When the voltage on PD is HIGH
the current consumption from VBB is 180 µA.
A capacitor must be connected in parallel with RGAT to
ensure stability of the microphone amplifier. Together with
RGAT, it also provides a first-order low-pass filter.
Microphone channel: pins MIC, GAT, MOUT, MICGND
and MUTET (see Fig.5)
By applying a HIGH level on pin MUTET, the microphone
amplifier is muted and the TEA1094 and TEA1094A are
automatically forced into the receive mode.
The TEA1094 and TEA1094A have an asymmetrical
microphone input MIC with an input resistance of 20 kΩ.
The gain of the input stage varies according to the mode
of the TEA1094 and TEA1094A. In the transmit mode, the
gain is at its maximum; in the receive mode, it is at its
minimum and in the idle mode, it is halfway between
maximum and minimum.
1996 Jul 15
7
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
handbook, full pagewidth
19 MUTET
GAT 21
(15)
VBB
CMIC
(17)
22 MIC
(18)
V
I
I
V
RGAT
CGAT
MOUT 20
to TEA106X
(16)
RMIC
to
envelope
detector
from
voice
switch
to
logic
MICGND
18
(14)
MGD343
The pin numbers given in parenthesis refer to the TEA1094A.
Fig.5 Microphone channel.
Loudspeaker channel
handbook, full pagewidth
RGAR
5
(4) GAR
CGAR
6
(5) LSP
to
logic
to/from
voice switch
to
envelope
detector
2
VBB
V
I
I
3
RIN2 (3)
V
CLSP
1
(1) DLC/MUTER
DYNAMIC
LIMITER
2
RIN1 (2)
VOLUME
CONTROL
11
VOL (8)
RVOL
CDLC
MGE437
The pin numbers given in parenthesis refer to the TEA1094A.
Fig.6 Loudspeaker channel.
1996 Jul 15
8
from
TEA106x
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
When the supply voltage drops below an internal threshold
voltage of 2.9 V, the gain of the loudspeaker amplifier is
rapidly reduced (approximately 1 ms). When the supply
voltage exceeds 2.9 V, the gain of the loudspeaker
amplifier is increased again.
LOUDSPEAKER AMPLIFIER: PINS RIN1, RIN2, GAR AND LSP
The TEA1094 and TEA1094A have symmetrical inputs for
the loudspeaker amplifier with an input resistance of 40 kΩ
between RIN1 and RIN2 (2 × 20 kΩ). The input stage can
accommodate signals up to 390 mV (RMS) at room
temperature for 2% of total harmonic distortion (THD).
The gain of the input stage varies according to the mode
of the TEA1094 and TEA1094A. In the receive mode, the
gain is at its maximum; in the transmit mode, it is at its
minimum and in the idle mode, it is halfway between
maximum and minimum. Switch-over from one mode to
the other is smooth and click-free. The rail-to-rail output
stage is designed to power a loudspeaker connected as a
single-ended load (between LSP and GND).
By forcing a level lower than 0.2 V on pin DLC/MUTER, the
loudspeaker amplifier is muted and the TEA1094
(TEA1094A) is automatically forced into the transmit
mode.
Duplex controller
SIGNAL AND NOISE ENVELOPE DETECTORS: PINS TSEN,
TENV, TNOI, RSEN, RENV AND RNOI
The signal envelopes are used to monitor the signal level
strength in both channels. The noise envelopes are used
to monitor background noise in both channels. The signal
and noise envelopes provide inputs for the decision logic.
The signal and noise envelope detectors are shown in
Fig.7.
In the receive mode, the overall gain of the loudspeaker
amplifier can be adjusted from 0 dB up to 33 dB to suit
specific application requirements. The gain from
RIN1 and RIN2 to LSP is proportional to the value of RGAR
and equals 18.5 dB with RGAR = 66.5 kΩ. A capacitor
connected in parallel with RGAR can be used to provide a
first-order low-pass filter.
For the transmit channel, the input signal at MIC is 40 dB
amplified to TSEN. For the receive channel, the differential
signal between RIN1 and RIN2 is 0 dB amplified to RSEN.
The signals from TSEN and RSEN are logarithmically
compressed and buffered to TENV and RENV
respectively. The sensitivity of the envelope detectors is
set with RTSEN and RRSEN. The capacitors connected in
series with the two resistors block any DC component and
form a first-order high-pass filter. In the basic application,
see Fig.13, it is assumed that VMIC = 1 mV (RMS) and
VRIN = 100 mV (RMS) nominal and both RTSEN and RRSEN
have a value of 10 kΩ. With the value of CTSEN and CRSEN
at 100 nF, the cut-off frequency is at 160 Hz.
VOLUME CONTROL: PIN VOL
The loudspeaker amplifier gain can be adjusted with the
potentiometer RVOL. A linear potentiometer can be used to
obtain logarithmic control of the gain at the loudspeaker
amplifier. Each 950 Ω increase of RVOL results in a gain
loss of 3 dB. The maximum gain reduction with the volume
control is internally limited to the switching range.
DYNAMIC LIMITER: PIN DLC/MUTER
The dynamic limiter of the TEA1094 and TEA1094A
prevents clipping of the loudspeaker output stage and
protects the operation of the circuit when the supply
voltage at VBB falls below 2.9 V.
The buffer amplifiers leading the compressed signals to
TENV and RENV have a maximum source current of
120 µA and a maximum sink current of 1 µA. Together with
the capacitor CTENV and CRENV, the timing of the signal
envelope monitors can be set. In the basic application, the
value of both capacitors is 470 nF. Because of the
logarithmic compression, each 6 dB signal increase
means 18 mV increase of the voltage on the envelopes
TENV or RENV at room temperature. Thus, timings can be
expressed in dB/ms. At room temperature, the 120 µA
sourced current corresponds to a maximum rise-slope of
the signal envelope of 85 dB/ms. This is sufficient to track
normal speech signals. The 1 µA current sunk by TENV or
RENV corresponds to a maximum fall-slope of 0.7 dB/ms.
This is sufficient for a smooth envelope and also eliminates
the effect of echoes on switching behaviour.
Hard clipping of the loudspeaker output stage is prevented
by rapidly reducing the gain when the output stage starts
to saturate. The time in which gain reduction is effected
(clipping attack time) is approximately a few milliseconds.
The circuit stays in the reduced gain mode until the peaks
of the loudspeaker signals no longer cause saturation.
The gain of the loudspeaker amplifier then returns to its
normal value within the clipping release time (typically
250 ms). Both attack and release times are proportional to
the value of the capacitor CDLC. The total harmonic
distortion of the loudspeaker output stage, in reduced gain
mode, stays below 5% up to 10 dB (minimum) of input
voltage overdrive [providing VRIN is below 390 mV (RMS)].
1996 Jul 15
9
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
This is small enough to track background noise and not to
be influenced by speech bursts. The 120 µA current that is
sunk corresponds to a maximum fall-slope of
approximately 8.5 dB/ms. However, during the decrease
of the signal envelope, the noise envelope tracks the
signal envelope so it will never fall faster than
approximately 0.7 dB/ms. The behaviour of the signal
envelope and noise envelope monitors is illustrated in
Fig.8.
To determine the noise level, the signals on TENV and
RENV are buffered to TNOI and RNOI. These buffers have
a maximum source current of 1 µA and a maximum sink
current of 120 µA. Together with the capacitors CTNOI and
CRNOI, the timing can be set. In the basic application of
Fig.13 the value of both capacitors is 4.7 µF. At room
temperature, the 1 µA sourced current corresponds to a
maximum rise-slope of the noise envelope of
approximately 0.07 dB/ms.
handbook, full pagewidth
DUPLEX CONTROLLER
to logic
to logic
LOG
LOG
from
microphone
amplifier
from
loudspeaker
amplifier
TSEN
TENV
28
(24)
27
(23)
TNOI
26
(22)
RSEN
RENV
25
(21)
24
(20)
RTSEN
CTSEN
RNOI
23
(19)
RRSEN
CTENV
CTNOI
CRSEN
CRENV
MGD223
The pin numbers given in parenthesis refer to the TEA1094A.
Fig.7 Signal and noise envelope detectors.
4 mV (RMS)
handbook, full pagewidth
MBG354
1 mV (RMS)
INPUT SIGNAL
SIGNAL ENVELOPE
A
36 mV
A
B
B
A: 85 dB/ms
B: 0.7 dB/ms
NOISE ENVELOPE
C
B: 0.7 dB/ms
C: 0.07 dB/ms
B
36 mV
C
B
time
Fig.8 Signal and noise envelope waveforms.
1996 Jul 15
CRNOI
10
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
DECISION LOGIC: PINS IDT AND SWT
handbook, full pagewidth
16
IDT (12)
DUPLEX CONTROLLER
Vref
27
(23) TENV
LOGIC(1)
RIDT
TNOI
26
(22)
14
SWT (11)
13 mV
ATTENUATOR
CSWT
24
(20) RENV
RNOI
23
(19)
X
X
1
1
− 10 µA
X
1
0
X
+ 10 µA
1
X
0
X
+ 10 µA
X
X
1
0
0
0
0
0
X
0
13 mV
19
(15) MUTET
Vdt
from dynamic
limiter
MGD224
The pin numbers given in parenthesis refer to the TEA1094A.
(1) When MUTET = HIGH, +10 µA is forced.
When DLC/MUTER < 0.2 V, −10 µA is forced.
Fig.9 Decision logic.
The TEA1094 and TEA1094A select their modes of
operation (transmit, receive or idle mode) by comparing
the signal and the noise envelopes of both channels. This
is executed by the decision logic. The resulting voltage on
pin SWT is the input for the voice-switch.
As a result, the signal envelope on TENV is formed mainly
by the loudspeaker signal. To correct this, an attenuator is
connected between TENV and the TENV/RENV
comparator. Its attenuation equals that applied to the
microphone amplifier.
To facilitate the distinction between signal and noise, the
signal is considered as speech when its envelope is more
than 4.3 dB above the noise envelope. At room
temperature, this is equal to a voltage difference
VENV − VNOI = 13 mV. This so called speech/noise
threshold is implemented in both channels.
When a dial tone is present on the line, without monitoring,
the tone would be recognized as noise because it is a
signal with a constant amplitude. This would cause the
TEA1094 (TEA1094A) to go into the idle mode and the
user of the set would hear the dial tone fade away. To
prevent this, a dial tone detector is incorporated which, in
standard applications, does not consider input signals
between RIN1 and RIN2 as noise when they have a level
greater than 127 mV (RMS). This level is proportional to
RRSEN.
The signal on MIC contains both speech and the signal
coming from the loudspeaker (acoustic coupling). When
receiving, the contribution from the loudspeaker overrules
the speech.
1996 Jul 15
11
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
As can be seen from Fig.9, the output of the decision logic
is a current source. The logic table gives the relationship
between the inputs and the value of the current source.
It can charge or discharge the capacitor CSWT with a
current of 10 µA (switch-over). If the current is zero, the
voltage on SWT becomes equal to the voltage on IDT via
the high-ohmic resistor RIDT (idling). The resulting voltage
difference between SWT and IDT determines the mode of
the TEA1094 (TEA1094A) and can vary between
−400 and +400 mV (see Table 1).
The difference between maximum and minimum is the so
called switching range. This range is determined by the
ratio of RSWR and RSTAB and is adjustable between
0 and 52 dB. RSTAB should be 3.65 kΩ and sets an
internally used reference current. In the basic application
diagram given in Fig.13, RSWR is 365 kΩ which results in a
switching range of 40 dB. The switch-over behaviour is
illustrated in Fig.11.
In the receive mode, the gain of the loudspeaker amplifier
can be reduced using the volume control. Since the
voice-switch keeps the sum of the gains constant, the gain
of the microphone amplifier is increased at the same time
(see dashed curves in Fig.11). In the transmit mode,
however, the volume control has no influence on the gain
of the microphone amplifier or the gain of the loudspeaker
amplifier. Consequently, the switching range is reduced
when the volume is reduced. At maximum reduction of
volume, the switching range becomes 0 dB.
Table 1 Modes of TEA1094; TEA1094A
VSWT − VIDT (mV)
MODE
<−180
transmit mode
0
idle mode
>180
receive mode
The switch-over timing can be set with CSWT, the idle mode
timing with CSWT and RIDT. In the basic application given in
Fig.13, CSWT is 220 nF and RIDT is 2.2 MΩ. This enables a
switch-over time from transmit to receive mode or
vice-versa of approximately 13 ms (580 mV swing on
SWT). The switch-over time from idle mode to transmit
mode or receive mode is approximately 4 ms (180 mV
swing on SWT).
DUPLEX CONTROLLER
to
microphone
amplifier
The switch-over time, from receive mode or transmit mode
to idle mode, is equal to 4 × RIDTCSWT and is
approximately 2 seconds (idle mode time).
The inputs MUTET and DLC/MUTER overrule the decision
logic. When MUTET goes HIGH, the capacitor CSWT is
charged with 10 µA thus resulting in the receive mode.
When the voltage on pin DLC/MUTER goes lower than
0.2 V, the capacitor CSWT is discharged with 10 µA thus
resulting in the transmit mode.
Gvtx + Gvrx = C(1)
VOICE SWITCH
from
volume
control
VOICE-SWITCH: PINS STAB AND SWR
A diagram of the voice-switch is illustrated in Fig.10. With
the voltage on SWT, the TEA1094 (TEA1094A)
voice-switch regulates the gains of the transmit and the
receive channel so that the sum of both is kept constant.
13 R
STAB
STAB (10)
RSWR
SWR
12
(9)
to
loudspeaker
amplifier
MGD225
In the transmit mode, the gain of the microphone amplifier
is at its maximum and the gain of the loudspeaker amplifier
is at its minimum. In the receive mode, the opposite
applies. In the idle mode, both microphone and
loudspeaker amplifier gains are halfway.
1996 Jul 15
from
SWT
The pin numbers given in parenthesis refer to the TEA1094A.
(1) C = constant.
Fig.10 Voice switch.
12
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
MBG351
idle
mode
handbook, halfpage
Tx mode
Gvtx, Gvrx
(10 dB/div)
Rx mode
RVOL
(Ω)
Gvtx
5700
3800
1900
0
0
1900
3800
5700
Gvrx
−400
−200
0
+200
+400
VSWT − VIDT (mV)
Fig.11 Switch-over behaviour.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Vn(max)
maximum voltage on all pins; except pins
VBB, RIN1 and RIN2
VGND − 0.4
VBB + 0.4
V
VRIN(max)
maximum voltage on pins RIN1 and RIN2
VGND − 1.2
VBB + 0.4
V
VBB(max)
maximum voltage on pin VBB
VGND − 0.4
12.0
V
Ptot
total power dissipation
TEA1094
−
1000
mW
TEA1094A
−
910
mW
TEA1094T
−
625
mW
TEA1094AT
−
590
mW
TEA1094AM
−
438
mW
Tamb = 75 °C
Tstg
IC storage temperature
−40
+125
°C
Tamb
operating ambient temperature
−25
+75
°C
1996 Jul 15
13
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
UNIT
TEA1094
45
K/W
TEA1094A
50
K/W
TEA1094T
70
K/W
TEA1094AT
75
K/W
TEA1094AM
104
K/W
thermal resistance from junction to ambient in free air
CHARACTERISTICS
VBB = 5 V; VGND = 0 V; f = 1 kHz; Tamb = 25 °C; MUTET = LOW; PD = LOW (TEA1094A only); RL = 50 Ω; RVOL = 0 Ω;
measured in test circuit of Fig.12; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (VBB, GND and PD)
VBB
supply voltage
3.3
−
12.0
V
IBB
current consumption from pin VBB
−
3.1
4.4
mA
0.3
V
POWER-DOWN INPUT PD (TEA1094A ONLY)
VIL
LOW level input voltage
VGND − 0.4 −
VIH
HIGH level input voltage
1.5
−
VBB + 0.4 V
IPD
input current
PD = HIGH
−
2.5
5
µA
IBB(PD)
current consumption from pin VBB
in power-down condition
PD = HIGH
−
180
240
µA
17
20
23
kΩ
13
15.5
18
dB
−15.5
−
+15.5
dB
Microphone channel (MIC, GAT, MOUT, MUTET and MICGND)
MICROPHONE AMPLIFIER
|Zi|
input impedance between
pins MIC and MICGND
Gvtx
voltage gain from pin MIC to
MOUT in transmit mode
∆Gvtxr
voltage gain adjustment with RGAT
∆GvtxT
voltage gain variation with
temperature referenced to 25 °C
VMIC = 1 mV (RMS);
Tamb = −25 to +75 °C
−
±0.3
−
dB
∆Gvtxf
voltage gain variation with
frequency referenced to 1 kHz
VMIC = 1 mV (RMS);
f = 300 to 3400 Hz
−
±0.3
−
dB
Vnotx
noise output voltage at pin MOUT
pin MIC connected to
MICGND through 200 Ω in
series with 10 µF;
psophometrically weighted
(P53 curve)
−
−100 −
1996 Jul 15
VMIC = 1 mV (RMS)
14
dBmp
Philips Semiconductors
Product specification
Hands free IC
SYMBOL
TEA1094; TEA1094A
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
TRANSMIT MUTE INPUT MUTET
VIL
LOW level input voltage
VGND − 0.4 −
VIH
HIGH level input voltage
1.5
−
VBB + 0.4 V
IMUTET
input current
MUTET = HIGH
−
2.5
5
µA
∆Gvtxm
voltage gain reduction with
MUTET active
MUTET = HIGH
−
80
−
dB
between pins RIN1 or RIN2 17
and GND
20
23
kΩ
between pins RIN1 and
RIN2
34
40
46
kΩ
VRIN = 20 mV (RMS)
16
18.5
21
dB
−18.5
−
+14.5
dB
0.3
V
Loudspeaker channel (RIN1, RIN2, GAR, LSP and DLC/MUTER)
LOUDSPEAKER AMPLIFIER
|Zi|
input impedance
Gvrx
voltage gain in receive mode;
between RIN1 and RIN2 to LSP
∆Gvrxr
voltage gain adjustment with RGAR
∆GvrxT
voltage gain variation with
temperature referenced to 25 °C
VRIN = 20 mV (RMS);
Tamb = −25 to +75 °C
−
±0.3
−
dB
∆Gvrxf
voltage gain variation with
frequency referenced to 1 kHz
VRIN = 20 mV (RMS);
f = 300 to 3400 Hz
−
±0.3
−
dB
VRIN(rms)
maximum input voltage between
RIN1 and RIN2 (RMS value)
RGAR = 11.8 kΩ; for 2%
THD in input stage
−
390
−
mV
Vnorx(rms)
noise output voltage at pin LSP
(RMS value)
inputs RIN1 and RIN2
short-circuited through
200 Ω in series with 10 µF;
psophometrically weighted
(P53 curve)
−
80
−
µV
CMRR
common mode rejection ratio
−
50
−
dB
∆Gvrxv
voltage gain variation related to
∆RVOL = 950 Ω
when total attenuation does −
not exceed the switching
range
3
−
dB
VRIN = 300 mV (RMS);
note 1
3.5
4.5
−
V
VRIN = 150 mV (RMS);
RGAR = 374 kΩ; RL = 33 Ω;
VBB = 9.0 V; note 2
−
7.5
−
V
150
500
−
mA
OUTPUT CAPABILITY
VOSE(p-p)
IOM
1996 Jul 15
output voltage
(peak-to-peak value)
maximum output current at LSP
(peak value)
15
Philips Semiconductors
Product specification
Hands free IC
SYMBOL
TEA1094; TEA1094A
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DYNAMIC LIMITER
tatt
attack time when VRIN jumps from
20 mV to 20 mV + 10 dB
RGAR = 374 kΩ
−
−
5
ms
trel
release time when VRIN jumps
from 20 mV + 10 dB to 20 mV
RGAR = 374 kΩ
−
250
−
ms
THD
total harmonic distortion at
VRIN = 20 mV + 10 dB
RGAR = 374 kΩ; t > tatt
−
0.9
5
%
VBB(th)
VBB limiter threshold
−
2.9
−
V
tatt
attack time when VBB jumps below
VBB(th)
−
1
−
ms
VGND − 0.4 −
0.2
V
MUTE RECEIVE
VDLC(th)
threshold voltage required on pin
DLC/MUTER to obtain mute
receive condition
IDLC(th)
threshold current sourced by
pin DLC/MUTER in mute receive
condition
VDLC = 0.2 V
−
100
−
µA
∆Gvrxm
voltage gain reduction in mute
receive condition
VDLC < 0.2 V
−
80
−
dB
Envelope and noise detectors (TSEN, TENV, RSEN, RENV, RNOI and TNOI)
PREAMPLIFIERS
Gv(TSEN)
voltage gain from MIC to TSEN
37.5
40
42.5
dB
Gv(RSEN)
voltage gain between RIN1 and
RIN2 to RSEN
−2.5
0
+2.5
dB
LOGARITHMIC COMPRESSOR AND SENSITIVITY ADJUSTMENT
∆Vdet(TSEN)
sensitivity detection on pin TSEN;
voltage change on pin TENV
when doubling the current from
TSEN
ITSEN = 0.8 to 160 µA
−
18
−
mV
∆Vdet(RSEN)
sensitivity detection on
pin RSEN; voltage change on
pin RENV when doubling the
current from RSEN
IRSEN = 0.8 to 160 µA
−
18
−
mV
SIGNAL ENVELOPE DETECTORS
Isource(ENV)
maximum current sourced from
pin TENV or RENV
−
120
−
µA
Isink(ENV)
maximum current sunk by
pin TENV or RENV
0.75
1
1.25
µA
∆VENV
voltage difference between
pins RENV and TENV
−
±3
−
mV
1996 Jul 15
when 10 µA is sourced
from both RSEN and
TSEN; envelope detectors
tracking; note 3
16
Philips Semiconductors
Product specification
Hands free IC
SYMBOL
TEA1094; TEA1094A
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
NOISE ENVELOPE DETECTORS
Isource(NOI)
maximum current sourced from
pins TNOI or RNOI
0.75
1
1.25
µA
Isink(NOI)
maximum current sunk by
pins TNOI or RNOI
−
120
−
µA
∆VNOI
voltage difference between
pins RNOI and TNOI
−
±3
−
mV
−
127
−
mV
when 5 µA is sourced from
both RSEN and TSEN;
noise detectors tracking;
note 3
DIAL TONE DETECTOR
VRINDT(rms)
threshold level at pins RIN1 and
RIN2 (RMS value)
Decision logic (IDT and SWT)
SIGNAL RECOGNITION
∆VSrx(th)
threshold voltage between
pins RENV and RNOI to
switch-over from receive to idle
mode
VRIN < VRINDT; note 4
−
13
−
mV
∆VStx(th)
threshold voltage between
pins TENV and TNOI to
switch-over from transmit to idle
mode
note 4
−
13
−
mV
SWITCH-OVER
Isource(SWT)
current sourced from pin SWT
when switching to receive mode
7.5
10
12.5
µA
Isink(SWT)
current sunk by pin SWT when
switching to transmit mode
7.5
10
12.5
µA
Iidle(SWT)
current sourced from pin SWT in
idle mode
−
0
−
µA
Voice switch (STAB and SWR)
−
40
−
dB
−40
−
+12
dB
voltage gain variation from
transmit mode to idle mode on
both channels
−
20
−
dB
gain tracking (Gvtx + Gvrx) during
switching, referenced to idle mode
−
±0.5
−
dB
SWRA
switching range
∆SWRA
switching range adjustment
|∆Gv|
Gtr
with RSWR referenced to
365 kΩ
Notes
1. Corresponds to 50 mW output power.
2. Corresponds to 200 mW output power.
3. Corresponds to ±1 dB tracking.
4. Corresponds to 4.3 dB noise/speech recognition level.
1996 Jul 15
17
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
handbook, full pagewidth
CSWT
220
nF
RSTAB
RIDT
2.2
MΩ
19
(15)
(13)
20
(16)
RGAT
30.1
kΩ
CGAT
CRIN1
21
(17)
2
(2)
16
(12)
MUTET
PD (1)
3.65
kΩ
IDT
14
(11)
SWT
13
(10)
STAB
3
(3)
12
(9)
SWR
8
(6)
VRIN1
10 µF
VBB
VVBB
10
(7)
GAT
RIN1
MIC
TEA1094
TEA1094A
22
(18)
CMIC
220 nF
VMIC
RIN2
220 nF
18
(14)
CVBB
MOUT
220 nF
CRIN2
RSWR
365
kΩ
GAR
5
(4)
MICGND
LSP
6
(5)
CGAR
RGAR
66.5
kΩ
GND
RSEN
RENV
25
(21)
RNOI
24
(20)
TSEN
23
(19)
100
nF
TNOI DLC/MUTER VOL
27
(23)
26
(22)
1
(1)
RTSEN
10 kΩ
RRSEN
10 kΩ
CRSEN
TENV
28
(24)
CRENV
470
nF
CRNOI
4.7
µF
CTSEN
100
nF
11
(8)
CLSP
47 µF
RVOL
CTENV
470
nF
CTNOI
4.7
µF
CDLC
RL
50 Ω
470
nF
MGE439
The pin numbers given in parenthesis refer to the TEA1094A.
(1) TEA1094A only.
Fig.12 Test circuit.
1996 Jul 15
18
LN
20
(16)
C7
MIC−
100 nF
C8
CGAT
RGAT
30.1
kΩ
21
(17)
MIC+
PD (1)
3.65
kΩ
16
(12)
MUTET
IDT
14
(11)
SWT
13
(10)
STAB
RSWR
365
kΩ
12
(9)
CVBB
SWR
10 µF
MOUT
VBB
Philips Semiconductors
19
(15)
(13)
VCC
RSTAB
RIDT
2.2
MΩ
R1
620 Ω
Hands free IC
APPLICATION INFORMATION
book, full pagewidth
1996 Jul 15
CSWT
220
nF
VVBB
10
(7)
GAT
100 nF
CRIN1
QR+
2
(2)
RIN1
100 nF
3
(3)
TEA106x
line
19
C1
100
µF
18
(14)
8
(6)
VEE
SLPE
TEA1094
TEA1094A
22 CMIC
(18)
RMIC
2.2 kΩ
100 nF
RIN2
GAR
5
(4)
MICGND
LSP
6
(5)
CGAR
RGAR
66.5
kΩ
GND
RSEN
RENV
25
(21)
RNOI
24
(20)
TSEN
23
(19)
100
nF
TNOI DLC/MUTER VOL
27
(23)
26
(22)
1
(1)
CRENV
470
nF
CRNOI
4.7
µF
CTSEN
100
nF
11
(8)
CLSP
47 µF
RVOL
RTSEN
10 kΩ
RRSEN
10 kΩ
CRSEN
TENV
28
(24)
CTENV
470
nF
CTNOI
4.7
µF
CDLC
RLSP
50 Ω
470
nF
MGE440
Fig.13 Basic application diagram.
Product specification
The pin numbers given in parenthesis refer to the TEA1094A.
(1) TEA1094A only.
TEA1094; TEA1094A
R9
20 Ω
MIC
VCC
from
microcontroller
100 µF
1 kΩ
S1
MIC−
100 nF
20
(16)
2.2 kΩ
tip
DP
DTMF
VBB
TEA1094
TEA1094A
C8
MIC+
MIC
100 nF
DTMF
MUTET
MOUT
C7b
TEA106x
MICROCONTROLLER
PD (1)
CRIN1
20
QR+
2
(2)
CVBB
19
(15)
(13)
C7a
LN
Philips Semiconductors
C1
100 µF
Hands free IC
book, full pagewidth
1996 Jul 15
R1
620 Ω
10 µF
VVBB
10
(7)
22 CMIC
(18)
RMIC
100 nF
2.2 kΩ
RIN1
100 nF
10 µF
ring
VEE
18
(14)
8
(6)
SLPE
R9
20 Ω
S2
MICGND
GND
LSP
6
(5)
CLSP
LSP
50 Ω
Fig.14 Application example.
Product specification
The pin numbers given in parenthesis refer to the TEA1094A.
(1) TEA1094A only.
TEA1094; TEA1094A
MGE441
interrupter
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
PACKAGE OUTLINES
seating plane
handbook, full
pagewidthdual in-line package; 28 leads (600 mil)
DIP28:
plastic
SOT117-1
ME
D
A2
L
A
A1
c
e
Z
w M
b1
(e 1)
b
MH
15
28
pin 1 index
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
5.1
0.51
4.0
1.7
1.3
0.53
0.38
0.32
0.23
36.0
35.0
14.1
13.7
2.54
15.24
3.9
3.4
15.80
15.24
17.15
15.90
0.25
1.7
inches
0.20
0.020
0.16
0.066
0.051
0.020
0.014
0.013
0.009
1.41
1.34
0.56
0.54
0.10
0.60
0.15
0.13
0.62
0.60
0.68
0.63
0.01
0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT117-1
051G05
MO-015AH
1996 Jul 15
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
21
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
seating plane
DIP24: plastic dual in-line package; 24 leads (600 mil)
SOT101-1
ME
D
A2
L
A
A1
c
e
Z
b1
w M
(e 1)
b
MH
13
24
pin 1 index
E
1
12
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
5.1
0.51
4.0
1.7
1.3
0.53
0.38
0.32
0.23
32.0
31.4
14.1
13.7
2.54
15.24
3.9
3.4
15.80
15.24
17.15
15.90
0.25
2.2
inches
0.20
0.020
0.16
0.066
0.051
0.021
0.015
0.013
0.009
1.26
1.24
0.56
0.54
0.10
0.60
0.15
0.13
0.62
0.60
0.68
0.63
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT101-1
051G02
MO-015AD
1996 Jul 15
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-23
22
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A
X
c
y
HE
v M A
Z
15
28
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
14
e
bp
0
detail X
w M
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.71
0.69
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
inches
0.10
Z
(1)
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT136-1
075E06
MS-013AE
1996 Jul 15
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
23
o
8
0o
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013AD
1996 Jul 15
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
24
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
D
SOT340-1
E
A
X
c
HE
y
v M A
Z
24
13
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.0
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
0.8
0.4
8
0o
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
SOT340-1
1996 Jul 15
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08
95-02-04
MO-150AG
25
o
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
WAVE SOLDERING
Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
SO and SSOP
REPAIRING SOLDERED JOINTS
REFLOW SOLDERING
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Reflow soldering techniques are suitable for all SO and
SSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
1996 Jul 15
26
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jul 15
27
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Internet: http://www.semiconductors.philips.com/ps/
(1) TEA1094_3 June 26, 1996 11:51 am
© Philips Electronics N.V. 1996
SCA50
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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Printed in The Netherlands
417021/1200/03/pp28
Date of release: 1996 Jul 15
Document order number:
9397 750 00926