INTEGRATED CIRCUITS DATA SHEET TDA5051A Home automation modem Product specification Supersedes data of 1997 Sep 19 File under Integrated Circuits, IC11 1999 May 31 Philips Semiconductors Product specification Home automation modem TDA5051A FEATURES APPLICATIONS • Full digital carrier generation and shaping • Home appliance control (air conditioning, shutters, lighting, alarms and so on) • Modulation/demodulation frequency set by clock adjustment, from microcontroller or on-chip oscillator • Energy/heating control • High clock rate of 6-bit A/D (Digital to Analog) converter for rejection of aliasing components • Amplitude Shift Keying (ASK) data transmission using the home power network. • Fully integrated output power stage with overload protection GENERAL DESCRIPTION • Automatic Gain Control (AGC) at receiver input The TDA5051A is a modem IC, specifically dedicated to ASK transmission by means of the home power supply network, at 600 or 1200 baud data rate. It operates from a single 5 V supply. • 8-bit A/D (Analog to Analog) converter and narrow digital filtering • Digital demodulation delivering baseband data • Easy compliance with EN50065-1 with simple coupling network • Few external components for low cost applications • SO16 plastic package. QUICK REFERENCE DATA SYMBOL PARAMETER VDD supply voltage IDD(tot) total supply current CONDITIONS TYP. MAX. UNIT 4.75 5.0 5.25 V − 28 38 mA − 47 68 mA − 19 25 mA 95 132.5 148.5 kHz fosc = 8.48 MHz reception mode transmission mode (DATAIN = 0) MIN. ZL = 30 Ω power-down mode fcr carrier frequency fosc oscillator frequency 6.08 8.48 9.504 MHz Vo(rms) output carrier signal on CISPR16 load (RMS value) 120 − 122 dBµV Vi(rms) input signal (RMS value) 82 − 122 dBµV THD total harmonic distortion on CISPR16 load with coupling network − −55 − dB ZL load impedance 1 30 − Ω BR baud rate − 600 1200 bits/s Tamb ambient temperature 0 − 70 °C note 1 note 2 Notes 1. Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency. 2. The minimum value can be improved by using an external amplifier, see application diagrams Figs 22 and 23. 1999 May 31 2 Philips Semiconductors Product specification Home automation modem TDA5051A ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA5051AT SO16 DESCRIPTION VERSION plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 BLOCK DIAGRAM handbook, full pagewidth DGND AGND VDDA 12 13 5 VDDD VDDAP 3 11 modulated carrier 6 ROM POWER DRIVE WITH PROTECTION D/A 10 9 DAC clock 10 1 DATAIN OSC1 DATAOUT 15 filter clock 4 ÷2 8 2 DIGITAL DEMODULATOR DIGITAL BAND-PASS FILTER 14 RXIN A/D 8 5 H PEAK DETECT U D U/D COUNT L 16 6 MGK832 TEST1 SCANTEST Fig.1 Block diagram. 1999 May 31 PD 7 OSCILLATOR OSC2 APGND CONTROL LOGIC TDA5051A CLKOUT TXOUT 3 Philips Semiconductors Product specification Home automation modem TDA5051A PINNING SYMBOL PIN DESCRIPTION DATAIN 1 digital data input (active LOW) DATAOUT 2 digital data output (active LOW) VDDD 3 digital supply voltage CLKOUT 4 clock output DGND 5 digital ground SCANTEST 6 test input (LOW in application) OSC1 7 oscillator input OSC2 8 oscillator output APGND 9 analog ground for power amplifier TXOUT 10 analog signal output VDDAP 11 analog supply voltage for power amplifier AGND 12 analog ground VDDA 13 analog supply voltage RXIN 14 analog signal input PD 15 power-down input (active HIGH) TEST1 16 test input (HIGH in application) handbook, halfpage DATAIN 1 DATAOUT 2 15 PD VDDD 3 CLKOUT 4 14 RXIN TDA5051AT DGND 5 13 VDDA 12 AGND SCANTEST 6 11 VDDAP OSC1 7 10 TXOUT OSC2 8 9 APGND MGK833 Fig.2 Pin configuration. All logic inputs and outputs are compatible with TTL/CMOS levels, providing an easy connection to a standard microcontroller I/O port. FUNCTIONAL DESCRIPTION Both transmission and reception stages are controlled either by the master clock of the microcontroller or by the on-chip reference oscillator connected to a crystal. This ensures the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on. The digital part of the IC is fully scan-testable. Two digital inputs, SCANTEST and TEST1, are used for production test: these pins must be left open-circuit in functional mode (correct levels are internally defined by pull-up or pull-down resistors). Transmission mode The interface with the power network is made by means of an LC network (see Fig.18). The device includes a power output stage that feeds a 120 dBµV (RMS) signal on a typical 30 Ω load. To provide strict stability with respect to environmental conditions, the carrier frequency is generated by scanning the ROM memory under the control of the microcontroller clock or the reference frequency provided by the on-chip oscillator. High frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling LC network and do not cause any significant disturbance. The data modulation is applied through pin DATAIN and smoothly applied by specific digital circuits to the carrier (shaping). Harmonic components are limited in this process, thus avoiding unacceptable disturbance of the transmission channel (according to CISPR16 and EN50065-1 recommendations). A −55 dB Total Harmonic Distortion (TDH) is reached when the typical LC coupling network (or an equivalent filter) is used. To reduce power consumption, the IC is disabled by a power-down input (pin PD): in this mode, the on-chip oscillator remains active and the clock continues to be supplied at pin CLKOUT. For low-power operation in reception mode, this pin can be dynamically controlled by the microcontroller, see Section “Power-down mode”. When the circuit is connected to an external clock generator (see Fig.6), the clock signal must be applied at pin OSC1 (pin 7); OSC2 (pin 8) must be left open-circuit. Fig.7 shows the use of the on-chip clock circuit. 1999 May 31 16 TEST1 4 Philips Semiconductors Product specification Home automation modem TDA5051A The DAC and the power stage are set in order to provide a maximum signal level of 122 dBµV (RMS) at the output. After digital demodulation, the baseband data signal is made available after pulse shaping. The output of the power stage (TXOUT) must always be connected to a decoupling capacitor, because of a DC level of 0.5VDD at this pin, which is present even when the device is not transmitting. This pin must also be protected against overvoltage and negative transient signals. The DC level of TXOUT can be used to bias a unipolar transient suppressor, as shown in the application diagram; see Fig.18. The signal pin (RXIN) is a high-impedance input which has to be protected and DC decoupled for the same reasons as with pin TXOUT. The high sensitivity (82 dBµV) of this input requires an efficient 50 Hz rejection filter (realized by the LC coupling network), which also acts as an anti-aliasing filter for the internal digital processing; see Fig.18. Data format Direct connection to the mains is done through an LC network for low-cost applications. However, a HF signal transformer could be used when power-line insulation has to be performed. TRANSMISSION MODE The data input (DATAIN) is active LOW: this means that a burst is generated on the line (pin TXOUT) when DATAIN pin is LOW. CAUTION Pin TXOUT is in a high-impedance state as long as the device is not transmitting. Successive logic 1s are treated in a Non-Return-to-Zero (NRZ) mode, see pulse shapes in Figs 8 and 9. In transmission mode, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. In this mode, the gain chosen before the beginning of the transmission is stored, and the AGC is internally set to −6 dB as long as DATAIN is LOW. Then, the old gain setting is automatically restored. RECEPTION MODE The data output (pin DATAOUT) is active LOW; this means that the data output is LOW when a burst is received. Pin DATAOUT remains LOW as long as a burst is received. Reception mode The input signal received by the modem is applied to a wide range input amplifier with AGC (−6 to +30 dB). This is basically for noise performance improvement and signal level adjustment, which ensures a maximum sensitivity of the ADC. An 8-bit conversion is then performed, followed by digital band-pass filtering, to meet the CISPR normalization and to comply with some additional limitations met in current applications. Power-down mode Power-down input (pin PD) is active HIGH; this means that the power consumption is minimum when pin PD is HIGH. Now, all functions are disabled, except clock generation. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VDD supply voltage 4.5 5.5 V fosc oscillator frequency − 12 MHz Tstg storage temperature −50 +150 °C Tamb ambient temperature −10 +80 °C Tj junction temperature − 125 °C HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. 1999 May 31 5 Philips Semiconductors Product specification Home automation modem TDA5051A CHARACTERISTICS VDDD = VDDA = 5 V ±5%; Tamb = 0 to 70 °C; VDDD connected to VDDA; DGND connected to AGND. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDD supply voltage 4.75 5 5.25 V IDD(RX/TX)(tot) total analog + digital supply current VDD = 5 V ±5% TX or RX mode − 28 38 mA IDD(PD)(tot) total analog + digital supply current; VDD = 5 V ±5%; PD = HIGH Power-down mode − 19 25 mA IDD(PAMP) power amplifier supply current VDD = 5 V ±5%; ZL = 30 Ω; DATAIN = LOW in transmission mode − 19 30 mA VDD = 5 V ±5%; ZL = 1 Ω; DATAIN = LOW in transmission mode − 76 − mA V IDD(PAMP)(max) maximum power amplifier supply current DATAIN and PD inputs: DATAOUT and CLKOUT outputs VIH HIGH-level input voltage 0.2VDD + 0.9 − VDD + 0.5 VIL LOW-level input voltage −0.5 − 0.2VDD − 0.1 V VOH HIGH-level output voltage IOH = −1.6 mA 2.4 − − V VOL LOW-level output voltage IOL = 1.6 mA − − 0.45 V OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit when using an external clock generator) VIH HIGH-level input voltage 0.7VDD − VDD + 0.5 V VIL LOW-level input voltage −0.5 − 0.2VDD − 0.1 V VOH HIGH-level output voltage IOH = −1.6 mA 2.4 − − V VOL LOW-level output voltage IOL = 1.6 mA − − 0.45 V MHz Clock fosc oscillator frequency 6.080 − 9.504 f osc -------f cr ratio between oscillator and carrier frequency − 64 − f osc --------------------f CLKOUT ratio between oscillator and clock output frequency − 2 − Transmission mode fcr carrier frequency fosc = 8.48 MHz − 132.5 − kHz tsu set-up time of the shaped burst fosc = 8.48 MHz; see Fig.8 − 170 − µs th hold time of the shaped burst fosc = 8.48 MHz; see Fig.8 − 170 − µs 1999 May 31 6 Philips Semiconductors Product specification Home automation modem SYMBOL PARAMETER TDA5051A CONDITIONS MIN. TYP. MAX. UNIT tW(DI)(min) minimum pulse width of DATAIN signal fosc = 8.48 MHz; see Fig.8 − 190 − µs Vo(rms) output carrier signal (RMS value) ZL = CISPR16; DATAIN = LOW 120 − 122 dBµV Io(max) power amplifier maximum ZL = 1 Ω; output current (peak value) DATAIN = LOW − 160 − mA Zo output impedance of the power amplifier − 5 − Ω VO output DC level at pin TXOUT − 2.5 − V THD total harmonic distortion on CISPR16 load with the coupling network (measured on the first ten harmonics) Vo(rms) = 121 dBµV on CISPR16 load; fosc = 8.48 MHz; DATAIN = LOW (no modulation); see Figs 3 and 16 − −55 − dB B−20dB bandwidth of the shaped output signal (at −20 dB) on CISPR16 load with the coupling network Vo(rms) = 121 dBµV on CISPR16 load; fosc = 8.48 MHz; DATAIN = 300 Hz; duty factor = 50%; see Fig.4 − 3000 − Hz Reception mode Vi(rms) analog input signal (RMS value) 82 − 122 dBµV VI DC level at pin RXIN − 2.5 − V Zi RXIN input impedance − 50 − kΩ RAGC AGC range − 36 − dB tc(AGC) AGC time constant fosc = 8.48 MHz; see Fig.5 − 296 − µs td(dem)(su) demodulation delay set-up time fosc = 8.48 MHz; see Fig.15 − 350 400 µs td(dem)(h) demodulation delay hold time fosc = 8.48 MHz; see Fig.15 − 420 470 µs Bdet detection bandwidth fosc = 8.48 MHz − 3 − kHz BER bit error rate fosc = 8.48 MHz; 600 baud; S/N = 35 dB; signal 76 dBµV; see Fig.17 − 1 − 1 × 10−4 1999 May 31 7 Philips Semiconductors Product specification Home automation modem SYMBOL PARAMETER TDA5051A CONDITIONS MIN. TYP. MAX. UNIT Power-up timing td(pu)(TX) delay between power-up and DATAIN in transmission mode − XTAL = 8.48 MHz; C1 = C2 = 27 pF; Rp = 2.2 MΩ; see Fig.10 1 − µs td(pu)(RX) delay between power-up and DATAOUT in reception mode XTAL = 8.48 MHz; C1 = C2 = 27 pF; Rp = 2.2 MΩ; fRXIN = 132.5 kHz; 120 dBµV sine wave; see Fig.11 − 1 − µs Power-down timing td(pd)(TX) delay between PD = 0 and DATAIN in transmission mode fosc = 8.48 MHz; see Fig.12 − 10 − µs td(pd)(RX) delay between PD = 0 and DATAOUT in reception mode fosc = 8.48 MHz; fRXIN = 132.5 kHz; 120 dBµV sine wave; see Fig.13 − 500 − µs tactive(min) minimum active time with T = 10 ms power-down period in reception mode fosc = 8.48 MHz; fRXIN = 132.5 kHz; 120 dBµV sine wave; see Fig.14 − 1 − µs MGK834 0 dbook, full pagewidth 132.5 kHz Vo(rms) (dBV) −100 105 f (Hz) Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBµV (RMS); marker at −5 dBV (RMS) = 115 dBµV (RMS); the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBµV (RMS). Fig.3 Carrier spectrum. 1999 May 31 8 106 Philips Semiconductors Product specification Home automation modem TDA5051A 1500 Hz MBH664 −10 handbook, full pagewidth 20 dB dBV (RMS) −60 117.5 132.5 f (kHz) Resolution bandwidth = 100 Hz; B−20dB = 3000 Hz (2 × 1500 Hz). Fig.4 Shaped signal spectrum. handbook, full pagewidth VRXIN modulated sine wave 122 dBµV amplitude V(I) 0 t GAGC +30 dB 8.68 dB AGC range −6 dB tc(AGC) (AGC time constant) MGK011 Fig.5 AGC time constant definition (not to scale). 1999 May 31 9 147.5 Philips Semiconductors Product specification Home automation modem TDA5051A TIMING Configuration for clock handbook, full pagewidth OSC1 CLKOUT XTAL 7 fosc MICROCONTROLLER TDA5051A DGND 5 GND MGK835 For parameter description, see Table 1. Fig.6 External clock. handbook, full pagewidth CLKIN CLKOUT 1/2 f osc 4 MICROCONTROLLER GND 8 TDA5051A DGND 5 C1 OSC2 Rp 7 OSC1 XTAL C2 MGK836 For parameter description, see Table 1. Fig.7 Typical configuration for on-chip clock circuit. 1999 May 31 10 Philips Semiconductors Product specification Home automation modem Table 1 TDA5051A Clock oscillator parameters OSCILLATOR FREQUENCY fosc CARRIER FREQUENCY fcr CLOCK OUTPUT FREQUENCY 1⁄ f 2 osc 6.080 to 9.504 MHz 95 to 148.5 kHz 3.040 to 4.752 MHz Table 2 EXTERNAL COMPONENTS C1 = C2 = 27 to 47 pF; Rp = 2.2 to 4.7 MΩ; XTAL = standard quartz crystal Calculation of parameters depending on the clock frequency SYMBOL PARAMETER CONDITIONS UNIT fosc oscillator frequency with on-chip oscillator: frequency of the crystal quartz; with external clock: frequency of the signal applied at OSC1 Hz fCLKOUT clock output frequency 1⁄ 2fosc Hz fcr carrier frequency/digital filter tuning frequency 1⁄ 64fosc Hz tsu set-up time of the shaped burst 23 1472 ------ or ------------f cr f osc s th hold time of the shaped burst 23 1472 ------ or ------------f cr f osc s tW(DI)(min) minimum pulse width of DATAIN signal 1 tsu + ----f cr s tW(burst)(min) minimum burst time of VO(DC) signal tW(DI)(min) + th s tc(AGC) AGC time constant 2514 ------------f osc s tsu(demod) demodulation set-up time 3200 ------------- (≈max.) f osc s th(demod) demodulation hold time 3800 ------------- (≈max.) f osc s 1999 May 31 11 Philips Semiconductors Product specification Home automation modem handbook, full pagewidth TDA5051A tW(burst) TXOUT tW(burst)(min) VO(DC) th tsu 0 tW(DI)(min) tW(DI) DATAIN (1) (2) (3) MGK837 (1) tW(DI) > tW(DI)(min). 1 (2) tW(DI)(min) = tsu + ----f cr (3) tW(DI)(min) < tsu; wrong operation. Fig.8 Relationship between DATAIN and TXOUT (see Table 3). Table 3 Relationship between DATAIN and TXOUT PD DATAIN 1 X(1) TXOUT high-impedance 0 1 high-impedance (after th) 0 0 active with DC offset Note 1. X = don’t care. tW(burst) handbook, halfpage tsu th 100% MGK010 Fig.9 Pulse shape characteristics. 1999 May 31 12 Philips Semiconductors Product specification Home automation modem TDA5051A Timing diagrams handbook, full pagewidth 90% VDD VDD NOT DEFINED CLKOUT CLOCK STABLE HIGH DATAIN TXOUT td(pu)(TX) MGK015 DATAIN is an edge-sensitive input and must be HIGH before starting a transmission. Fig.10 Timing diagram during power-up in transmission mode. handbook, full pagewidth 90% VDD VDD CLKOUT NOT DEFINED CLOCK STABLE RXIN DATAOUT NOT DEFINED HIGH td(pu)(RX) td(dem)(h) MGK016 Fig.11 Timing diagram during power-up in reception mode. 1999 May 31 13 Philips Semiconductors Product specification Home automation modem TDA5051A handbook, full pagewidth PD DATAIN TXOUT td(pd)(TX) normal operation wrong operation TXOUT delayed by PD MGK017 Fig.12 Power-down sequence in transmission mode. handbook, full pagewidth PD RXIN DATAOUT td(dem)(su) td(pd)(RX) td(pd)(RX) MGK018 DATAOUT delayed by PD Fig.13 Power-down sequence in reception mode. handbook, full pagewidth PD RXIN DATAOUT tactive(min) T IDD(RX) IDD IDD(PD) 0 MGK845 Fig.14 Power saving by dynamic control of power-down. 1999 May 31 14 Philips Semiconductors Product specification Home automation modem TDA5051A TEST INFORMATION handbook, full pagewidth DATAIN pulse generator 300 Hz 50% 1 10 TXOUT 1 µF TDA5051A DATAOUT (to be tested) 2 14 7 Y1 RXIN 10 nF 8 30 Ω Y2 XTAL fosc OSCILLOSCOPE DATAIN TXOUT/RXIN DATAOUT td(dem)(su) td(dem)(h) MGK838 Fig.15 Test set-up for measuring demodulation delay. 1999 May 31 15 Philips Semiconductors Product specification Home automation modem TDA5051A coupling network(3) handbook, full pagewidth OSC1 10 7 TXOUT 8 12, 5, 9 1 33 nF 47 µH 47 µH 33 nF TDA5051A OSC2 10 µF CISPR16 network(4) AGND, DGND, APGND 250 nF 50 µH 50 Ω 13, 3, 11 DATAIN 5Ω VDDA, VDDD, VDDAP 250 nF (1) (2) +5 V POWER SUPPLY 50 µH 5Ω SPECTRUM ANALYSER 50 Ω MGK839 (1) (2) (3) (4) Square wave TTL signal 300 Hz, duty factor = 50% for measuring signal bandwidth (see spectrum Fig.3). DATAIN = LOW for measuring total harmonic distortion (see spectrum Fig.3). Tuned for fcr = 132.5 kHz. The CISPR16 network provides a −6 dB attenuation. Fig.16 Test set-up for measuring THD and bandwidth of the TXOUT signal. 1999 May 31 16 Philips Semiconductors Product specification Home automation modem handbook, full pagewidth 10 TDA5051A TXOUT in out COUPLING NETWORK (1) TDA5051A 1 7 8 OSC1 DATAIN 12, AGND, DGND, APGND 5, 9 + + SPECTRUM ANALYSER 50 Ω OSC2 out WHITE NOISE GENERATOR XTAL = 8.48 MHz OSC1 OSC2 7 8 14 RXIN out TDA5051A (to be tested) 2 in COUPLING NETWORK (1) 12, AGND, DGND, APGND 5, 9 PARAMETERS 600 BAUD PSEUDO RANDOM SEQUENCE: 29−1 BITS LONG DATAOUT DATAIN DATAOUT RXD V24 SERIAL DATA ANALYSER V24/TTL INTERFACE TXD MGK840 (1) See Fig.16. Fig.17 Test set-up for measuring Bit Error Rate (BER). 1999 May 31 17 Philips Semiconductors Product specification Home automation modem TDA5051A APPLICATION INFORMATION handbook, full pagewidth 250 V (AC) max T 630 mA 47 nF/X2 250 V (AC) 2 µF 250 V (AC) MOV 250 V (AC) 68 Ω (2 W) +5 V 1 78L05 1N4006 3 2 7V5 (1.3 W) 470 µF (16 V) DATAOUT MICROCONTROLLER 3 VDDAP 11 VDDA 13 1 14 2 TDA5051A CLKOUT PD 47 µH 1 µF (16 V) VDDD DATAIN 1N4006 100 µF (16 V) 47 nF +5 V 47 nF (63 V) 1 mH 47 µH low RS 10 4 15 RXIN 10 nF TXOUT SA5.0A 7 8 OSC1 5 9 12 OSC2 DGND APGND AGND 2.2 MΩ XTAL 7.3728 MHz 27 pF 27 pF MGK841 fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal. Fig.18 Application diagram without power line insulation. 1999 May 31 18 Philips Semiconductors Product specification Home automation modem TDA5051A MBH907 20 handbook, full pagewidth 103 gain (dB) 0 input impedance (Ω) −20 −40 102 1 −60 2 −80 −100 10 102 103 104 105 106 f (Hz) 10 107 Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency (1⁄2fosc). Input impedance always higher than 10 Ω within the 95 to 148.5 kHz band. Fig.19 Gain (curve 1) and input impedance (curve 2) of the coupling network (fcr = 115.2 kHz; L = 47 µH; C = 47 nF). MBH908 130 handbook, halfpage Vo (dBµV) 120 110 100 1 10 Zline (Ω) 102 Fig.20 Output voltage as a function of line impedance (with coupling network; L = 47 µH; C = 47 nF). 1999 May 31 19 Philips Semiconductors Product specification Home automation modem TDA5051A handbook, full pagewidth 250 V (AC) max 470 nF/X2 250 V (AC) T 630 mA MOV 250 V (AC) 100 Ω (0.5 W) 230 V 2 NEWPORT 76250 47 µH low RS 6 1 VA 1 6V +5 V 5 100 Ω 1 78L05 3 FDB08 100 nF 2 470 µF (16 V) (63 V) 22 µH 100 µF (16 V) 47 nF 1 µF (16 V) VDDD +5 V DATAIN DATAOUT MICROCONTROLLER 3 VDDAP 11 VDDA 13 1 14 2 TDA5051A CLKOUT PD 10 4 15 7 8 OSC1 5 9 RXIN 10 nF TXOUT 12 OSC2 DGND APGND AGND SA5.0A 2.2 MΩ XTAL 7.3728 MHz 27 pF 27 pF MGK842 fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal. Fig.21 Application diagram with power line insulation. 1999 May 31 20 Philips Semiconductors Product specification Home automation modem TDA5051A handbook, full pagewidth 250 V (AC) max T 630 mA 2 µF 250 V (AC) MOV 250 V (AC) 47 nF/X2 250 V (AC) 68 Ω (2 W) +5 V 1 mH 1 78L05 7V5 (1.3 W) 470 µF (16 V) MICROCONTROLLER 47 µH 1 µF (16 V) VDDD DATAOUT 1N4006 100 µF (16 V) 47 nF DATAIN 3 VDDAP 11 VDDA PD 1 14 2 RXIN 10 nF 150 kΩ 10 nF 10 4 15 10 kΩ 13 TDA5051A CLKOUT 47 nF (63 V) 1N4006 3 2 +5 V 47 µH low RS TXOUT BC547B 1 kΩ 7 8 OSC1 5 9 33 kΩ 12 OSC2 DGND APGND AGND 2.2 MΩ XTAL 7.3728 MHz 27 pF SA5.0A 27 pF MGK843 fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal. Fig.22 Application diagram without power line insulation, with improved sensitivity (68 dBµV typ.). 1999 May 31 21 Philips Semiconductors Product specification Home automation modem TDA5051A handbook, full pagewidth 250 V (AC) max 470 nF/X2 250 V (AC) T 630 mA MOV 250 V (AC) 100 Ω (0.5 W) 230 V 2 NEWPORT 76250 47 µH low RS 6 1 VA 1 6V +5 V 5 100 Ω 1 78L05 3 FDB08 100 nF 2 470 µF (16 V) (63 V) 22 µH 100 µF (16 V) 47 nF 1 µF (16 V) VDDD +5 V DATAIN DATAOUT MICROCONTROLLER 3 VDDAP 11 VDDA 14 2 PD 10 4 15 RXIN 10 nF 150 kΩ 10 nF TDA5051A CLKOUT 10 kΩ 13 1 TXOUT BC547B 1 kΩ 7 8 OSC1 5 9 33 kΩ 12 OSC2 DGND APGND AGND 2.2 MΩ XTAL 7.3728 MHz 27 pF SA5.0A 27 pF MGK844 fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal. Fig.23 Application diagram with power line insulation, with improved sensitivity (68 dBµV typ.). 1999 May 31 22 Philips Semiconductors Product specification Home automation modem TDA5051A PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA 1999 May 31 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 23 Philips Semiconductors Product specification Home automation modem TDA5051A If wave soldering is used the following conditions must be observed for optimal results: SOLDERING Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. 1999 May 31 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 24 Philips Semiconductors Product specification Home automation modem TDA5051A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable suitable(2) suitable suitable suitable LQFP, QFP, TQFP not recommended(3)(4) suitable SSOP, TSSOP, VSO not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 May 31 25 Philips Semiconductors Product specification Home automation modem TDA5051A NOTES 1999 May 31 26 Philips Semiconductors Product specification Home automation modem TDA5051A NOTES 1999 May 31 27 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 295002/25/02/pp28 Date of release: 1999 May 31 Document order number: 9397 750 05035