INTEGRATED CIRCUITS DATA SHEET TDA5051 Home automation modem Product specification Supersedes data of 1997 Mar 11 File under Integrated Circuits, IC11 1997 Sep 19 Philips Semiconductors Product specification Home automation modem TDA5051 FEATURES APPLICATIONS • Full digital carrier generation and shaping • Home appliance control (air conditioning, shutters, lighting, alarms and so on) • Modulation/demodulation frequency set by clock adjustment, from microcontroller or on-chip oscillator • Energy/heating control • High clock rate of 6 bits D/A (Digital-to-Analog) converter for rejection of aliasing components • ASK (Amplitude Shift Keying) data transmission using the home power network. • Fully integrated output power stage with overload protection GENERAL DESCRIPTION • Automatic gain control at receiver input The TDA5051 is a modem IC, specifically dedicated to ASK transmission by means of the home power supply network, at 600 or 1200 baud data rate. It operates from a single 5 V supply. • 8-bit A/D and narrow digital filtering • Digital demodulation delivering baseband data • Easy compliance with EN50065-1 with simple coupling network • Few external components for low cost applications • SO16 plastic package. QUICK REFERENCE DATA SYMBOL PARAMETER VDD supply voltage IDD(tot) total supply current CONDITIONS 4.75 TYP. 5.0 MAX. 5.25 UNIT V fosc = 8.48 MHz reception mode transmission mode (DATAIN = 0) MIN. ZL = 30 Ω power down mode − 28 38 mA − 47 68 mA − 19 25 mA 0 − 70 °C 95 132.5 148.5 kHz Tamb operating ambient temperature fcr carrier frequency fosc oscillator frequency 6.08 8.48 9.504 MHz Vo(rms) output carrier signal on CISPR16 load (RMS value) 120 − 122 dBµV Vi(rms) input signal (RMS value) 66 − 122 dBµV THD total harmonic distortion on CISPR16 load with coupling network − −55 − dB ZL load impedance 1 30 − Ω BR baud rate − 600 1200 bits/s note 1 Note 1. Frequency range corresponding to the EN50065-1 band. However the modem can operate at any lower oscillator frequency. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA5051T SO16 1997 Sep 19 DESCRIPTION plastic small outline package: 16 leads; body width 7.5 mm 2 VERSION SOT162-1 Philips Semiconductors Product specification Home automation modem TDA5051 BLOCK DIAGRAM handbook, full pagewidth DGND AGND VDDA 12 13 5 VDDD VDDAP 3 11 modulated carrier ROM D/A 6 POWER DRIVE WITH PROTECTION 10 9 DAC clock 10 1 DATAIN OSC1 DATAOUT 15 filter clock 4 ÷2 8 2 DIGITAL DEMODULATOR DIGITAL BANDPASS FILTER 14 RXIN A/D 8 5 H PEAK DETECT U D U/D COUNT L 16 6 MGK006 TEST1 SCANTEST Fig.1 Block diagram. 1997 Sep 19 PD 7 OSCILLATOR OSC2 APGND CONTROL LOGIC TDA5051 CLKOUT TXOUT 3 Philips Semiconductors Product specification Home automation modem TDA5051 PINNING SYMBOL PIN DESCRIPTION DATAIN 1 digital data input (active LOW) DATAOUT 2 digital data output (active LOW) VDDD 3 digital supply voltage CLKOUT 4 clock output DGND 5 digital ground SCANTEST 6 test input (LOW in application) OSC1 7 oscillator input OSC2 8 oscillator output APGND 9 analog ground for power amplifier TXOUT 10 VDDAP handbook, halfpage DATAIN 1 16 TEST1 DATAOUT 2 15 PD VDDD 3 CLKOUT 4 14 RXIN TDA5051T DGND 5 13 VDDA 12 AGND SCANTEST 6 11 VDDAP analog signal output OSC1 7 10 TXOUT 11 analog supply voltage for power amplifier OSC2 8 9 AGND 12 analog ground VDDA 13 analog supply voltage RXIN 14 analog signal input PD 15 power-down input (active HIGH) TEST1 16 test input (HIGH in application) 1997 Sep 19 APGND MGK005 Fig.2 Pin configuration. 4 Philips Semiconductors Product specification Home automation modem TDA5051 The D/A converter and the power stage are set in order to provide a maximum signal level of 122 dBµV (RMS) at the output. FUNCTIONAL DESCRIPTION Both transmission and reception stages are controlled either by the master clock of the microcontroller, or by the on-chip reference oscillator connected to a crystal. This holds for the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on. The output of the power stage (TXOUT) always has to be connected to a decoupling capacitor, because of a DC level of 0.5VDD at this pin, present even when the device is not transmitting. This pin also has to be protected against overvoltage and negative transient signals. The DC level of TXOUT can be used to bias an unipolar transient suppressor, as shown in the application diagram (see Fig.18). The interface with the power network is made by means of a LC network (see Fig.18). The device includes a power output stage able to feed a 120 dBµV (RMS) signal on a typical 30 Ω load. Direct connection to the mains is done through a LC network for low-cost applications. However, a HF signal transformer could be used when power-line insulation has to be performed. To reduce power consumption, the IC is disabled by a power-down input (pin PD): in this mode, the on-chip oscillator remains active and the clock continues to be supplied at pin CLKOUT. For low-power operation in reception mode, this pin can be dynamically controlled by the microcontroller (see Section “Power-down mode”). CAUTION In transmission mode, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. In this mode, the gain chosen before the beginning of the transmission is stored, and the AGC is internally set to −6 dB as long as DATAIN is LOW. Then, the old gain setting is automatically restored. When the circuit is connected to an external clock generator (see Fig.6), the clock signal must be applied at pin OSC1 (pin 7); OSC2 (pin 8) must be left open. Use of the on-chip clock circuitry is shown in Fig.7. All logic inputs and outputs are compatible with TTL/CMOS levels, providing an easy connection to a standard microcontroller I/O port. Receiving mode The input signal received by the modem is applied to a wide range input amplifier with Automatic Gain Control (AGC) (−6 to +30 dB). This is basically for noise performance improvement and signal level adjustment that ensures a maximum sensitivity of the A/D converter. Then an 8 bit A/D conversion is performed, followed by digital bandpass filtering, in order to meet the CISPR normalization and to comply with some additional limitations encountered in current applications. After digital demodulation, the baseband data signal is made available after pulse shaping. The digital part of the IC is fully scan-testable. Two digital inputs, SCANTEST and TEST1, are used for production test: these pins must be left open in functional mode (correct levels are internally defined by pull-up/down resistors). Transmission mode The carrier frequency is generated by the scanning of a ROM memory under the control of the microcontroller clock or the reference frequency provided by the on-chip oscillator, thus providing strict stability with respect to environmental conditions. High frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling LC network and do not cause any significant disturbance. The data modulation is applied through pin DATAIN and smoothly applied by specific digital circuitry to the carrier (shaping). Harmonic components are limited in this process, thus avoiding unacceptable disturbance of the transmission channel (according to CISPR16 and EN50065-1 recommendations). A −55 dB total harmonic distortion is reached when using the typical LC coupling network (or an equivalent filter). 1997 Sep 19 The signal pin (RXIN) is a high-impedance input, which has to be protected and DC decoupled for the same reasons as with pin TXOUT. The high sensitivity (66 dBµV) of this input requires an efficient 50 Hz rejection filter (realized by the LC coupling network) also used as an anti-aliasing filter for the internal digital processing (see Fig.18). 5 Philips Semiconductors Product specification Home automation modem TDA5051 Data format RECEIVING MODE TRANSMISSION MODE The data output (pin DATAOUT) is active LOW; this means that the data output is LOW when a burst is received. Pin DATAOUT remains LOW as long as a burst is received. The data input (DATAIN) is active LOW: this means that a burst is generated on the line (pin TXOUT) when pin DATAIN is LOW. Power-down mode Pin TXOUT is in high-impedance state as long as the device is not transmitting. Successive logic 1s are treated in a NRZ mode (see pulse shape description in Figs 8 and 9). Power-down input (pin PD) is active HIGH; this means that the power consumption is minimal when pin PD is HIGH. All functions, except clock generation, are disabled then. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VDD supply voltage 4.5 5.5 V fosc oscillator frequency − 12 MHz Tstg storage temperature −50 +150 °C Tamb operating ambient temperature −10 +80 °C Tj junction temperature − 125 °C HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. 1997 Sep 19 6 Philips Semiconductors Product specification Home automation modem TDA5051 CHARACTERISTICS VDDD = VDDA = 5 V ±5%; Tamb = 0 to 70 °C; VDDD connected to VDDA; DGND connected to AGND. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDD supply voltage 4.75 5 5.25 V IDD(RX/TX)(tot) total analog + digital supply current; TX or RX mode VDD = 5 V ±5% − 28 38 mA IDD(PD)(tot) total analog + digital supply current; power-down mode VDD = 5 V ±5%; PD = HIGH − 19 25 mA IDD(PAMP) power amplifier supply current VDD = 5 V ±5%; in transmission mode ZL = 30 Ω; DATAIN = LOW − 19 30 mA IDD(PAMP)(max) maximum power amplifier VDD = 5 V ±5%; supply current in transmission ZL = 1 Ω; mode DATAIN = LOW − 76 − mA VDD + 0.5 V DATAIN input, PD input: DATAOUT output, CLKOUT output VIH HIGH-level input voltage 0.2VDD + 0.9 − VIL LOW-level input voltage −0.5 − 0.2VDD − 0.1 V VOH HIGH-level output voltage IOH = −1.6 mA 2.4 − − V VOL LOW-level output voltage IOL = 1.6 mA − − 0.45 V OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open when using an external clock generator) VIH HIGH-level input voltage 0.7VDD − VDD + 0.5 VIL LOW-level input voltage −0.5 − 0.2VDD − 0.1 V VOH HIGH-level output voltage IOH = −1.6 mA 2.4 − − V VOL LOW-level output voltage IOL = 1.6 mA − − 0.45 V MHz V Clock fosc oscillator frequency 6.080 − 9.504 f osc -------f cr ratio between oscillator and carrier frequency − 64 − f osc -------------------f CLKOUT ratio between oscillator and clock output frequency − 2 − 1997 Sep 19 7 Philips Semiconductors Product specification Home automation modem SYMBOL PARAMETER TDA5051 CONDITIONS MIN. TYP. MAX. UNIT Transmission mode fcr carrier frequency fosc = 8.48 MHz − 132.5 − kHz tsu set-up time of the shaped burst fosc = 8.48 MHz; see Fig.8 − 170 − µs th hold time of the shaped burst fosc = 8.48 MHz; see Fig.8 − 170 − µs tW(DI)(min) minimum pulse width of DATAIN signal fosc = 8.48 MHz; see Fig.8 − 190 − µs Vo(rms) output carrier signal (RMS value) ZL = CISPR16 DATAIN = LOW 120 − 122 dBµV Io(max) power amplifier maximum output current (peak value) ZL = 1 Ω; DATAIN = LOW − 160 − mA Zo output impedance of the power amplifier − 5 − Ω VO output DC level at TXOUT − 2.5 − V THD total harmonic distortion on CISPR16 load with the coupling network (measured on the first ten harmonics) Vo(rms) = 121 dBµ V on CISPR16 load; fosc = 8.48 MHz; DATAIN = LOW (no modulation); see Figs 3 and 16 − −55 − dB B−20dB bandwidth of the shaped output signal (at −20 dB) on CISPR16 load with the coupling network Vo(rms) = 121 dBµ − V on CISPR16 load; fosc = 8.48 MHz; DATAIN = 300 Hz; duty factor = 50%; see Fig.4 3000 − Hz Reception mode Vi(rms) analog input signal (RMS value) 68 − 122 dBµV VI DC level at pin RXIN − 2.5 − V Zi RXIN input impedance − 50 − kΩ RAGC automatic gain control range − 36 − dB tc(AGC) automatic gain control time constant fosc = 8.48 MHz; see Fig.5 − 296 − µs td(dem)(su) demodulation delay set-up time fosc = 8.48 MHz; see Fig.15 − 410 460 µs td(dem)(h) demodulation delay hold time fosc = 8.48 MHz; see Fig.15 − 330 380 µs Bdet detection bandwidth fosc = 8.48 MHz − 3 − kHz 1997 Sep 19 8 Philips Semiconductors Product specification Home automation modem SYMBOL BER PARAMETER bit error rate TDA5051 CONDITIONS fosc = 8.48 MHz; 600 baud; S/N = 35 dB; signal 76 dBµV; see Fig.17 MIN. TYP. MAX. UNIT − 1 − 1 × 10−4 Power-up timing td(pu)(TX) delay between power-up and DATAIN in transmission mode XTAL = 8.48 MHz; − C1 = C2 = 27 pF; Rp = 2.2 MΩ; see Fig.10 1 − µs td(pu)(RX) delay between power-up and DATAOUT in reception mode XTAL = 8.48 MHz; − C1 = C2 = 27pF; Rp = 2.2 MΩ; fRXIN = 132.5 kHz; 120 dBµV sinewave; see Fig.11 1 − µs Power-down timing td(pd)(TX) delay between PD = 0 and DATAIN in transmission mode fosc = 8.48 MHz; see Fig.12 − 10 − µs td(pd)(RX) delay between PD = 0 and DATAOUT in reception mode fosc = 8.48 MHz; fRXIN = 132.5 kH; 120 dBµV sinewave; see Fig.13 − 500 − µs tactive(min) minimum active time with fosc = 8.48 MHz; T = 10 ms power-down period fRXIN = 132.5 kH; in reception mode 120 dBµV sinewave; see Fig.14 − 1 − µs 1997 Sep 19 9 Philips Semiconductors Product specification Home automation modem TDA5051 MGK834 0 dbook, full pagewidth 132.5 kHz Vo(rms) (dBV) −100 105 f (Hz) Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBµV (RMS); marker at −5 dBV (RMS) = 115 dBµV (RMS); the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBµV (RMS). Fig.3 Carrier spectrum. 1997 Sep 19 10 106 Philips Semiconductors Product specification Home automation modem TDA5051 1500 Hz MBH664 −10 handbook, full pagewidth 20 dB dBV (RMS) −60 117.5 132.5 f (kHz) Resolution bandwidth = 100 Hz; B−20dB = 3000 Hz (2 × 1500 Hz). Fig.4 Shaped signal spectrum. handbook, full pagewidth VRXIN modulated sinewave 122 dBµV amplitude V(I) 0 t GAGC +30 dB 8.68 dB AGC range −6 dB tc(AGC) (AGC time constant) MGK011 Fig.5 AGC time constant definition (not to scale). 1997 Sep 19 11 147.5 Philips Semiconductors Product specification Home automation modem TDA5051 TIMING Configurations for clock handbook, full pagewidth OSC1 CLKOUT 7 fosc MICROCONTROLLER XTAL TDA5051 DGND 5 GND MGK007 For parameter description see Table 1. Fig.6 External clock. handbook, full pagewidth CLKOUT CLKIN fosc / 2 4 MICROCONTROLLER 8 TDA5051 DGND GND 5 C1 OSC2 Rp 7 XTAL C2 OSC1 MGK008 For parameter description see Table 1. Fig.7 Typical configuration for on-chip clock circuit. Table 1 Clock oscillator parameters fosc OSCILLATOR FREQUENCY 6.080 to 9.504 MHz 1997 Sep 19 fcr CARRIER FREQUENCY 95 to 148.5 kHz 1⁄ f 2 osc CLOCK OUTPUT FREQUENCY 3.040 to 4.752 MHz 12 EXTERNAL COMPONENTS C1 = C2 = 27 to 47 pF; Rp = 2.2 to 4.7 MΩ; XTAL = standard quartz crystal Philips Semiconductors Product specification Home automation modem Table 2 TDA5051 Calculation of parameters depending of the clock frequency SYMBOL PARAMETER CONDITIONS UNIT fosc oscillator frequency with on-chip oscillator: frequency of the crystal quartz; with external clock: frequency of the signal applied at OSC1 Hz fCLKOUT clock output frequency 1⁄ 2fosc Hz fcr carrier frequency/digital filter tuning frequency 1⁄ 64fosc Hz tsu set-up time of the shaped burst 23 1472 ------ or f cr fosc s th hold time of the shaped burst 23 1472 ------ or ------------f cr f osc s tW(DI)(min) minimum pulse width of DATAIN signal 1 tsu + ----f cr s tW(DI)(min) + th s tW(burst)(min) minimum burst time of VO(DC) signal tc(AGC) AGC time constant 2514 ------------f osc s tsu(demod) demodulation set-up time 3700 ------------- (≈max.) f osc s th(demod) demodulation hold time 3050 ------------- (≈max.) f osc s handbook, full pagewidth tW(burst) TXOUT tW(burst)(min) VO(DC) th tsu 0 DATAIN tW(DI)(min) tW(DI) (1) tW(DI) > tW(DI)(min) 1 (2) tW(DI)(min) = tsu + ----f cr (1) (2) (3) MGK837 (3) tW(DI)(min) < tsu; wrong operation Fig.8 Relationship between DATAIN and TXOUT (see Table 3). 1997 Sep 19 13 Philips Semiconductors Product specification Home automation modem Table 3 TDA5051 Relationship between DATAIN and TXOUT PD DATAIN TXOUT 1 X(1) 0 1 high impedance (after th) 0 0 active with DC offset high impedance Note 1. X = don’t care. tW(burst) handbook, halfpage tsu th 100% MGK010 Fig.9 Pulse shape characteristics. 1997 Sep 19 14 Philips Semiconductors Product specification Home automation modem TDA5051 Timing diagrams handbook, full pagewidth 90% VDD VDD NOT DEFINED CLKOUT CLOCK STABLE HIGH DATAIN TXOUT td(pu)(TX) MGK015 DATAIN is an edge-sensitive input and must be HIGH before starting a transmission. Fig.10 Timing diagram during power-up in transmission mode. handbook, full pagewidth 90% VDD VDD CLKOUT NOT DEFINED CLOCK STABLE RXIN DATAOUT NOT DEFINED HIGH td(pu)(RX) td(dem)(h) MGK016 Fig.11 Timing diagram during power-up in reception mode. 1997 Sep 19 15 Philips Semiconductors Product specification Home automation modem TDA5051 handbook, full pagewidth PD DATAIN TXOUT td(pd)(TX) normal operation wrong operation TXOUT delayed by PD MGK017 Fig.12 Power-down sequence in transmission mode. handbook, full pagewidth PD RXIN DATAOUT td(dem)(su) td(pd)(RX) td(pd)(RX) MGK018 DATAOUT delayed by PD Fig.13 Power-down sequence in reception mode. handbook, full pagewidth PD RXIN DATAOUT tactive(min) T IDD(RX) IDD IDD(PD) 0 MGK845 Fig.14 Power saving by dynamic control of power-down. 1997 Sep 19 16 Philips Semiconductors Product specification Home automation modem TDA5051 TEST INFORMATION handbook, full pagewidth DATAIN pulse generator 300 Hz 50% 1 10 TXOUT 1 µF TDA5051 DATAOUT (to be tested) 2 14 7 Y1 RXIN 10 nF 8 30 Ω Y2 XTAL fosc OSCILLOSCOPE DATAIN TXOUT/RXIN DATAOUT td(dem)(su) td(dem)(h) MGK012 Fig.15 Test set-up for measuring demodulation delay. 1997 Sep 19 17 Philips Semiconductors Product specification Home automation modem TDA5051 coupling network(3) handbook, full pagewidth OSC1 10 7 TXOUT 8 12, 5, 9 1 33 nF 47 µH 33 nF TDA5051 OSC2 10 µF CISPR16 network(4) AGND, DGND, APGND 47 µH 250 nF 50 µH 50 Ω 13, 3, 11 DATAIN 5Ω VDDA, VDDD, VDDAP 250 nF (1) (2) +5 V POWER SUPPLY 50 µH 5Ω SPECTRUM ANALYSER 50 Ω MGK013 (1) (2) (3) (4) Square wave TTL signal 300 Hz, duty factor = 50% for measuring signal bandwidth (see spectrum Fig.3). DATAIN = LOW for measuring total harmonic distortion (see spectrum Fig.3). Tuned for fcr = 132.5 kHz. The CISPR16 network provides a −6 dB attenuation. Fig.16 Test set-up for measuring THD and bandwidth of the TXOUT signal. 1997 Sep 19 18 Philips Semiconductors Product specification Home automation modem handbook, full pagewidth 10 TDA5051 TXOUT in out COUPLING NETWORK (1) TDA5051 1 7 8 OSC1 DATAIN 12, AGND, DGND, APGND 5, 9 + + SPECTRUM ANALYSER 50 Ω OSC2 out WHITE NOISE GENERATOR XTAL = 8.48 MHz OSC1 OSC2 7 8 14 RXIN out COUPLING NETWORK (1) TDA5051 (to be tested) 2 in 12, AGND, DGND, APGND 5, 9 PARAMETERS 600 BAUD PSEUDO RANDOM SEQUENCE: 29−1 BITS LONG DATAOUT DATAIN DATAOUT RXD V24 SERIAL DATA ANALYSER V24/TTL INTERFACE TXD MGK014 (1) See Fig.16. Fig.17 Test set-up for measuring bit error rate (BER). 1997 Sep 19 19 Philips Semiconductors Product specification Home automation modem TDA5051 APPLICATION INFORMATION handbook, full pagewidth 250 V (AC) max T 630 mA 2 µF 250 V (AC) MOV 250 V (AC) 47 µH 68 Ω (2 W) 1 78L05 7V5 (1.3 W) 470 µF (16 V) 1 µF (16 V) VDDD DATAOUT 1N4006 100 µF (16 V) 47 nF DATAIN 47 µH 1N4006 3 2 MICROCONTROLLER 33 nF 1 mH +5 V +5 V 33 nF 250 V (AC) 3 VDDAP 11 VDDA 13 1 14 2 TDA5051 CLKOUT PD 10 4 15 RXIN 10 nF TXOUT P6KE6V8 7 8 OSC1 5 9 12 OSC2 DGND APGND AGND 2.2 MΩ XTAL 8.48 MHz 27 pF 27 pF MGK020 Fig.18 Application diagram without power line insulation. 1997 Sep 19 20 Philips Semiconductors Product specification Home automation modem TDA5051 MBH907 20 handbook, full pagewidth 103 gain (dB) 0 input impedance (Ω) −20 −40 102 1 −60 2 −80 −100 10 102 103 104 105 106 f (Hz) 10 107 Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency (1⁄2fosc). Input impedance always higher than 10 Ω within the 95 to 148.5 kHz band. Fig.19 Gain (curve 1) and input impedance (curve 2) of the coupling network (fcr = 132.5 kHz); L = 47 µH; C = 33 nF. MBH908 130 handbook, halfpage Vo (dBµV) 120 110 100 1 10 Zline (Ω) 102 Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency (1⁄2fosc). Input impedance always higher than 10 Ω within the 95 to 148.5 kHz band. Fig.20 Output voltage versus line impedance (with coupling network); L = 47 µH; C = 33 nF. 1997 Sep 19 21 Philips Semiconductors Product specification Home automation modem TDA5051 handbook, full pagewidth 250 V (AC) max T 630 mA MOV 250 V (AC) 100 Ω (0.5 W) 230 V 4 TOKO T1002 n=1 470 nF 250 V (AC) 6 1 VA 6V +5 V 1 78L05 2 3 FDB08 DATAOUT MICROCONTROLLER 3 VDDAP 11 VDDA 13 1 14 2 TDA5051 CLKOUT PD 10 4 15 7 8 OSC1 5 9 RXIN TXOUT 12 OSC2 DGND APGND AGND 2.2 MΩ XTAL 8.48 MHz 27 pF 27 pF MGK021 Fig.21 Application diagram with power line insulation. 1997 Sep 19 3.3 µH 470 nF 100 µF (16 V) VDDD DATAIN 3 n=4 n=1 1 2 33 nF 470 µF (16 V) 47 nF +5 V 6.8 nF 22 P6KE6V8 Philips Semiconductors Product specification Home automation modem TDA5051 PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA 1997 Sep 19 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 23 Philips Semiconductors Product specification Home automation modem TDA5051 SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all SO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 1997 Sep 19 24 Philips Semiconductors Product specification Home automation modem TDA5051 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Sep 19 25 Philips Semiconductors Product specification Home automation modem TDA5051 NOTES 1997 Sep 19 26 Philips Semiconductors Product specification Home automation modem TDA5051 NOTES 1997 Sep 19 27 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 297027/1200/02/pp28 Date of release: 1997 Sep 19 Document order number: 9397 750 02513