DISCRETE SEMICONDUCTORS DATA SHEET M3D744 PMEG1020EV Ultra low VF MEGA Schottky barrier rectifier Product data sheet 2003 Jul 15 NXP Semiconductors Product data sheet Ultra low VF MEGA Schottky barrier rectifier FEATURES PMEG1020EV PINNING • Forward current: 2 A PIN DESCRIPTION • Reverse voltage: 10 V 1 cathode • Ultra low forward voltage 2 cathode • Ultra small plastic SMD package. 3 anode 4 anode APPLICATIONS 5 cathode • Low voltage rectification 6 cathode • High efficiency DC/DC conversion • Switch mode power supply • Inverse polarity protection • Low power consumption applications. handbook, halfpage 6 5 4 DESCRIPTION 1, 2 5, 6 Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection encapsulated in a SOT666 ultra small plastic SMD package. 3, 4 MHC310 1 2 3 Marking code: F2. Fig.1 Simplified outline (SOT666) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage − 10 V IF continuous forward current Tsp ≤ 55 °C; note 1 − 2 A IFRM repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.5; note 1 − 3.2 A IFSM non-repetitive peak forward current tp = 8 ms square wave; note 1 − 9 A Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C Note 1. Only valid if pins 3 and 4 are connected in parallel. 2003 Jul 15 2 NXP Semiconductors Product data sheet Ultra low VF MEGA Schottky barrier rectifier PMEG1020EV ELECTRICAL CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL VF IR Cd PARAMETER forward voltage CONDITIONS TYP. MAX. UNIT see Fig.2; note 1 reverse current IF = 0.01 A 100 130 mV IF = 0.1 A 164 200 mV IF = 1 A 255 350 mV IF = 2 A 306 460 mV VR = 5 V 0.7 2 mA VR = 8 V 1 2.5 mA VR = 10 V 1.2 3 mA 37 45 pF see Fig.3 note 2 diode capacitance VR = 5 V; f = 1 MHz; see Fig.4 Notes 1. Pulse test: tp = 300 μs; δ = 0.02. 2. For Schottky barrier rectifiers thermal runaway has to be considered, as in some applications the reverse power losses (PR) are a significant part of the total power losses. THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS Rth j-a thermal resistance from junction to ambient Rth j-s thermal resistance from junction to solder point VALUE UNIT note 1 405 K/W note 2 215 K/W note 3 80 K/W Notes 1. Refer to SOT666 standard mounting conditions. 2. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for cathode 1 cm2. 3. Solder point of cathode tabs. Soldering Reflow soldering is the only recommended soldering method. 2003 Jul 15 3 NXP Semiconductors Product data sheet Ultra low VF MEGA Schottky barrier rectifier PMEG1020EV GRAPHICAL DATA MDB591 104 handbook, halfpage MDB195 105 handbook, halfpage IR (μA) IF (mA) (1) 104 103 103 (1) 102 (2) (2) (3) 102 10 10 (3) 1 0 100 200 300 1 400 500 VF (mV) 0 2 (1) Tamb = 85 °C. (2) Tamb = 25 °C. (3) Tamb = −40 °C. (1) Tamb = 85 °C. (2) Tamb = 25 °C. (3) Tamb = −40 °C. Fig.2 Fig.3 Forward current as a function of forward voltage; typical values. MDB196 120 handbook, halfpage Cd (pF) 100 80 60 40 20 2 0 4 6 8 10 VR (V) f = 1 MHz; Tamb = 25 °C. Fig.4 Diode capacitance as a function of reverse voltage; typical values. 2003 Jul 15 4 4 6 8 10 VR (V) Reverse current as a function of reverse voltage; typical values. NXP Semiconductors Product data sheet Ultra low VF MEGA Schottky barrier rectifier PMEG1020EV PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT666 D E A X Y S S HE 6 5 4 pin 1 index A 1 2 e1 c 3 bp w M A Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E e e1 HE Lp w y mm 0.6 0.5 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 1.0 0.5 1.7 1.5 0.3 0.1 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 01-01-04 01-08-27 SOT666 2003 Jul 15 EUROPEAN PROJECTION 5 NXP Semiconductors Product data sheet Ultra low VF MEGA Schottky barrier rectifier PMEG1020EV DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2003 Jul 15 6 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/01/pp7 Date of release: 2003 Jul 15 Document order number: 9397 750 11686