INTEGRATED CIRCUITS DATA SHEET TDA8712; TDF8712 8-bit digital-to-analog converters Product specification Supersedes data of April 1993 File under Integrated Circuits, IC02 Philips Semiconductors June 1994 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 FEATURES APPLICATIONS • 8-bit resolution • High-speed digital-to-analog conversion • Conversion rate up to 50 MHz • Digital TV including: – field progressive scan • TTL input levels – line progressive scan • Internal reference voltage generator • Subscriber TV decoders • Two complementary analog voltage outputs • Satellite TV decoders • No deglitching circuit required • Digital VCRs • Internal input register • Industrial and automotive. • Low power dissipation GENERAL DESCRIPTION • Internal 75 Ω output load (connected to the analog supply) The TDA8712 and TDF8712 are 8-bit digital-to-analog converters (DACs) for video and other applications. They convert the digital input signal into an analog voltage output at a maximum conversion rate of 50 MHz. No external reference voltage is required and all digital inputs are TTL compatible. • Very few external components required • Temperature range – TDA8712: 0 to 70 °C – TDF8712: −40 to +85 °C. ORDERING INFORMATION PACKAGE TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA8712 16 DIP plastic SOT38-1 TDF8712 16 DIP plastic SOT38-1 TDA8712T 16 SO16L plastic SOT162-1 TDF8712T 16 SO16L plastic SOT162-1 June 1994 2 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 QUICK REFERENCE DATA SYMBOL VCCA VCCD PARAMETER CONDITIONS MIN. TYP. MAX. UNIT analog supply voltage TDA8712 4.5 5.0 5.5 V TDF8712 4.75 5.0 5.25 V TDA8712 4.5 5.0 5.5 V TDF8712 4.75 5.0 5.25 V digital supply voltage ICCA analog supply current note 1 20 26 32 mA ICCD digital supply current note 1 16 23 30 mA ∆VOUT(p-p) full-scale analog output voltage differences between VOUT and VOUT (peak-to-peak value) ZL = 10 kΩ; note 2 −1.45 −1.60 −1.75 V ZL = 75 Ω; note 2 −0.72 0.80 −0.88 V ILE DC integral linear error − ±0.3 ±0.5 LSB DLE DC differential linearity error − ±0.3 ±0.5 LSB fclk(max) maximum conversion rate 50 − − MHz B −3 dB analog bandwidth 150 − MHz Ptot total power dissipation fclk = 50 MHz; note 3 − TDA8712 160 250 340 mW TDF8712 170 250 325 mW Notes 1. D0 to D7 are connected to VCCD and CLK is connected to DGND. 2. The analog output voltages (VOUT and VOUT) are negative with respect to VCCA (see Table 1). The output resistance between VCCA and each of these outputs is typically 75 Ω. 3. The −3 dB analog output bandwidth is determined by real time analysis of the output transient at a maximum input code transition (code 0 to 255). June 1994 3 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 BLOCK DIAGRAM handbook, full pagewidth 1 REF 100 nF DGND AGND BAND-GAP REFERENCE 6 16 CURRENT GENERATORS 2 75 Ω 5 CLK 12 11 3 4 10 9 8 7 CURRENT SWITCHES 14 VOUT VOUT REGISTERS VCCD DATA INPUT INTERFACE MBC915 - 1 Fig.1 Block diagram. June 1994 VCCA 75 Ω 15 CLOCK INPUT INTERFACE TDA8712 TDF8712 (LSB) D0 D1 D2 D3 D4 D5 D6 (MSB) D7 CURRENT REFERENCE LOOP 4 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 PINNING SYMBOL PIN DESCRIPTION REF 1 voltage reference (decoupling) AGND 2 analog ground D2 3 data input; bit 2 REF 1 16 V CCA D3 4 data input; bit 3 AGND 2 15 VOUT CLK 5 clock input D2 3 14 V OUT DGND 6 digital ground D3 4 D7 7 data input; bit 7 (MSB) D6 8 data input; bit 6 D5 9 data input; bit 5 D4 10 data input; bit 4 D1 11 data input; bit 1 D0 12 data input; bit 0 (LSB) VCCD 13 digital supply voltage (+5 V) VOUT 14 analog output voltage VOUT 15 complimentary analog output voltage VCCA 16 analog supply voltage (+5 V) June 1994 handbook, halfpage 13 V CCD TDA8712 TDF8712 CLK 5 DGND 6 11 D1 D7 7 10 D4 D6 8 9 D5 12 D0 MBC901 - 1 Fig.2 Pin configuration. 5 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL PARAMETER MIN. MAX. UNIT VCCA analog supply voltage −0.3 +7.0 V VCCD digital supply voltage −0.3 +7.0 V ∆VCC supply voltage differences between VCCA and VCCD −0.5 +0.5 V ∆VGND ground voltage differences between VAGND and VDGND −0.1 +0.1 V VI input voltage (pins 3 to 5 and 7 to 12) −0.3 VCCD V Itot total output current (IOUT + IOUT; pins 14 and 15) −5 +26 mA Tstg storage temperature −55 +150 °C Tamb operating ambient temperature TDA8712 0 +70 °C TDF8712 −40 +85 °C − +150 °C junction temperature Tj HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth j-a June 1994 PARAMETER VALUE UNIT SOT38-1 70 K/W SOT162-1 90 K/W thermal resistance from junction to ambient in free air 6 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 CHARACTERISTICS VCCA = V16 to V2 = 4.5 to 5.5 V (TDA8712) = 4.75 to 5.25 V (TDF8712); VCCD = V13 to V6 = 4.5 to 5.5 V (TDA8712) = 4.75 to 5.25 V (TDF8712); VCCA to VCCD = −0.5 to +0.5 V (TDA8712) = −0.25 to +0.25 V (TDF8712); REF decoupled to AGND via a 100 nF capacitor; Tamb = −40 to +85 °C; AGND and DGND shorted together; typical readings taken at VCCA = VCCD = 5 V and Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VCCA VCCD analog supply voltage TDA8712 4.5 5.0 5.5 V TDF8712 4.75 5.0 5.25 V 4.5 5.0 5.5 V digital supply voltage TDA8712 4.75 5.0 5.25 V ICCA analog supply current TDF8712 note 1 20 26 32 mA ICCD digital supply current note 1 16 23 30 mA ∆VGND ground voltage differences between VAGND and VDGND −0.1 − +0.1 V Inputs DIGITAL INPUTS (D7 TO D0) AND CLOCK INPUT CLK VIL LOW level input voltage 0 − 0.8 V VIH HIGH level input voltage 2.0 − VCCD V IIL LOW level input current VI = 0.4 V − −0.3 −0.4 mA IIH HIGH level input current VI = 2.7 V fclk(max) maximum clock frequency − 0.01 20 µA 50 − − MHz full-scale analog output voltage ZL = 10 kΩ; note 2 differences between VOUT and ZL = 75 Ω; note 2 VOUT (peak-to-peak value) −1.45 −1.60 −1.75 V −0.72 0.80 −0.88 V Vos analog offset output voltage − −3 −25 mV TCVOUT full-scale analog output voltage temperature coefficient − − 200 µV/K TCVos analog offset output voltage temperature coefficient − − 20 µV/K B −3 dB analog bandwidth − 150 − MHz Gdiff differential gain − 0.6 − % ϕdiff differential phase − 1 − deg Zo output impedance − 75 − Ω Outputs (referenced to VCCA) ∆VOUT(p-p) code = 0 fclk = 50 MHz; note 3 Transfer function (fclk = 50 MHz) ILE DC integral linear error − ±0.3 ±0.5 LSB DLE DC differential linearity error − ±0.3 ±0.5 LSB June 1994 7 Philips Semiconductors Product specification 8-bit digital-to-analog converters SYMBOL PARAMETER TDA8712; TDF8712 CONDITIONS MIN. TYP. MAX. UNIT Switching characteristics (fclk = 50 MHz; notes 4 and 5; see Figs 3, 4 and 5) tSU;DAT data set-up time −0.3 − − ns tHD;DAT data hold time 2.0 − − ns tPD propagation delay time − − 1.0 ns tS1 settling time 1 10% to 90% full-scale change to ±1 LSB − 1.1 1.5 ns tS2 settling time 2 10% to 90% full-scale change to ±1 LSB − 6.5 8.0 ns td input to 50% output delay time − 3.0 5.0 ns − − 30 LSB⋅ns Output transients (glitches; fclk = 50 MHz; note 6; see Fig.6) Eg glitch energy from code transition 127 to 128 Notes 1. D0 to D7 are connected to VCCD and CLK is connected to DGND. 2. The analog output voltages (VOUT and VOUT) are negative with respect to VCCA (see Table 1). The output resistance between VCCA and each of these outputs is typically 75 Ω. 3. The −3 dB analog output bandwidth is determined by real time analysis of the output transient at a maximum input code transition (code 0 to 255). 4. The worst case characteristics are obtained at the transition from input code 0 to 255 and if an external load impedance greater than 75 Ω is connected between VOUT or VOUT and VCCA. The specified values have been measured with an active probe between VOUT and AGND. No further load impedance between VOUT and AGND has been applied. All input data is latched at the rising edge of the clock. The output voltage remains stable (independent of input data variations) during the HIGH level of the clock (CLK = HIGH). During a LOW-to-HIGH transition of the clock (CLK = LOW), the DAC operates in the transparent mode (input data will be directly transferred to their corresponding analog output voltages; see Fig.5. 5. The data set-up time (tSU;DAT) is the minimum period preceding the rising edge of the clock that the input data must be stable in order to be correctly registered. A negative set-up time indicates that the data may be initiated after the rising edge of the clock and still be recognized. The data hold time (tHD;DAT) is the minimum period following the rising edge of the clock that the input data must be stable in order to be correctly registered. A negative hold time indicates that the data may be released prior to the rising edge of the clock and still be recognized. 6. The definition of glitch energy and the measurement set-up are shown in Fig.6. The glitch energy is measured at the input transition between code 127 and 128 and on the falling edge of the clock. June 1994 8 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 Table 1 Input coding and output voltages (typical values; referenced to VCCA, regardless of the offset voltage). DAC OUTPUT VOLTAGES (V) CODE INPUT DATA (D7 to D0) ZL = 75 Ω ZL = 10 kΩ VOUT VOUT VOUT VOUT 0 000 00 00 0 −1.6 0 −0.8 1 000 000 01 −0.006 −1.594 −0.003 −0.797 . . . . . . 128 100 000 00 −0.8 −0.8 −0.4 −0.4 . . . . . . 254 111 111 10 −1.594 −0.006 −0.797 −0.003 255 111 111 11 −1.6 0 −0.8 0 t SU; DAT andbook, full pagewidth t HD; DAT 3.0 V input data stable 1.3 V 0V 3.0 V CLK 1.3 V 0V MBC912 The shaded areas indicate when the input data may change and be correctly registered. Data input update must be completed within 0.3 ns after the first rising edge of the clock (tSU;DAT is negative; −0.3 ns). Data must be held at least 2 ns after the rising edge (tHD;DAT = +2 ns). Fig.3 Data set-up and hold times. June 1994 9 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 andbook, full pagewidth 1.3 V CLK code 255 input data (example of a full-scale input transition) 1.3 V code 0 1 LSB VCCA (code 0) 10 % td 50 % VOUT 90 % VCCA 1.6 V (code 255) 1 LSB t S1 t PD MBC913 t S2 Fig.4 Switching characteristics. handbook, full pagewidth transparent mode CLK latched mode 1.3 V input codes V OUT analog output voltage MBC914 - 1 transparent mode latched mode (stable output) beginning of transparent mode During the transparent mode (CLK = LOW), any change of input data will be seen at the output. During the latched mode (CLK = HIGH), the analog output remains stable regardless of any change at the input. A change of input data during the latched mode will be seen on the falling edge of the clock (beginning of the transparent mode). Fig.5 Latched and transparent mode. June 1994 10 Philips Semiconductors Product specification 8-bit digital-to-analog converters handbook, full pagewidth HP8082A PULSE GENERATOR (SLAVE) 1/10 f clk TDA8712; TDF8712 D7 MSB D6 D5 HP8082A PULSE GENERATOR (SLAVE) 1/10 f clk VOUT VOUT D4 D3 D2 TDA8712 TDF8712 TEK P6201 TEK7104 and TEK7A26 DYNAMIC PROBE OSCILLOSCOPE R = 100 kΩ C = 3 pF bandwidth = 20 MHz D1 DIVIDER ( 10) clock D0 (LSB) f clk f clk 3 PULSE GENERATOR (MASTER) 1 MODEL EH107 1 LSB 2 code 127 timing diagram code 128 MBC916 VOUT time The value of the glitch energy is the sum of the shaded area measured in LSB⋅ns. Fig.6 Glitch energy measurement. June 1994 11 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 INTERNAL PIN CONFIGURATIONS handbook, full pagewidth V CCA V REF output current generators regulation loop REF MBC911 - 1 AGND Fig.7 Reference voltage generator decoupling. handbook, halfpage V CCA handbook, halfpage D0 to D7, CLK DGND AGND substrate MBC908 AGND MBC910 Fig.8 AGND and DGND. June 1994 Fig.9 D7 to D0 and CLK. 12 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 handbook, halfpage VCCA 75 Ω 75 Ω VOUT handbook, halfpage VOUT VCCD AGND DGND bit n bit n MBC907 MBC909 - 1 Fig.10 Digital supply. Fig.11 Analog outputs. handbook, halfpage VCCA AGND MBC906 Fig.12 Analog supply. June 1994 switches and current generators 13 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 APPLICATION INFORMATION Additional application information can be supplied on request (please quote “FTV/8901”). (1) handbook, halfpage 100 nF REF AGND VCCA VO VOUT VOUT TDA8712 TDF8712 MBC905 - 1 (1) This is a recommended value for decoupling pin 1. VO = −VOUT; see Table 1; ZL = 10 kΩ. Fig.13 Analog output voltage without external load. (1) handbook, 100 halfpage nF REF VCCA ZL AGND VO Z L / ( Z L 75 ) VOUT TDA8712 TDF8712 MBC904 - 1 (1) This is a recommended value for decoupling pin 1. External load ZL = 75 Ω to ∞. Fig.14 Analog output voltage with external load. June 1994 14 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 (1) handbook, halfpage 100 nF VCCA REF 100 µF VOUT AGND VO 2 75 Ω TDA8712 TDF8712 AGND MBC903 - 1 (1) This is a recommended value for decoupling pin 1. Fig.15 Analog output voltage with AGND as reference. handbook, full pagewidth TDA8712 TDF8712 10 µH VOUT (pin 15) or VOUT (pin 14) 100 µF 390 Ω 27 pF 12 µH 12 pF 390 Ω 39 pF 100 pF 56 pF Vo [390/(780+75)] MSA656 Fig.16 Example of anti-aliasing filter (analog output referenced to AGND). June 1994 15 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 Characteristics of Fig. 17 • Order 5; adapted CHEBYSHEV • Ripple ρ ≤ 0.1 dB MSA657 0 handbook, halfpage α • f = 6.7 MHz at −3 dB (dB) • fnotch = 9.7 MHz and 13.3 MHz. 20 40 60 80 100 0 10 20 30 40 f i (MHz) Fig.17 Frequency response for filter shown in Fig.16. handbook, full pagewidth 100 nF (1) R2 REF 100 µF AGND R1 VOUT R1 VOUT 100 µF TDA8712 TDF8712 2 X VO (R2/R1) R2 AGND MBC902 (1) This is a recommended value for decoupling pin 1. Fig.18 Differential mode (improved supply voltage ripple rejection). June 1994 16 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 PACKAGE OUTLINES 22.00 21.35 seating plane handbook, full pagewidth 8.25 7.80 3.7 4.7 max max 3.9 3.4 0.51 min 2.2 max 2.54 (7x) 0.53 max 0.254 M 0.32 max 7.62 1.4 max 9.5 8.3 16 9 6.48 6.14 1 8 Dimensions in mm. Fig.19 Plastic dual in-line package; 16 leads (300 mil) SOT38-1. June 1994 17 MSA254 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 10.5 10.1 handbook, full pagewidth 7.6 7.4 A 10.65 10.00 0.1 S S 0.9 (4x) 0.4 9 16 2.45 2.25 1.1 1.0 0.3 0.1 2.65 2.35 0.32 0.23 pin 1 index 1 1.1 0.5 8 detail A 1.27 0.49 0.36 0.25 M (16x) Dimensions in mm. Fig.20 Plastic small outline package; 16 leads; large body (SOT162-1). June 1994 18 0 to 8 o MBC233 - 1 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 °C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 °C. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 °C, it must not be in contact for more than 10 s; if between 300 and 400 °C, for not more than 5 s. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 °C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) Plastic small-outline packages During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 °C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 °C. (Pulse-heated soldering is not recommended for SO packages.) Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 °C within 6 s. Typical dwell time is 4 s at 250 °C. For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement. BY WAVE June 1994 19 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. June 1994 20 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 NOTES June 1994 21 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 NOTES June 1994 22 Philips Semiconductors Product specification 8-bit digital-to-analog converters TDA8712; TDF8712 NOTES June 1994 23 Philips Semiconductors – a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SÃO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)821-2327, Fax. (011)829-1849 Canada: INTEGRATED CIRCUITS: Tel. 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(708)296-8556 DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd., P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404, Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601 For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BAF-1, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD31 © Philips Electronics N.V. 1994 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 533061/1500/03/pp24 Document order number: Date of release: June 1994 9397 734 70011