INTEGRATED CIRCUITS DATA SHEET TDA8714 8-bit high-speed analog-to-digital converter Product specification Supersedes data of 1996 Jan 31 File under Integrated Circuits, IC02 1997 Oct 29 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 FEATURES APPLICATIONS • 8-bit resolution High-speed analog-to-digital conversion for: • Sampling rate up to 80 MHz • video data digitizing • No missing codes guaranteed • radar pulse analysis • High signal-to-noise ratio over a large analog input frequency range (7.7 effective bits at 4.43 MHz full-scale input at fclk = 80 MHz) • transient signal analysis • high energy physics research • Σ∆ modulators • Overflow/underflow 3-state TTL output • medical imaging. • TTL compatible digital inputs • Low-level AC clock input signal allowed GENERAL DESCRIPTION • External reference voltage regulator The TDA8714 is an 8-bit high-speed Analog-to-Digital Converter (ADC) for professional video and other applications. It converts the analog input signal into 8-bit binary-coded digital words at a maximum sampling rate of 80 MHz. All digital inputs and outputs are TTL compatible, although a low-level sine wave clock input signal is allowed. • Power dissipation only 340 mW (typical) • Low analog input capacitance, no buffer amplifier required • No sample-and-hold circuit required. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCCA analog supply voltage 4.75 5.0 5.25 V VCCD digital supply voltage 4.75 5.0 5.25 V VCCO output stages supply voltage 4.75 5.0 5.25 V ICCA analog supply current − 25 30 mA ICCD digital supply current − 27 33 mA ICCO output stages supply current − 16 20 mA INL DC integral non-linearity − ±0.4 ±0.5 LSB DNL DC differential non-linearity − ±0.2 ±0.35 LSB AINL AC integral non-linearity − ±0.5 ±1.0 LSB fclk(max) maximum clock frequency TDA8714/7 80 − − MHz TDA8714/6 60 − − MHz TDA8714/4 40 − − MHz − 340 435 mW Ptot note 1 total power dissipation Note 1. Full-scale sine wave (fi = 4.43 MHz; fclk = 80 MHz). 1997 Oct 29 2 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8714T/4 SO24 TDA8714T/6 SO24 DESCRIPTION plastic small outline package; 24 leads; body width 7.5 mm TDA8714T/7 SO24 TDA8714M/4 SSOP24 TDA8714M/6 SSOP24 TDA8714M/7 SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm VERSION SAMPLING FREQUENCY (MHz) SOT137-1 40 SOT137-1 60 SOT137-1 80 SOT340-1 40 SOT340-1 60 SOT340-1 80 BLOCK DIAGRAM handbook, full pagewidth V CCA CLK VCCD CE 7 16 18 22 CLOCK DRIVER VRT 9 TDA8714 12 D7 13 D6 MSB 14 D5 analog voltage input VI 15 D4 8 ANALOG -TO-DIGITAL CONVERTER LATCHES TTL OUTPUTS data outputs 23 D3 24 D2 1 D1 2 D0 19 VRB 4 LSB VCCO1 21 VCCO2 OVERFLOW / UNDERFLOW LATCH OGND 20 output ground 6 17 AGND DGND analog ground 11 MSA669 digital ground Fig.1 Block diagram. 1997 Oct 29 TTL OUTPUT 3 overflow / underflow output Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 PINNING SYMBOL PIN DESCRIPTION D1 1 data output; bit 1 D0 2 data output; bit 0 (LSB) n.c. 3 not connected VRB 4 reference voltage BOTTOM input n.c. 5 not connected AGND 6 analog ground VCCA 7 analog supply voltage (+5 V) VI 8 analog input voltage VRT 9 reference voltage TOP input n.c. 10 not connected O/UF 11 overflow/underflow data output D7 12 data output; bit 7 (MSB) D6 13 data output; bit 6 D5 14 data output; bit 5 D4 15 data output; bit 4 CLK 16 clock input DGND 17 digital ground VCCD 18 digital supply voltage (+5 V) VCCO1 19 supply voltage for output stages 1 (+5 V) OGND 20 output ground VCCO2 21 supply voltage for output stages 2 (+5 V) CE 22 chip enable input (TTL level input, active LOW) D3 23 data output; bit 3 D2 24 data output; bit 2 1997 Oct 29 handbook, halfpage D1 1 24 D2 D0 2 23 D3 n.c. 3 22 CE VRB 4 21 VCCO2 n.c. 5 20 OGND AGND 6 TDA8714 19 VCCO1 VCCA 7 18 VCCD VI 8 17 DGND VRT 9 16 CLK n.c. 10 15 D4 O/UF 11 14 D5 D7 12 13 D6 MSA667 Fig.2 Pin configuration. 4 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCCA analog supply voltage note 1 −0.3 +7.0 V VCCD digital supply voltage note 1 −0.3 +7.0 V VCCO output stages supply voltage note 1 −0.3 +7.0 V ∆VCC supply voltage differences between VCCA and VCCD −1.0 +1.0 V ∆VCC supply voltage differences between VCCO and VCCD −1.0 +1.0 V ∆VCC supply voltage differences between VCCA and VCCO −1.0 +1.0 V VI input voltage referenced to AGND −0.3 +7.0 V Vclk(p-p) AC input voltage for switching (peak-to-peak value) referenced to DGND − VCCD V IO output current − 10 mA Tstg storage temperature −55 +150 °C Tamb operating ambient temperature 0 +70 °C Tj junction temperature − +150 °C Note 1. The supply voltages VCCA and VCCD may have any value between −0.3 V and +7.0 V provided the difference between VCCA and VCCD is between −1 V and +1 V. HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth j-a 1997 Oct 29 PARAMETER VALUE UNIT SOT137-1 75 K/W SOT340-1 119 K/W thermal resistance from junction to ambient in free air 5 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 CHARACTERISTICS VCCA = V7 to V6 = 4.75 to 5.25 V; VCCD = V18 to V17 = 4.75 to 5.25 V; VCCO = V19 and V21 to V20 = 4.75 to 5.25 V; AGND and DGND shorted together; VCCA to VCCD = −0.25 to +0.25 V; VCCO to VCCD = −0.25 to +0.25 V; VCCA to VCCO = −0.25 to +0.25 V; Vi(p-p) = 1.75 V; Tamb = 0 to +70 °C; typical values measured at VCCA = VCCD = VCCO = 5 V and Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VCCA analog supply voltage 4.75 5.0 5.25 V VCCD digital supply voltage 4.75 5.0 5.25 V VCCO output stages supply voltage 4.75 5.0 5.25 V ICCA analog supply current − 25 30 mA ICCD digital supply current − 27 33 mA ICCO output stages supply current − 16 20 mA Inputs CLOCK INPUT CLK (REFERENCED TO DGND); note 1 VIL LOW level input voltage 0 − 0.8 V VIH HIGH level input voltage 2.0 − VCCD V IIL LOW level input current Vclk = 0.4 V −400 − − µA IIH HIGH level input current Vclk = 2.7 V − − 300 µA ZI input impedance fclk = 80 MHz − 18 − kΩ CI input capacitance fclk = 80 MHz − 1 − pF 0 − 0.8 V INPUT CE (REFERENCED TO DGND); see Table 2 VIL LOW level input voltage VIH HIGH level input voltage 2.0 − VCCD V IIL LOW level input current VIL = 0.4 V −400 − − µA IIH HIGH level input current VIH = 2.7 V − − 20 µA VI (ANALOG INPUT VOLTAGE REFERENCED TO AGND) IIL LOW level input current VI = 1.2 V − 0 − µA IIH HIGH level input current VI = 3.5 V 60 130 280 µA ZI input impedance fi = 4.43 MHz − 10 − kΩ CI input capacitance fi = 4.43 MHz − 14 − pF Reference voltages for the resistor ladder; see Table 1 VRB reference voltage BOTTOM 1.2 1.3 1.6 V VRT reference voltage TOP 3.5 3.6 3.9 V Vdiff differential reference voltage VRT − VRB 1.9 2.3 2.7 V Iref reference current − 11.5 − mA RLAD resistor ladder − 200 − Ω TCRLAD temperature coefficient of the resistor ladder − 0.24 − ppm VosB offset voltage BOTTOM note 2 275 285 295 mV VosT offset voltage TOP note 2 Vi(p-p) analog input voltage (peak-to-peak value) 1997 Oct 29 6 305 315 325 mV 1.45 1.75 2.15 V Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter SYMBOL PARAMETER CONDITIONS TDA8714 MIN. TYP. MAX. UNIT Outputs DIGITAL OUTPUTS D7 to D0 (REFERENCED TO DGND) VOL LOW level output voltage IO = 1 mA 0 − 0.4 V VOH HIGH level output voltage IO = −0.4 mA 2.7 − VCCD V IOZ output current in 3-state mode IO = −1 mA 2.4 − VCCD V 0.4 V < VO < VCCD −20 − +20 µA TDA8714/4 40 − − MHz TDA8714/6 60 − − MHz TDA8714/7 80 − − MHz Switching characteristics CLOCK INPUT CLK (note 1; see Fig.3) fclk(max) maximum clock frequency tCPH clock pulse width HIGH 6 − − ns tCPL clock pulse width LOW 6 − − ns Analog signal processing LINEARITY INL DC integral non-linearity − ±0.4 ±0.5 LSB DNL DC differential non-linearity − ±0.2 ±0.35 LSB AINL AC integral non-linearity note 3 − ±0.5 ±1.0 LSB full-scale sine wave − 13 − MHz 75% full-scale sine wave; small signal at Vi = ±5 LSB, code 128 − 20 − MHz BANDWIDTH (fclk = 40 MHz); note 4 B analog bandwidth tSTLH analog input settling time LOW-to-HIGH full-scale square wave; Fig.6; note 5 − 2.5 3.5 ns tSTHL analog input settling time HIGH-to-LOW full-scale square wave; Fig.6; note 5 − 3.0 4.0 ns − − 0 dB second harmonics − −64 −60 dB third harmonics − −58 −55 dB fi = 4.43 MHz − −56 − dB without harmonics; fclk = 40 MHz; fi = 4.43 MHz 46 48 − dB HARMONICS (fclk = 40 MHz) h1 fundamental harmonics (full scale) fi = 4.43 MHz hall harmonics (full scale); all components fi = 4.43 MHz THD total harmonic distortion SIGNAL-TO-NOISE RATIO (note 6; see Figs 7 and 13) S/N 1997 Oct 29 signal-to-noise ratio (full scale) 7 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter SYMBOL PARAMETER CONDITIONS TDA8714 MIN. TYP. MAX. UNIT EFFECTIVE BITS (note 6; see Figs 7 and 13) EB effective bits TDA8714/4 fclk = 40 MHz fi = 4.43 MHz − 7.75 − bits fi = 7.5 MHz − 7.6 − bits effective bits TDA8714/6 fclk = 60 MHz fi = 4.43 MHz − 7.7 − bits fi = 7.5 MHz − 7.55 − bits fi = 10 MHz − 7.4 − bits fi = 4.43 MHz − 7.7 − bits fi = 7.5 MHz − 7.5 − bits fi = 10 MHz − 7.2 − bits fi = 15 MHz − 6.3 − bits fclk = 40 MHz − −56 − dB fclk = 40 MHz; fi = 4.43 MHz; VI = ±16 LSB at code 128 − 10−11 − times/ samples fclk = 40 MHz; fi = 4.43 MHz − 0.6 − % fclk = 40 MHz; fi = 4.43 MHz − 0.8 − deg effective bits TDA8714/7 fclk = 80 MHz TWO-TONE (note 7) TTIR two-tone intermodulation rejection BIT ERROR RATE BER bit error rate DIFFERENTIAL GAIN (note 8) Gdiff differential gain DIFFERENTIAL PHASE (note 8) ϕdiff differential phase Timing (note 9; see Figs 3 and 5; fclk = 80 MHz) tds sampling delay time − − 2 ns th output hold time 5 − − ns td output delay time − 10 11 ns 3-state output delay times (see Fig.4) tdZH enable HIGH − 40 44 ns tdZL enable LOW − 12 16 ns tdHZ disable HIGH − 50 54 ns tdLZ disable LOW − 10 14 ns 1997 Oct 29 8 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 Notes to the characteristics 1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must not be less than 1 ns. 2. Analog input voltages producing code 00 up to and including FF: a) VosB (voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and the reference voltage BOTTOM (VRB) at Tamb = 25 °C. b) VosT (voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which produces data outputs equal to FF at Tamb = 25 °C. 3. Full-scale sine wave (fi = 4.43 MHz; fclk = 80 MHz). 4. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device. No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal. 5. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square-wave signal) in order to sample the signal and obtain correct output data. 6. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB. 7. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter. 8. Measurement carried out using video analyser VM700A where the video analog signal is reconstructed through a digital-to-analog converter. 9. Output data acquisition: the output data is available after the maximum delay time of td; in the event of 80 MHz clock operation, the hardware design must take into account the td and th limits with respect to the input characteristics of the acquisition circuit. 1997 Oct 29 9 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter Table 1 TDA8714 Output coding and input voltage (typical values; referenced to AGND) BINARY OUTPUT BITS VI(p-p) O/UF Underflow <1.585 0 1 . STEP D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 0 0 0 0 1.585 0 0 0 0 0 0 0 0 0 . 0 0 0 0 0 0 0 0 1 . . . . . . . . . . . . . . . . . . . . 254 . 0 1 1 1 1 1 1 1 0 255 3.28 0 1 1 1 1 1 1 1 1 Overflow >3.28 1 1 1 1 1 1 1 1 1 Table 2 Mode selection CE D7 to D0 O/UF 1 high impedance high impedance 0 active; binary active t CPL handbook, full pagewidth t CPH 50 % CLK sample N sample N + 1 sample N + 2 V l t ds DATA D0 to D7 th VDDO DATA N-2 DATA N-1 DATA N DATA N+1 50 % 0V td MSA670 Fig.3 Timing diagram. 1997 Oct 29 10 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter dbook, full pagewidth TDA8714 V CCD 50 % CE t dHZ t dZH HIGH 90 % output data 50 % t dLZ LOW t dZL HIGH output data 50 % LOW TEST 10 % V CCD 3.3 kΩ S1 TDA8714 tdLZ VCCD tdZL VCCD tdHZ DGND tdZH DGND 15 pF MBD876 CE fCE = 100 kHz. Fig.4 Timing diagram and test conditions of 3-state output delay time. handbook, halfpage D0 to D7 15 pF MBB956 - 1 Fig.5 Load circuit for timing measurement. 1997 Oct 29 11 S1 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 t STHL t STLH handbook, full pagewidth code 255 VI 50 % 50 % code 0 2 ns CLK MGD184 2 ns 50 % 50 % 0.5 ns Fig.6 Analog input settling-time diagram. 1997 Oct 29 12 0.5 ns Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 MBD877 0 handbook, full pagewidth amplitude (dB) 20 40 60 80 100 120 0 2.50 5.00 7.50 10.0 12.5 15.0 17.5 f (MHz) 20.0 Effective bits: 7.80; THD = −57.82 dB. Harmonic levels (dB): 2nd = −68.00; 3rd = −61.54; 4th = −72.46; 5th = −65.80; 6th = −68.88. Fig.7 Fast Fourier Transform (fclk = 40 MHz; fi = 4.43 MHz). MBD878 0 handbook, full pagewidth amplitude (dB) 20 40 60 80 100 120 0 4.69 9.39 14.1 18.8 23.5 28.2 Effective bits: 7.27; THD = −49.23 dB. Harmonic levels (dB): 2nd = −56.16; 3rd = −51.01; 4th = −69.84; 5th = −59.10; 6th = −65.34. Fig.8 Fast Fourier Transform (fclk = 80 MHz; fi = 10 MHz). 1997 Oct 29 13 32.9 f (MHz) 37.5 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 INTERNAL PIN CONFIGURATIONS handbook, halfpage VCCO1 handbook, halfpage VCCO2 V CCA (x 90) D7 to D0 O/UF VI DGND AGND MLB036 MLB037 Fig.9 TTL data and overflow/underflow outputs. Fig.10 Analog inputs. book, halfpage VCCO1 handbook, halfpage VCCA VRT VRM CE R LAD VRB AGND MEA050 - 1 DGND MLB038 Fig.11 CE (3-state) input. 1997 Oct 29 Fig.12 VRB and VRT. 14 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter handbook, full pagewidth TDA8714 VCCD V ref CLK 30 kΩ DGND MCD189 - 1 Fig.13 CLK input. 1997 Oct 29 30 kΩ 15 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 APPLICATION INFORMATION handbook, halfpage D1 D0 1 24 2 23 3 22 4 21 5 20 6 19 D2 D3 (2) n.c. (1) VRB 100 nF CE VCCO2 (2) n.c. OGND AGND AGND VCCO1 TDA8714 VCCA VI 7 18 8 17 9 16 10 15 11 14 12 13 VCCD DGND (1) VRT 100 nF CLK (2) n.c. D4 AGND O/UF D7 D5 D6 MSA668 The analog and digital supplies should be separated and decoupled. The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value. (1) VRB and VRT are decoupled to AGND. (2) Pin 5 should be connected to AGND; pins 3 and 10 to DGND in order to prevent noise influence. Fig.14 Application diagram. 1997 Oct 29 16 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 PACKAGE OUTLINES SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD 1997 Oct 29 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 17 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.8 0.4 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 1997 Oct 29 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AG 18 o Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 SOLDERING SSOP Introduction Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. If wave soldering cannot be avoided, the following conditions must be observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). • The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Reflow soldering Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. METHOD (SO AND SSOP) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering SO Repairing soldered joints Wave soldering techniques can be used for all SO packages if the following conditions are observed: Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. 1997 Oct 29 19 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8714 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Oct 29 20 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter NOTES 1997 Oct 29 21 TDA8714 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter NOTES 1997 Oct 29 22 TDA8714 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter NOTES 1997 Oct 29 23 TDA8714 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. 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No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Philips Electronics N.V. 1997 SCA55 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547047/1200/06/pp24 Date of release: 1997 Oct 29 Document order number: 9397 750 02956