PHILIPS TDA8718

INTEGRATED CIRCUITS
DATA SHEET
TDA8718
8-bit high-speed analog-to-digital
converter
Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02
Philips Semiconductors
June 1994
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
FEATURES
GENERAL DESCRIPTION
• 8-bit resolution
The TDA8718 is an 8-bit analog-to-digital converter (ADC)
designed for professional applications. The device
converts the analog input signal into 8-bit binary coded
digital words at a sampling rate of 600 MHz. It has an
effective bandwidth capability up to 150 MHz full-scale
sine wave. All digital outputs are ECL compatible.
• Sampling rate up to 600 MHz
• ECL (100K family) compatible for digital inputs and
outputs
• Overflow/Underflow output
• 50 Ω load drive capability
• Low input capacitance (5 pF typ.).
APPLICATIONS
• High speed analog-to-digital conversion
• Industrial instrumentation
• Data communication
• RF communication.
QUICK REFERENCE DATA
Measured over full voltage and temperature ranges, unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VEEA
analog supply voltage
−4.2
−4.5
−4.8
V
VEED
digital supply voltage
−4.2
−4.5
−4.8
V
Iref
resistive ladder current
30
45
60
mA
IEEA
analog supply current
30
42
54
mA
IEED
digital supply current
100
120
150
mA
IEEO(L)
LOW level output supply current
RL = 50 Ω
40
70
90
mA
IEEO(H)
HIGH level output supply current
RL = 50 Ω
155
170
185
mA
ILE
DC integral linearity error
−
±0.7
±1.0
LSB
DLE
DC differential linearity error
−
±0.3
±0.5
LSB
EB
effective bits
fi = 4.43 MHz; Iref = 45 mA;
fclk = 100 MHz
−
7.5
−
bits
fi = 4.43 MHz; Iref = 45 mA;
fclk = 100 MHz
−
6.5
−
bits
R = 48 Ω
fclk(max)
maximum clock frequency
600
−
−
MHz
Ptot
total power dissipation
−
990
1250
mW
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
TDA8718K
June 1994
PINS
PIN POSITION
MATERIAL
CODE
28
PLCC28
plastic
SOT261-2
2
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
BLOCK DIAGRAM
handbook, full pagewidth
clock inputs
analog negative
supply voltage
V EEA
CLK
CLK
VEED
9
8
23
28
reference V RM
voltage middle
reference VRT
digital negative
supply voltage
2
TDA8718
18 OGND2
CLOCK DRIVER
6 OF
5
voltage TOP
output
ground
overflow
output
10 D7
13 D6
8Ω
analog
voltage input
VI
INPUT
AND
OUTPUT
LATCHES
RESISTOR
LADDER
3
32 Ω
&
14 D5
15 D4
ECL OUTPUTS
ANALOG SIGNAL
PROCESSING
8Ω
&
16 D3
19 D1
1
21 UF
27
24
AGND
DGND
analog ground
12
OGND1
Fig.1 Block diagram.
June 1994
11
V BB
digital ground
3
data outputs
17 D2
DIGITAL
DECODING
20 D0
V RB
reference
voltage BOTTOM
MSB
MBB854 - 2
LSB
underflow
output
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
PINNING
n.c.
7
not connected
CLK
8
clock input
CLK
9
complementary clock input
D7
10
digital output; bit 7 (MSB)
VBB
11
ECL reference voltage
handbook, halfpage
V RT
5
25 n.c.
OF
6
24 DGND
n.c.
7
23 V EED
OGND1
12
output ground 1 (0 V)
D6
13
digital output; bit 6
CLK
8
D5
14
digital output; bit 5
CLK
9
15
digital output; bit 4
D3
16
digital output; bit 3
V BB 11
D2
17
digital output; bit 2
OGND2
18
output ground 2 (0 V)
D1
19
digital output; bit 1
D0
20
digital output; bit 0 (LSB)
UF
21
underflow digital output
n.c.
22
not connected
VEED
23
digital supply voltage (−4.5 V)
DGND
24
digital ground
n.c.
25
not connected
n.c.
26
not connected
AGND
27
analog ground
VEEA
28
analog supply voltage (−4.5 V)
22 n.c.
TDA8718
21 UF
OGND1 12
D4
D7 10
June 1994
26 n.c.
overflow digital output
27 AGND
6
D2 17
OF
OGND2 18
reference voltage TOP
28 V EEA
not connected
5
D3 16
4
VRT
VRB
n.c.
1
analog input voltage
D4 15
3
V RM
VI
2
reference voltage MIDDLE decoupling
D5 14
reference voltage BOTTOM
2
n.c.
1
VI
VRB
VRM
4
DESCRIPTION
3
PIN
D6 13
SYMB
OL
Fig.2 Pin configuration.
4
20 D0
19 D1
MBB850 - 2
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VEEA
analog supply voltage (pin 28)
−7.0
+0.3
V
VEED
digital supply voltage (pin 23)
−7.0
+0.3
V
∆VEE
supply voltage difference between VEEA
and VEED
−1.00
+1.0
V
VI
input voltage (pin 3)
referenced to AGND
VEEA
0
V
∆Vclk(p-p)
clock input voltage difference between
CLK and CLK pin 8 to pin 9
(peak-to-peak value)
referenced to VEED;
note 1
−
2.0
V
IO
output current for each digital output
−
30
mA
Tstg
storage temperature
−55
+150
°C
Tamb
operating ambient temperature
0
+70
°C
Tj
junction temperature
−
+150
°C
Note
1. The circuit has two clock inputs CLK and CLK. Sampling takes place on the falling edge of the clock input signal;
CLK and CLK are two complementary signals.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
thermal resistance from junction to ambient in free air
MBB851
0
handbook, halfpage
∆ R th j-a
(%)
10
20
30
40
50
0
200
400
600
800
1000
airflow (LFPM)
Test conditions: PCB (2.24 × 2.24 × 0.062 inches).
LFPM = Linear Foot Per Minute.
Fig.3 Average effect of air flow on Rth j-a.
June 1994
5
VALUE
UNIT
55
K/W
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
CHARACTERISTICS
VEEA = −4.2 to −4.8 V; VEED = −4.2 to −4.8 V; VEEA to VEED = −0.1 to +0.1 V; AGND and DGND shorted together;
Tamb = 0 to +70 °C; typical values measured at VEEA = −4.5 V, VEED = −4.5 V and Tamb = 25 °C;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
−4.2
−4.5
−4.8
VEEA
analog supply voltage (pin 28)
V
VEED
digital supply voltage (pin 23)
−4.2
−4.5
−4.8
V
IEEA
analog supply current (pin 28)
30
42
54
mA
IEED
digital supply current (pin 23)
100
120
150
mA
IEEO(L)
LOW level output supply current
RL = 50 Ω
40
70
90
mA
IEEO(H)
HIGH level output supply current
RL = 50 Ω
155
170
185
mA
60
mA
Reference voltages for the resistor ladder (see Table 1)
R = 48 Ω
IRT
reference current (pin 5)
30
45
VRB
reference voltage BOTTOM (pin 1)
−
48 Ω × IRT −
V
VRT
reference voltage TOP (pin 5)
−
0
−
V
RLAD
resistor ladder
−
48
−
Ω
TCRLAD
temperature coefficient of the
resistor ladder
−
175
−
MΩ/K
VosB
voltage offset BOTTOM
note 1
−
8 Ω × IRT
−
mV
VosT
voltage offset TOP
note 1
−
8 Ω × IRT
−
mV
Inputs
CLK INPUT (PIN 8); CLK INPUT (PIN 9)
VIL
LOW level input voltage
−
−1.8
−
V
VIH
HIGH level input voltage
−
−0.8
−
V
IIL
LOW level input current
Vclk = −1.8 V
−
0
−
µA
IIH
HIGH level input current
Vclk = −0.8 V
−
120
−
µA
RI
input resistance
fclk = 100 MHz
−
1.5
−
kΩ
CI
input capacitance
fclk = 100 MHz
−
3.5
−
pF
∆Vclk(p-p)
clock input voltage difference
between CLK and CLK pin 8 to
pin 9 (peak-to-peak value)
−
900
−
mV
ANALOG INPUT (PIN 3); NOTE 2
IIL
LOW level input current
data output = 00
20
40
80
µA
IIH
HIGH level input current
data output = FF
100
200
400
µA
RI
input resistance
−
10
−
kΩ
CI
input capacitance
−
5
−
pF
June 1994
6
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
SYMBOL
PARAMETER
TDA8718
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Outputs (RL = 50 Ω)
DIGITAL 100K ECL OUTPUTS (D0 TO D7; OF; UF)
VOL
LOW level output voltage
Tamb = 25 °C
−
−1770
−1650
mV
VOH
HIGH level output voltage
Tamb = 25 °C
−1300
−1150
−
mV
VECL
ECL reference voltage
−1550
−1450
−1350
mV
IOL
LOW level output current
4
6
8
mA
IOH
HIGH level output current
10
20
25
mA
600
−
−
MHz
fi = 100 MHz
−
−
750
ps
Switching characteristics
fclk(max)
maximum clock frequency
(pins 8 and 9)
tr; tf
rise and fall times
Analog signal processing (fclk = 500 MHz)
HARMONICS (FULL SCALE)
h1
fundamental harmonics
fi = 100 MHz
−
0
−
dB
h2
second harmonics
fi = 100 MHz
−
−54
−
dB
h3
third harmonics
fi = 100 MHz
−
−50
−
dB
−
±0.7
±1.0
LSB
Transfer function
ILE
DC integral linearity error
DLE
DC differential linearity error
−
±0.3
±0.5
LSB
AILE
AC integral linearity error
note 3
−
±0.9
±1.5
LSB
EB
effective bits
fi = 4.43 MHz, full scale;
Iref = 45 mA; note 4;
fclk = 100 MHz; Fig.5
−
7.5
−
bits
fi = 100 MHz, full scale;
Iref = 45 mA; note 4;
fclk = 500 MHz; Fig.6
−
6.5
−
bits
fclk = 500 MHz;
fi = 100 MHz;
Vi = ±8 LSB at code
128; 50% clock duty
cycle
−
10−11
−
times/
samples
BER
bit error rate
Timing (fclk = 500 MHz; RL = 50 Ω; CL = 5 pF) note 5
tds
sampling delay
−
−
300
ps
th
output hold time
400
700
−
ps
td
output delay time
−
1300
1500
ps
June 1994
7
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
Notes to the “Characteristics”
1. Voltage offset BOTTOM (VosB) is the difference between the analog input which produces data outputs equal to 00
and the reference voltage BOTTOM (VRB) at Tamb = 25 °C. Voltage offset TOP (VosT) is the difference between
reference voltage TOP (VRT) and the analog input which produces data outputs equal to FF, at Tamb = 25 °C.
2. The analog input is not internally biased. It should be externally biased between VRT and VRB levels.
3. Full-scale sine wave; fi = 4.43 MHz; fclk = 100 MHz.
4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 4K acquisition points per period.
The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency).
Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.
5. TDA8718 can only withstand one or two 100K ECL loads in order to work out timings at the maximum sampling
frequency. It is recommended to minimize the printed circuit-board load by implementing the load device as close as
possible to the TDA8718.
Table 1 Output coding and input voltage (typical values; referenced to AGND.
BINARY OUTPUT BITS
STEP
VI
O/UF
D5
D4
D3
D2
D1
D0
< −40 Ω × IRT
1
0
0
0
0
0
0
0
−40 Ω × IRT
0
0
0
0
0
0
0
1
.
0
0
0
0
0
0
1
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Underflow
254
.
0
1
1
1
1
1
0
255
−8 Ω × IRT
0
1
1
1
1
1
1
> −8 Ω × IRT
1
1
1
1
1
1
1
Overflow
handbook, full pagewidth
50 %
CLK
sample N
sample N + 1
sample N + 2
VI
th
t ds
DATA
OF/UF
DATA
N-2
DATA
N-1
DATA
N
DATA
N+1
50 %
MSA666
Fig.4 Timing diagram.
June 1994
8
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
MBD879
0
handbook, full pagewidth
amplitude
(dB)
20
40
60
80
100
120
0
6.27
12.5
18.8
25.1
31.3
37.6
43.9
f (MHz)
50.2
Effective bits: 7.53; THD = −54.56 dB.
Harmonic levels (dB): 2nd = −77.28; 3rd = −54.76; 4th = −71.43; 5th = −71.85; 6th = −105.50.
Fig.5 Fast Fourier Transform (fclk = 100 MHz; fi = 4.43 MHz).
MBD880
0
handbook, full pagewidth
amplitude
(dB)
20
40
60
80
100
120
0
31.2
62.4
93.5
125.0
156.0
187.0
Effective bits: 6.60; THD = −48.60 dB.
Harmonic levels (dB): 2nd = −64.81; 3rd = −51.10; 4th = −65.05; 5th = −58.33; 6th = −54.07.
Fig.6 Fast Fourier Transform (fclk = 500 MHz; fi = 100 MHz).
June 1994
9
218.0
f (MHz)
249.0
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
APPLICATION INFORMATION
VRB
V RM
handbook, full pagewidth
22
nF
V EEA
22
nF
AGND
22
nF
22
nF
VI
n.c.
n.c.
4
VRT
22 nF
OF
n.c.
3
2
28
1
27
26
5
25
6
24
7
23
CLK
8
CLK
9
21
10
20
11
19
D7
V BB
22
TDA8718
12
13
OGND1 D6
14
D5
15
D4
16
17
D3
D2
n.c.
DGND
V EED
22 nF
n.c.
UF
D0
D1
18
OGND2
–2 V
MBB852 - 2
Fig.7 Application diagram.
June 1994
10
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
PACKAGE OUTLINE
12.57
12.32
handbook, full pagewidth
seating plane
11.58
11.43
S
0.53
max
1.27
(24 x)
0.10 S
0.18 M
0.81
max
25
R 1.14
0.64
19
26
18
28
11.58 12.57
11.43 12.32
2.16
max
10.92
9.91
1
A
45 o
12
4
1.22
1.07
5
11
0.51 (3x)
max
0.32
max
4.57
max
3.04
max
0.51 min
detail A
Dimensions in mm.
Fig.8 Plastic leaded chip carrier, 28-leads; SOT261-2.
June 1994
11
MBC654
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
SOLDERING
Plastic leaded chip carriers
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
BY WAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between
270 and 320 °C. (Pulse-heated soldering is not
recommended for SO packages.)
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
June 1994
12
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
NOTES
June 1994
13
TDA8718
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
NOTES
June 1994
14
TDA8718
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
NOTES
June 1994
15
TDA8718
Philips Semiconductors – a worldwide company
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New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. (09)849-4160, Fax. (09)849-7811
Philips Semiconductors
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (022)74 8000, Fax. (022)74 8341
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. (021)587 4641-49,
Fax. (021)577035/5874546.
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474
Portugal: PHILIPS PORTUGUESA, S.A.,
Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. (01)14163160/4163333, Fax. (01)14163174/4163366.
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65)350 2000, Fax. (65)251 6500
South Africa: S.A. PHILIPS Pty Ltd., Components Division,
195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430 Johannesburg 2000,
Tel. (011)470-5911, Fax. (011)470-5494.
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03)301 6312, Fax. (03)301 42 43
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
Tel. (0)8-632 2000, Fax. (0)8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (01)488 2211, Fax. (01)481 77 30
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382.
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. (662)398-0141, Fax. (662)398-3319.
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0 212)279 2770, Fax. (0212)269 3094
United Kingdom: Philips Semiconductors Limited, P.O. Box 65,
Philips House, Torrington Place, LONDON, WC1E 7HD,
Tel. (071)436 41 44, Fax. (071)323 03 42
United States: INTEGRATED CIRCUITS:
811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. (800)234-7381, Fax. (708)296-8556
DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd.,
P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404,
Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BAF-1,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-724825
SCD31
© Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
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Printed in The Netherlands
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Document order number:
Date of release: June 1994
9397 734 40011