INFINEON BGB741L7ESD

D a t a S h e e t , R e v . 1 . 0 , A p r i l 2 00 9
BGB741L7ESD
E S D - R o b u s t a n d E a s y - T o - U s e B r o a d b a nd L N A
MMIC
RF & Protection Devices
Edition 2009-04-17
Published by Infineon Technologies AG,
85579 Neubiberg, Germany
© Infineon Technologies AG 2009.
All Rights Reserved.
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BGB741L7ESD
BGB741L7ESD, ESD-Robust and Easy-To-Use Broadband LNA MMIC
Revision History: 2009-04-17, Rev. 1.0
Prevision History: no previous version
Page
Data Sheet
Subjects (major changes since last revision)
3
Rev. 1.0, 2009-04-17
BGB741L7ESD
ESD-Robust and Easy-To-Use Broadband LNA MMIC
1
ESD-Robust and Easy-To-Use Broadband LNA MMIC
Features
• High-performance broadband LNA MMIC for applications
between 50 MHz and 5.5 GHz
• Integrated stabilization, biasing, matching and ESD-protection
simplifies design and reduces external parts count
• Integrated active biasing circuit makes operation point highly
stable against temperature- and processing-variations
• Integrated ESD protection: RF input pin typical 4 kV vs. GND,
RF output pin 2.5 kV vs. GND (HBM stress pulses)
• Supply voltage 1.8 - 4.0 V
• Adjustable current 6 mA to 30 mA by an external resistor
• Power-off function
• Excellent noise figure for a broadband LNA by using latest SiGe:C
bipolar technolgy
• High linearity due to active biasing
• Very small, leadless, Pb-free (RoHS compliant) and halogen-free
(WEEE compliant) “green” package TSLP-7-1,
2.0 x 1.3 x 0.4 mm
Applications
• Mobile TV, DAB, RKE, AMR, Cellular, ZigBee, WiMAX, SDARs, WiFi, Cordless phone, UMTS, WLAN, UWB
2
Product Brief
The BGB741L7ESD is an advanced high performance low noise amplifier (LNA) MMIC which simplifies the design
of arbitrary LNA application circuits. Due to its integrated feedback the device is perfectly matched up to 3.5 GHz.
The integrated biasing further reduces external parts count and stabilizes the bias current against temperatureand process-variations. The integrated feedback provides unconditional stability and eases the design process.
The device is highly flexible because the bias current is adjustable and the device works with a broad supply
voltage range. The BGB741L7ESD is based upon Infineon Techologies’ cost effective bipolar silicon germanium
carbon (SiGe:C) technology and comes in a low profile TSLP-7-1 leadless “green” package.
Type
Package
Marking
BGB741L7ESD
TSLP-7-1
AY
Data Sheet
4
Rev. 1.0, 2009-04-17
BGB741L7ESD
Product Brief
6
5
4
7
1
Figure 1
Pin configuration
Table 1
Pinning table
Pin
Function
1
VCC
2
Bias-Out
3
RF-In
4
RF-Out
5
Control On/Off
6
Current Adjust
7
GND
2
3
The following diagram shows the principal schematic how the BGB741L7ESD is used in a circuit. The Power
On/Off function is used by applying Vctrl. By applying an external resistor Rext the pre-set current of 6mA (which is
adjusted by the integrated biasing when Rext is omitted) can be increased. Base- and collector voltages are applied
to the respective RFin- and RFout-pins by external inductors.
DC,
VCC
Rext
1
VCC
2
6
internal
Biasing
Current Adjust
5
LB Bias-Out
In
On/Off
3
Cin
LC
Out
DC,
V ctrl
4
RF-In
RF-Out
GND
7
Cout
(on package backside )
BGB741L7ESD functional block
Figure 2
Data Sheet
Functional block diagram
5
Rev. 1.0, 2009-04-17
BGB741L7ESD
Maximum Ratings
3
Maximum Ratings
Table 2
Maximum ratings at TA = 25°C (unless otherwise specified)
Parameter
Symbol
Value
Unit
Supply voltage
TA = -55°C
VCC
4.0
3.5
V
Supply current at VCC pin
ICC
IB
Vctrl
Ptot
30
mA
3
mA
4.0
V
120
mW
TJOp
TStg
-55...150
°C
DC current at RF In pin
Voltage at Control On / Off pin
Total power dissipation
TS<117°C
1)
Operation junction temperature
Storage temperature
-55...150
°C
1) The soldering point temperature TS measured at the GND pin (7) at the soldering point to the pcb
Note: Exceeding only one of the above maximum rating limits even for a short moment may cause permanent
damage to the device. Even if the device continues to operate, its lifetime may be considerably shortened.
Maximum ratings are stress ratings only and do not mean unaffected functional operation and lifetime at
others than standard operation conditions.
4
Thermal Characteristics
Table 3
Thermal Resistance
Parameter
Value
Unit
Junction - soldering point1)
RthJS
275
1) For calculation of RthJA please refer to Application Note Thermal Resistance
Symbol
K/W
140
120
Ptot [mW]
100
80
60
40
20
0
0
50
100
150
Ts [°C]
Figure 3
Data Sheet
Maximum total Power Dissipation Ptot as function of temperature TS at soldering point
6
Rev. 1.0, 2009-04-17
BGB741L7ESD
Operation Conditions
5
Operation Conditions
Table 4
Operation Conditions
Parameter
Symbol
VCC
Voltage Control On/Off pin in On mode Vctrl-on
Voltage Control On/Off pin in Off mode Vctrl-off
Supply voltage
6
Electrical Characteristics
6.1
DC Characteristics
Table 5
DC characteristics at TA = 25 °C
Parameter
Supply current in On-mode
Values
Min.
Typ.
Max.
1.8
3.0
4.0
V
1.2
4.0
V
-0.3
0.3
V
Symbol
ICC
Unit
Values
Min.
Typ.
Max.
5.0
6.0
10
7.2
Note /
Test Condition
Unit
Note /
Test Condition
mA
Rext = open
Rext = 4 kΩ
VCC = 3.0 V
Vctrl = 3.0 V
(Small signal
operation)
Supply current in Off mode
ICC-off
Current into Control On/Off pin in On- Ictrl-on
mode
14
Current into Control On/Off pin in Off- Ictrl-off
mode
Data Sheet
7
6.0
µA
VCC = 3.0 V
Vctrl = 0 V
20
µA
VCC = 3.0 V
Vctrl = 3.0 V
0.1
µA
VCC = 3.0 V
Vctrl = 0 V
Rev. 1.0, 2009-04-17
BGB741L7ESD
Electrical Characteristics
6.2
AC Characteristics
The measurement setup is a test fixture with Bias-T’s in a 50 Ω system, TA = 25 °C.
Top View
VB
1
VCC
2
BiasOut
GND
Current
Adjust
6
On/Off
Control
5
Bias-T
In
VC
Bias-T
3
RF-In
RF-Out
Out
4
7
Figure 4
BGB741L7ESD testing setup
Table 6
AC Characteristics, VC = 3 V, f = 150 MHz
Parameter
Symbol
Values
Min.
Minimum Noise Figure1)
Typ.
NFmin
Unit
Note /
Test Condition
dB
ZS = ZSopt
IC = 6 mA
IC = 10 mA
ZS = ZL= 50Ω
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
ZL = ZLopt, ZS = ZSopt
IC = 6 mA
IC = 10 mA
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Max.
1.05
0.95
Noise Figure in 50Ω System2)
NF50
dB
1.1
1.05
Transducer Gain
|S21|²
Maximum Stable Power Gain
Gms
19
21
dB
dB
20
21.5
Input 1 dB Gain compression point3)
IP1dB
-5.5
-8
dBm
Input 3rd Order Intercept Point
IIP3
5.5
3.5
dBm
Input Return Loss
R.L.in
14
18
dB
Output Return Loss
R.L.out
12.5
18.5
dB
1) Test fixture losses extracted
2) Test fixture losses extracted
3) Measured on an application board according to figure 2) presenting roughly a 50 Ω system to the device. ICq is the
quiescent current, that is at small RF input power level. IC increases as RF input power level approaches P1dB.
Data Sheet
8
Rev. 1.0, 2009-04-17
BGB741L7ESD
Electrical Characteristics
Table 7
AC Characteristics, VC = 3 V, f = 450 MHz
Parameter
Symbol
Values
Min.
Minimum Noise Figure
1)
Typ.
Unit
Note /
Test Condition
dB
ZS = ZSopt
IC = 6 mA
IC = 10 mA
ZS = ZL= 50Ω
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
ZL = ZLopt, ZS = ZSopt
IC = 6 mA
IC = 10 mA
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Max.
NFmin
1.05
0.95
Noise Figure in 50Ω System2)
NF50
dB
1.1
1.05
Transducer Gain
|S21|²
Maximum Available Power Gain
Gma
18.5
20.5
dB
dB
19
20.5
Input 1 dB Gain compression point3)
IP1dB
-5
-7.5
dBm
Input 3rd Order Intercept Point
IIP3
4
2.5
dBm
Input Return Loss
R.L.in
15.5
21
dB
Output Return Loss
R.L.out
14.5
28
dB
1) Test fixture losses extracted
2) Test fixture losses extracted
3) Measured on an application board according to figure 2) presenting roughly a 50 Ω system to the device. ICq is the
quiescent current, that is at small RF input power level. IC increases as RF input power level approaches P1dB.
Table 8
AC Characteristics, VC = 3 V, f = 900 MHz
Parameter
Symbol
Values
Min.
Minimum Noise Figure
1)
Typ.
NFmin
Unit
Note /
Test Condition
dB
ZS = ZSopt
IC = 6 mA
IC = 10 mA
ZS = ZL= 50Ω
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
ZL = ZLopt, ZS = ZSopt
IC = 6 mA
IC = 10 mA
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
Max.
1.05
0.95
Noise Figure in 50Ω System2)
NF50
dB
1.1
1.05
Transducer Gain
|S21|²
Maximum Available Power Gain
Gma
18.5
20
dB
dB
19
20.5
Input 1 dB Gain compression point3)
IP1dB
-5
-7
dBm
Input 3rd Order Intercept Point
IIP3
3
1.5
dBm
Data Sheet
9
Rev. 1.0, 2009-04-17
BGB741L7ESD
Electrical Characteristics
Table 8
AC Characteristics, VC = 3 V, (cont’d)f = 900 MHz
Parameter
Symbol
Values
Min.
Typ.
Unit
Note /
Test Condition
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Max.
Input Return Loss
R.L.in
15.5
19
dB
Output Return Loss
R.L.out
14.5
28.5
dB
1) Test fixture losses extracted
2) Test fixture losses extracted
3) Measured on an application board according to figure 2) presenting roughly a 50 Ω system to the device. ICq is the
quiescent current, that is at small RF input power level. IC increases as RF input power level approaches P1dB.
Table 9
AC Characteristics, VC = 3 V, f = 1500 MHz
Parameter
Symbol
Values
Min.
Minimum Noise Figure
1)
Typ.
NFmin
Unit
Note /
Test Condition
dB
ZS = ZSopt
IC = 6 mA
IC = 10 mA
ZS = ZL= 50Ω
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
ZL = ZLopt, ZS = ZSopt
IC = 6 mA
IC = 10 mA
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Max.
1.05
1.0
Noise Figure in 50Ω System2)
NF50
dB
1.1
1.05
Transducer Gain
|S21|²
Maximum Available Power Gain
Gma
18
19.5
dB
dB
18.5
20
Input 1 dB Gain compression point
IP1dB
-4.5
-6.5
dBm
Input 3rd Order Intercept Point3)
IIP3
2.5
1
dBm
Input Return Loss
R.L.in
14.5
16
dB
Output Return Loss
R.L.out
14
23
dB
1) Test fixture losses extracted
2) Test fixture losses extracted
3) Measured on an application board according to figure 2) presenting roughly a 50 Ω system to the device. ICq is the
quiescent current, that is at small RF input power level. IC increases as RF input power level approaches P1dB.
Data Sheet
10
Rev. 1.0, 2009-04-17
BGB741L7ESD
Electrical Characteristics
Table 10
AC Characteristics, VC = 3 V, f = 1900 MHz
Parameter
Symbol
Values
Min.
Minimum Noise Figure
1)
Typ.
Unit
Note /
Test Condition
dB
ZS = ZSopt
IC = 6 mA
IC = 10 mA
ZS = ZL= 50Ω
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
ZL = ZLopt, ZS = ZSopt
IC = 6 mA
IC = 10 mA
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Max.
NFmin
1.05
1.05
Noise Figure in 50Ω System2)
NF50
dB
1.15
1.1
Transducer Gain
|S21|²
Maximum Available Power Gain
Gma
17.5
19
dB
dB
18
19.5
Input 1 dB Gain compression point
IP1dB
-4
-6
dBm
Input 3rd Order Intercept Point3)
IIP3
2.5
1
dBm
Input Return Loss
R.L.in
13.5
15
dB
Output Return Loss
R.L.out
13.5
21
dB
1) Test fixture losses extracted
2) Test fixture losses extracted
3) Measured on an application board according to figure 2) presenting roughly a 50 Ω system to the device. ICq is the
quiescent current, that is at small RF input power level. IC increases as RF input power level approaches P1dB.
Table 11
AC Characteristics, VC = 3 V, f = 2400 MHz
Parameter
Symbol
Values
Min.
Minimum Noise Figure
1)
Typ.
NFmin
Unit
Note /
Test Condition
dB
ZS = ZSopt
IC = 6 mA
IC = 10 mA
ZS = ZL= 50Ω
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
ZL = ZLopt, ZS = ZSopt
IC = 6 mA
IC = 10 mA
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
Max.
1.1
1.05
Noise Figure in 50Ω System2)
NF50
dB
1.15
1.1
Transducer Gain
|S21|²
Maximum Available Power Gain
Gma
17
18.5
dB
dB
17.5
19
Input 1 dB Gain compression point3)
IP1dB
-3.5
-5.5
dBm
Input 3rd Order Intercept Point
IIP3
3
1
dBm
Data Sheet
11
Rev. 1.0, 2009-04-17
BGB741L7ESD
Electrical Characteristics
Table 11
AC Characteristics, VC = 3 V, (cont’d)f = 2400 MHz
Parameter
Symbol
Values
Min.
Typ.
Unit
Note /
Test Condition
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Max.
Input Return Loss
R.L.in
12.5
13.5
dB
Output Return Loss
R.L.out
12.5
18
dB
1) Test fixture losses extracted
2) Test fixture losses extracted
3) Measured on an application board according to figure 2) presenting roughly a 50 Ω system to the device. ICq is the
quiescent current, that is at small RF input power level. IC increases as RF input power level approaches P1dB.
Table 12
AC Characteristics, VC = 3 V, f = 3500 MHz
Parameter
Symbol
Values
Min.
Minimum Noise Figure
1)
Typ.
NFmin
Unit
Note /
Test Condition
dB
ZS = ZSopt
IC = 6 mA
IC = 10 mA
ZS = ZL= 50Ω
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
ZL = ZLopt, ZS = ZSopt
IC = 6 mA
IC = 10 mA
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Max.
1.25
1.2
Noise Figure in 50Ω System2)
NF50
dB
1.35
1.25
Transducer Gain
|S21|²
Maximum Available Power Gain
Gma
15
16.5
dB
dB
16
17.5
Input 1 dB Gain compression point3)
IP1dB
-2.5
-4.5
dBm
Input 3rd Order Intercept Point
IIP3
3.5
1.5
dBm
Input Return Loss
R.L.in
10
10.5
dB
Output Return Loss
R.L.out
10
13.5
dB
1) Test fixture losses extracted
2) Test fixture losses extracted
3) Measured on an application board according to figure 2) presenting roughly a 50 Ω system to the device. ICq is the
quiescent current, that is at small RF input power level. IC increases as RF input power level approaches P1dB.
Data Sheet
12
Rev. 1.0, 2009-04-17
BGB741L7ESD
Electrical Characteristics
Table 13
AC Characteristics, VC = 3 V, f = 5500 MHz
Parameter
Symbol
Values
Min.
Minimum Noise Figure
1)
Typ.
NFmin
Unit
Note /
Test Condition
dB
ZS = ZSopt
IC = 6 mA
IC = 10 mA
ZS = ZL= 50Ω
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
ZL = ZLopt, ZS = ZSopt
IC = 6 mA
IC = 10 mA
ICq = 6 mA
ICq = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
IC = 6 mA
IC = 10 mA
Max.
1.8
1.75
Noise Figure in 50Ω System2)
NF50
dB
1.95
1.85
Transducer Gain
|S21|²
Maximum Available Power Gain
Gma
12
13
dB
dB
14
15
Input 1 dB Gain compression point3)
IP1dB
-1
-3
dBm
Input 3rd Order Intercept Point
IIP3
8.5
4
dBm
Input Return Loss
R.L.in
7
8
dB
Output Return Loss
R.L.out
7
8.5
dB
1) Test fixture losses extracted
2) Test fixture losses extracted
3) Measured on an application board according to figure 2) presenting roughly a 50 Ω system to the device. ICq is the
quiescent current, that is at small RF input power level. IC increases as RF input power level approaches P1dB.
Data Sheet
13
Rev. 1.0, 2009-04-17
BGB741L7ESD
Package Information
Package Information
Top view
Bottom view
+0.1
0.4
1.3±0.05
0.05 MAX.
1 ±0.05
6
1.2±0.0351)
7
3
Pin 1 marking
2
1
6 x 0.2±0.0351)
GPC09484
1) Dimension applies to plated terminal
Package Outline of TSLP-7-1
NSMD
SMD
Solder mask
0.2
0.3
R0.1
0.3
0.2
0.2
0.25
0.25
1.9
0.2
0.25
1.9
1.9
0.25
0.3
Copper
0.25
0.2
0.2
0.25
0.2
0.2
0.3
0.2
0.2
1.9
0.3
1.4
0.2
1.4
0.2
1.4
0.2
1.4
0.3
Stencil apertures
Copper
Solder mask
0.2
Figure 5
2 ±0.05
5
6 x 0.2±0.0351)
1.7±0.05
4
1.1±0.0351)
7
0.25
0.25
R0.1
Stencil apertures
TSLP-7-1-FP V01
Figure 6
Foot Print of TSLP-7-1
BGB741L7ESD
Type Code
AY
AX
Figure 7
Marking Layout of TSLP-7-1
0.5
8
2.18
4
Pin 1
marking
Figure 8
Data Sheet
1.45
CPSG9506
Tape of TSLP-7-1
14
Rev. 1.0, 2009-04-17