INTEGRATED CIRCUITS DATA SHEET TEA1097 Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer Product specification Supersedes data of 1998 Jun 11 File under Integrated Circuits, IC03 1999 Apr 08 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 • General purpose auxiliary output for transmit and receive FEATURES Line interface • Low DC line voltage • Auxiliary transmit input with high signal level capability dedicated to line transmission • Voltage regulator with adjustable DC voltage • Auxiliary receive input with high signal level capability • Symmetrical high-impedance inputs (70 kΩ) for dynamic, magnetic or electric microphones • Integrated multiplexer for channels selection. • Dual Tone Multi-Frequency (DTMF) input with confidence tone on earphone and/or loudspeaker APPLICATIONS • Receive amplifier for dynamic, magnetic or piezo-electric earpieces (with externally adjustable gain) • Telephone answering machines • Automatic Gain Control (AGC) for true line loss compensation. • Line powered telephone sets • Telephones with digital handsfree • Cordless telephones • Fax machines. Supplies • Provides a strong 3.35 V regulated supply for microcontroller or dialler GENERAL DESCRIPTION The TEA1097 is an analog bipolar circuit dedicated for telephone applications. It includes a line interface, handset microphone and earpiece amplifiers, base microphone and loudspeaker amplifiers, some specific auxiliary Inputs/Outputs (I/Os) and an analog multiplexer to enable the right transmit and/or receive channels. The multiplexer is controlled by a logic circuitry decoding four logic inputs provided by a microcontroller. Twelve different application modes have been defined and can be accessed by selecting the right logic inputs. • Provides filtered power supply, optimized according to line current and compatible with external voltage or current sources • Filtered 2 V power supply output for electret microphone • Compatible with a ringer mode • Power-Down (PD) logic input for power-down. Loudspeaker amplifier • Single-ended rail-to-rail output This IC can be supplied by the line and/or by the mains if available (in a cordless telephone or a telephone answering machine for example). It provides a 3.35 V supply for a microcontroller or dialler and a 2 V filtered voltage supply for electret microphones. The IC is designed to facilitate the use of the loudspeaker amplifier during ringing phase. • Externally adjustable gain • Dynamic limiter to prevent distortion • Logarithmic volume control via linear potentiometer. Auxiliary interfaces • Asymmetrical high-impedance input for electret microphone. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TEA1097TV VSO40 plastic very small outline package; 40 leads SOT158-1 TEA1097H QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 × 10 × 1.75 mm SOT307-2 1999 Apr 08 DESCRIPTION 2 VERSION Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 QUICK REFERENCE DATA Iline = 15 mA; RSLPE = 20 Ω; Zline = 600 Ω; f = 1 kHz; Tamb = 25 °C; AGC pin connected to LN; PD = HIGH; HFC = LOW; AUXC = LOW; MUTT = HIGH; MUTR = HIGH; measured according to test circuits; unless otherwise specified. SYMBOL Iline VSLPE VBB VDD PARAMETER line current operating range CONDITIONS MIN. TYP. MAX. UNIT normal operation TEA1097H 11 − 140 mA TEA1097TV 11 − 130 mA with reduced performance 1 − 11 mA stabilized voltage between SLPE and GND (Vref) Iline = 15 mA 3.4 3.7 4.0 V Iline = 70 mA 5.7 6.1 6.5 V regulated supply voltage for internal circuitry Iline = 15 mA 2.75 3.0 3.25 V Iline = 70 mA 4.9 5.3 5.7 V regulated supply voltage on pin VDD VBB > 3.35 V + 0.25 V (typ.) 3.1 3.35 3.6 V otherwise − VBB − 0.25 − V VESI(ext) external voltage supply allowed on pin ESI − − 6 V IESI(ext) external current supply allowed on pin ESI − − 140 mA IBB current available on pin VBB speech mode − 11 − mA handsfree mode; HFC = HIGH − 9.5 − mA IBB(pd) current consumption on VBB during power-down phase PD = LOW − 460 − µA Gv(MIC-LN) voltage gain from pin MIC+/MIC− to LN VMIC = 5 mV (RMS) 43.3 44.3 45.3 dB Gv(IR-RECO) voltage gain from pin IR (referenced to LN) to RECO VIR = 15 mV (RMS) 28.7 29.7 30.7 dB ∆Gv(QR) gain voltage range between pins RECO and QR −3 − +15 dB Gv(TXIN-TXOUT) voltage gain from pin TXIN to TXOUT 13.15 14.85 16.55 dB Gv(TXAUX-LN) voltage gain from pin TXAUX to LN VTXAUX = 0.1 V (RMS); note 1 11.5 12.5 13.5 dB Gv(HFRX-LSAO) voltage gain from pin HFRX to LSAO VHFRX = 20 mV (RMS); RGALS = 255 kΩ; note 1 25.5 28 30.5 dB ∆Gv(trx) gain control range for transmit and receive amplifiers affected by the AGC; with respect to Iline = 15 mA Iline = 70 mA; on Gv(MIC-LN), Gv(IR-RECO) and Gv(IR-AUXO) 5.45 6.45 7.45 dB VTXIN = 3 mV (RMS); RGATX = 30.1 kΩ; note 1 Note 1. When the channel is enabled according to Table 1. 1999 Apr 08 3 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 BLOCK DIAGRAM handbook, full pagewidth LN 19 (15) REG SLPE 20 (16) 18 (14) STARTER LINE CURRENT DETECTION LOW VOLTAGE BEHAVIOUR AGC 22 (18) SWITCH D6 SUPPLY MANAGEMENT 17 (13) VBB (9) 12 ESI (19) 23 VDD (20) 24 MICS (38) 40 PD (37) 39 HFC AGC POWER-DOWN CURRENT SOURCES GND (10) 13 Tail currents for preamps TXAUX 5 (43) DTMF 34 (32) ATT. TEA1097TV ANALOG MULTIPLEXER CONTROL MIC+ 33 (31) (39) 1 MUTT (40) 2 MUTR (41) 3 AUXC (27) 29 GATX MIC− 32 (30) TXIN 30 (28) STAB 25 (21) GALS 14 (11) LSAO 16 (12) DLC 11 (8) AUXO 6 (44) RECO (26) 28 TXOUT (29) 31 GNDTX (23) 27 VOL TAIL CURRENTS VOLUME CONTROL (1) 7 HFRX (36) 38 HFTX (17) 21 IR DYNAMIC LIMITER 37 (35) GARX 36 (34) QR 35 (33) ATT. (42) 4 MGL392 The pin numbers given in parenthesis refer to the TEA1097H. Fig.1 Block diagram. 1999 Apr 08 4 RAUX Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 PINNING PIN SYMBOL DESCRIPTION VSO40 QFP44 MUTT 1 39 logic input (active LOW) MUTR 2 40 logic input (active LOW) AUXC 3 41 logic input RAUX 4 42 auxiliary receive amplifier input TXAUX 5 43 auxiliary transmit amplifier input AUXO 6 44 auxiliary amplifier output HFRX 7 1 receive input for loudspeaker amplifier 8 to 10, 15 and 26 2 to 7, 22, 24 and 25 n.c. not connected DLC 11 8 dynamic limiter capacitor for the loudspeaker amplifier ESI 12 9 external supply input VBB 13 10 stabilized supply for internal circuitry GALS 14 11 loudspeaker amplifier gain adjustment LSAO 16 12 loudspeaker amplifier output GND 17 13 ground reference SLPE 18 14 line current sense LN 19 15 positive line terminal REG 20 16 line voltage regulator decoupling IR 21 17 receive amplifier input AGC 22 18 automatic gain control/line loss compensation VDD 23 19 3.35 V regulated voltage supply for microcontroller MICS 24 20 microphone supply output STAB 25 21 reference current adjustment VOL 27 23 loudspeaker volume adjustment TXOUT 28 26 base microphone amplifier output GATX 29 27 base microphone amplifier gain adjustment TXIN 30 28 base microphone amplifier input GNDTX 31 29 ground reference for microphone amplifiers MIC− 32 30 negative handset microphone amplifier input MIC+ 33 31 positive handset microphone amplifier input DTMF 34 32 dual tone multi-frequency input QR 35 33 earpiece amplifier output GARX 36 34 earpiece amplifier gain adjustment RECO 37 35 receive amplifier output HFTX 38 36 transmit input for auxiliary receive amplifier HFC 39 37 logic input PD 40 38 power-down input (active LOW) 1999 Apr 08 5 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer handbook, halfpage MUTT 1 40 PD MUTR 2 39 HFC AUXC 3 38 HFTX RAUX 4 37 RECO TXAUX 5 36 GARX AUXO 6 35 QR HFRX 7 34 DTMF n.c. 8 33 MIC+ n.c. 9 32 MIC− n.c. 10 31 GNDTX TEA1097TV DLC 11 30 TXIN ESI 12 29 GATX VBB 13 28 TXOUT GALS 14 27 VOL n.c. 15 26 n.c. LSAO 16 25 STAB GND 17 24 MICS SLPE 18 23 VDD LN 19 22 AGC REG 20 21 IR MGL393 Fig.2 Pin configuration (VSO40). 1999 Apr 08 6 TEA1097 Philips Semiconductors Product specification TEA1097 34 GARX 35 RECO 36 HFTX 37 HFC 38 PD 39 MUTT 40 MUTR 41 AUXC 42 RAUX handbook, full pagewidth 43 TXAUX 44 AUXO Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer 33 QR HFRX 1 n.c. 2 32 DTMF n.c. 3 31 MIC+ n.c 4 30 MIC− n.c 5 29 GNDTX n.c 6 28 TXIN TEA1097H n.c 7 27 GATX 26 TXOUT DLC 8 ESI 9 25 n.c. VBB 10 24 n.c. 23 VOL n.c 22 STAB 21 MICS 20 VDD 19 IR 17 AGC 18 REG 16 LN 15 SLPE 14 GND 13 LSAO 12 GALS 11 FCA019 Fig.3 Pin configuration (QFP44). The voltage between pins SLPE and REG is used by the internal regulator to generate the stabilized reference voltage and is decoupled by means of a capacitor between pins LN and REG. FUNCTIONAL DESCRIPTION All data given in this chapter are typical values, except when otherwise specified. This capacitor converted into an equivalent inductance realizes the set impedance conversion from its DC value (RSLPE) to its AC value (done by an external impedance). Supplies LINE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE, REG AND VBB) The IC regulates the line voltage at pin LN and it can be calculated as follows: The supply for the TEA1097 and its peripherals is obtained from the line. The IC generates a stabilized reference voltage (Vref) between pins SLPE and GND. This reference voltage is equal to 3.7 V for line currents lower than 18 mA. It than increases linearly with the line current and reaches the value of 6.1 V for line currents higher than 45 mA. For line currents below 9 mA, the internal reference voltage generating Vref is automatically adjusted to a lower value. This is the so-called low voltage area and the TEA1097 has limited performances in this area (see Section “Low voltage behaviour”). This reference voltage is temperature compensated. 1999 Apr 08 V LN = V ref + R SLPE × I SLPE I SLPE = I line – I x where: Iline = line current Ix = current consumed on pin LN (approximately a few µA) ISLPE = current flowing through the RSLPE resistor. 7 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 The preferred value for RSLPE is 20 Ω. Changing this value will affect more than the DC characteristics; it also influences the transmit gains to the line, the gain control characteristic, the sidetone level and the maximum output swing on the line. The aim of the current switch TR1 and TR2 is to reduce distortion of large AC line signals. Current ISLPE is supplied to VBB via TR1 when the voltage on SLPE is greater than VBB + 0.25 V. When the voltage on SLPE is lower than this value, the current ISLPE is shunted to GND via TR2. As can be seen from Fig.4, the internal circuitry is supplied by pin VBB, which is a strong supply point combined with the line interface. The line current is flowing through the RSLPE resistor and is sunk by the VBB voltage stabilizer, becoming available for a loudspeaker amplifier or any peripheral IC. Its voltage is equal to 3.0 V for line currents lower than 18 mA. It than increases linearly with the line current and reaches the value of 5.3 V for line currents greater than 45 mA. It is temperature compensated. The reference voltage Vref can be increased by connecting an external resistor between pins REG and SLPE. For large line currents, this increase can slightly affect some dynamic performances such as maximum signal level on the line for 2% THD. The voltage on pin VBB is not affected by this external resistor. See Fig.5 for the main DC voltages. LN handbook, full pagewidth TR2 RSLPE GND 20 Ω TR1 SLPE CREG 4.7 µF VBB E2 E1 TP1 D1 J1 R3 D1 REG R1 TN2 R2 from preamp J2 TN1 GND GND Fig.4 Line interface principle. 1999 Apr 08 8 MGM298 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 FCA049 8 handbook, full pagewidth LN voltages (V) SLPE 6 VBB 4 VDD MICS 2 0 0 0.01 0.02 0.03 0.04 0.05 0.06 Iline (A) 0.07 Fig.5 Main DC voltages as a function of line current. EXTERNAL SUPPLY (PINS ESI AND VBB) VDD SUPPLY FOR MICROCONTROLLERS (PIN VDD) The TEA1097 can be supplied by the line as well as by external power sources (voltage or current sources) that must be connected to pin ESI. The voltage on VDD supply point follows the voltage on VBB with a difference equal to 250 mV (typ.) and is internally limited to 3.35 V. This voltage is temperature compensated. This supply point can provide a current up to 3 mA (typ.). Its internal consumption stays low (a few 10 nA) as long as VDD does not exceed 1.5 V (see Fig.6). The IC will choose which supply to use according to the voltage it can provide. A voltage supply on ESI is efficient only if its value is greater than the working voltage of the internal VBB voltage stabilizer. Otherwise the IC continues to be line powered. The current consumed on this source is at least equal to the internal consumption. It depends on the voltage difference between the value forced on ESI and the working voltage of the internal stabilizer. The current required increases with the voltage difference to manage. The excess current compared to the internal consumption becomes then available for other purposes such as supplying a loudspeaker amplifier. The voltage source should not exceed 6 V. If the value of the external voltage source can be lower than the working voltage of the internal stabilizer, an external diode is required to avoid reverse current flowing into the external power supply. An external voltage can be connected on VDD with limited extra consumption on VDD (typically 100 µA). This voltage source should not be lower than 3.5 V and higher than 6 V. VBB and VDD can supply external circuits in the limits of currents provided either from the line or from pin ESI, taking into account the internal current consumption. In case of current source, the voltage on VBB and ESI depends on the current available. It is internally limited to 6.6 V. The current source should not exceed 140 mA. 1999 Apr 08 9 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 FCA050 10 8 handbook, full pagewidth IDD (pA) 10 7 10 6 10 5 10 4 10 3 10 2 10 1.0 1.5 2.5 2.0 VDD (V) 3.0 Fig.6 Current consumption on VDD. When VBB becomes lower than 2.5 V, the TEA1097 is forced in a low voltage mode whatever the levels on the logic inputs are. It is a speech mode with reduced performances only enabling the microphone channel (between the MIC inputs and LN) and the earpiece amplifier. These two channels are able to deliver signals for line currents as small as 3 mA. The HFC input is tied to GND sinking a current equal to 300 µA (typ.). SUPPLY FOR MICROPHONE (PINS MICS AND GNDTX) The MICS output can be used as a supply for an electret microphone. Its voltage is equal to 2 V; it can source current up to 1 mA and has an output impedance equal to 200 Ω. LOW VOLTAGE BEHAVIOUR For line currents below 9 mA, the reference voltage is automatically adjusted to a lower value; the VBB voltage follows the SLPE voltage with 250 mV difference. The excess current available for other purposes than DC biasing of the IC becomes small. In this low voltage area, the IC has limited performances. POWER-DOWN MODE (PINS PD AND AUXC) To reduce current consumption during dialling or register recall (flash), the TEA1097 is provided with a power-down input (PD). When the voltage on pins PD and AUXC is LOW, the current consumption from VBB and VDD is reduced to 460 µA (typ.). Therefore a capacitor of 470 µF connected to pin VBB is sufficient to power the TEA1097 during pulse dialling or flash. The PD input has a pull-up structure, while AUXC has a pull-down structure. In this mode, the capacitor CREG is internally disconnected. When the VBB voltage reaches 2.7 V, the VBB detector of the receive dynamic limiter on pin LSAO acts continuously, discharging the capacitor at pin DLC. In the DC condition, the loudspeaker is automatically disabled below this voltage. 1999 Apr 08 10 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 RINGER MODE (PINS ESI, VBB, AUXC AND PD) AUXILIARY TRANSMIT AMPLIFIER (PINS TXAUX AND LN) The TEA1097 is designed to be activated during the ringing phase. The loudspeaker amplifier can be used for the melody signal. The IC must be powered by an external supply on pin ESI, while applying a HIGH level on the logic input AUXC and a LOW level on the PD input. Only the HFRX input and the LSAO output are activated, in order to limit the current consumption. Some dynamic limiting is provided to prevent VBB from being discharged below 2.7 V. The TEA1097 has an asymmetrical auxiliary input TXAUX. The input impedance between pins TXAUX and GND is 20 kΩ (typ.). The voltage gain between pins TXAUX and LN is set to 12.5 dB. Without limitation from the output, the input stage can accommodate signals up to 1.2 V (RMS) at room temperature for 2% of THD. The TXAUX input is biased at two diodes voltage. Automatic gain control is provided for line loss compensation. Transmit channels (pins MIC+, MIC−, DTMF, TXAUX and LN) MICROPHONE MONITORING ON TXOUT (PINS MIC+, MIC− AND TXOUT) HANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC− AND LN) The voltage gain between the microphone inputs MIC+, MIC− and the output TXOUT is set to 49.8 dB. This channel gives an image of the signal sent on the line while speaking in the handset microphone. Using external circuitry, this signal can be used for several purposes such as sending dynamic limiting or anti-howling in a listening-in application. The TXOUT output is biased at two diodes voltage. The TEA1097 has symmetrical microphone inputs. The input impedance between MIC+ and MIC− is 70 kΩ (typ.). The voltage gain between pins MIC+, MIC− and LN is set to 44.3 dB. Without limitation from the output, the microphone input stage can accommodate signals up to 18 mV (RMS) at room temperature for 2% of THD. The microphone inputs are biased at one diode voltage. The automatic gain control has no effect on these channels. Automatic gain control is provided for line loss compensation. Receive channels (pins IR, RAUX, RECO, GARX and QR) DTMF AMPLIFIER (PINS DTMF, LN AND RECO) RX AMPLIFIER (PINS IR AND RECO) The TEA1097 has an asymmetrical DTMF input. The input impedance between pin DTMF and GND is 20 kΩ (typ.). The voltage gain between pins DTMF and LN is set to 25.35 dB. Without limitation from the output, the input stage can accommodate signals up to 180 mV (RMS) at room temperature for 2% of THD. The receive amplifier has one input IR which is referred to the line. The input impedance between pins IR and LN is 20 kΩ (typ.) and the DC biasing between these pins is equal to one diode voltage. The gain between pins IR (referenced to LN) and RECO is typically equal to 29.7 dB. Without limitation from the output, the input stage can accommodate signals up to 50 mV (RMS) at room temperature for 2% of THD. When the DTMF amplifier is enabled, dialling tones may be sent on the line. These tones can be heard in the earpiece or in the loudspeaker at a low level. This is called the confidence tone. The voltage attenuation between pins DTMF and RECO is typically equal to −16.5 dB. The DC biasing of this input is 0 V. This receive amplifier has a rail-to-rail output RECO, which is designed for use with high-ohmic (real) loads (larger than 5 kΩ). This output is biased at two diodes voltage. The automatic gain control has no effect on these channels. Automatic gain control is provided for line loss compensation. 1999 Apr 08 11 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer EARPIECE AMPLIFIER (PINS GARX AND QR) AUXILIARY AMPLIFIERS USING THE MICROPHONE INPUTS (PINS MIC+, MIC− AND AUXO) The earpiece amplifier is an operational amplifier having its output (QR) and its inverting input (GARX) available. Its input signal comes, via a decoupling capacitor, from the receive RECO output. It is used in combination with two resistors to get the required gain or attenuation compared to the receive gain. It can be chosen between −3 and +15 dB. The auxiliary transmit amplifier using the microphone MIC+ and MIC− inputs has a gain of 25.5 dB referenced to AUXO. Without limitation from the output, the input stage can accommodate signals up to 16 mV (RMS) at room temperature for 2% of THD. The automatic gain control has no effect on this channel. Two external capacitors CGAR (connected between pins GARX and QR) and CGARS (connected between pins GARX and GND) ensure stability. The CGAR capacitor provides a first-order low-pass filter. The cut-off frequency corresponds to the time constant CGAR × Re2. The relationship CGARS ≥ 10 × CGAR must be fulfilled. AUXILIARY AMPLIFIERS USING HFTX (PINS HFTX AND AUXO) The auxiliary transmit amplifier using the HFTX input has a gain of 15.2 dB referenced to AUXO. The automatic gain control has no effect on this channel. The earpiece amplifier has a rail-to-rail output QR, biased at two diodes voltage. It is designed for use with low-ohmic (real) loads (150 Ω) or capacitive loads (100 nF in series with 100 Ω). RX AMPLIFIER USING IR (PINS IR AND AUXO) The auxiliary receive amplifier uses pin IR as input. The input is referenced to pin LN and the DC biasing between these two pins is one diode voltage. The voltage gain between the input IR (referenced to LN) and the output AUXO is typically equal to 32.8 dB, which compensates typically the attenuation provided by the anti-sidetone network. When the amplifier is turned off, the signal present on the earpiece is equal to the ratio between the load on QR and Re1 + Re2 AUXILIARY RECEIVE AMPLIFIER (PINS RAUX AND RECO) The auxiliary receive amplifier has an asymmetrical input RAUX; it uses the RECO output. Its input impedance between pins RAUX and GND is typically equal to 20 kΩ. The voltage gain between pins RAUX and RECO is equal to −2.4 dB. Without any limitation from the output, the input stage can accommodate signals up to 0.95 V (RMS) at room temperature for 2% of THD. Automatic gain control is provided for line loss compensation. Automatic gain control (pin AGC) The TEA1097 performs automatic line loss compensation, which fits well with the true line attenuation. The automatic gain control varies the gain of some transmit and receive amplifiers in accordance with the DC line current. The control range is 6.45 dB for Gv(MIC-LN), Gv(IR-RECO) and Gv(IR-AUXO) and 6.8 dB for Gv(TXAUX-LN), which corresponds approximately to a line length of 5.5 km for a 0.5 mm twisted-pair copper cable. This auxiliary amplifier has a rail-to-rail output RECO, which is designed for use with high ohmic (real) loads (larger than 5 kΩ). This output is biased at two diodes voltage. The automatic gain control has no effect on this channel. To enable this gain control, the pin AGC must be shorted to pin LN. The start current for compensation corresponds to a line current equal to typically 23 mA and the stop current to 57 mA. The start current can be increased by connecting an external resistor between pins AGC and LN. It can be increased to 40 mA (using a resistor typically equal to 80 kΩ). The start and stop current will be maintained in a ratio equal to 2.5. By leaving the AGC pin open-circuit, the gain control is disabled and no line loss compensation is performed. Auxiliary amplifiers using AUXO (pins MIC+, MIC−, HFTX, IR and AUXO) The TEA1097 has an auxiliary output AUXO, biased at two diodes voltage. This output stage is a rail-to-rail one, designed for use with high-ohmic (real) loads (larger than 5 kΩ). The AUXO output amplifier is used in three different channels, two transmit channels and one receive channel. 1999 Apr 08 TEA1097 12 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer The gain is proportional to the value of RGATX and equals 14.85 dB with RGATX = 30.1 kΩ. Without limitation from the output, the microphone input stage can accommodate signals up to 18 mV (RMS) at room temperature for 2% of THD. Base microphone channel (pins TXIN, GATX, TXOUT and GNDTX) see Fig.7 The TEA1097 has an asymmetrical base microphone input TXIN with an input resistance of 20 kΩ. The DC biasing of the input is 0 V. A capacitor can be connected in parallel with RGATX to provide a 1st-order low-pass filter. The output TXOUT is biased at two diodes voltage and has a current capability equal to 20 µA (RMS). The gain of the microphone amplifier (from pins TXIN to TXOUT) can be adjusted from 0 to 31 dB to suit specific application requirements. handbook, full pagewidth TEA1097 VBB GATX 29 (27) RMIC CMIC 30 TXIN (28) V I I V TXOUT 28 (26) GNDTX 31 (29) MGL395 The pin numbers given in parenthesis refer to the TEA1097H. Fig.7 Base microphone channel. 1999 Apr 08 13 RGATX CGATX Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 Loudspeaker channel handbook, full pagewidth RGALS CGALS to logic 14 GALS (11) VBB 16 LSAO (12) V I I V HFRX CLSAO 11 DLC (8) DYNAMIC LIMITER VOLUME CONTROL CDLC 7 (1) VOL 27 (23) R VOL MGL394 The pin numbers given in parenthesis refer to the TEA1097H. Fig.8 Loudspeaker channel. LOUDSPEAKER AMPLIFIER: PINS HFRX, GALS AND LSAO DYNAMIC LIMITER (PIN DLC) The TEA1097 has an asymmetrical input for the loudspeaker amplifier with an input resistance of 20 kΩ between pins HFRX and GND. It is biased at two diodes voltage. The input stage can accommodate signals up to 580 mV (RMS) at room temperature for 2% of THD. The dynamic limiter of the TEA1097 prevents clipping of the loudspeaker output stage and protects the operation of the circuit when the supply voltage at VBB falls below 2.7 V. Hard clipping of the loudspeaker output stage is prevented by rapidly reducing the gain when the output stage starts to saturate. The time in which gain reduction is effected (clipping attack time) is approximately a few milliseconds. The circuit stays in the reduced gain mode until the peaks of the loudspeaker signals no longer cause saturation. The gain of the loudspeaker amplifier then returns to its normal value within the clipping release time (typically 100 ms). Both attack and release times are proportional to the value of the capacitor CDLC. The total harmonic distortion of the loudspeaker output stage, in reduced gain mode, stays below 1% up to 10 dB (min.) of input voltage overdrive [providing VHFRX is below 580 mV (RMS)]. The rail-to-rail output stage is designed to power a loudspeaker down to 8 Ω connected as a single-ended load (between pins LSAO and GND). When the circuit is externally supplied, the maximum output power is equal to 280 mW (typ.) for 6 V applied to pin ESI. The gain of the loudspeaker amplifier can be adjusted from 0 to 35 dB to suit specific application requirements. The gain from HFRX to LSAO is proportional to the value of RGALS and equals 28 dB with RGALS = 255 kΩ. A capacitor connected in parallel with RGALS is recommended and provides a first-order low-pass filter. When the supply voltage drops below an internal threshold voltage of 2.7 V, the gain of the loudspeaker amplifier is rapidly reduced (approximately 1 ms). When the supply voltage exceeds 2.7 V, the gain of the loudspeaker amplifier is increased again. By forcing a level lower than 0.2 V on pin DLC, the loudspeaker amplifier is muted. VOLUME CONTROL (PIN VOL) The loudspeaker amplifier gain can be adjusted with the potentiometer RVOL. A linear potentiometer can be used to obtain logarithmic control of the gain at the loudspeaker amplifier. Each 1.9 kΩ increase of RVOL results in a gain loss of 3 dB. 1999 Apr 08 14 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 Logic inputs Table 1 Selection of transmit and receive channels for 12 different application modes LOGIC INPUTS FEATURES APPLICATION EXAMPLES PD HFC MUTT MUTR AUXC 0 X X X 1 0 X X X 0 1 0 0 0 0 DTMF to LN; DTMF to RECO; QR and MICS are active DTMF dialling in handset 1 0 0 1 0 MIC to AUXO; RAUX to RECO; QR and MICS are active cordless intercom with corded handset 1 0 1 1 0 MIC to LN; IR to RECO; handset conversation IR to AUXO; MIC to TXOUT; QR and MICS are active 1 0 1 0 1 TXAUX to LN and IR to AUXO 1 1 0 1 1 RAUX to RECO and HFRX to LSAO listening on the loudspeaker 1 1 0 0 1 TXAUX to LN; IR to AUXO; RAUX to RECO; HFRX to LSAO answering machine: play and record messages; listen the recorded message on the loudspeaker 1 1 0 0 0 DTMF to LN; DTMF to RECO; HFRX to LSAO; QR and MICS are active DTMF dialling in handsfree or group listening modes 1 1 1 0 1 TXAUX to LN; IR to AUXO; IR to RECO and HFRX to LSAO answering machine: play and record messages while listening in the loudspeaker 1 1 0 1 0 TXIN to TXOUT; HFTX to AUXO; RAUX to RECO; HFRX to LSAO and MICS is active cordless intercom with base 1 1 1 1 0 TXIN to TXOUT; TXAUX to LN; IR to RECO; IR to AUXO; HFRX to LSAO; MICS is active digital handsfree conversation 1 1 1 0 0 MIC to LN; IR to RECO; IR to AUXO; HFRX to LSAO; MIC to TXOUT; QR and MICS are active handset conversation with group-listening 1999 Apr 08 HFRX to LSAO ringer mode flash, DC dialling 15 conversation using auxiliary I/O; cordless: digital handsfree in mobile Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); DC levels are referenced to GND. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT positive continuous line voltage −0.4 +12 V repetitive line voltage during switch-on or line interruption −0.4 +13.2 V VESI positive continuous voltage on pin ESI −0.4 +6 V Ii(ESI) input current at pin ESI − 140 mA Vn(max) maximum voltage on pins REG, SLPE, IR and AGC −0.4 VLN + 0.4 V on all other pins except VDD −0.4 VBB + 0.4 V TEA1097H − 140 mA TEA1097TV − 130 mA TEA1097TV − 400 mW TEA1097H − 720 mW VLN Iline Ptot maximum line current for Tamb = 75 °C total power dissipation Tstg IC storage temperature −40 +125 °C Tamb operating ambient temperature −25 +75 °C THERMAL CHARACTERISTICS SYMBOL Rth(j-a) 1999 Apr 08 PARAMETER CONDITIONS VALUE UNIT TEA1097TV 115 K/W TEA1097H 63 K/W thermal resistance from junction to ambient 16 in free air Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 FCA026 160 Iline (mA) handbook, full pagewidth (1) 120 (2) (3) (4) 80 (5) (6) 40 0 3.5 5.5 7.5 11.5 9.5 17 13.5 LINE Tamb (°C) Ptot (mW) (1) 25 800 (2) 35 720 (3) 45 640 (4) 55 560 (5) 65 480 (6) 75 400 Fig.9 Safe operating area (TEA1097TV). 1999 Apr 08 VSLPE (V) Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 FCA025 160 handbook, full pagewidth Iline (mA) (1) (2) 120 (3) (4) 80 (5) 40 0 3 4 5 6 7 8 10 9 18 12 VSLPE (V) 13 LINE Tamb (°C) Ptot (mW) (1) 35 1304 (2) 45 1158 (3) 55 1012 (4) 65 866 (5) 75 720 Fig.10 Safe operating area (TEA1097H). 1999 Apr 08 11 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 CHARACTERISTICS Iline = 15 mA; RSLPE = 20 Ω; Zline = 600 Ω; f = 1 kHz; Tamb = 25 °C; AGC pin connected to LN; PD = HIGH; HFC = LOW; AUXC = LOW; MUTT = HIGH; MUTR = HIGH; measured according to test circuits; DC levels are referenced to GND; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies LINE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE, REG AND VBB) VSLPE stabilized voltage between SLPE Iline = 15 mA and GND (Vref) Iline = 70 mA 3.4 3.7 4 V 5.7 6.1 6.5 V regulated supply voltage for internal circuitry Iline = 15 mA 2.75 3.0 3.25 V Iline = 70 mA 4.9 5.3 5.7 V Iline line current for voltage increase start current − 18 − mA stop current − 45 − mA ∆VSLPE(T) stabilized voltage variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±60 − mV ∆VBB(T) regulated voltage variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±30 − mV IBB current available on pin VBB speech mode − 11 − mA digital handsfree mode; HFC = HIGH − 9.5 − mA Iline = 1 mA − 1.55 − V Iline = 4 mA − 2.35 − V Iline = 15 mA 3.7 4.0 4.3 V Iline = 130 mA − 8.7 9.3 V − − 6 V VBB VLN line voltage EXTERNAL SUPPLY (PIN ESI) VESI external voltage supply allowed on pin ESI voltage on pin ESI when supplied by a current source IESI = 140 mA except in power-down mode − 6.6 − V Ii(ESI) input current on pin ESI VESI = 3.5 V − 3.1 − mA IESI(ext) external current supply allowed on pin ESI − − 140 mA 1999 Apr 08 19 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer SYMBOL PARAMETER CONDITIONS TEA1097 MIN. TYP. MAX. UNIT SUPPLY FOR PERIPHERALS (PIN VDD) VDD regulated supply voltage on VDD VBB > 3.35 V + 0.25 V (typ.) 3.1 3.35 3.6 V otherwise − VBB − 0.25 − V ∆VDD(T) regulated voltage variation with temperature referenced to 25 °C Tamb = −25 to +75 °C; VBB > 3.35 V + 0.25 V (typ.) − ±30 − mV IDD current consumption on VDD in trickle mode; Iline = 0 mA; VDD = 1.5 V; VBB discharging − 15 150 nA VDD > 3.35 V 60 100 − µA VDD = 3.35 V − − −3 mA IDD(o) current available for peripherals SUPPLY FOR MICROPHONE (PIN MICS) VMICS supply voltage for a microphone − 2 − V IMICS current available on MICS − − −1 mA V POWER-DOWN INPUT (PIN PD) VIL LOW-level input voltage −0.4 − +0.3 VIH HIGH-level input voltage 1.8 − VBB + 0.4 V Ii(pd) input current − −3 −6 µA IBB(pd) current consumption on VBB during power-down phase − 460 − µA PD = LOW; AUXC = LOW RINGER MODE (PINS PD, AUXC, HFRX AND LSAO) Ii(ESI) input current on pin ESI PD = LOW; AUXC = HIGH; VESI = 3.5 V − 3.1 − mA Gv(HFRX-LSAO) voltage gain from pin HFRX to LSAO PD = LOW; AUXC = HIGH; VESI = 3.5 V VHFRX = 20 mV (RMS); RGALS = 255 kΩ − 28 − dB Preamplifier inputs (pins MIC+, MIC−, IR, DTMF, TXIN, HFTX, HFRX, TXAUX and RAUX) Zi(MIC) input impedance differential between pins MIC+ and MIC− − 70 − kΩ single-ended between pins MIC+/MIC− and GNDTX − 35 − kΩ Zi(IR) input impedance between pins IR and LN − 20 − kΩ Zi(DTMF) input impedance between pins DTMF and GND − 20 − kΩ Zi(TXIN) input impedance between pins TXIN and GNDTX − 20 − kΩ 1999 Apr 08 20 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer SYMBOL PARAMETER CONDITIONS TEA1097 MIN. TYP. MAX. UNIT Zi(HFTX) input impedance between pins HFTX and GND − 20 − kΩ Zi(HFRX) input impedance between pins HFRX and GND − 20 − kΩ Zi(TXAUX) input impedance between pins TXAUX and GND − 20 − kΩ Zi(RAUX) input impedance between pins RAUX and GND − 20 − kΩ TX amplifiers; see note 1 TX HANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC− AND LN) Gv(MIC-LN) voltage gain from pin MIC+/MIC− VMIC = 5 mV (RMS) to LN 43.3 44.3 45.3 dB ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.25 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.25 − dB CMRR common mode rejection ratio − 80 − dB THD total harmonic distortion at pin LN VLN = 1.4 V (RMS) − − 2 % Iline = 4 mA; VLN = 0.12 V (RMS) − − 10 % Vno(LN) noise output voltage at pin LN; pins MIC+/MIC− shorted through 200 Ω psophometrically weighted (p53 curve) − −77.5 − dBmp ∆Gv(mute) gain reduction if not activated HFC = LOW; MUTT = LOW; MUTR = LOW; AUXC = LOW 60 80 − dB DTMF AMPLIFIER (PINS DTMF, LN AND RECO) Gv(DTMF-LN) voltage gain from pin DTMF to LN VDTMF = 50 mV (RMS) 24.35 25.35 26.35 dB ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.25 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.25 − dB ∆Gv(mute) gain reduction if not activated HFC = LOW; MUTT = HIGH; MUTR = HIGH; AUXC = LOW 60 80 − dB Gv(DTMF-RECO) voltage gain from pin DTMF to RECO VDTMF = 50 mV (RMS) − −16.5 − dB 1999 Apr 08 21 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer SYMBOL PARAMETER CONDITIONS TEA1097 MIN. TYP. MAX. UNIT TX AUXILIARY AMPLIFIER USING TXAUX (PINS TXAUX AND LN) Gv(TXAUX-LN) voltage gain from pin TXAUX to LN VTXAUX = 0.1 V (RMS) 11.5 12.5 13.5 dB ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.25 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.25 − dB THD total harmonic distortion at LN VLN = 1.4 V (RMS) − − 2 % VTXAUX(rms) maximum input voltage at TXAUX (RMS value) Iline = 70 mA; THD = 2% − 1.2 − V Vno(LN) noise output voltage at pin LN; pin TXAUX shorted to GND through 200 Ω in series with 10 µF psophometrically weighted (p53 curve) − −80.5 − dBmp ∆Gv(mute) gain reduction if not activated HFC = LOW; MUTT = LOW; MUTR = LOW; AUXC = LOW 60 80 − dB MICROPHONE MONITORING ON TXOUT (PINS MIC+, MIC− AND TXOUT) Gv(MIC-TXOUT) voltage gain from pin MIC+/MIC− VMIC = 2 mV (RMS) to TXOUT 48.3 49.8 51.3 dB ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.1 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.35 − dB RX amplifiers; see note 1 RX AMPLIFIERS USING IR (PINS IR AND RECO) Gv(IR-RECO) voltage gain from pin IR (referenced to LN) to RECO VIR = 15 mV (RMS) 28.7 29.7 30.7 dB ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.25 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.3 − dB VIR(rms)(max) maximum input voltage on IR (referenced to LN) (RMS value) Iline = 70 mA; THD = 2% − 50 − mV VRECO(rms)(max) maximum output voltage on pin RECO (RMS value) THD = 2% 0.75 0.9 − V Vno(RECO)(rms) noise output voltage at pin RECO; pin IR is an open-circuit (RMS value) psophometrically weighted (p53 curve) − −88 − dBVp ∆Gv(mute) gain reduction if not activated HFC = LOW; MUTT = LOW; MUTR = LOW; AUXC = LOW 60 80 − dB 1999 Apr 08 22 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer SYMBOL PARAMETER CONDITIONS TEA1097 MIN. TYP. MAX. UNIT RX EARPIECE AMPLIFIER (PINS GARX AND QR) ∆Gv(RECO-QR) gain voltage range between pins RECO and QR VQR(rms)(max) maximum output voltage on pin QR (RMS value) Vno(QR)(rms) noise output voltage at pin QR; pin IR is an open-circuit (RMS value) −3 − +15 dB sine wave drive; RL = 150 Ω; THD < 2% 0.75 0.9 − V Gv(QR) = 0 dB; psophometrically weighted (p53 curve) − −88 − dBVp RX AMPLIFIER USING RAUX (PINS RAUX AND RECO) Gv(RAUX-RECO) voltage gain from pin RAUX to RECO VRAUX = 0.4 V (RMS) −3.7 −2.4 −1.1 dB ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.25 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.25 − dB VRAUX(rms)(max) maximum input voltage on RAUX THD = 2% (RMS value) − 0.95 − V Vno(RECO)(rms) noise output voltage at pin RECO; pin RAUX shorted to GND through 200 Ω in series with 10 µF (RMS value) psophometrically weighted (p53 curve) − −100 − dBVp ∆Gv(mute) gain reduction if not activated HFC = LOW; MUTT = LOW; MUTR = LOW; AUXC = LOW 60 80 − dB Auxiliary amplifiers using AUXO; see note 1 TX AUXILIARY AMPLIFIER USING MIC+ AND MIC− (PINS MIC+, MIC− AND AUXO) Gv(MIC-AUXO) voltage gain from pin MIC+/MIC− VMIC = 10 mV (RMS) to AUXO 24.2 25.5 26.8 dB ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.1 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.3 − dB VMIC(rms) maximum input voltage on MIC+/MIC− (RMS value) THD = 2% − 16 − mV Vno(AUXO)(rms) noise output voltage at pin AUXO; pins MIC+/MIC− shorted to GNDTX through 200 Ω in series with 10 µF (RMS value) psophometrically weighted (p53 curve) − −91 − dBVp 1999 Apr 08 23 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer SYMBOL PARAMETER CONDITIONS TEA1097 MIN. TYP. MAX. UNIT TX AUXILIARY AMPLIFIER USING HFTX (PINS HFTX AND AUXO) Gv(HFTX-AUXO) voltage gain from pin HFTX to AUXO VHFTX = 100 mV (RMS) 14.2 15.2 16.2 dB ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.1 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.1 − dB VAUXO(rms) maximum output voltage on pin AUXO (RMS value) THD = 2% 0.8 0.9 − V Vno(AUXO)(rms) noise output voltage at pin AUXO; pin HFTX shorted to GND through 200 Ω in series with 10 µF (RMS value) psophometrically weighted (p53 curve) − −91.5 − dBVp ∆Gv(mute) gain reduction if not activated HFC = LOW; MUTT = LOW; MUTR = HIGH; AUXC = LOW 60 80 − dB RX AMPLIFIER USING IR (PINS IR AND AUXO) Gv(IR-AUXO) voltage gain from pin IR (referenced to LN) to AUXO VIR = 3 mV (RMS) 31.6 32.8 34 dB ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.1 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.3 − dB VAUXO(rms) maximum output voltage on AUXO (RMS value) THD = 2% 0.8 0.9 − V Vno(AUXO)(rms) noise output voltage at pin AUXO; pin IR is an open-circuit (RMS value) psophometrically weighted (p53 curve) − −85 − dBVp ∆Gv(mute) gain reduction if not activated HFC = HIGH; MUTT = LOW; MUTR = HIGH; AUXC = HIGH 60 80 − dB Iline = 70 mA; on Gv(MIC-LN), Gv(IR-RECO) and Gv(IR-AUXO) 5.45 6.45 7.45 dB Iline = 70 mA; Gv(TXAUX-LN) 5.8 6.8 7.8 dB Automatic Gain Control (pin AGC) ∆Gv(trx) gain control range for transmit and receive amplifiers affected by the AGC; with respect to Iline = 15 mA Istart highest line current for maximum gain − 23 − mA Istop lowest line current for maximum gain − 57 − mA 1999 Apr 08 24 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer SYMBOL PARAMETER CONDITIONS TEA1097 MIN. TYP. MAX. UNIT Logic inputs (pins HFC, AUXC, MUTT and MUTR) VIL LOW-level input voltage −0.4 − +0.3 VIH HIGH-level input voltage 1.8 − VBB + 0.4 V Ii input current V for pins HFC and AUXC − 3 6 µA for pins MUTT and MUTR − −2.5 −6 µA 13.15 14.85 16.55 dB −15 − +16 dB Base microphone amplifier (pins TXIN, TXOUT and GATX); see note 1 Gv(TXIN-TXOUT) voltage gain from pin TXIN to TXOUT VTXIN = 3 mV (RMS); RGATX = 30.1 kΩ ∆Gv voltage gain adjustment with RGATX ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.1 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.15 − dB Vno(TXOUT)(rms) noise output voltage at pin TXOUT; pin TXIN is shorted through 200 Ω in series with 10 µF to GNDTX (RMS value) psophometrically weighted (p53 curve) − −101 − dBVp ∆Gv(mute) gain reduction if not activated HFC = HIGH; MUTT = LOW; MUTR = LOW; AUXC = LOW 60 80 − dB 25.5 28 30.5 dB −28 − +7 dB Loudspeaker amplifier (pins HFRX, LSAO, GALS and VOL); see note 1 Gv(HFRX-LSAO) voltage gain from pin HFRX to LSAO ∆Gv voltage gain adjustment with RGALS ∆Gv(f) gain variation with frequency referenced to 1 kHz f = 300 to 3400 Hz − ±0.3 − dB ∆Gv(T) gain variation with temperature referenced to 25 °C Tamb = −25 to +75 °C − ±0.3 − dB ∆Gv(vol) voltage gain variation related to ∆RVOL = 1.9 kΩ − −3 − dB Iline = 70 mA; RGALS = 33 kΩ; for 2% THD in the input stage − 580 − mV − −79 − dBVp Iline = 18 mA − 0.9 − V Iline = 30 mA − 1.2 − V Iline > 50 mA − 1.6 − V V(HFRX)(rms)(max) maximum input voltage at pin HFRX (RMS value) VHFRX = 20 mV (RMS); RGALS = 255 kΩ Vno(LSAO)(rms) noise output voltage at pin LSAO; pin HFRX is open-circuit (RMS value) psophometrically weighted (p53 curve) VLSAO(rms) output voltage (RMS value) without external supply on pin ESI IBB = 0 mA; IDD = 1 mA 1999 Apr 08 25 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer SYMBOL ILSAO(max) PARAMETER maximum output current at pin LSAO (peak value) CONDITIONS TEA1097 MIN. TYP. MAX. UNIT 300 − mA when VHFRX jumps from − 20 mV to 20 mV + 10 dB − 5 ms − 1 − ms external supply on ESI 150 Dynamic limiter (pins LSAO and DLC); see note 1 tatt attack time when VBB jumps below VBB(th) trel release time when VHFRX jumps from − 20 mV + 10 dB to 20 mV 100 − ms THD total harmonic distortion at VHFRX = 20 mV + 10 dB t > tatt − 0.1 2 % VBB(th) VBB limiter threshold − 2.7 − V −0.4 − +0.2 V Mute Loudspeaker (pin DLC); see note 1 VDLC(th) threshold voltage required on pin DLC to obtain mute receive condition IDLC(th) threshold current sourced by pin DLC in mute receive condition VDLC = 0.2 V − 100 − µA ∆Gvrx(mute) voltage gain reduction in mute receive condition VDLC = 0.2 V 60 80 − dB Note 1. When the channel is enabled according to Table 1. 1999 Apr 08 26 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 10 V Cemc SLPE 10 nF CIR Cimp Cexch 100 µF 100 µF 4.7 µF 20 Ω IR 100 nF 18 (14) REG 20 (16) AGC 22 (18) LN 19 (15) ESI 12 (9) CVDD CVBB 470 µF VBB DESI 13 (10) 47 µF VDD 23 (19) 40 PD (38) 39 HFC 21 (17) (37) CMICS 4.7 µF MICS MIC+ RMIC 200 Ω MIC− VMIC CHFTX HFTX 100 nF TXOUT 27 CGATX RGATX 100 pF 30.1 kΩ GATX CTXIN TXIN 100 nF VHFTX CDTMF DTMF 100 nF VTXIN CTXAUX VDTMF TXAUX 100 nF CRAUX VTXAUX RAUX 100 nF AUXC 3 (41) MUTT 1 (39) MUTR 2 (40) CAUXO 10 µF AUXO 6 (44) 24 (20) 33 (31) 32 (30) 38 (36) 35 (33) TEA1097 28 (26) 36 (34) from controller RAUXO 10 kΩ QR GARX CGAR 100 pF Re2 100 kΩ CGARS 1 nF Re1 100 kΩ CRXE 29 (27) 37 (35) 30 (28) 7 (1) 34 (32) 14 (11) 5 (43) 4 (42) 17 (13) GND 16 (12) 31 (29) 25 (21) 27 (23) GNDTX STAB 11 (8) VOL DLC VRAUX RVOL 0 to 22 kΩ HFRX CHFRX 100 nF GALS RGALS LSAO 255 kΩ CGALS 150 pF CGALS 220 µF RLSAO 8Ω CDLC 470 nF TEA1097 Fig.11 Test circuit. 4.7 µF VHFRX FCA001 The pin numbers given in parenthesis refer to the TEA1097H. CQR Product specification RSTAB 3.65 kΩ 100 nF RECO RQR 150 Ω Philips Semiconductors Dz Vd CREG RSLPE VIR Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer Zimp 620 Ω i = 15 mA J_line TEST AND APPLICATION INFORMATION 600 Ω ok, full pagewidth 1999 Apr 08 Zexch external supply This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... RSLPE Rbal1 130 Ω Zimp 620 Ω Dz Vd 10 V Rast2 3.92 kΩ CIR Cimp 22 µF D2 4.7 µF Rast3 IR SLPE 21 (17) 18 (14) REG 20 (16) AGC 22 (18) LN 19 (15) ESI 12 (9) CVDD 47 µF VDD CVBB 470 µF VBB DESI 392 Ω Cemc 10 nF external supply CREG 20 Ω 13 (10) 23 (19) 100 nF 39 HFC (37) 3 AUXC Rast1 130 kΩ D3 40 PD (38) from controller (41) 1 MUTT (39) 2 MUTR CMICS 10 µF MICS 24 (20) Rtx2 MIC+ 33 (31) MICS (40) RMICP Ctx2 1 kΩ handset microphone Cmich 33 nF RMICM 22 nF 15 kΩ Ctx1 Rtx1 22 nF 15 kΩ Rtx3 8.2 kΩ 6 (44) 32 MIC− (30) 35 (33) 1 kΩ TEA1097 28 CHFTX HFTX 38 (36) TXOUT 28 (26) A 100 nF to digital handsfree B RGATX 30.1 kΩ GATX from MICS Rbmics CTXIN 2 kΩ base microphone Cmicb 30 (28) DTMF 34 (32) CDTMF 100 nF D1 D4 from digital answering machine CQR 4.7 µF QR GARX CGAR 100 pF Re2 100 kΩ CGARS Re1 100 kΩ 1 nF CRXE 37 (35) 29 (27) TXIN to digital answering machine or digital handsfree 100 nF 7 (1) RECO 100 nF HFRX from digital handsfree 100 nF 22 nF from digital answering machine or digital handsfree 36 (34) C AUXO AUXO Philips Semiconductors Cbal 220 nF Rbal2 820 Ω Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer 1999 Apr 08 handbook, full pagewidth CTXAUX TXAUX 14 (11) 16 (12) 5 (43) GALS RGALS CGALS CLSAO 255 kΩ LSAO 150 pF 220 µF 100 nF CRAUX 100 nF RAUX 4 (42) 17 (13) GND 31 (29) 25 (21) GNDTX STAB 27 (23) 11 (8) VOL Fig.12 Basic application diagram. 0 to 22 kΩ CDLC 470 nF Product specification The pin numbers given in parenthesis refer to the TEA1097H. RVOL TEA1097 RSTAB 3.65 kΩ MGL396 DLC Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 PACKAGE OUTLINES VSO40: plastic very small outline package; 40 leads SOT158-1 D E A X c y HE v M A Z 40 21 Q A2 A (A 3) A1 θ pin 1 index Lp L 1 detail X 20 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 2.70 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 12.3 11.8 2.25 1.7 1.5 1.15 1.05 0.2 0.1 0.1 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.30 0.29 0.03 0.48 0.46 0.067 0.089 0.059 inches 0.11 0.045 0.024 0.008 0.004 0.004 0.041 0.012 θ 7o 0o Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-24 SOT158-1 1999 Apr 08 EUROPEAN PROJECTION 29 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.10 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 10.1 9.9 0.8 12.9 12.3 12.9 12.3 1.3 0.95 0.55 0.15 0.15 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 θ o 10 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT307-2 1999 Apr 08 EUROPEAN PROJECTION 30 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer If wave soldering is used the following conditions must be observed for optimal results: SOLDERING Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. 1999 Apr 08 TEA1097 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 31 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer TEA1097 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable suitable(2) suitable suitable suitable LQFP, QFP, TQFP not recommended(3)(4) suitable SSOP, TSSOP, VSO not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Apr 08 32 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer NOTES 1999 Apr 08 33 TEA1097 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer NOTES 1999 Apr 08 34 TEA1097 Philips Semiconductors Product specification Speech and loudspeaker amplifier IC with auxiliary inputs/outputs and analog multiplexer NOTES 1999 Apr 08 35 TEA1097 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 465002/750/03/pp36 Date of release: 1999 Apr 08 Document order number: 9397 750 05008