INTEGRATED CIRCUITS DATA SHEET 74AHC123A; 74AHCT123A Dual retriggerable monostable multivibrator with reset Product specification File under Integrated Circuits, IC06 2000 Mar 15 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset Once triggered, the basic output pulse width may be extended by retriggering the gated active LOW-going edge input (nA) or the active HIGH-going edge input (nB). By repeating this process, the output pulse period (nQ = HIGH, nQ = LOW) can be made as long as desired. Alternatively an output delay can be terminated at any time by a LOW-going edge on input nRD, which also inhibits the triggering. FEATURES • ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V CDM EIA/JESD22-C101 exceeds 1000 V • All inputs have Schmitt-trigger actions • Inputs accept voltages higher than VCC • For AHC only: operates with CMOS input levels An internal connection from nRD to the input gate makes it possible to trigger the circuit by a positive-going signal at input nRD as shown in the function table. Figs 8 and 9 illustrate pulse control by retriggering and early reset. The basic output pulse width is essentially determined by the value of the external timing components REXT and CEXT. When CEXT ≥ 10 nF, the typical output pulse width is defined as: tW = REXT × CEXT where tW = pulse width in ns; REXT = external resistor in kΩ; CEXT = external capacitor in pF. Schmitt-trigger action at all inputs makes the circuit highly tolerant to slower input rise and fall times. The ‘123’ is identical to the ‘423’ but can be triggered via the reset input. • For AHCT only: operates with TTL input levels • Specified from −40 to +85 °C and −40 to +125 °C • DC triggered from active HIGH or active LOW inputs • Retriggerable for very long pulses up to 100% duty factor • Direct reset terminates output pulse • Output capability: standard (except for nREXT/CEXT). DESCRIPTION The 74AHC/AHCT123A are high-speed Si-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no.7A. The 74AHC/AHCT123A are dual retriggerable monostable multivibrators with output pulse width control by three methods. The basic pulse time is programmed by selection of an external resistor (REXT) and capacitor (CEXT). The external resistor and capacitor are normally connected as shown in Fig.6. 2000 Mar 15 74AHC123A; 74AHCT123A 2 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns. TYPICAL SYMBOL tPHL/tPLH PARAMETER CONDITIONS propagation delay CL = 15 pF; VCC = 5 V; REXT = 5 kΩ; CEXT = 0 pF nA, nB to nQ, nQ nRD to nQ, nQ CI input capacitance CO output capacitance CPD power dissipation capacitance VI = VCC or GND CL = 50 pF; f = 1 MHz; notes 1 and 2 Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) × CEXT × VCC2 × fo + D × 16 × VCC where: fi = input frequency in MHz; fo = output frequency in MHz; ∑ (CL × VCC2 × fo) = sum of outputs; D = duty factor in %; CL = output load capacitance in pF; CEXT = timing capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. 2000 Mar 15 3 UNIT AHC AHCT 5.1 5.0 ns 5.6 5.2 ns 5 3 pF 4 4 pF 57 58 pF Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A FUNCTION TABLE See note 1. INPUTS OUTPUTS nRD nA nB nQ nQ L X X L H H(2) X H X L(2) X X L L(2) H L H ↑ H(2) ↑ (3) (4) ↓ H (3) (4) L H (3) (4) Notes 1 H = HIGH voltage level; L = LOW voltage level; X = don’t care; ↑ = LOW-to-HIGH CP transition; ↓ = HIGH-to-LOW CP transition. 2 If the monostable multivibrator was triggered before this condition was established, the pulse will be continued as programmed. 3 One HIGH-level output pulse. 4 One LOW-level output pulse. ORDERING INFORMATION PACKAGES TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE −40 to +125 °C 16 SO plastic SOT109-1 74AHC123APW 16 TSSOP plastic SOT403-1 74AHCT123AD 16 SO plastic SOT109-1 74AHCT123APW 16 TSSOP plastic SOT403-1 74AHC123AD 2000 Mar 15 4 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A PINNING PIN SYMBOL DESCRIPTION 1, 9 1A, 2A trigger inputs (negative-edge triggered) 2, 10 1B, 2B trigger inputs (positive-edge triggered) 3, 11 1RD, 2RD direct reset LOW and trigger action at positive edge 4, 12 1Q, 2Q outputs (active LOW) 5, 13 2Q, 1Q outputs (active HIGH) 6, 14 2CEXT, 1CEXT external capacitor connection 7, 15 2REXT/CEXT, 1REXT/CEXT external resistor/capacitor connection 8 GND ground (0 V) 16 VCC DC supply voltage 1CEXT 14 2CEXT 6 handbook, halfpage handbook, halfpage 1A 1 16 VCC 1B 2 15 1REXT/CEXT 1RD 3 1REXT/CEXT 15 2REXT/CEXT 7 14 1CEXT S 13 1Q 1Q 4 123 9 2A 2REXT/CEXT 7 10 2B GND 8 9 2A 2 1B 10 2B Q RD 3 1RD 11 2RD MNA514 Fig.1 Pin configuration. 1Q 4 2Q 12 MNA515 Fig.2 Logic diagram. 5 1Q 13 2Q 5 T 11 2RD 2CEXT 6 2000 Mar 15 Q 1 1A 12 2Q 2Q 5 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset handbook, halfpage 14 15 74AHC123A; 74AHCT123A CX 1 handbook, halfpage 13 RCX 1CEXT 14 2CEXT & 2 1REXT/CEXT 15 2REXT/CEXT 7 4 3 R S 7 9 2A CX 9 2 1B 10 2B & 10 Q 1Q 4 2Q 12 RD MNA517 R MNA516 Fig.3 IEC logic symbol. 2000 Mar 15 5 3 1RD 11 2RD 12 11 2Q T 5 RCX 1Q 13 Q 1 1A 6 6 Fig.4 Functional diagram. 6 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset handbook, full pagewidth 74AHC123A; 74AHCT123A nREXT/CEXT VCC Q RD CL VCC Q R R CL VCC R CL MNA518 CL A B CL R For minimum noise generation, it is recommended to ground pins 6 (2CEXT) and 14 (1CEXT) externally to pin 8 (GND). Fig.5 Logic diagram (one flip-flop). 2000 Mar 15 7 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A VCC handbook, halfpage REXT CEXT to nCEXT (pin 14 or 6) to nREXT/CEXT (pin 15 or 7) MNA519 Fig.6 Timing component connections. RECOMMENDED OPERATING CONDITIONS 74AHC SYMBOL PARAMETER 74AHCT CONDITIONS UNIT MIN. TYP. MAX. MIN. TYP. MAX. VCC DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V VI input voltage 0 − 5.5 0 − 5.5 V VO output voltage 0 − VCC 0 − VCC V Tamb operating ambient temperature see DC and AC characteristics per device −40 +25 +85 −40 +25 +85 °C −40 +25 +125 −40 +25 +125 °C input rise and fall time ratios VCC = 3.3 ±0.3 V − − 100 − − − ns/V VCC = 5 ±0.5 V − − 20 − − 20 ns/V external timing resistor VCC = 2 V 5 − − 5 − − kΩ VCC > 3 V 1 − − 1 − − kΩ tr, tf REXT CEXT 2000 Mar 15 external timing capacitor no limits 8 pF Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC DC supply voltage −0.5 +7.0 V VI input voltage −0.5 +7.0 V IIK DC input diode current VI < −0.5 V; note 1 − −20 mA IOK DC output clamping diode current VO < −0.5 V or VO > VCC + 0.5 V; note 1 − ±20 mA IO DC output sink current −0.5 V < VO < VCC + 0.5 V − ±25 mA ICC DC VCC or GND current − ±75 mA Tstg storage temperature −65 +150 °C PD power dissipation per package − 500 mW for temperature range: −40 to +125 °C; note 2 Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO packages: above 70 °C the value of PD derates linearly with 8 mW/K. For TSSOP packages: above 60 °C the value of PD derates linearly with 5.5 mW/K. 2000 Mar 15 9 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A DC CHARACTERISTICS Family 74AHC Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER VIL VOH VOL II ICC CI VCC (V) −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. 2.0 1.5 − − 1.5 − 1.5 − V 3.0 2.1 − − 2.1 − 2.1 − V 5.5 3.85 − − 3.85 − 3.85 − V 2.0 − − 0.5 − 0.5 − 0.5 V 3.0 − − 0.9 − 0.9 − 0.9 V 5.5 − − 1.65 − 1.65 − 1.65 V 2.0 1.9 2.0 − 1.9 − 1.9 − V 3.0 2.9 3.0 − 2.9 − 2.9 − V 4.5 4.4 4.5 − 4.4 − 4.4 − V VI = VIH or VIL; IO = −4.0 mA 3.0 2.58 − − 2.48 − 2.40 − V VI = VIH or VIL; IO = −8.0 mA 4.5 3.94 − − 3.8 − 3.70 − V VI = VIH or VIL; IO = 50 µA 2.0 − 0 0.1 − 0.1 − 0.1 V 3.0 − 0 0.1 − 0.1 − 0.1 V HIGH-level input voltage LOW-level input voltage HIGH-level output VI = VIH or VIL; voltage IO = −50 µA LOW-level output voltage −40 to +85 25 OTHER VIH Tamb (°C) 4.5 − 0 0.1 − 0.1 − 0.1 V VI = VIH or VIL; IO = 4.0 mA 3.0 − − 0.36 − 0.44 − 0.55 V VI = VIH or VIL; IO = 8.0 mA 4.5 − − 0.36 − 0.44 − 0.55 V input leakage current; REXT/CEXT VI = VCC or GND; note 1 5.5 − − ±0.25 − ±2.5 − ±10.0 µA input leakage current; nA, nB, nRD VI = VCC or GND 5.5 − − ±0.1 − ±1.0 − ±2.0 µA quiescent supply current VI = VCC or GND; IO = 0 5.5 − − 4.0 − 40 − 80 µA quiescent supply current active state (per circuit) VI = VCC or GND; note 1 3 − 160 250 − 280 − 280 µA 4.5 − 380 500 − 650 − 650 µA 5.5 − 560 750 − 975 − 975 µA − − 5 10 − 10 − 10 pF input capacitance Note 1. Voltage on pin nREXT/CEXT = 0.5 × VCC and pin REXT/CEXT in OFF-state during test. 2000 Mar 15 10 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A Family 74AHCT Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 OTHER VCC (V) MIN. −40 to +125 UNIT TYP. MAX. MIN. MAX. MIN. MAX. VIH HIGH-level input voltage 4.5 to 5.5 2.0 − − 2.0 − 2.0 − V VIL LOW-level input voltage 4.5 to 5.5 − − 0.8 − 0.8 − 0.8 V VOH HIGH-level output VI = VIH or VIL; voltage IO = −50 µA 4.5 4.4 4.5 − 4.4 − 4.4 − V VI = VIH or VIL; IO = −8.0 mA 4.5 3.94 − − 3.8 − 3.70 − V VI = VIH or VIL; IO = 50 µA 4.5 − 0 0.1 − 0.1 − 0.1 V VI = VIH or VIL; IO = 8.0 mA 4.5 − − 0.36 − 0.44 − 0.55 V input leakage current; REXT/CEXT VI = VCC 5.5 or GND; note 1 − − ±0.25 − ±2.5 − ±10.0 µA input leakage current; nA, nB, nRD VI = VCC or GND 5.5 − − ±0.1 − ±1.0 − ±2.0 µA quiescent supply current VI = VCC or GND; IO = 0 5.5 − − 4.0 − 40 − 80 µA quiescent supply current active state (per circuit) VI = VCC 4.5 or GND; note 1 5.5 − 380 500 − 650 − 650 µA − 560 750 − 975 − 975 µA − 3 10 − 10 − 10 pF VOL II ICC CI LOW-level output voltage input capacitance − Note 1. Voltage on pin nREXT/CEXT = 0.5 × VCC and pin REXT/CEXT in OFF-state during test. 2000 Mar 15 11 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A AC CHARACTERISTICS Type 74AHC123A GND = 0 V; tr = tf ≤ 3.0 ns. Tamb (°C) TEST CONDITIONS SYMBOL −40 to +85 25 PARAMETER WAVEFORMS CL −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. VCC = 3.0 to 3.6 V; note 1 tPHL/tPLH tW propagation delay; CEXT = 0 pF; nA, nB to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 15 pF − 7.4 20.6 1.0 24.0 1.0 26.0 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 − 8.2 22.4 1.0 26.0 1.0 26.0 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; (reset) see Figs 7 and 11 − 6.4 15.8 1.0 18.5 1.0 20.0 ns propagation delay; CEXT = 0 pF; nA, nB to nQ , nQ REXT = 5 kΩ; see Figs 7 and 11 50 pF − 10.5 24.1 1.0 27.5 1.0 30.0 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 − 11.7 25.9 1.0 29.5 1.0 32.0 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; (reset) see Figs 7 and 11 − 9.2 19.3 1.0 22.0 1.0 24.5 ns trigger pulse width; nA = LOW see Fig 8 5.0 − − 5.0 − 5.0 − ns trigger pulse width; nB = HIGH see Fig 8 5.0 − − 5.0 − 5.0 − ns reset pulse width; nRD = LOW see Fig 9 5.0 − − 5.0 − 5.0 − ns − 115 240 − 300 − 300 ns CEXT = 0.01 µF; REXT = 10 kΩ; note 3; see Figs 8, 9 and 10 90 100 110 90 110 85 115 µs CEXT = 0.1 µF; REXT = 10 kΩ; note 3; see Figs 8, 9 and 10 0.9 1 1.1 0.9 1.1 0.85 1.15 ms CEXT = 28 pF; output pulse width; nQ = HIGH; REXT = 2 kΩ; note 3; see Figs 8, nQ = LOW 9 and 10 2000 Mar 15 12 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 WAVEFORMS CL −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. VCC = 3.0 to 3.6 V; note 1 trt CEXT = 100 pF; REXT = 1 kΩ; see Figs 8, 9 and 10 50 pF − 60 − − − − − ns CEXT = 0.01 µF; REXT = 1 kΩ; see Figs 8, 9 and 10 − 1.5 − − − − − µs propagation delay; CEXT = 0 pF; nA, nB to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 15 pF − 5.1 12 1.0 14.0 1.0 15.5 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 − 5.6 12.9 1.0 15.0 1.0 16.5 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; (reset) see Figs 7 and 11 − 4.4 9.4 1.0 11.0 1.0 12.0 ns propagation delay; CEXT = 0 pF; nA, nB to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 50 pF − 7.3 14 1.0 16.0 1.0 17.5 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 − 8.1 14.9 1.0 17.0 1.0 19.0 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; (reset) see Figs 7 and 11 − 6.3 11.4 1.0 13.0 1.0 14.5 ns retrigger time; nA to nB VCC = 4.5 to 5.5 V; note 2 tPHL/tPLH 2000 Mar 15 13 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A Tamb (°C) TEST CONDITIONS SYMBOL −40 to +85 25 PARAMETER WAVEFORMS CL −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. VCC = 4.5 to 5.5 V; note 2 tW trigger pulse width; nA = LOW see Fig 8 50 pF 5.0 − − 5.0 − 5.0 − ns trigger pulse width; nB = HIGH see Fig 8 5.0 − − 5.0 − 5.0 − ns reset pulse width; nRD = LOW see Fig 9 5.0 − − 5.0 − 5.0 − ns − 100 200 − 240 − 240 ns CEXT = 0.01 µF; REXT = 10 kΩ; note 3; see Figs 8, 9 and 10 90 100 110 90 110 85 115 µs CEXT = 0.1 µF; REXT = 10 kΩ; note 3; see Figs 8, 9 and 10 0.9 1 1.1 0.9 1.1 0.85 1.15 ms CEXT = 100 pF; REXT = 1 kΩ; see Figs 8, 9 and 10 − 39 − − − − − ns CEXT = 0.01 µF; REXT = 1 kΩ; see Figs 8, 9 and 10 − 1.2 − − − − − µs output pulse CEXT = 28 pF; width; nQ = HIGH; REXT = 2 kΩ; nQ = LOW note 3; see Figs 8, 9 and 10 trt retrigger time; nA to nB Notes 1. Typical values are measured at VCC = 3.3 V and Tamb = 25 °C. 2. Typical values are measured at VCC = 5.0 V and Tamb = 25 °C. 3. For CEXT ≥ 10 nF the typical value of the pulse width tW (µs) = REXT (kΩ) × CEXT (nF). 2000 Mar 15 14 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A Type 74AHCT123A GND = 0 V; tr = tf ≤ 3.0 ns. TEST CONDITIONS SYMBOL Tamb (°C) −40 to +85 25 PARAMETER WAVEFORMS CL −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. VCC = 4.5 to 5.5 V; note 1 tPHL/tPLH tW propagation delay; CEXT = 0 pF; nA, nB to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 15 pF − 5.0 12 1.0 14 1.0 15.5 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 − 5.2 12.9 1.0 15.0 1.0 16.5 ns propagation delay; CEXT = 0 pF; REXT = 5 kΩ; see nRD to nQ, nQ (reset) Figs 7 and 11 − 4.7 9.4 1.0 11 1.0 12.0 ns propagation delay; CEXT = 0 pF; nA, nB to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 50 pF − 7.1 14 1.0 16 1.0 17.5 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; see Figs 7 and 11 − 7.5 14.9 1.0 17.0 1.0 18.5 ns propagation delay; CEXT = 0 pF; nRD to nQ, nQ REXT = 5 kΩ; see (reset) Figs 7 and 11 − 6.7 11.4 1.0 13 1.0 14.5 ns trigger pulse width; nA = LOW see Fig 8 50 pF 5.0 − − 5.0 − 5.0 − ns trigger pulse width; nB = HIGH see Fig 8 5.0 − − 5.0 − 5.0 − ns reset pulse width; nRD = LOW see Fig 9 5.0 − − 5.0 − 5.0 − ns − 100 200 − 240 − 240 ns CEXT = 0.01 µF; REXT = 10 kΩ; note 2; see Figs 8, 9 and 10 90 100 110 90 110 85 115 µs CEXT = 0.1 µF; REXT = 10 kΩ; note 2; see Figs 8, 9 and 10 0.9 1 1.1 0.9 1.1 0.85 1.15 ms output pulse width; CEXT = 28 pF; nQ = HIGH; REXT = 2 kΩ; note 2; nQ = LOW see Figs 8, 9 and 10 2000 Mar 15 15 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 WAVEFORMS CL −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. VCC = 4.5 to 5.5 V; note 1 trt retrigger time; nA to nB CEXT = 100 pF; REXT = 1 kΩ; see Figs 8, 9 and 10 50 pF − 60 − − − − − ns CEXT = 0.01 µF; REXT = 1 kΩ; see Figs 8, 9 and 10 − 1.5 − − − − − µs Notes 1. Typical values are measured at VCC = 5.0 V and Tamb = 25 °C. 2. For CEXT ≥ 10 nF the typical value of the pulse width tW (µs) = REXT (kΩ) × CEXT (nF). 2000 Mar 15 16 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A AC WAVEFORMS handbook, full pagewidth nA input VM(1) VM(1) tW VM(1) nB input tW nRD input VM(1) t rt t PLH nQ output tW VM(2) t PHL nQ output VM(2) t W + t rt FAMILY VI INPUT REQUIREMENTS VM (1) INPUT t PHL t PLH t PHL MNA520 VM (2) OUTPUT AHC GND to VCC 50% VCC 50% VCC AHCT GND to 3.0 V 1.5 V 50% VCC Fig.7 t PLH tW tW Input (nA, nB, nRD) to output (nQ, nQ) propagation delays, the input and output pulse widths and the input retrigger time. 2000 Mar 15 17 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A handbook, full pagewidth nB input tW nA input t rt tW nQ output tW tW tW MNA521 Fig.8 Output pulse control using retrigger pulse; nRD = HIGH. handbook, full pagewidth nB input nRD input tW nQ output tW tW MNA522 Fig.9 Output pulse control using reset input nRD; nA = LOW. 2000 Mar 15 18 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A t rt handbook, full pagewidth nA input nB input nRD input nREXT/CEXT nQ output nQ output tW t W + t rt tW MNA523 Fig.10 Input and output timing. S1 handbook, full pagewidth VCC PULSE GENERATOR VI 1000 Ω VO VCC open GND D.U.T. CL RT MNA183 TEST S1 tPLH/tPHL open tPLZ/tPZL VCC tPHZ/tPZH GND Definitions for test circuit. CL = load capacitance including jig and probe capacitance (See Chapter “AC characteristics”). RT = termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.11 Load circuitry for switching times. 2000 Mar 15 19 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.041 0.228 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 2000 Mar 15 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 20 o 8 0o Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 2000 Mar 15 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27 MO-153 21 o Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset SOLDERING 74AHC123A; 74AHCT123A If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 2000 Mar 15 22 Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74AHC123A; 74AHCT123A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2000 Mar 15 23 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613507/01/pp24 Date of release: 2000 Mar 15 Document order number: 9397 750 06696