PHILIPS SAA5360

INTEGRATED CIRCUITS
DATA SHEET
SAA5360; SAA5361
Multi page intelligent teletext
decoder
Product specification
Supersedes data of 2005 Jan 25
2005 Mar 09
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
QUICK REFERENCE DATA
4
ORDERING INFORMATION
5
BLOCK DIAGRAM
6
PINNING
6.1
6.2
Type SAA5360
Type SAA5361
7
COMMANDS AND CHARACTER SETS
7.1
7.2
High-level command interface
Character sets
8
LIMITING VALUES
9
THERMAL CHARACTERISTICS
10
QUALITY AND RELIABILITY
11
CHARACTERISTICS
12
APPLICATION INFORMATION
12.1
12.2
12.3
12.3.1
12.3.2
EMC guidelines
Application diagram
Application notes
External data memory access
Symbol explanations
2005 Mar 09
13
PACKAGE OUTLINE
14
SOLDERING
14.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
14.2
14.3
14.4
14.5
2
SAA5360; SAA5361
15
DATA SHEET STATUS
16
DEFINITIONS
17
DISCLAIMERS
18
PURCHASE OF PHILIPS I2C COMPONENTS
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
1
SAA5360; SAA5361
FEATURES
• Support for 50 or 60 and 100 or 120 Hz and progressive
scan display modes
• Complete 625 line teletext decoder in one chip reduces
printed-circuit board area and cost
• Automatic detection of transmitted fastext links or
service information (packet 8/30)
• Automatic detection of transmitted pages to be selected
by page up and page down
• On-Screen Display (OSD) for user interface menus
using teletext and dedicated menu icons
• 8 page fastext decoder
• Video Programming System (VPS) decoding
• Table Of Pages (TOP) decoder with Basic Top Table
(BTT) and Additional Information Tables (AITs)
• Wide Screen Signalling (WSS) decoding
• 4 page user-defined list mode.
• SAA5360 supports Pan-European, Arabic and Iranian
character sets
2
• SAA5361 supports Pan-European, Cyrillic, Greek and
Arabic character sets
The SAA5360; SAA5361 is a single-chip multi page 625
line world system teletext decoder with a high-level
command interface, and is SAFARI compatible.
• High-level command interface via I2C-bus gives easy
control with a low software overhead
The device is designed to minimize the overall system
cost, due to the high-level command interface offering the
benefit of a low software overhead in the TV
microcontroller.
• High-level command interface is backward compatible
to Stand-Alone Fastext And Remote Interface (SAFARI)
• 625 and 525 line display
• RGB interface to standard colour decoder ICs; current
source
The SAA5360 incorporates the following functions:
• 10 page teletext decoder with OSD, fastext, TOP,
default and list acquisition modes
• Versatile 8-bit open-drain Input/Output (I/O) expander;
5 V tolerant
• Automatic channel installation support.
• Single 12 MHz crystal oscillator
The functionality of the SAA5361 is similar to the
SAA5360, but offers the capability to store up to
250 additional pages of teletext in an external SRAM.
• Single power supply: from 3.0 V to 3.6 V
• Operating temperature: −20 to +70 °C
3
GENERAL DESCRIPTION
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDD
all supply voltages
referenced to VSS
3.0
3.3
3.6
V
IDDP
periphery supply current
note 1
1
−
−
mA
IDDC
core supply current
normal mode
−
15
18
mA
idle mode
−
4.6
6
mA
IDDA
analog supply current
normal mode
−
45
48
mA
idle mode
−
0.87
1
mA
fundamental mode
−
12
−
MHz
fxtal(nom)
nominal crystal frequency
Tamb
ambient temperature
−20
−
+70
°C
Tstg
storage temperature
−55
−
+125
°C
Note
1. Periphery supply current is dependent on external components and I/O voltage levels.
2005 Mar 09
3
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
4
SAA5360; SAA5361
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
SAA5360HL
LQFP100 plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
SOT407-1
SAA5361HL
LQFP100 plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
SOT407-1
5
BLOCK DIAGRAM
TV CONTROL
AND
INTERFACE
I2C-bus,
general I/O
ROM
(128 or 192-kbyte)
MICROCONTROLLER
(80C51)
DRAM
(14-kbyte)
MEMORY
INTERFACE
SRAM
256-byte
SAA5360
SAA5361
R
CVBS
DATA
CAPTURE
G
DISPLAY
B
VDS
CVBS
DATA
CAPTURE
TIMING
HSYNC
DISPLAY
TIMING
VSYNC
mhc633
Fig.1 Block diagram.
2005 Mar 09
4
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
6
SAA5360; SAA5361
PINNING
6.1
Type SAA5360
SYMBOL
PIN
TYPE
1
I/O
P3_0/ADC0
2
I/O
n.c.
3
−
P3_1/ADC1
4
I/O
programmable bidirectional port 3: bit 1 or input 1 for the software ADC facility
P3_2/ADC2
5
I/O
programmable bidirectional port 3: bit 2 or input 2 for the software ADC facility
P3_3/ADC3
6
I/O
programmable bidirectional port 3: bit 3 or input 3 for the software ADC facility
n.c.
7
−
not connected
n.c.
8
−
not connected
n.c.
9
−
not connected
n.c.
10
−
not connected
VSSC
11
−
core ground
VSSP
12
−
periphery ground
P0_5
13
I/O
n.c.
14
−
not connected
n.c.
15
−
not connected
SCL_NVRAM
16
I
I2C-bus serial clock input to non-volatile RAM
SDA_NVRAM
17
I/O
P0_2
18
I/O
n.c.
19
−
not connected
n.c.
20
−
not connected
VPE
21
I
OTP programming voltage input; connect to ground
P0_3
22
I/O
n.c.
23
−
P0_4
24
I/O
n.c.
25
−
not connected
n.c.
26
−
not connected
n.c.
27
−
not connected
P0_6
28
I/O
8 mA current sinking output for direct drive of LED
P0_7
29
I/O
programmable bidirectional port 0: bit 7
VSSA
30
−
analog ground
CVBS0
31
I
composite video input 0 selectable via SFR; a positive-going 1 V (p-p) input is
required and connected via a 100 nF capacitor
CVBS1
32
I
composite video input 1 selectable via SFR; a positive-going 1 V (p-p) input is
required and connected via a 100 nF capacitor
n.c.
33
−
not connected
SYNC_FILTER
34
I/O
IREF
35
I
P2_7/PWM6
2005 Mar 09
DESCRIPTION
programmable bidirectional port 2: bit 7 or output bit 6 of the 7-bit PWM
programmable bidirectional port 3: bit 0 or input 0 for the software ADC facility
not connected
8 mA current sinking output for direct drive of LED
I2C-bus serial data input and output of non-volatile RAM
programmable bidirectional port 0: bit 2
programmable bidirectional port 0: bit 3
not connected
programmable bidirectional port 0: bit 4
CVBS sync filter input; this pin should be connected to VSSA via a 100 nF
capacitor
reference current input for analog circuits and connected to VSSA via a 24 kΩ
resistor
5
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SYMBOL
SAA5360; SAA5361
PIN
TYPE
n.c.
36
−
not connected
n.c.
37
−
not connected
n.c.
38
−
not connected
n.c.
39
−
not connected
n.c.
40
−
not connected
FRAME
41
O
de-interlace output synchronized with the VSYNC pulse to produce a
non-interlaced display by adjustment of the vertical deflection circuits
VPE
42
I
OTP programming voltage input; connect to ground
COR
43
O
output which allows selective contrast reduction of the TV picture to enhance a
mixed mode display; open-drain; active LOW
n.c.
44
−
not connected
VDDA
45
−
3.3 V analog supply voltage
B
46
O
pixel rate output of the blue colour information
G
47
O
pixel rate output of the green colour information
R
48
O
pixel rate output of the red colour information
n.c.
49
−
not connected
n.c.
50
−
not connected
n.c.
51
−
not connected
VDS
52
O
video or data switch push-pull output for dot rate fast blanking
HSYNC
53
I
Schmitt-triggered input for a TTL-level version of the horizontal sync pulse; the
polarity of this pulse is programmable by register bit TXT1.H POLARITY
n.c.
54
−
not connected
VSYNC
55
I
Schmitt-triggered input for a TTL-level version of the vertical sync pulse; the
polarity of this pulse is programmable by register bit TXT1.V POLARITY
n.c.
56
−
not connected
n.c.
57
−
not connected
n.c.
58
−
not connected
n.c.
59
−
not connected
VSSP
60
−
periphery ground
n.c.
61
−
not connected
VSSC
62
−
core ground
VDDC
63
−
3.3 V core supply voltage
n.c.
64
−
not connected
n.c.
65
−
not connected
n.c.
66
−
not connected
n.c.
67
−
not connected
n.c.
68
−
not connected
OSCGND
69
−
crystal oscillator ground
XTALIN
70
I
12 MHz crystal oscillator input
XTALOUT
71
O
12 MHz crystal oscillator output
RESET
72
I
reset input; if LOW for at least 24 crystal oscillator periods while the oscillator is
running, the device is reset; internal pull-up
2005 Mar 09
DESCRIPTION
6
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SYMBOL
SAA5360; SAA5361
PIN
TYPE
DESCRIPTION
73
I
reset input; if HIGH for at least 24 crystal oscillator periods while the oscillator is
running, the device is reset; this pin should be connected to VDDC via a capacitor if
an active HIGH reset is required; internal pull-down
n.c.
74
−
not connected
VDDP
75
−
3.3 V periphery supply voltage
P1_0
76
I/O
n.c.
77
−
P1_1
78
I/O
programmable bidirectional port 1: bit 1
P1_2
79
I/O
programmable bidirectional port 1: bit 2
P1_3
80
I/O
SCL
81
I
SDA
82
I/O
I2C-bus serial data input from or output to application
P1_4
83
I/O
programmable bidirectional port 1: bit 4
P1_5
84
I/O
n.c.
85
−
not connected
n.c.
86
−
not connected
n.c.
87
−
not connected
n.c.
88
−
not connected
n.c.
89
−
not connected
n.c.
90
−
not connected
n.c.
91
−
not connected
n.c.
92
−
not connected
P2_1/PWM0
93
I/O
programmable bidirectional port 2: bit 1 or output bit 0 of the 7-bit PWM
P2_2/PWM1
94
I/O
programmable bidirectional port 2: bit 2 or output bit 1 of the 7-bit PWM
P2_3/PWM2
95
I/O
programmable bidirectional port 2: bit 3 or output bit 2 of the 7-bit PWM
P2_4/PWM3
96
I/O
programmable bidirectional port 2: bit 4 or output bit 3 of the 7-bit PWM
P2_5/PWM4
97
I/O
programmable bidirectional port 2: bit 5 or output bit 4 of the 7-bit PWM
P2_6/PWM5
98
I/O
programmable bidirectional port 2: bit 6 or output bit 5 of the 7-bit PWM
VSSC
99
−
P2_0/TPWM
100
I/O
RESET
2005 Mar 09
programmable bidirectional port 1: bit 0
not connected
programmable bidirectional port 1: bit 3
I2C-bus serial clock input from application
programmable bidirectional port 1: bit 5
core ground
programmable bidirectional port 2: bit 0 or output for 14-bit high precision PWM
7
Philips Semiconductors
Product specification
77 n.c.
76 P1_0
78 P1_1
79 P1_2
80 P1_3
81 SCL
82 SDA
83 P1_4
84 P1_5
85 n.c.
86 n.c.
87 n.c.
88 n.c.
SAA5360; SAA5361
89 n.c.
90 n.c.
91 n.c.
92 n.c.
93 P2_1/PWM0
94 P2_2/PWM1
95 P2_3/PWM2
96 P2_4/PWM3
97 P2_5/PWM4
98 P2_6/PWM5
99 VSSC
100 P2_0/TPWM
Multi page intelligent teletext decoder
P2_7/PWM6
1
75 VDDP
P3_0/ADC0
2
74 n.c.
n.c.
3
73 RESET
P3_1/ADC1
4
72 RESET
P3_2/ADC2
5
71 XTALOUT
P3_3/ADC3
6
70 XTALIN
n.c.
7
69 OSCGND
n.c.
8
68 n.c.
n.c.
9
67 n.c.
n.c. 10
66 n.c.
VSSC 11
65 n.c.
64 n.c.
VSSP 12
63 VDDC
SAA5360HL
P0_5 13
n.c. 14
62 VSSC
n.c. 15
SCL_NVRAM 16
61 n.c.
60 VSSP
SDA_NVRAM 17
59 n.c.
P0_2 18
58 n.c.
n.c. 19
57 n.c.
n.c. 20
56 n.c.
VPE 21
55 VSYNC
54 n.c.
P0_3 22
53 HSYNC
n.c. 23
P0_4 24
52
8
n.c. 50
n.c. 49
R 48
G 47
B 46
VDDA 45
n.c. 44
COR 43
VPE 42
FRAME 41
n.c. 40
n.c. 39
n.c. 38
n.c. 37
n.c. 36
IREF 35
SYNC_FILTER 34
n.c. 33
CVBS1 32
CVBS0 31
VSSA 30
P0_7 29
P0_6 28
n.c. 27
n.c. 26
Fig.2 Pin configuration of SAA5360HL.
2005 Mar 09
VDS
51 n.c.
n.c. 25
mhc508
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
6.2
SAA5360; SAA5361
Type SAA5361
SYMBOL
PIN
TYPE
P2_7/PWM6
1
I/O
programmable bidirectional port 2: bit 7 or output bit 6 of the 6-bit PWM
P3_0/ADC0
2
I/O
programmable bidirectional port 3 with alternative functions: bit 0 or input 0 for the
software ADC facility
n.c.
3
O
not connected
P3_1/ADC1
4
I/O
programmable bidirectional port 3 with alternative functions: bit 1 or input 1 for the
software ADC facility
P3_2/ADC2
5
I/O
programmable bidirectional port 3 with alternative functions: bit 2 or input 2 for the
software ADC facility
P3_3/ADC3
6
I/O
programmable bidirectional port 3 with alternative functions: bit 3 or input 3 for the
software ADC facility
n.c.
7
O
not connected
A14
8
O
address line 14
RD
9
O
read control output to external data memory; active LOW
WR
10
O
write control output to external data memory; active LOW
VSSC
11
-
core ground
VSSP
12
-
periphery ground
P0_5
13
I/O
n.c.
14
I
not connected
A7
15
O
address line 7
SCL_NVRAM
16
I
I2C-bus serial clock input to non-volatile RAM
SDA_NVRAM
17
I/O
I2C-bus serial data input and output of non-volatile RAM
P0_2
18
I/O
programmable bidirectional port 0 with alternative functions: bit 2 input and output
for general use
n.c.
19
O
not connected
n.c.
20
O
not connected
VPE
21
I
OTP programming voltage input; connect to ground
P0_3
22
I/O
programmable bidirectional port 0 with alternative functions: bit 3 input and output
for general use
A6
23
O
address line 6
P0_4
24
I/O
programmable bidirectional port 0 with alternative functions: bit 4 input and output
for general use
n.c.
25
I/O
not connected
A5
26
O
address line 5
A4
27
O
address line 4
P0_6
28
I/O
8 mA current sinking output for direct drive of LED
P0_7
29
I/O
programmable bidirectional port 0 with alternative functions: bit 7 input and output
for general use
VSSA
30
-
analog ground
CVBS0
31
I
composite video input 0 selectable via SFR; a positive-going 1 V (p-p) input is
required and connected via a 100 nF capacitor
CVBS1
32
I
composite video input 1 selectable via SFR; a positive-going 1 V (p-p) input is
required and connected via a 100 nF capacitor
2005 Mar 09
DESCRIPTION
8 mA current sinking output for direct drive of LED
9
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SYMBOL
SAA5360; SAA5361
PIN
TYPE
A15_BK
33
O
address line 15
SYNC_FILTER
34
I/O
CVBS sync filter input; this pin should be connected to VSSA via a 100 nF capacitor
IREF
35
I
reference current input for analog circuits and connected to VSSA via a 24 kΩ
resistor
A13
36
O
address line 13
A12
37
O
address line 12
A3
38
O
address line 3
A2
39
O
address line 2
A1
40
O
address line 1
FRAME
41
O
de-interlace output synchronized with the VSYNC pulse to produce a
non-interlaced display by adjustment of the vertical deflection circuits
VPE
42
I
OTP programming voltage input; connect to ground
COR
43
O
output which allows selective contrast reduction of the TV picture to enhance a
mixed mode display; open-drain; active LOW
n.c.
44
I/O
not connected
VDDA
45
-
3.3 V analog supply voltage
B
46
O
pixel rate output of the blue colour information
G
47
O
pixel rate output of the green colour information
R
48
O
pixel rate output of the red colour information
A0
49
O
address line 0
RAMBK1
50
O
RAMBK SFR selection bits input 1 for external program SRAM data storage
RAMBK0
51
O
RAMBK SFR selection bits input 0 for external program SRAM data storage
VDS
52
O
video or data switch push-pull output for dot rate fast blanking
HSYNC
53
I
Schmitt-triggered input for a TTL-level version of the horizontal sync pulse; the
polarity of this pulse is programmable by register bit TXT1.H POLARITY
n.c.
54
I/O
VSYNC
55
I
Schmitt-triggered input for a TTL-level version of the vertical sync pulse; the polarity
of this pulse is programmable by register bit TXT1.V POLARITY
n.c.
56
O
not connected
n.c.
57
O
not connected
n.c.
58
O
not connected
n.c.
59
I/O
VSSP
60
-
periphery ground
n.c.
61
I
not connected (internal pull-up)
VSSC
62
-
core ground
VDDC
63
-
3.3 V core supply voltage
A11
64
O
address line 11
A10
65
O
address line 10
A9
66
O
address line 9
A8
67
O
address line 8
n.c.
68
O
not connected
OSCGND
69
-
crystal oscillator ground
2005 Mar 09
DESCRIPTION
not connected
not connected
10
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SYMBOL
SAA5360; SAA5361
PIN
TYPE
70
I
XTALOUT
71
O
12 MHz crystal oscillator output
RESET
72
I
reset input; if LOW for at least 24 crystal oscillator periods while the oscillator is
running, the device is reset; internal pull-up
RESET
73
I
reset input; if HIGH for at least 24 crystal oscillator periods while the oscillator is
running, the device is reset; this pin should be connected to VDDC via a capacitor if
an active HIGH reset is required; internal pull-down
n.c.
74
O
not connected
VDDP
75
-
3.3 V periphery supply voltage
P1_0
76
IO
XTALIN
DESCRIPTION
12 MHz crystal oscillator input
programmable bidirectional port 1 with alternative functions: bit 0 input and output
for general use
n.c.
77
O
not connected
P1_1
78
I/O
programmable bidirectional port 1 with alternative functions: bit 1 input and output
for general use
P1_2
79
I/O
programmable bidirectional port 1 with alternative functions: bit 2 input and output
for general use
P1_3
80
I/O
programmable bidirectional port 1 with alternative functions: bit 3 input and output
for general use
SCL
81
I
SDA
82
I/O
I2C-bus serial data input from or output to application
P1_4
83
I/O
programmable bidirectional port 1 with alternative functions: bit 4 input and output
for general use
P1_5
84
I/O
programmable bidirectional port 1 with alternative functions: bit 5 input and output
for general use
AD0
85
I/O
address line 0 with multiplexed data line 0
AD1
86
I/O
address line 1 with multiplexed data line 1
AD2
87
I/O
address line 2 with multiplexed data line 2
AD3
88
I/O
address line 3 with multiplexed data line 3
AD4
89
I/O
address line 4 with multiplexed data line 4
AD5
90
I/O
address line 5 with multiplexed data line 5
AD6
91
I/O
address line 6 with multiplexed data line 6
AD7
92
I/O
address line 7 with multiplexed data line 7
P2_1/PWM0
93
I/O
programmable bidirectional port 2: bit 1 or output bit 0 of the 6-bit PWM
P2_2/PWM1
94
I/O
programmable bidirectional port 2: bit 2 or output bit 1 of the 6-bit PWM
P2_3/PWM2
95
I/O
programmable bidirectional port 2: bit 3 or output bit 2 of the 6-bit PWM
P2_4/PWM3
96
I/O
programmable bidirectional port 2: bit 4 or output bit 3 of the 6-bit PWM
P2_5/PWM4
97
I/O
programmable bidirectional port 2: bit 5 or output bit 4 of the 6-bit PWM
P2_6/PWM5
98
I/O
programmable bidirectional port 2: bit 6 or output bit 5 of the 6-bit PWM
VSSC
99
-
P2_0/TPWM
100
I/O
2005 Mar 09
I2C-bus serial clock input from application
core ground
programmable bidirectional port 2: bit 0 or output for 14-bit high precision PWM
11
Philips Semiconductors
Product specification
77 n.c.
76 P1_0
78 P1_1
79 P1_2
80 P1_3
81 SCL
82 SDA
83 P1_4
84 P1_5
85 AD0
86 AD1
87 AD2
SAA5360; SAA5361
88 AD3
89 AD4
90 AD5
91 AD6
92 AD7
93 P2_1/PWM0
94 P2_2/PWM1
95 P2_3/PWM2
96 P2_4/PWM3
97 P2_5/PWM4
98 P2_6/PWM5
99 VSSC
100 P2_0/TPWM
Multi page intelligent teletext decoder
P2_7/PWM6
1
75 VDDP
P3_0/ADC0
2
74 n.c.
n.c.
3
73 RESET
P3_1/ADC1
4
72 RESET
P3_2/ADC2
5
71 XTALOUT
P3_3/ADC3
6
70 XTALIN
n.c.
7
69 OSCGND
A14
8
68 n.c.
RD
9
67 A8
WR 10
66 A9
VSSC 11
65 A10
VSSP 12
64 A11
63 VDDC
SAA5361HL
P0_5 13
n.c. 14
62 VSSC
A7 15
SCL_NVRAM 16
61 n.c.
60 VSSP
SDA_NVRAM 17
59 n.c.
P0_2 18
58 n.c.
n.c. 19
57 n.c.
n.c. 20
56 n.c.
VPE 21
55 VSYNC
54 n.c.
P0_3 22
53 HSYNC
A6 23
52 VDS
P0_4 24
51 RAMBK0
Fig.3 Pin configuration of SAA5361HL.
2005 Mar 09
12
RAMBK1 50
A0 49
R 48
G 47
B 46
VDDA 45
n.c. 44
COR 43
VPE 42
FRAME 41
A1 40
A2 39
A3 38
A12 37
A13 36
IREF 35
SYNC_FILTER 34
A15_BK 33
CVBS1 32
CVBS0 31
VSSA 30
P0_7 29
P0_6 28
A4 27
A5 26
n.c. 25
001aaa526
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
7
SAA5360; SAA5361
COMMANDS AND CHARACTER SETS
7.1
High-level command interface
The I2C-bus interface is used to pass control commands and data between the SAA5360; SAA5361 and the television
microcontroller. The interface uses high-level commands, which are backwards compatible with the SAFARI.
The I2C-bus transmission formats are given in Tables 1 to 3.
Table 1
User command
USER COMMAND
I2C-bus address
START
Table 2
write
ACK
command
ACK
STOP
ACK
STOP
ACK
STOP
System command
SYSTEM COMMAND
I2C-bus address
START
Table 3
write
ACK
command
ACK
parameter
User read
USER READ
START
7.2
I2C-bus address
read
ACK
data
Character sets
The SAA5360HL/M1/0004 contains the character set for Pan-Euro, Arabic and Iranian and has slave address 58H.
The SAA5361HL/M1/1651 contains the character set for Pan-Euro, Cyrillic, Greek and Arabic and has slave address
60H.
2005 Mar 09
13
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
8 LIMITING VALUES
In accordance with Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
VDD
all supply voltages
VI
input voltage (any input)
VO
output voltage (any output)
IO
CONDITIONS
MIN.
VDD < 3.6 V; note 1
MAX.
UNIT
−0.5
+4.0
V
−0.5
VDD + 0.5
V
VDD ≥ 3.6 V; note 1
−0.5
4.1
V
note 1
−0.5
VDD + 0.5
V
output current (each output)
−
10
mA
IIO(d)
diode DC input or output current
−
20
mA
Tamb
ambient temperature
−20
+70
°C
Tj
junction temperature
−20
+125
°C
Tstg
storage temperature
−55
+125
°C
Vesd
electrostatic discharge voltage
Human body model;
C = 100 pF; R = 1.5 kΩ
−
2000
V
Machine model;
C = 200 pF; R = 0 Ω
−
200
V
1.5 × VDD
−
100
mA
latch-up current
Ilu
Note
1. This maximum value refers to 5 V tolerant I/Os and may be 6 V maximum but only when VDD is present.
9
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth(j-a)
thermal resistance from junction to ambient
Rth(j-c)
thermal resistance from junction to case
CONDITIONS
in free air
10 QUALITY AND RELIABILITY
In accordance with “General Quality Specification for Integrated circuits SNW-FQ-611”.
2005 Mar 09
14
VALUE
UNIT
52
K/W
8
K/W
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
11 CHARACTERISTICS
VDD = 3.3 V ± 10 %; VSS = 0 V; Tamb = −20 °C to +70 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDD
any supply voltage
referenced to VSS
IDDP
periphery supply current
IDDC
core supply current
IDDA
analog supply current
3.0
3.3
3.6
V
note 1
1
−
−
mA
operating mode
−
15
18
mA
idle mode
−
4.6
6
mA
power-down mode
−
0.76
1
mA
operating mode
−
45
48
mA
idle mode
−
0.87
1
mA
power-down mode
−
0.45
0.7
mA
Digital inputs
PIN RESET
VIL
LOW-level input voltage
−
−
1.00
V
VIH
HIGH-level input voltage
1.85
−
5.5
V
Vhys
hysteresis voltage of Schmitt-trigger input
0.44
−
0.58
V
ILI
input leakage current
VI = 0
−
−
0.17
µA
Rpd
equivalent pull-down resistance
VI = VDD
55.73 70.71
92.45
kΩ
PIN RESET
VIL
LOW-level input voltage
−
−
0.98
V
VIH
HIGH-level input voltage
1.73
−
5.5
V
Vhys
hysteresis voltage of Schmitt-trigger input
0.41
−
0.5
V
ILI
input leakage current
VI = VDD
−
−
0.00
µA
Rpu
equivalent pull-up resistance
VI = 0
46.07 55.94
70.01
kΩ
PINS HSYNC AND VSYNC
VIL
LOW-level input voltage
−
−
0.96
V
VIH
HIGH-level input voltage
1.80
−
5.5
V
Vhys
hysteresis of Schmitt-trigger input
ILI
input leakage current
0.40
−
0.56
V
VI = 0 to VDD
−
−
0.00
µA
Digital outputs
PINS FRAME AND VDS
VOL
LOW-level output voltage
IOL = 3 mA
−
−
0.13
V
VOH
HIGH-level output voltage
IOH = 3 mA
2.84
−
−
V
to(r)
output rise time
10 % to 90 % of VDD;
CL = 70 pF
7.50
8.85
10.90
ns
to(f)
output fall time
10 % to 90 % of VDD;
CL = 70 pF
6.70
7.97
10.00
ns
2005 Mar 09
15
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SYMBOL
PARAMETER
SAA5360; SAA5361
CONDITIONS
MIN.
TYP.
MAX.
UNIT
PIN COR (OPEN-DRAIN)
VOL
LOW-level output voltage
IOL = 3 mA
−
−
0.14
V
VOH
HIGH-level pull-up output voltage
IOL = −3 mA; push-pull
2.84
−
−
V
ILI
input leakage current
VI = 0 to VDD
−
−
0.12
µA
to(r)
output rise time
10 % to 90 % of VDD;
CL = 70 pF
7.20
8.64
11.10
ns
to(f)
output fall time
10 % to 90 % of VDD;
CL = 70 pF
4.90
7.34
9.40
ns
Digital input/outputs
PINS SCL_NVRAM, SDA_NVRAM, P0_4 TO P0_7, P1_0, P1_1, P2_1 TO P2_7 AND P3_0 TO P3_4
VIL
LOW-level input voltage
−
−
0.98
V
VIH
HIGH-level input voltage
1.78
−
5.50
V
Vhys
hysteresis of Schmitt-trigger input
0.41
−
0.55
V
ILI
input leakage current
VI = 0 to VDD
−
−
0.01
µA
VOL
LOW-level output voltage
IOL = 4 mA
−
−
0.18
V
VOH
HIGH-level output voltage
IOH = −4 mA; push-pull
2.81
−
−
V
to(r)
output rise time
10 % to 90 % of VDD;
CL = 70 pF; push-pull
6.50
8.47
10.70
ns
to(f)
output fall time
10 % to 90 % of VDD;
CL = 70 pF
5.70
7.56
10.00
ns
PINS P1_2, P1_3 AND P2_0
VIL
LOW-level input voltage
−
−
0.99
V
VIH
HIGH-level input voltage
1.80
−
5.50
V
Vhys
hysteresis voltage of Schmitt-trigger input
0.42
−
0.56
V
ILI
input leakage current
VI = 0 to VDD
−
−
0.02
µA
VOL
LOW-level output voltage
IOL = 4 mA
−
−
0.17
V
VOH
HIGH-level output voltage
IOH = −4 mA; push-pull
2.81
−
−
V
to(r)
output rise time
10 % to 90 % of VDD;
CL = 70 pF; push-pull
7.00
8.47
10.50
ns
to(f)
output fall time
10 % to 90 % of VDD;
CL = 70 pF
5.40
7.36
9.30
ns
PINS P0_5 AND P0_6
VIL
LOW-level input voltage
−
−
0.98
V
VIH
HIGH-level input voltage
1.82
−
5.50
V
ILI
input leakage current
VI = 0 to VDD
−
−
0.11
µA
Vhys
hysteresis voltage of Schmitt-trigger input
0.42
−
0.58
V
VOL
LOW-level output voltage
IOL = 8 mA
−
−
0.20
V
VOH
HIGH-level output voltage
IOH = −8 mA; push-pull
2.76
−
−
V
to(r)
output rise time
10 % to 90 % of VDD;
CL = 70 pF; push-pull
7.40
8.22
8.80
ns
2005 Mar 09
16
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SYMBOL
to(f)
PARAMETER
output fall time
SAA5360; SAA5361
CONDITIONS
10 % to 90 % of VDD;
CL = 70 pF
MIN.
TYP.
MAX.
UNIT
4.20
4.57
5.20
ns
PINS P1_4 AND P1_5 (OPEN DRAIN)
VIL
LOW-level input voltage
−
−
1.08
V
VIH
HIGH-level input voltage
1.99
−
5.50
V
Vhys
hysteresis voltage of Schmitt-trigger input
0.49
−
0.60
V
ILI
input leakage current
VI = 0 to VDD
−
−
0.13
µA
VOL
LOW-level output voltage
IOL = 8 mA
−
−
0.35
V
to(f)
output fall time
10 % to 90 % of VDD;
CL = 70 pF
69.70 83.67
103.30
ns
to(f)(I2C)
output fall time in relation to the I2C-bus
specifications
Vo = 3 V to 1.5 V at
−
IOL = 3 mA; CL = 400 nF
57.80
−
ns
Analog inputs
PINS CVBS0 AND CVBS1
Vsync
sync voltage amplitude
0.1
0.3
0.6
V
Vv(p-p)
video input voltage amplitude
(peak-to-peak value)
0.7
1.0
1.4
V
Zsource
source impedance
0
−
250
Ω
VIH
HIGH-level input voltage
3.0
−
VDDA + 0.3
V
Ci
input capacitance
−
−
10
pF
resistor tolerance 2 %
−
24
−
kΩ
range = VDDP − VTN;
note 2
−
−
VDDA
V
−
−
10
pF
PIN IREF
Rgnd
resistance to ground
PINS ADC0 TO ADC3
VIH
HIGH-level input voltage
Ci
input capacitance
Analog outputs
PINS R, G AND B
Io(b)
output current (black level)
VDDA = 3.3 V
−10
−
+10
µA
Io(max)
output current (maximum Intensity)
VDDA = 3.3 V; intensity
level code = 31 decimal
6.0
6.67
7.3
mA
Io(70)
output current (70 % of full intensity)
VDDA = 3.3 V; intensity
level code = 0 decimal
4.2
4.7
5.1
mA
RL
load resistor
referenced to VSSA;
resistor tolerance 5 %
−
150
−
Ω
CL
load capacitance
−
−
15
pF
to(r)
output rise time
10 % to 90 % full
intensity
−
16.1
−
ns
to(f)
output fall time
90 % to 10 % full
intensity
−
14.5
−
ns
2005 Mar 09
17
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SYMBOL
PARAMETER
SAA5360; SAA5361
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Analog input/output
PIN SYNC_FILTER
Csync
storage capacitor to ground
−
100
−
nF
Vsync
sync filter level voltage for nominal sync
amplitude
0.35
0.55
0.75
V
Crystal oscillator
INPUT: PIN XTALIN
VIL
LOW-level input voltage
VSSA
−
−
V
VIH
HIGH-level input voltage
−
−
VDDA
V
Ci
input capacitance
−
−
10
pF
−
−
10
pF
−
12
−
MHz
OUTPUT: PIN XTALOUT
Co
output capacitance
Crystal specification; notes 3 and 4
fxtal
nominal frequency
CL
load capacitance
−
−
30
pF
Cmot
motional capacitance
Tamb = 25 °C
−
−
20
fF
Rres
resonance resistance
Tamb = 25 °C
−
−
60
Ω
Cosc
capacitors at pins XTALIN and XTALOUT Tamb = 25 °C
−
note 4 −
pF
CO
crystal holder capacitance
Tamb = 25 °C
−
note 4 −
pF
Txtal
crystal temperature range
−20
+25
Xj
adjustment tolerance
Xd
drift
fundamental mode
Tamb = 25 °C
°C
+85
10−6
−
−
±50 ×
−
−
±100 × 10−6
I2C-bus characteristics for fast mode
fSCL
SCL clock frequency
0
−
400
kHz
tBUF
bus free time between a STOP and
START condition
1.3
−
−
µs
tHD;STA
hold time START condition; after this
period; the first clock pulse is generated
0.6
−
−
µs
tLOW
SCL LOW time
1.3
−
−
µs
tHIGH
SCL HIGH time
0.6
−
−
µs
tSU;STA
set-up time repeated START
0.6
−
−
µs
tHD;DAT
data hold time
notes 5 and 6
0
−
0.9
µs
tSU;DAT
data set-up time
note 7
100
−
−
ns
tr
rise time SDA and SCL
note 7
20
−
300
ns
tf
fall time SDA and SCL
note 7
20
−
300
ns
tSU;STO
set-up time STOP condition
0.6
−
−
µs
Cb
capacitive load of each bus line
note 8
−
−
400
pF
2005 Mar 09
18
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
Notes
1. Periphery current is dependent on external components and voltage levels on I/Os.
2. VTN is the drop across a protection transistor which clamps the input to VDD. The maximum value is VTN = 0.75 V
3. Crystal order number 4322 143 05561.
4. If the 4322 143 05561 crystal is not used, the formula in the crystal specification should be used. The mean of the
capacitances due to the chip at XTALIN and at XTALOUT is CIO, where CIO = 7 pF. Cext is a value for the mean of
the stray capacitances due to the external circuits at XTALIN and XTALOUT.
a) Cosc(typ) = 2CL − CIO − Cext. Capacitor Cosc may need to be reduced from the initial selected value.
b) CO(max) = 35 − 0.5 (Cosc + CIO + Cext) pF. The maximum value for the crystal holder capacitance is to ensure
start-up.
5. A device must internally provide a hold time of at least 300 ns for the SDA signal, referenced to the VIH(min) of the
SCL signal, in order to bridge the undefined region of the falling edge of SCL.
6. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period of the SCL signal (tLOW(SCL)).
7. A fast mode I2C-bus device can be used in a standard-mode I2C-bus system, but the requirement tSU;DAT ≥ 250 ns
must be met. This requirement is met for a device that does not stretch tLOW(SCL). If a device does stretch tLOW(SCL),
the next data bit to the SDA line must be output tr(max) + tSU;DAT = 1000 + 250 = 1250 ns before the SCL line is
released (according to the standard-mode I2C-bus specification).
8. Cb = total capacitance of one bus line in pF.
12 APPLICATION INFORMATION
12.1
Using a device socket would increase the area and
therefore increase the inductance of the external bypass
loop.
EMC guidelines
Optimization of circuit return paths and minimization of
common mode emission is achieved by a double sided
Printed-Circuit Board (PCB) with low inductance ground
plane.
To provide a high-impedance to any high frequency
signals on the VDD supplies to the IC, a ferrite bead or
inductor can be connected in series with the supply line
close to the decoupling capacitor. To prevent signal
radiation, pull-up resistors of signal outputs should not be
connected to the VDD supply on the IC side of the ferrite
bead or inductor.
On a single-sided PCB a local ground plane under the
whole IC should be present. Preferably, the PCB local
ground plane connection should not be connected to other
grounds on route to the PCB ground. Do not use wire links.
Wire links cause ground inductance which increases
ground bounce.
OSCGND should only be connected to the crystal load
capacitors and not to any other ground connection.
Distances to physical connections of associated active
devices should be as short as possible.
The supply pins can be decoupled at the ground pin plane
below the IC. This is easily achieved by using surface
mount capacitors, which, at high frequency, are more
effective than components with leads.
2005 Mar 09
PCB output tracks should have close proximity, mutually
coupled and ground return paths.
19
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VDD
VDD
47 µF
100 nF
VSS
VSS
VDD
VSS
P2_0/TPWM
P2_1/PWM0
brightness
P2_2/PWM1
contrast
P2_3/PWM2
saturation
P2_4/PWM3
hue
P2_5/PWM4
volume (L)
P2_6/PWM5
volume (R)
P2_7/PWM6
VSS
P3_0/ADC0
VAFC
P3_1/ADC1
AV status
P3_2/ADC2
P3_3/ADC3
20
program +
VSSC
VSS
SCL_NVRAM
program−
SDA_NVRAM
P0_2
menu
P0_3
P0_4
minus(−)
P0_5
VDD
P0_6
1 kΩ
P0_7
84
93
83
94
82
95
81
96
80
97
79
98
78
1
76
2
75
4
73
5
71
6
70
11, 62, 99
16
69
SAA5360HL
SAA5361HL
63
12, 60
18
55
22
53
24
52
13
48
28
47
29
46
30
45
31
44
32
43
34
21, 42
35
41
VSSA
VSS
CVBS (IF)
100 nF
CVBS0
CVBS1
CVBS (SCART)
100 nF
SYNC_FILTER
IREF
SDA
72
TV
control
signals
SCL
P1_3
P1_2
P1_1
P1_0
VDD
VDDP
10 µF
RESET
IR
RECEIVER
VDD
XTALOUT
XTALIN
12 MHz
56 pF
OSCGND
VDD
VDDC
VSSP
VSYNC
VSS
field flyback
HSYNC
line flyback
VDS
R
G
B
VDDA
24 kΩ
100 nF
P1_4
VDD
to TV
display
circuits
150 Ω
VDD
COR
VSS
VPE
FRAME
VSS
VDD
RESET
VSS
VDD
Fig.4 Application diagram.
mhc509
Product specification
17
P1_5
SAA5360; SAA5361
1 kΩ
VSS
100
Philips Semiconductors
VSS
VDD
Application diagram
PH2369
Vtune
plus(+)
Bidirectional ports have been configured as open-drain.
Output ports have been configured as push-pull.
Connections of the SAA5361HL to the external SDRAM are shown in Fig.5.
VDD
Multi page intelligent teletext decoder
12.2
2005 Mar 09
40 V
Philips Semiconductors
Product specification
SAA5360; SAA5361
A8
A9
A10
A11
RAMBK0
Multi page intelligent teletext decoder
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
79
80
81
82
47
46
45
44
83
84
85
86
87
SAA5361HL
88
89
90
91
92
93
94
95
96
97
98
99
100
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A1
A2
A3
A12
A13
A15_BK
A4
A5
OE
RD/WR
A6
A7
RAMBK1
50
A0
49
48
A14
RD
WR
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
76
77
78
D7
D6
D5
D4
D3
D2
D1
D0
SRAM
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
coa003
Fig.5 Application diagram of SAA5361 with external SRAM connections.
2005 Mar 09
21
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
12.3
SAA5360; SAA5361
12.3.2
Application notes
SYMBOL EXPLANATIONS
Each timing symbol has five characters. The first character
is always ‘t’ (time). Depending on their positions, the other
characters indicate the name of a signal or the logical
status of that signal.
Ports AD0 to AD7 of the microcontroller can be connected
to pins D0 to D7 of the SRAM in any order.
For the addressing, the lower group of address lines
(A0 to A8) and the upper group of address lines
(A9 to A14, A15_BK, RAMBK0 and RAMBK1) may be
connected in any order within the groups, provided that the
full 256 kbytes of external SRAM is used.
The designations are:
A = Address
C = Clock
Fig.5 shows the application diagram of the SAA5361 with
external SRAM connections.
D = Input data
When using an external SRAM smaller than 256 kbytes,
the relevant number of bits from the microcontroller
address bus should be disconnected, always removing the
most significant bits first.
H = Logic level HIGH
For power saving modes, it might be advisable to control
the CE pin of the SRAM module(s) using one of the
microcontroller ports to de-select the SRAM.
P = PSEN
I = Instruction (program memory contents)
L = Logic level LOW, or ALE
Q = Output data
R = RD signal
12.3.1
Table 4
EXTERNAL DATA MEMORY ACCESS
t = Time
External data memory access (see Fig.6 and
Fig.7)
SYMBOL
PARAMETER
V = Valid
W = WR signal
TYPICAL(1) UNIT
X = No longer a valid logic level
tRLRH
RD pulse width
250
ns
tWLWH
WR pulse width
250
ns
Z = Float
tRLDV
RD LOW to valid data in 198
ns
tRHDX
Data hold after RD
0
ns
tRHDZ
Data float after RD
tbd
ns
Examples:
tAVLL = time for address valid to ALE LOW.
tLLPL = time for ALE to PSEN LOW.
tLLWL
ALE LOW to RD or
WR LOW
132
ns
tAVWL
Address valid to WR
LOW or RD LOW
172
ns
tQVWX
Data valid to WR LOW
89
ns
tWHQX
Data hold after WR
15
ns
tRLAZ
RD LOW to address
float
tbd
ns
tWHLH
RD or WR HIGH to
ALE HIGH
40
ns
Note
1. The timings are only valid for the nominal 12 MHz
clock provided to the microcontroller.
2005 Mar 09
22
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
handbook, full pagewidth
ALE
t WHLH
PSEN
t LLWL
t RLRH
RD
t RLDV
t LLAX
t RHDZ
t RHDX
t RLAZ
tAVLL
A0-A7
AD<0:7>
A0-A7
DATA IN
INSTR IN
tAVWL
A<0:14>, A15_BK,
RAMBK<0:1>
GSA082
Fig.6 External data memory read cycle.
handbook, full pagewidth
ALE
t WHLH
PSEN
t LLWL
t WLWH
WR
t LLAX
t QVWX
tAVLL
AD<0:7>
t WHQX
DATA OUT
A0-A7
A0-A7 FROM PCL
INSTR IN
tAVWL
A<0:14>, A15_BK,
RAMBK<0:1>
GSA083
Fig.7 External data memory write cycle.
2005 Mar 09
23
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
13 PACKAGE OUTLINE
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
c
y
X
A
51
75
50
76
ZE
e
E HE
A A2
(A 3)
A1
w M
θ
bp
Lp
pin 1 index
L
100
detail X
26
1
25
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
14.1
13.9
0.5
HD
HE
16.25 16.25
15.75 15.75
L
Lp
v
w
y
1
0.75
0.45
0.2
0.08
0.08
Z D (1) Z E (1)
θ
1.15
0.85
7
o
0
1.15
0.85
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT407-1
136E20
MS-026
2005 Mar 09
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-02-01
03-02-20
24
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
To overcome these problems the double-wave soldering
method was specifically developed.
14 SOLDERING
14.1
Introduction to soldering surface mount
packages
If wave soldering is used the following conditions must be
observed for optimal results:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
14.2
SAA5360; SAA5361
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 seconds and 200 seconds
depending on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 °C to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending
on solder material applied, SnPb or Pb-free respectively.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
– for all BGA, HTSSON..T and SSOP..T packages
14.4
– for packages with a thickness ≥ 2.5 mm
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 seconds to 5 seconds
between 270 °C and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
14.3
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
2005 Mar 09
Manual soldering
25
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
14.5
SAA5360; SAA5361
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
REFLOW(2)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,
VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
suitable
suitable
not
recommended(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended(7)
suitable
CWQCCN..L(8), PMFP(9), WQCCN..L(8)
not suitable
LQFP, QFP, TQFP
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar soldering or manual soldering is suitable for PMFP packages.
2005 Mar 09
26
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
15 DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
16 DEFINITIONS
17 DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2005 Mar 09
27
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA76
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R24/06/pp28
Date of release: 2005
Mar 09
Document order number:
9397 750 14857