DISCRETE SEMICONDUCTORS DATA SHEET fpage M3D088 BAT754 series Schottky barrier (double) diodes Product data sheet Supersedes data of 1999 Aug 05 2003 Mar 25 NXP Semiconductors Product data sheet Schottky barrier (double) diodes FEATURES BAT754 series PINNING • Very low forward voltage BAT754 PIN • Guard ring protected • Small plastic SMD package • Low diode capacitance. A C S 1 a k1 a1 a1 2 n.c. k2 a2 k2 3 k 3 1 2 MLC360 a1, a2 k1, k2 k1, a2 APPLICATIONS • Ultra high-speed switching • Voltage clamping handbook, 2 columns Fig.3 3 BAT754A diode configuration (symbol). • Protection circuits • Blocking diodes • Low power consumption applications, e.g. hand-held applications. 3 1 2 1 Top view DESCRIPTION Planar Schottky barrier diodes encapsulated in a SOT23 small plastic SMD package. Low forward voltage selection of the BAT54 series. Single diodes and double diodes with different pinning are available. Fig.1 TYPE NUMBER MGC421 Simplified outline (SOT23) and pin configuration. MARKING BAT754 2K* BAT754A 2L* BAT754C 2M* BAT754S 2N* Note 1 Fig.4 BAT754C diode configuration (symbol). 3 2 n.c. 1 MLC357 Fig.2 BAT754 single diode configuration (symbol). 1. ∗ = p : Made in Hong Kong. ∗ = t : Made in Malaysia. ∗ = W : Made in China. 2003 Mar 25 MLC359 3 MARKING CODE(1) 2 2 2 MLC358 Fig.5 BAT754S diode configuration (symbol). NXP Semiconductors Product data sheet Schottky barrier (double) diodes BAT754 series LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode − 30 V − 200 mA − 300 mA − 600 mA storage temperature −65 +150 °C junction temperature − 125 °C operating ambient temperature −65 +125 °C VR continuous reverse voltage IF continuous forward current IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 IFSM non-repetitive peak forward current t = 8.3 ms half sinewave; JEDEC method Tstg Tj Tamb ELECTRICAL CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT Per diode VF forward voltage see Fig.6 IF = 0.1 mA − 200 mV IF = 1 mA − 260 mV IF = 10 mA − 340 mV IF = 30 mA − 420 mV IF = 100 mA 600 − mV IR reverse current VR = 25 V; note 1; see Fig.7 − 2 μA Cd diode capacitance f = 1 MHz; VR = 1 V; see Fig.8 − 10 pF Note 1. Pulse test: tp = 300 μs; δ ≤ 0.02. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 Note 1. Refer to SOT23 standard mounting conditions. 2003 Mar 25 3 VALUE UNIT 500 K/W NXP Semiconductors Product data sheet Schottky barrier (double) diodes BAT754 series GRAPHICAL DATA MSA892 IF MSA893 10 3 3 10halfpage handbook, I R (μA) (1) (2) (3) (mA) (1) 10 2 10 2 (2) 10 10 (1) 1 10 1 (2) (3) 1 (3) 10 1 0 0.4 0.8 VF (V) 0 1.2 10 (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. Fig.6 Fig.7 Forward current as a function of forward voltage; typical values. MSA891 15 handbook, halfpage Cd (pF) 10 5 0 0 10 20 VR (V) 30 f = 1 MHz; Tamb = 25 °C. Fig.8 Diode capacitance as a function of reverse voltage; typical values. 2003 Mar 25 4 20 VR (V) 30 Reverse current as a function of reverse voltage; typical values. NXP Semiconductors Product data sheet Schottky barrier (double) diodes BAT754 series PACKAGE OUTLINE Plastic surface mounted package; 3 leads SOT23 D E B A X HE v M A 3 Q A A1 1 2 e1 bp c w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp c D E e e1 HE Lp Q v w mm 1.1 0.9 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.1 OUTLINE VERSION SOT23 2003 Mar 25 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-02-28 99-09-13 TO-236AB 5 NXP Semiconductors Product data sheet Schottky barrier (double) diodes BAT754 series DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Mar 25 Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 6 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/02/pp7 Date of release: 2003 Mar 25 Document order number: 9397 750 10968