DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D087 BAT160 series Schottky barrier double diodes Product data sheet Supersedes data of 1999 Mar 26 1999 Sep 20 NXP Semiconductors Product data sheet Schottky barrier double diodes FEATURES BAT160 series PINNING • Low switching losses BAT160 PIN • Capability of absorbing very high surge current • Fast recovery time • Guard ring protected • Plastic SMD package. 4 A C S 1 k1 a1 a1 2 n.c. n.c. n.c. 3 k2 a2 k2 4 a1, a2 k1, k2 k1, a2 1 2 n.c. Fig.2 APPLICATIONS 3 MGL171 BAT160A diode configuration (symbol). • Low power switched-mode power supplies • Rectification 4 page 4 • Polarity protection. 1 DESCRIPTION Planar Schottky barrier double diodes encapsulated in a SOT223 plastic SMD package. 2 n.c. Fig.3 1 TYPE NUMBER 2 Top view MARKING 3 AT160A BAT160C AT160C BAT160S AT160S BAT160C diode configuration (symbol). 4 Fig.1 Simplified outline (SOT223) and pin configuration. 1 3 2 n.c. Fig.4 1999 Sep 20 MGL172 MSB002 - 1 MARKING CODE BAT160A 3 2 MGL173 BAT160S diode configuration (symbol). NXP Semiconductors Product data sheet Schottky barrier double diodes BAT160 series LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode − 60 V − 1 A − 10 A − 0.5 A storage temperature −65 +150 °C junction temperature − 150 °C VR continuous reverse voltage IF continuous forward current IFSM non-repetitive peak forward current tp = 8.3 ms; half sinewave; JEDEC method IRSM non-repetitive peak reverse current tp = 100 μs Tstg Tj ELECTRICAL CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MAX. UNIT Per diode VF IR Cd forward voltage reverse current diode capacitance see Fig.5 IF = 100 mA 400 mV IF = 1 A 650 mV IF = 2 A 850 mV VR = 60 V; note 1; see Fig.6 350 μA VR = 60 V; Tj = 100 °C; note 1; see Fig.6 8 mA f = 1 MHz; VR = 4 V; see Fig 7 60 pF Note 1. Pulse test: tp = 300 μs; δ = 0.02. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 Note 1. Refer to SOT223 standard mounting conditions. 1999 Sep 20 3 VALUE UNIT 100 K/W NXP Semiconductors Product data sheet Schottky barrier double diodes BAT160 series GRAPHICAL DATA MCD784 104 handbook, halfpage MCD768 105 handbook, halfpage IR IF (mA) (μA) 104 103 (1) 103 (2) (3) 102 102 (2) (1) 10 10 (3) (4) (4) 1 1 10−1 0 0.2 0.4 (1) Tamb = 125 °C. (2) Tamb = 100 °C. Fig.5 0.6 VF (V) 0.8 0 (3) Tamb = 75 °C. (4) Tamb = 25 °C. (1) Tamb = 125 °C. (2) Tamb = 100 °C. Forward current as a function of forward voltage; typical values. Fig.6 MCD766 103 handbook, halfpage Cd (pF) 102 10 0 20 40 VR (V) 60 f = 1 MHz; Tamb = 25 °C. Fig.7 Diode capacitance as a function of reverse voltage; typical values. 1999 Sep 20 20 4 40 VR (V) 60 (3) Tamb = 75 °C. (4) Tamb = 25 °C. Reverse current as a function of reverse voltage; typical values. NXP Semiconductors Product data sheet Schottky barrier double diodes BAT160 series PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION SOT223 1999 Sep 20 REFERENCES IEC JEDEC EIAJ SC-73 5 EUROPEAN PROJECTION ISSUE DATE 97-02-28 99-09-13 NXP Semiconductors Product data sheet Schottky barrier double diodes BAT160 series DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 1999 Sep 20 6 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 115002/03/pp7 Date of release: 1999 Sep 20 Document order number: 9397 750 06097