LDS-0100

JANS 2N5152 and JANS 2N5154
Qualified Levels:
JANSM, JANSD,
JANSP, JANSL,
JANSR, JANSF
RADIATION HARDENED
NPN POWER SILICON TRANSISTOR
Qualified per MIL-PRF-19500/544
DESCRIPTION
These RHA level 2N5152 and 2N5154 silicon transistor devices are military Radiation
Hardness Assurance qualified up to a JANSF level for high-reliability applications. Microsemi
also offers numerous other products to meet higher and lower power voltage regulation
applications.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
•
JEDEC registered 2N5152 and 2N5154.
•
JANS RHA qualifications are available per MIL-PRF-19500/544.
TO-39 (TO-205AD)
Package
Also available in:
APPLICATIONS / BENEFITS
•
•
•
•
TO-5 Package
(long-leaded)
JANS_2N5152L &
JANS_2N5154L
High frequency operation.
Lightweight.
High-speed power-switching applications.
High-reliability applications.
U3 Package
(surface mount)
JANS_2N5152U3 &
JANS_2N5154U3
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Ambient
Thermal Resistance Junction-to-Case
(1)
Reverse Pulse Energy
Collector Current (dc)
Collector to base voltage (static), emitter open
Collector to emitter voltage (static) base open
Emitter to base voltage (static) collector open
Steady-State Power Dissipation @ TA = +25 ºC
Steady-State Power Dissipation @ TC = +25 ºC
Symbol
Value
Unit
TJ and TSTG
RӨJA
RӨJC
-65 to +200
175
10
15
2
100
80
5.5
1
10
ºC
ºC/W
ºC/W
mJ
A
V
V
V
W
W
IC
VCBO
VCEO
VEBO
PD
PD
Notes: 1. This rating is based on the capability of the transistors to operate safely in the unclamped inductive load
energy test circuit.
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0100, Rev. 2 (120716)
©2012 Microsemi Corporation
Page 1 of 8
JANS 2N5152 and JANS 2N5154
MECHANICAL and PACKAGING
•
•
•
•
•
•
CASE: Hermetically sealed, kovar base, nickel cap.
TERMINALS: Gold plate over nickel.
MARKING: Part number, date code, manufacturer’s ID.
POLARITY: NPN
WEIGHT: Approximately 1.064 grams.
See Package Dimensions on last page.
PART NOMENCLATURE
JANSM
2N5152
Reliability Level
JANSM – 3K Rads (Si)
JANSD – 10K Rads (Si)
JANSP – 30K Rads (Si)
JANSL – 50K Rads (Si)
JANSR – 100K Rads (Si)
JANSF – 300K Rads (Si)
Symbol
Cobo
ICEO
ICEX
IEBO
hFE
VCEO
VCBO
VEBO
JEDEC type number
(See Electrical Characteristics
table)
SYMBOLS & DEFINITIONS
Definition
Common-base open-circuit output capacitance.
Collector cutoff current, base open.
Collector cutoff current, circuit between base and emitter.
Emitter cutoff current, collector open.
Common-emitter static forward current transfer ratio.
Collector-emitter voltage, base open.
Collector-emitter voltage, emitter open.
Emitter-base voltage, collector open.
T4-LDS-0100, Rev. 2 (120716)
©2012 Microsemi Corporation
Page 2 of 8
JANS 2N5152 and JANS 2N5154
ELECTRICAL CHARACTERISTICS @ TA = +25 ºC unless otherwise noted.
OFF CHARACTERISTICS
Parameters / Test Conditions
Collector-Emitter Breakdown Voltage
IC = 100 mA, IB = 0
Emitter-Base Cutoff Current
VEB = 4.0 V, IC = 0
VEB = 5.5 V, IC = 0
Collector-Emitter Cutoff Current
VCE = 60 V, VBE = 0
VCE = 100 V, VBE = 0
Collector-Emitter Cutoff Current
VCE = 40 V, IB = 0
Symbol
Min.
V(BR)CEO
80
Max.
Unit
V
IEBO
1.0
1.0
µA
mA
ICES
1.0
1.0
µA
mA
ICEO
50
µA
Min.
Max.
Unit
20
50
30
70
20
40
--90
200
---
ON CHARACTERISTICS
Parameters / Test Conditions
Forward-Current Transfer Ratio
IC = 50 mA, VCE = 5 V
IC = 2.5 A, VCE = 5 V
IC = 5A, VCE = 5V
Symbol
2N5152
2N5154
2N5152
2N5154
2N5152
2N5154
Collector-Emitter Saturation Voltage
IC = 2.5 A, IB = 250 mA
IC = 5.0 A, IB = 500 mA
Base-Emitter Voltage Non-Saturation
IC = 2.5 A, VCE = 5 V
Base-Emitter Saturation Voltage
IC = 2.5 A, IB = 250 mA
IC = 5.0 A, IB = 500 mA
hFE
VCE(sat)
0.75
1.5
V
VBE
1.45
V
VBE(sat)
1.45
2.2
V
Max.
Unit
250
pF
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions
Magnitude of Common Emitter Small-Signal ShortCircuit Forward Current Transfer Ratio
2N5152
2N5154
IC = 500 mA, VCE = 5 V, f = 10 MHz
Small-signal short Circuit Forward-Current
Transfer Ratio
2N5152
2N5154
IC = 100 mA, VCE = 5 V, f = 1 KHz
Output Capacitance
VCB = 10 V, IE = 0, f = 1.0 MHz
T4-LDS-0100, Rev. 2 (120716)
Symbol
Min.
|hfe|
6
7
hfe
20
50
Cobo
©2012 Microsemi Corporation
Page 3 of 8
JANS 2N5152 and JANS 2N5154
ELECTRICAL CHARACTERISTICS @ TA = +25 °C unless otherwise noted. (continued)
SWITCHING CHARACTERISTICS
Parameters / Test Conditions
Turn-On Time
IC = 5 A, IB1 = 500 mA
Turn-Off Time
RL = 6Ω
Storage Time IB2 = -500 mA
Fall Time
Symbol
Max.
Unit
ton
0.5
µs
toff
1.5
µs
tS
1.4
µs
tf
0.5
µs
VBE(OFF) = 3.7 V
Min.
SAFE OPERATING AREA (See SOA graph below and MIL-STD-750, method 3053)
DC Tests
TC = +25 °C, tP = 1.0 s, 1 Cycle
Test 1
VCE = 5.0 V, IC = 2.0 A
Test 2
VCE = 32 V, IC = 310 mA
Test 3
VCE = 80 V, IC = 12.5 mA
IC – COLLECTOR CURRENT - A
dc Operation
TC < 25 ºC
VCE – COLLECTOR – EMITTER VOLTAGE – V
Maximum Safe Operating Area
T4-LDS-0100, Rev. 2 (120716)
©2012 Microsemi Corporation
Page 4 of 8
JANS 2N5152 and JANS 2N5154
ELECTRICAL CHARACTERISTICS @ TA = +25 °C, unless otherwise noted (continued)
POST RADIATION ELECTRICAL CHARACTERISTICS
Parameters / Test Conditions
Symbol
Collector to Emitter Cutoff Current
VCE = 40 V
Emitter to Base Cutoff Current
VEB = 4 V
Breakdown Voltage, Collector to Emitter
IC = 100 mA
Collector to Emitter Cutoff Current
VCE = 60 V
Emitter to Base Cutoff Current
VEB = 5.5 V
(1)
Forward-Current Transfer Ratio
IC = 50 mA, VCE = 5 V
IC = 2.5 A, VCE = 5 V
Base to Emitter voltage (non-saturated)
VCE = 5 V, IC = 2.5 A, pulsed
Collector-Emitter Saturation Voltage
IC = 2.5 mA, IB = 250 mA, pulsed
IC = 500 mA, IB = 500 mA, pulsed
Base-Emitter Saturation Voltage
IC = 2.5 A, IB = 250 mA, pulsed
IC = 5 A, IB = 500 mA, pulsed
Unit
ICEO
100
µA
IEBO
2.0
µA
80
V
ICES
2.0
µA
IEBO
2.0
mA
2N5152
[10]
2N5154
[25]
2N5152
IC = 5 A pulsed, VCE = 5 V
Max.
V(BR)CEO
Min.
[15]
90
2N5154
[35]
200
2N5152
[10]
2N5154
[20]
[hFE]
VBE
1.45
V
VCE(sat)
0.86
1.73
V
VBE(sat)
1.67
2.53
V
(1) See method 1019 of MIL-STD-750 for how to determine [hFE] by first calculating the delta (1/hFE) from the preand post-radiation hFE. Notice the [hFE] is not the same as hFE and cannot be measured directly. The [hFE] value
can never exceed the pre-radiation minimum hFE that it is based upon.
T4-LDS-0100, Rev. 2 (120716)
©2012 Microsemi Corporation
Page 5 of 8
JANS 2N5152 and JANS 2N5154
DC Operation Maximum Rating (W)
GRAPHS
TC (°C) (Case)
DC Operation Maximum Rating (W)
FIGURE 1
Temperature-Power Derating Curve
TA (°C) (Ambient)
FIGURE 2
Temperature-Power Derating Curve
T4-LDS-0100, Rev. 2 (120716)
©2012 Microsemi Corporation
Page 6 of 8
JANS 2N5152 and JANS 2N5154
o
Theta ( CW)
GRAPHS (continued)
Time (sec)
o
Theta ( CW)
FIGURE 3
Thermal Impedance (RӨJA)
Time (sec)
FIGURE 4
Thermal Impedance (RӨJC)
T4-LDS-0100, Rev. 2 (120716)
©2012 Microsemi Corporation
Page 7 of 8
JANS 2N5152 and JANS 2N5154
PACKAGE DIMENSIONS
Symbol
CD
CH
HD
LC
LD
LL
LU
Dimensions
Millimeters
Min
Max
Min
Max
.305
.335
7.75
8.51
.240
.260
6.10
6.60
.335
.370
8.51
9.40
.200 TP
5.08 TP
.016
.019
0.41
0.48
See note 14
.016
.019
0.41
0.48
Inch
L1
.050
1.27
L2
.250
6.35
P
Q
TL
TW
r
α
.100
2.54
.030
.029
.045
.028
.034
.010
45° TP
Note
6
7
8,9
8,9
8,9
8,9
0.76
1.14
0.86
0.25
0.74
0.71
45° TP
7
5
3,4
3
10
7
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Beyond r (radius) maximum, TW shall be held for a minimum length of .011 (0.28 mm).
4. Dimension TL measured from maximum HD.
5. Body contour optional within zone defined by HD, CD, and Q.
6. CD shall not vary more than .010 inch (0.25 mm) in zone P. This zone is controlled for automatic handling.
7. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm)
radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. The device may be measured by
direct methods or by gauging procedure.
8. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled in
and beyond LL minimum.
9. All three leads.
10. The collector shall be internally connected to the case.
11. Dimension r (radius) applies to both inside corners of tab.
12. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
13. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
14. TO-39 dimension LL = .5 inch (12.70 mm) min. and .750 inch (19.05 mm) max.
T4-LDS-0100, Rev. 2 (120716)
©2012 Microsemi Corporation
Page 8 of 8