Document No.001-69721 Rev. *A ECN # 4020611 Cypress Semiconductor Package Qualification Report QTP# 034601 June 2013 ALL Plastic Leaded Chip Carrier (PLCC) Pb-Free, MSL3, 260C Reflow Amkor Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Mira Ben- Tzur Reliability Engineer, MTS (408) 943-2732 Quality Engineering Director (408) 943-2675 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 12 Document No.001-69721 Rev. *A ECN # 4020611 PACKAGE QUALIFICATION HISTORY Qual Report Description of Qualification Purpose Date Comp 034601 ALL Plastic Leaded Chip Carrier (PLCC) package , Pb-Free, MSL3, 260C Reflow using G600 Mold Compound, 8361J epoxy and Matte Tin Plating with Annealing Process (150C, 1hr) assembled @ Amkor-Philippines Mar 04 111501 Qualification of C194 Copper Base Leadframe for All PLCC Packages Built at Amkor Phils (P1) May 11 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 12 Document No.001-69721 Rev. *A ECN # 4020611 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: J32 32 lead Plastic Leaded Chip Carrier (PLCC) G600 Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: None Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8361J Bond Diagram Designation 10-02241 Wire Bond Method: Thermosonic Wire Material/Size: Gold, 1.0mil Thermal Resistance Theta JA °C/W: 65.10 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-14012 Name/Location of Assembly (prime) facility: Amkor Philippines (PHIL-M) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Fault Coverage: 100% Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 12 Document No.001-69721 Rev. *A ECN # 4020611 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: J52 52 lead Plastic Leaded Chip Carrier (PLCC) G600 Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: None Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8361J Bond Diagram Designation 10-02868 Wire Bond Method: Thermosonic Wire Material/Size: Gold, 1.3mil Thermal Resistance Theta JA °C/W: 43.54 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-14012 Name/Location of Assembly (prime) facility: Amkor Philippines (PHIL-M) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Fault Coverage: 100% Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 12 Document No.001-69721 Rev. *A ECN # 4020611 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: JZ84 84 lead Plastic Leaded Chip Carrier (PLCC) G600 Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: None Lead Frame Material: Copper / C194 Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8361J Wire Bond Method: Thermosonic Wire Material/Size: Gold, 1.3mil/ 1.0 mil Thermal Resistance Theta JA °C/W: 30.56 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-14012 Name/Location of Assembly (prime) facility: Amkor Philippines (PHIL-M) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Fault Coverage: 100% Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 12 Document No.001-69721 Rev. *A ECN # 4020611 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: JZ44 44 lead Plastic Leaded Chip Carrier (PLCC) G600 Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: None Lead Frame Material: Copper / C194 Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8361J Bond Diagram Designation 10-06312 Wire Bond Method: Thermosonic Wire Material/Size: 1.0 mil Thermal Resistance Theta JA °C/W: 30.56 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-14012 Name/Location of Assembly (prime) facility: Amkor Philippines (PHIL-M) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Fault Coverage: 100% Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 12 Document No.001-69721 Rev. *A ECN # 4020611 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy Test (C-SAM) J-STD-020 P Adhesion of Lead Finish MIL-STD-883, Method 2025 – Adhesion of Lead Finish P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009 P High Accelerated Saturation Test 130°C, 85%RH, 5.5V P Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C Dynamic Operating Condition, Vcc Max = 2.3V, 125C P Dynamic Operating Condition, Vcc Max= 2.45V, 135C P High Temperature Storage 150°C, no bias P Pressure Cooker Test No bias, 121°C, 100%, Precondition: JESD22 Moisture Sensitivity MSL 3 P High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate 192 Hrs., 30 C/60%RH+3IR-Reflow, 260°C+5, -0°C Solderability, Steam Aged J-STD-002, JESD22-B102 95% solder coverage minimum P Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C P X-Ray MIL-STD-883-2012 P Physical Dimension MIL-STD-1835, JESD22-B100 P Internal Visual MIL-STD-883-2014 P Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack Criteria: Meet external and internal characteristics of Cypress package P Constructional Analysis Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 12 P Document No.001-69721 Rev. *A ECN # 4020611 Reliability Test Data Device Fab Lot # QTP #: 034601 Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC MICROSCOPY CY7C421 (7C421D) 2119532 610349196 PHIL-M COMP 15 0 CY7C136 (7C136G) 2124768 610349419 PHIL-M COMP 15 0 CY7C341B (7C341F) 2129128 610352023 PHIL-M COMP 15 0 610349196 PHIL-M COMP 5 0 STRESS: ADHESION OF LEAD FINISH CY7C421 (7C421D) 2119532 STRESS: EXTERNAL VISUAL CY7C421 (7C421D) 2119532 610349196 PHIL-M COMP 15 0 CY7C341B (7C341F) 2129128 610352023 PHIL-M COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, (5.5V), PRE COND 192 HR 30C/60%RH, MSL3 CY7C421 (7C421D) 2119532 610349196 PHIL-M 128 45 0 CY7C136 (7C136G) 2124768 610349419 PHIL-M 128 50 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 5.75V, Vcc Max CY7C421 (7C421D) 2119532 610349196 PHIL-M 48 817 0 CY7C136 (7C136G) 2124768 610349419 PHIL-M 48 799 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 5.75V, Vcc Max CY7C421 (7C421D) 2119532 610349196 PHIL-M 80 355 0 CY7C421 (7C421D) 2119532 610349196 PHIL-M 500 120 0 CY7C136 (7C136G) 2124768 610349419 PHIL-M 80 120 0 CY7C136 (7C136G) 2124768 610349419 PHIL-M 500 120 0 STRESS: HIGH TEMP STORGAGE, PLASTIC, 150C CY7C421 (7C421D) 2119532 610349196 PHIL-M 500 45 0 CY7C421 (7C421D) 2119532 610349196 PHIL-M 1000 45 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH), PRE COND 192HRS 30C/60%RH, MSL3 CY7C421 (7C421D) 2119532 610349196 PHIL-M 168 45 0 CY7C341B (7C341F) 2129128 610352023 PHIL-M 168 50 0 STRESS: SOLDERABILITY CY7C421 (7C421D) 2119532 610349196 PHIL-M COMP 3 0 CY7C341B (7C341F) 2129128 610352023 PHIL-M COMP 3 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 12 Document No.001-69721 Rev. *A ECN # 4020611 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 034601 Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC CONDITION C, -65C TO 150C, PRE COND. 192 HRS 30C/60% RH, MSL3 CY7C421 (7C421D) 2119532 610349196 PHIL-M 300 45 0 CY7C421 (7C421D) 2119532 610349196 PHIL-M 500 45 0 CY7C421 (7C421D) 2119532 610349196 PHIL-M 1000 45 0 CY7C136 (7C136G) 2124768 610349419 PHIL-M 300 50 0 CY7C136 (7C136G) 2124768 610349419 PHIL-M 500 50 0 CY7C136 (7C136G) 2124768 610349419 PHIL-M 1000 50 0 CY7C341B (7C341F) 2129128 610352023 PHIL-M 300 50 0 CY7C341B (7C341F) 2129128 610352023 PHIL-M 500 50 0 CY7C341B (7C341F) 2129128 610352023 PHIL-M 1000 50 0 CY7C421 (7C421D) 2119532 610349196 PHIL-M COMP 15 0 CY7C341B (7C341F) 2129128 610352023 PHIL-M COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 12 Document No.001-69721 Rev. *A ECN # 4020611 Reliability Test Data QTP #: 111501 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC MICROSCOPY CY7C024 (7C024C) 2835941 611116759 PHIL-M COMP 15 0 CY7C024 (7C024C) 2835941 611116762 PHIL-M COMP 15 0 CY37064P44 (7C37625B) 8048005 611116148 PHIL-M COMP 15 0 STRESS: ADHESION OF LEAD FINISH CY7C024 (7C024C) 2835941 611116759 PHIL-M COMP 5 0 CY7C024 (7C024C) 2835941 611116762 PHIL-M COMP 5 0 CY37064P44 (7C37625B) 8048005 611116148 PHIL-M COMP 5 0 STRESS: CONSTRUCTIONAL ANALYSIS CY7C024 (7C024C) 2835941 611116759 PHIL-M COMP 5 0 CY7C024 (7C024C) 2835941 611116762 PHIL-M COMP 5 0 CY37064P44 (7C37625B) 8048005 611116148 PHIL-M COMP 5 0 STRESS: DYE PENETRANT TEST CY7C024 (7C024C) 2835941 611116759 PHIL-M COMP 15 0 CY7C024 (7C024C) 2835941 611116762 PHIL-M COMP 15 0 CY37064P44 (7C37625B) 8048005 611116148 PHIL-M COMP 15 0 STRESS: INTERNAL VISUAL CY7C024 (7C024C) 2835941 611116759 PHIL-M COMP 5 0 CY7C024 (7C024C) 2835941 611116762 PHIL-M COMP 5 0 CY37064P44 (7C37625B) 8048005 611116148 PHIL-M COMP 5 0 STRESS: PHYSICAL DIMENSION CY7C024 (7C024C) 2835941 611116759 PHIL-M COMP 30 0 CY7C024 (7C024C) 2835941 611116762 PHIL-M COMP 30 0 CY37064P44 (7C37625B) 8048005 611116148 PHIL-M COMP 30 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 SAC DIE 1.03-2 N/A 531L0088 PHIL-M 1000 77 0 PHIL-M 1000 77 0 STRESS: HIGH TEMP STORGAGE, PLASTIC, 150C SAC DIE 1.03-2 N/A 531L0088 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 12 Document No.001-69721 Rev. *A ECN # 4020611 Reliability Test Data QTP #: 111501 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: TC CONDITION C, -65C TO 150C, PRE COND. 192 HRS 30C/60% RH, MSL3 SAC DIE 1.03-2 N/A 531L0088 PHIL-M 500 77 0 STRESS: SOLDERABILITY CY7C024 (7C024C) 2835941 611116759 PHIL-M COMP 3 0 CY7C024 (7C024C) 2835941 611116762 PHIL-M COMP 3 0 CY37064P44 (7C37625B) 8048005 611116148 PHIL-M COMP 3 0 CY7C024 (7C024C) 2835941 611116759 PHIL-M COMP 15 0 CY7C024 (7C024C) 2835941 611116762 PHIL-M COMP 15 0 CY37064P44 (7C37625B) 8048005 611116148 PHIL-M COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 12 Document No.001-69721 Rev. *A ECN # 4020611 History Page Document Title: QTP 034601: ALL PLASTIC LEADED CHIP CARRIER (PLCC), PB-FREE, MSL3, 260C REFLOW, AMKOR PHILIPPINES ASSEMBLY QUALIFICATION REPORT 001-69721 Document Number: Rev. ECN Orig. of No. Change ** 3261166 NSR *A 4020611 NSR Description of Change Initial spec release. Changes from Rev. 1 - Changed Revision from Rev 1 to Rev 2 - Added QTP#111501 on the history page and QTP#111501 data on the reliability test data section. - Added JZ44 on the major package information used in this qualification. - Updated the reliability tests performed per specification requirements table. Removed VERSION 2.0 in the title page. Removed obsolete Bond Diagram Designation Spec 10-03722 & 1005836. Removed reference Cypress specs in the reliability tests performed table. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. 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