Document No.001-89475 Rev. *A ECN # 4517626 Cypress Semiconductor Package Qualification Report QTP# 051206 VERSION*A September 2014 All Plastic Dual-In-Line (PDIP/300mils) Package NiPdAu, Pb-Free, 260C Reflow Millennium Microtech Thailand FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 6 Document No.001-89475 Rev. *A ECN # 4517626 PACKAGE QUALIFICATION HISTORY QUAL REPORT 051206 090203 DESCRIPTION OF QUALIFICATION PURPOSE Qualify All Plastic Dual-In-Line Package (PDIP), 300mils with NiPdAu Lead Finish, Pb- Free, 260C Reflow assembled @ Millennium Microtech Thailand (formerly Alphatek) Subcon Test Pull-in of PDIP Packages from Omedata to CML Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 6 DATE COMP. Aug 05 July 09 Document No.001-89475 Rev. *A ECN # 4517626 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: PZ24 24-Pin Plastic Dual-In-Line Package (PDIP) Sumitomo G600 Mold Compound Flammability Rating: V-O per UL 94 Oxygen Rating Index: None Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Sawing Die Attach Supplier: Ablestik Die Attach Material: 84-1LMISR4 Bond Diagram Designation 10-05494 Wire Bond Method: Thermosonic Wire Material/Size: Au 1.0 mil Thermal Resistance Theta JA °C/W: 14.1°C/W Assembly Process Flow: 001-04160 Name/Location of Assembly (prime) facility: Millennium Microtech - Thailand ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Fault Coverage: 100% Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 6 Document No.001-89475 Rev. *A ECN # 4517626 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Adhesion of Lead Finish MIL-STD-883, Method 2025 P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009 P High Temperature Storage 150C, no bias P High Accelerated Saturation Test (HAST) Solderability 130°C, 5.75V, 85%RH P J-STD-002, JESD22-B102 P Pressure Cooker 121°C, 100%RH P Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C P X-Ray MIL-STD-883, Method 32012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 6 Document No.001-89475 Rev. *A ECN # 4517626 Reliability Test Data QTP #:051206 Device Fab Lot # Assy Lot# Assy Loc Duration Samp Rej CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND COMP 15 0 CY7C62743 (7C63740A) 2430877 610507073 MMT-THAILAND COMP 15 0 Failure Mechanism STRESS: EXTERNAL VISUAL STRESS: ADHESION OF LEAD FINISH CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND COMP 3 0 CY7C62743 (7C63740A) 2430877 610507073 MMT-THAILAND COMP 3 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.75V) CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND 128 48 0 CY7C62743 (7C63740A) 2430877 610507073 MMT-THAILAND 128 48 0 STRESS: HIGH TEMPERATURE STORAGE CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND 500 50 0 CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND 1000 50 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH) CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND 168 50 0 CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND COMP 3 0 CY7C62743 (7C63740A) 2430877 610507073 MMT-THAILAND COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND 300 50 0 CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND 500 50 0 CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND 1000 50 0 CY7C62743 (7C63740A) 2430877 610507069 MMT-THAILAND 300 50 0 CY7C62743 (7C63740A) 2430877 610507069 MMT-THAILAND 500 50 0 CY7C62743 (7C63740A) 2430877 610507069 MMT-THAILAND 1000 50 0 CY7C62743 (7C63740A) 2430877 610507073 MMT-THAILAND 300 48 0 CY7C62743 (7C63740A) 2430877 610507073 MMT-THAILAND 500 48 0 CY7C62743 (7C63740A) 2430877 610507073 MMT-THAILAND 1000 48 0 CY7C62743 (7C63740A) 2430877 610507067 MMT-THAILAND COMP 15 0 CY7C62743 (7C63740A) 2430877 610507073 MMT-THAILAND COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 6 Document No.001-89475 Rev. *A ECN # 4517626 Document History Page Document Title: QTP#051206: All Plastic Dual-In-Line (PDIP/300mils) Package NiPdAu, Pb-Free, 260C Reflow Millennium Microtech Thailand Document Number: 001-89475 Rev. ECN Orig. of No. Change ** 4142687 HSTO *A 4517626 HSTO Description of Change Initial Spec Release Initiate report as per memo HGA-853 Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 6