QTP 120205 48 QFN (6X6X0.6MM) / 36 QFN (5X5X0.6MM) / 56 QFN (7X7X0.6MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW CML-RA.pdf

Document No.001-77743 Rev. *B
ECN # 4321669
Cypress Semiconductor
Package Qualification Report
QTP# 120205 VERSION *B
March 2014
48 QFN (6x6x0.6mm) / 36 QFN (5x5x0.6mm) /
56 QFN (7x7x0.6mm)
NiPdAu, 100% Cu Wire
MSL3, 260C Reflow
CML-RA
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Lorena R. Zapanta (ILZ)
Reliability Engineer
Reviewed By:
Rene Rodgers (RT)
Reliability Manager
Approved By:
Richard Oshiro(RGO)
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 9
Document No.001-77743 Rev. *B
ECN # 4321669
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
120205
Qualification of 48 QFN (6X6X0.6mm), 36 QFN (5x5x0.6mm) and
56 QFN (7x7x0.6mm) package dimensions at CML Autoline (RA)
using NiPdAu Leadframe, 100% Cu Wire , GE7470 mold
compound and QMI 519 epoxy
Mar 2012
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 9
Document No.001-77743 Rev. *B
ECN # 4321669
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
LQ48
Package Outline, Type, or Name:
48-Lead Quad Flat No Lead, 6x6x0.6mm Package
Mold Compound Name/Manufacturer:
GE7470 / Nitto
Mold Compound Flammability Rating:
V-0 / UL94
Mold Compound Alpha Emission Rate:
N/A
Oxygen Rating Index: >28%
N/A
Lead Frame Designation:
C7025
Lead Frame Material:
Copper (PPF)
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
SAW Process
Die Attach Supplier:
Dexter
Die Attach Material:
QMI 519
Bond Diagram Designation
001-57376
Wire Bond Method:
Thermosonic
Wire Material/Size:
0.8mil / Cu
Thermal Resistance Theta JA C/W:
18.69
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
001-80666
Name/Location of Assembly (prime) facility:
CML-RA
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-RA
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 9
Document No.001-77743 Rev. *B
ECN # 4321669
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Temperature Operating Life
Early Failure Rate
High Temperature Operating Life
Latent Failure Rate
High Accelerated Saturation Test
(HAST)
Test Condition (Temp/Bias)
Result
P/F
Ball Shear
Dynamic Operating Condition, Vcc = 5.75, 150 C
JESD22-A108
Dynamic Operating Condition, Vcc = 5.75V, 150 C
JESD22-A108
JEDEC STD 22-A110, 130 C, 85%RH, 5.5V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
JESD22-A102, 121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
JESD22-A103, 150 C, no bias
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
JESD22-B116A, Cpk : 1.33, Ppk : 1.66
P
Bond Pull
MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66
P
Constructional Analysis
Meet external and internal characteristics of a package
P
Dye Penetrant Test
P
Internal Visual
Test to determine the existence and extent of cracks, Criteria: No
Package Crack
MIL-STD-883-2014
P
Final Visual Inspection
JESD22-B101B
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Pressure Cooker Test
Temperature Cycle
High Temp Storage
Acoustic Microscopy
MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and
Thermal Shock
P
P
P
P
P
P
P
P
JESD22-A106B, Condition C, -55 C to 125C
X-Ray
MIL-STD-883 - 2012
P
Post Stress Ball Shear
JESD22-A116
P
Post Stress Bond Shear
MIL-STD-883 - 2011
P
Electrical Characterization
AEC-Q100-009
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 9
Document No.001-77743 Rev. *B
ECN # 4321669
Reliability Test Data
QTP #: 120205
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
COMP
15
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
COMP
15
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
COMP
15
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
COMP
5
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
COMP
5
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
COMP
5
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
COMP
5
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
COMP
5
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
COMP
5
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYIS
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
COMP
5
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
COMP
5
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
COMP
5
0
5137028
611158285
RA-CML
COMP
5
0
STRESS: CROSS SECTION
CY8CTMA300E (8C20323E)
STRESS: DYE PENETRATION TEST
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
COMP
15
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
COMP
15
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
COMP
15
0
RA-CML
COMP
30
0
STRESS: ELECTRICAL CHARACTERIZATION
CY8CTMA300E (8C20323E)
5137028
611158285
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 5.75V, Vcc Max)
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
48
1493
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 5.75V, Vcc Max)
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
80
116
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
500
114
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 9
Document No.001-77743 Rev. *B
ECN # 4321669
Reliability Test Data
QTP #: 120205
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
128
79
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
192
39
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
128
79
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
192
40
0
STRESS: HIGH TEMP STORAGE, 150C
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
500
114
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
1000
104
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
1500
94
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
2000
94
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
2500
94
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
3000
94
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
500
114
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
1000
104
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
1500
104
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
2000
104
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
2500
104
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
3000
104
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
500
114
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
1000
104
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
1500
104
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
2000
103
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
2500
103
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
3000
103
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
COMP
5
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
COMP
5
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
COMP
5
0
STRESS: INTERNAL VISUAL
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 9
Document No.001-77743 Rev. *B
ECN # 4321669
Reliability Test Data
QTP #: 120205
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
168
114
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
288
104
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
168
114
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
288
104
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
168
114
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
288
104
0
CY8CTMA300E(8CC20323EK)
5227044
611240187
RA-CML
168
45
0
CY8CTMA300E(8CC20323EK)
5227044
611240187
RA-CML
288
45
0
CY8CTMA300E(8CC20323EK)
5227044
611240187
RA-CML
500
44
0
STRESS: PHYSICAL DIMENSION
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
COMP
30
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
COMP
30
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
COMP
30
0
611158285
RA-CML
COMP
4
0
611158285
RA-CML
COMP
RA-CML
COMP
3
0
RA-CML
128
5
0
RA-CML
1000
5
0
STRESS: POST MSL3 BALL SHEAR
CY8CTMA300E (8C20323E)
5137028
STRESS: POST MSL3 BOND PULL
CY8CTMA300E (8C20323E)
5137028
0
STRESS: POST MSL3 CONSTRUCTIONAL ANALYSIS
CY8CTMA300E (8C20323E)
5137028
611158285
STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR
CY8CTMA300E (8C20323E)
5137028
611158285
STRESS: POST HIGH TEMP STORAGE BALL SHEAR
CY8CTMA300E (8C20323E)
5137028
611158285
STRESS: POST PRESSURE COOKER TEST BALL SHEAR TEST
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
168
5
0
CY8CTMA300E(8CC20323EK)
5227044
611240187
RA-CML
500
5
0
611158285
RA-CML
500
5
0
STRESS: POST TC BALL SHEAR
CY8CTMA300E (8C20323E)
5137028
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 9
Document No.001-77743 Rev. *B
ECN # 4321669
Reliability Test Data
QTP #: 120205
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: POST HIGH TEMP STORAGE BOND PULL
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
1000
5
0
128
5
0
STRESS: POST HI-ACCEL SATURATION TEST BOND PULL
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
STRESS: POST PRESSURE COOKER TEST BOND PULL TEST
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
168
5
0
5137028
611158285
RA-CML
500
5
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
200
77
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
1000
77
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
COMP
15
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
COMP
15
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
COMP
15
0
STRESS: POST TC BOND PULL
CY8CTMA300E (8C20323E)
STRESS: THERMAL SHOCK
STRESS: X-RAY
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
500
114
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
1000
104
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
1500
94
0
CY8CTMA300E (8C20323E)
5137028
611158285
RA-CML
2000
94
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
500
114
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
1000
104
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
1500
94
0
CY8CTMA300E (8C20323E)
5137028
611158286
RA-CML
2000
94
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
500
114
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
1000
104
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
1500
92
0
CY8CTMA300E (8C20323E)
5137028
611158287
RA-CML
2000
92
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 9
Document No.001-77743 Rev. *B
ECN # 4321669
Document History Page
Document Title:
QTP 120205: 48 QFN (6x6x0.6mm) / 36 QFN (5x5x0.6mm) / 56 QFN (7x7x0.6mm) NIPDAU,
100% CU WIRE MSL3, 260C REFLOW CML-RA
001-77743
Document Number:
Rev. ECN
No.
**
3553253
*A
3577076
*B
Orig. of
Change
NSR
NSR
4321669 ILZ
Description of Change
Initial spec release
Added extended readpoints 1500 Cycle TCT, 192H HAST and 1500H
HTS.
Added the reference Industry Standards (JEDEC and MIL) in the stress
test conditions table.
Sunset Spec Review
Updated front page to reflect new qual report template per
Spec 001-57716
Page 2 - Added LF and Wire material on Qual Title on Package
qualification history page
Page 3 - Major package information table – Changed assembly
process flow from 001-69810M to 001-80666
Page 4 – Reliability Tests performed per specification table: Deleted
Cypress reference specs for Constructional analysis, dye penetrant,
internal visual, final visual and physical dimension testing
Added extended readpoints for the following stress:
>2000 cycles TCT
>2000/2500/3000Hrs HTS
>500Hrs PCT
Added Post 500Hrs PCT ball shear
Updated spec title to QTP 120205: 48 QFN (6x6x0.6mm) / 36 QFN
(5x5x0.6mm) / 56 QFN (7x7x0.6mm) NIPDAU, 100% CU WIRE MSL3,
260C REFLOW CML-RA
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 9 of 9
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