Document No.001-89614 Rev. *A ECN # 4536462 Cypress Semiconductor Package Qualification Report QTP# 083909 VERSION*A October 2014 32QFN (5X5X0.6) NiPdAu-Ag, MSL3, 260C Reflow Amkor-Phil (Phil-M) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-89614 Rev. *A ECN # 4536462 PACKAGE QUALIFICATION HISTORY QUAL REPORT 083909 DESCRIPTION OF QUALIFICATION PURPOSE To qualify 32QFN(5X5X0.6) Saw Type Pb-Free (NiPdAu-Ag) using AMK-06 epoxy, and Nitto 7470-LA Mold compound, MSL3 and 260C Reflow at Amkor Phil (P3) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 DATE COMP. Feb 09 Document No.001-89614 Rev. *A ECN # 4536462 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate : LQ32 32- Quad Flat No Lead (QFN) 7470-LA Nitto UL-94 NA Oxygen Rating Index: NA Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Henkel Die Attach Material: AMK-06 Die Attach Method: Epoxy Bond Diagram Designation 001-48168 Wire Bond Method: Thermosonic Wire Material/Size: Au, 0.8mil Thermal Resistance Theta JA °C/W: 27°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-20659 Name/Location of Assembly (prime) facility: Amkor-Phil (Phil-M) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-89614 Rev. *A ECN # 4536462 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Temperature Cycle Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity MSL 3 Result P/F P 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C High Accelerated Saturation Test 130°C, 5.25V Precondition: JESD22 Moisture Sensitivity MSL 3 P 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C Pressure Cooker Test 121°C, 100%, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL 3 P 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C Acoustics Microscopy MSL 3 J-STD-020 P Ball Shear JESD22-B116A P Bond Pull MIL-STD-883 – Method 2011, P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Die Shear MIL-STD-883, Method 2019 P Dye Penetration test Test to determine the existence and extent of cracks, Criteria: No Package Crack P Electrostatic Discharge 500V Charge Device Model (ESD-CDM) JESD22-C101 P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V JESD22, Method A114-B P Final Visual JESD22-B101B P Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P Solderability J-STD-002, JESD22-B102 P 125C, -55C Thermal Shock P MIL-STD-883C, Method 1011, X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P Document No.001-89614 Rev. *A ECN # 4536462 Reliability Test Data QTP #: 083909 Device Fab Lot # Assy Lot # Assy Loc Duration Samp CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M COMP 15 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M COMP 15 0 CY8C204345 (8C204345AK) 5821013 610842517 PHIL-M COMP 15 0 CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M COMP 10 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M COMP 10 0 5821013 610842515 PHIL-M COMP 10 0 5821013 610842515 PHIL-M COMP 5 0 CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M COMP 15 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M COMP 15 0 STRESS: STRESS: STRESS: BALL SHEAR BOND PULL CONSTRUCTIONAL ANALYSIS CY8C204345 (8C204345AK) STRESS: STRESS: DIE SHEAR DYE PENETRANT TEST CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M COMP 15 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M COMP 15 0 CY8C204345 (8C204345AK) 5821013 610842517 PHIL-M COMP 15 0 PHIL-M COMP 9 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY8C204345 (8C204345AK) STRESS: Failure Mechanism ACOUSTIC, MSL3 CY8C204345 (8C204345AK) STRESS: Rej 5821013 610842515 ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 2,200V CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M COMP 8 0 CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M COMP 534 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M COMP 422 0 STRESS: FINAL VISUAL STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.25V, PRE COND 192 HR 30C/60%RH, MSL3 CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M 128 77 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M 128 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-89614 Rev. *A ECN # 4536462 Reliability Test Data QTP #: 083909 Device Fab Lot # Assy Lot # Assy Loc Duration Samp CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M COMP 5 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M COMP 5 0 CY8C204345 (8C204345AK) 5821013 610842517 PHIL-M COMP 5 0 STRESS: Rej Failure Mechanism INTERNAL VISUAL STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M 168 80 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M 168 80 0 STRESS: PHYSICAL DIMENSION CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M COMP 30 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M COMP 30 0 CY8C204345 (8C204345AK) 5821013 610842517 PHIL-M COMP 30 0 CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M COMP 5 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M COMP 5 0 CY8C204345 (8C204345AK) 5821013 610842517 PHIL-M COMP 5 0 STRESS: SOLDERABILITY STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M 500 80 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M 500 80 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M 1000 80 0 CY8C204345 (8C204345AK) 5821013 610842517 PHIL-M 500 80 0 CY8C204345 (8C204345AK) 5821013 610842517 PHIL-M 1000 80 0 STRESS: THERMAL SHOCK COND. B – 55C TO 125C CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M 200 80 0 CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M 1000 80 0 CY8C204345 (8C204345AK) 5821013 610842515 PHIL-M COMP 10 0 CY8C204345 (8C204345AK) 5821013 610842516 PHIL-M COMP 10 0 CY8C204345 (8C204345AK) 5821013 610842517 PHIL-M COMP 10 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-89614 Rev. *A ECN # 4536462 Document History Page Document Title: QTP#083909: 32QFN (5X5X0.6) NiPdAu-Ag, MSL3, 260C Reflow Amkor-Phil (Phil-M) Document Number: 001-89614 Rev. ECN Orig. of No. Change ** 4150761 HSTO *A 4536462 HSTO Description of Change Initial Spec Release. Initiate spec as per memo HGA-778. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7