0.9V Drive Nch MOSFET RYE002N05 z Structure Silicon N-channel MOSFET z Dimensions (Unit : mm) EMT3 (SC-75A) <SOT-416> zFeatures 1) High speed switing. 2) Small package(EMT3). 3) Ultra low voltage drive(0.9V drive). Abbreviated symbol : QJ z Application Switching z Packaging specifications Package Type Code Basic ordering unit (pieces) RYE002N05 z Inner circuit (3) Taping TCL 3000 { z Absolute maximum ratings (Ta = 25°C) Parameter Symbol Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Limits Unit 50 ±8 V V ±200 ±800 125 mA mA mA 800 150 mA mW Tch Tstg 150 −55 to +150 °C °C Symbol Limits Unit 833 °C / W Continuous VDSS VGSS ID Pulsed Continuous Pulsed IDP IS ISP *1 PD *2 Power dissipation Channel temperature Range of storage temperature *1 (1) Source (2) Gate (3) Drain (1) (2) (2) (1) ∗1 ESD PROTECTION DIODE ∗2 BODY DIODE *1 Pw≤10µs, Duty cycle≤1% *2 Each terminal mounted on a recommended land. z Thermal resistance Parameter Channel to Ambient Rth (ch-a)* * Each terminal mounted on a recommended land. www.rohm.com ©2011 ROHM Co., Ltd. All rights reserved. 1/5 2011.05 - Rev.B RYE002N05 Data Sheet z Electrical characteristics (Ta = 25°C) Parameter Symbol Gate-source leakage IGSS Drain-source breakdown voltage V (BR)DSS Min. Conditions Typ. Max. Unit - - ±10 µA VGS=±8V, VDS=0V 50 - - V ID=1mA, VGS=0V IDSS - - 1 µA VDS=50V, VGS=0V VGS (th) 0.3 - 0.8 V VDS=10V, ID=1mA - 1.6 2.2 - 1.7 2.4 - 2.0 2.8 - 2.2 3.3 ID=100mA, VGS=1.2V - 3.0 9.0 ID=10mA, VGS=0.9V l Yfs l* 0.2 - - Input capacitance Ciss - 26 - pF VDS=10V Output capacitance Coss - 6 - pF VGS=0V Reverse transfer capacitance Crss - 3 - pF f=1MHz Turn-on delay time td(on) * - 5 - ns ID=100mA, VDD 25V tr * - 8 - ns VGS=4.5V td(off) * tf * - 17 43 - ns ns RL=250Ω RG=10Ω Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance * RDS (on) Rise time Turn-off delay time Fall time ID=200mA, VGS=4.5V ID=200mA, VGS=2.5V Ω S ID=200mA, VGS=1.5V ID=200mA, VDS=10V *Pulsed zBody diode characteristics (Source-Drain) (Ta = 25°C) Parameter Forward Voltage Symbol VSD * Min. Typ. Max. - - 1.2 Unit V Conditions Is=200mA, VGS=0V *Pulsed www.rohm.com ©2011 ROHM Co., Ltd. All rights reserved. 2/5 2011.05 - Rev.B Data Sheet RYE002N05 z Electrical characteristic curves (Ta = 25°C) 0.2 1 0.1 DRAIN CURRENT : ID[A] VGS= 2.5V VGS= 1.5V VGS= 1.2V VGS= 0.9V Ta=25°C Pulsed VGS= 0.8V VGS= 4.5V VGS= 2.5V VGS= 1.5V VGS= 1.2V VGS= 0.9V 0.1 VGS= 0.8V 0.4 0.6 0.8 1 0 2 4 6 8 0 10 0.2 0.4 0.6 0.8 1 GATE-SOURCE VOLTAGE : VGS[V] Fig.1 Typical Output Characteristics( Ⅰ) Fig.2 Typical Output Characteristics( Ⅱ) Fig.3 Typical Transfer Characteristics Ta= 25°C Pulsed 1000 VGS= 0.9V VGS= 1.2V VGS= 1.5V VGS= 2.5V VGS= 4.5V 100 0.001 0.01 0.1 1 10000 VGS= 4.5V Pulsed 1000 Ta= 125°C Ta= 75°C Ta= 25°C Ta= − 25°C 100 0.001 DRAIN-CURRENT : ID[A] Ta= 125°C Ta= 75°C Ta= 25°C Ta= − 25°C 100 0.01 0.1 1 10 DRAIN-CURRENT : ID[A] Fig.7 Static Drain-Source On-State Resistance vs. Drain Current( Ⅳ) www.rohm.com ©2011 ROHM Co., Ltd. All rights reserved. 0.1 VGS= 2.5V Pulsed Ta= 125°C Ta= 75°C Ta= 25°C Ta= − 25°C 1000 100 1 0.001 10000 VGS= 1.2V Pulsed 1000 Ta= 125°C Ta= 75°C Ta= 25°C Ta= − 25°C 100 0.001 0.01 0.1 1 10 DRAIN-CURRENT : ID[A] Fig.8 Static Drain-Source On-State Resistance vs. Drain Current( Ⅴ) 3/5 0.01 0.1 1 10 DRAIN-CURRENT : ID[A] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current( Ⅱ) STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] VGS= 1.5V Pulsed 0.001 0.01 10000 DRAIN-CURRENT : ID[A] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current( Ⅰ) 1000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] DRAIN-SOURCE VOLTAGE : VDS[V] 10000 10000 0.01 DRAIN-SOURCE VOLTAGE : VDS[V] STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] 0.2 Ta= 125°C Ta= 75°C Ta= 25°C Ta= − 25°C 0.1 0.001 0 0 VDS= 10V Pulsed VGS= 0.7V VGS= 0.7V 0 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] Ta=25°C Pulsed Fig.6 Static Drain-Source On-State Resistance vs. Drain Current( Ⅲ) STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] DRAIN CURRENT : ID[A] VGS= 4.5V DRAIN CURRENT : ID[A] 0.2 10000 VGS= 0.9V Pulsed Ta= 125°C Ta= 75°C Ta= 25°C Ta= − 25°C 1000 100 0.001 0.01 0.1 1 10 DRAIN-CURRENT : ID[A] Fig.9 Static Drain-Source On-State Resistance vs. Drain Current( Ⅵ) 2011.05 - Rev.B Data Sheet 1 Ta= −25°C Ta=25°C Ta=75°C Ta=125°C 0.1 0.01 0.1 Ta= 125°C Ta= 75°C Ta= 25°C Ta= − 25°C 1 0 0.5 1 SOURCE-DRAIN VOLTAGE : VSD [V] Fig.10 Forward Transfer Admittance vs. Drain Current Fig.11 Reverse Drain Current vs. Sourse-Drain Voltage td(off) tf 100 Ta=25°C VDD=25V VGS=4.5V RG=10Ω Pulsed 10 td(on) tr 1 0.1 1 DRAIN-CURRENT : ID[A] Fig.13 Switching Characteristics www.rohm.com ©2011 ROHM Co., Ltd. All rights reserved. 5000 Ta=25°C Pulsed 4000 ID= 0.01A 3000 ID= 0.20A 2000 1000 0 1.5 DRAIN-CURRENT : ID[A] GATE-SOURCE VOLTAGE : VGS [V] SWITCHING TIME : t [ns] VGS=0V Pulsed 0.01 0.1 1000 0.01 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ] 1 VDS= 10V Pulsed 0 2 4 6 8 GATE-SOURCE VOLTAGE : VGS[V] Fig.12 Static Drain-Source On-State Resistance vs. Gate Source Voltage 1000 Ta=25°C f=1MHz VGS=0V 4 3 2 Ta=25°C VDD=25V ID= 0.2A RG=10Ω Pulsed 1 0 0 0.5 1 1.5 CAPACITANCE : C [pF] 10 SOURCE CURRENT : Is [A] FORWARD TRANSFER ADMITTANCE : |Yfs| [S] RYE002N05 100 Ciss 10 Crss Coss 1 0.01 0.1 1 10 100 TOTAL GATE CHARGE : Qg [nC] DRAIN-SOURCE VOLTAGE : VDS[V] Fig.14 Typical Capacitance vs. Drain-Source Voltage Fig.15 Typical Capacitance vs. Drain-Source Voltage 4/5 2011.05 - Rev.B RYE002N05 Data Sheet z Measurement circuits Pulse width VGS ID VDS RL 50% 10% D.U.T. RG 90% 50% 10% VGS VDS VDD 90% td(on) tr ton Fig.1-1 Switching time measurement circuit 10% 90% td(off) tf toff Fig.1-2 Switching waveforms z Notice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit. www.rohm.com ©2011 ROHM Co., Ltd. All rights reserved. 5/5 2011.05 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. 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