AEC-Q100G Qualification Summary 64ld LQFP Objective: Bolero 256k New Product Introduction Qualification Freescale PN: Part Name: Technology: Package: Fab / Assembly / Final Test Sites: Maskset#: Rev#: Die Size (in mm) WxLxT Part Operating Temp. Grade: Customer Name(s): PN(s): Design Engr: Phone #: Lead Product Engr: Phone #: Prod. Package Phone #: NPI PRQE: Phone #: MPC5602D Bolero 256k 0.09um CMOS90 Z3 core LQFP 64 10x10 x 1.4 Pitch 0.5 FSL-ATMC / FSL-TJN-FM FSL-TJN-FM M18Y 1 3.778 x 3.411 x 0.3302 (with scribe) 125°C Grade 1 Trace/DateCode Summary Revision # Date: General Market Akshay Pathak QUARTZ Tracking #: 1.4 13th October 2011 212211 (Signature/Date shown below may be electronic) PPE Approval Signature & Date: NPI PRQE Plan Approval Douglas Blackwood Signature & Date: 12th October 2011 Allan Scott J.M. Liu Douglas Blackwood DD86284 DD88771 DD88507 CTCTZW1119A CTCTZN1120A CTCTZW1120A CAB Approval 09191271M Signature & Date: Neil Ross 13th October 2011 TESTS HIGHLIGHTED IN YELLOW WERE PERFORMED FOR THIS STUDY This testing is performed by Freescale FSL-EKB, FSL-TJN and FSL-ATX where noted in the Comments GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS STRESS TEST PC HAST Reference J=JESD22 Test Conditions (Surface Mount Devices Only - PC required for THB, HAST, AC, UHST, TC, PC+PTC) End Point Requirements JESD22- Preconditioning : TEST @ RHC A113 MSL 3 @ 260°C, +5/-0°C J-STD-020 Pre and Post CSAM SS=11 units per lot per stress test JESD22- PC before HAST required for SMDs. TEST @ RH A110 Highly Accelerated Stress Test, Biased: HAST = 130°C/85%RH for 96 hrs. Bias = 5.5V PC before AC required for SMDs. Autoclave: AC = 121°C/100%RH/15 psig for 96 hrs Minimum Sample Size # of Lots Total Units Results LotID-(#Rej/SS) NA=Not Applicable All surface mount devices prior to THB, HAST, AC, Lot1: 0/231 UHST, TC, PC+PTC Lot2: 0/231 Lot3: 0/231 Comments Performed in TJN 77 3 231 Lot1: 0/77 Lot2: 0/77 Lot3: 0/77 Performed in TJN 77 3 231 Lot1: 0/77 Lot2: 0/77 Lot3: 0/77 Performed in TJN 77 3 231 Lot1: 0/77 Lot2: 0/77 Lot3: 0/77 Performed in TJN Minimum Sample Size # of Lots Total Units TEST @ RH 22 SMD only 0 0 Low power device, not required. 23 SMDs; 45 non- SMD 0 0 Low power device, not required. 77 0 0 AC JESD22A102 TEST @ R TC JESD22A104 AEC Q100Appendix 3 PC before TC required for SMDs TEST @ HC Temperature Cycle: WBP =/> 3 grams TC = -65°C to 150°C for 500 cycles. WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used. STRESS TEST Reference J=JESD22 PC + PTC JESD22A105 Test Conditions (Surface Mount Devices Only - PC required for THB, HAST, AC, UHST, TC, PC+PTC) For SMD devices only. Preconditioning plus Power Temperture Cycle: PTC JESD22A105 Power Temperature Cycle: PTC = ?°C to ?°C for 1000 cycles; Bias = ? TEST @ RH HTSL JESD22A103 High Temperature Storage Life: 150°C for 1008 hrs TEST @ RHC STRESS TEST Reference HTOL JESD22A108 End Point Requirements All Post 500TC wirepulls >3g Results LotID-(#Rej/SS) NA=Not Applicable Generic Data Lot1: 0/77 Comments Generic Data Quartz: 212020 Pictus 256k 64ld NPI Qualification. Performed in TJN TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS Test Conditions High Temperature Operating Life: Ta= 125°C for 1008, 2016hrs FIO End Point Requirements TEST @ RHC Minimum Sample Size # of Lots Total Units 77 0 0 AEC Q100- Early Life Failure Rate: 008 Ta = 125°C for 48 hrs; TEST @ RHC 800 0 0 10% of NVM cycling @125°C, as shown in EDR below, is required NVM in Checkerboard EDR AEC Q100- NVM Endurance, Data Retention, 005 C-Flash: 256k Array @ 125°C (2x16k, 3x32k, 1x128k) 100K W/E for 16k block size 10K W/E for 32k block size 1K W/E for 128k block size Lot1: 0/77 (1008hrs) Generic Data Lot2: 0/77 (3024hrs) Lot3: 0/77 (1008hrs) Lot4: 0/77 (1008hrs) NVM cycling @125°C, as shown in EDR below, is required NVM in Checkerboard ELFR Results LotID-(#Rej/SS) NA=Not applicable TEST @ RHC 77 0 0 Comments Lot1: Quartz: 212209 Bolero 256k HTOL performed on 100ld: Performed in TJN Generic Data: Lot2,3,4: Quartz: 212019 Pictus 256k 100ld NPI Qualification. Performed in TJN Lot1: 0/800 Lot1: Bolero 256k ELFR performed on 100ld: Performed in TJN Generic Data Lot2: 0/400 Lot3: 0/400 Lot4: 0/787 Lot5: 0/813 Generic Data: Lot2,3: Quartz: 212019 Pictus 256k 100ld NPI Qualification. Performed in EKB Lot4: Quartz: 212657 Bolero 1.5M 176ld Qualification. Performed in EKB Lot5: Quartz: 212658 Bolero 1.5M 144ld Qualification. Performed in EKB Lot1: 0/77 Lot1: Bolero 256k ELFR performed on 100ld: Performed in TJN Generic Data Lot1: 0/77 Lot2: 0/77 Lot3: 0/77 Generic Data: Lot1,2,3: Quartz: 212019 Pictus 256k 100ld NPI Qualification. Performed in EKB Lot1: 0/77 Lot1: Bolero 256k ELFR performed on 100ld: Performed in TJN Generic Data Lot1: 0/77 Lot2: 0/77 Lot3: 0/77 Generic Data: Lot1,2,3: Quartz: 212019 Pictus 256k 100ld NPI Qualification. Performed in EKB D-Flash: 64Kb Block @ 125°C 100K W/E for 16k block size NVM in Checkerboard 504, 1008hrs, 2016hrs FIO @ 150°C NVM Endurance, Data Retention, TEST @ RHC 77 C-Flash 0: 256k Array @ -40°C (2x16k, 3x32k, 1x128k) 100K W/E for 16k block size 10K W/E for 32k block size 1K W/E for 128k block size 0 0 D-Flash: 64Kb Block @ -40°C 100K W/E for 16k block size NVM in Checkerboard 504, 1008hrs, 2016hrs FIO @ 150°C FORMPPAP004XLS 1 of 3 Freescale Rev U Freescale PN: MPC5602D Part Name: Bolero 256k Customer Name(s): General Market PN(s): Summary Revision # Date: 1.4 13th October 2011 TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS STRESS TEST Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results LotID-(#Rej/SS) NA=Not applicable Comments WBS AEC Q100- Wire Bond shear 001 Cpk = or > 1.67 30 bonds from minimum 5 units 1 5 Lot1: Cpk= 4.19 Lot2: Cpk= 3.93 Lot3: Cpk= 2.39 Performed in TJN WBP MilStd883- Wire Bond Pull 2011 Cond. C or D Cpk = or > 1.67 30 bonds from minimum 5 units 1 5 Lot1: Cpk= 2.86 Lot2: Cpk= 3.70 Lot3: Cpk= 2.44 Performed in TJN Performed in TJN SD JESD22B102 Solderability; 8hr. Steam age (1 hr. for Au-plated leads) prior to test. If production burn-in is done, samples must also undergo burn-in. >95% lead coverage of critical areas 15 1 15 Lot1: 0/15 PD JESD22B100 Physical Dimensions PD per 98A drawing Cpk = or > 1.67 10 3 30 (w) Lot1: Cpk= 3.76 Lot2: Cpk= 4.82 Lot3: Cpk= 5.43 Cpk = or >1.67 10 (5 balls from a min. of 10 devices) 0 0 N/A, not required for SM devices. 5 (10 leads from each of 5 parts) 0 0 N/A, not required for SM devices. AEC-Q100- Solder Ball Shear; 010 Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, Micro Lead Frame (but NOT Flip Chip). Two 260°C reflow cycles before shear. SBS LI JESD22B105 STRESS TEST Reference Lead Integrity Not required for surface mount devices; Only required for through-hole devices. No lead breakage or cracks (l) 2.98 3.89 4.46 (h) 2.37 2.98 3.77 Performed in TJN TEST GROUP D - DIE FABRICATION RELIABILITY TESTS Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results LotID-(#Rej/SS) NA=Not applicable Comments Electro Migration Derivative Device on qualified Process. Report available on request The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. NBTI Negative Bias Temperature Instability Derivative Device on qualified Process. Report available on request The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. TDDB Time Dependent Dielectric Breakdown Derivative Device on qualified Process. Report available on request The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. HCI Hot Carrier Injection Derivative Device on qualified Process. Report available on request The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. SM Stress Migration Derivative Device on qualified Process. Report available on request The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies. EM FORMPPAP004XLS 2 of 3 Freescale Rev U Freescale PN: MPC5602D Part Name: Bolero 256k Customer Name(s): General Market PN(s): Summary Revision # Date: 1.4 13th October 2011 TEST GROUP E - ELECTRICAL VERIFICATION TESTS STRESS TEST Reference Test Conditions Freescale 48A End Point Requirements Minimum Sample Size # of Lots Total Units All All All Results LotID-(#Rej/SS) NA=Not applicable Lot1: DD86284 Lot2: DD88771 Lot3: DD88507 Comments Pre- and Post Functional / Parametrics Test software shall meet requirements of AECQ100-007. Testing performed to the limits of device specification in temperature and limit value. AEC-Q100- ElectroStatic Discharge/ ESD 002 Human Body Model Classification: (HBM) Test @ 500 / 1000 / 1500 / 2000Volts CLASSIFICATION See AEC-Q100-002 for classification levels. 0 Fails TEST @ RH 2KV min. 3 units per Voltage level 0 0 Lot1: 500V 0/3 1000V 0/3 1500V 0/3 2000V 0/3 Lot1: Quartz: 212209 Bolero 256k HBM ESD performed on 100ld: Performed in KLM AEC-Q100- ElectroStatic Discharge/ ESD 003 Machine Model Classification: (MM) Test @ 50 / 100 / 150 / 200Volts CLASSIFICATION See AEC-Q100-003 for classification levels. TEST @ RH 250V min. 3 units per Voltage level 0 0 Lot1: 50V 0/3 100V 0/3 150V 0/3 200V 0/3 Lot1: Quartz: 212209 Bolero 256k MM ESD performed on 100ld: Performed in KLM AEC-Q100- ElectroStatic Discharge/ ESD 011 Charged Device Model Classification: (CDM) Test @ 250 / 500 / 750 Volts CLASSIFICATION See AEC-Q100-011 for classification levels. JESD78 Latch-up: LU plus Test per JEDEC JESD78 with the AEC-Q100-004 AEC-Q100- requirements. 004 Ta= Operating Temperature Maximum TEST @ RH Corner pins =/> 750V; All other pins =/> 500V TEST @ RH 3 units per Voltage level 1 9 Performed in KLM 6 1 6 Lot1: 250V 0/3 500V 0/3 750V 0/3 Lot1: 0/6 30 0 0 Lot1: Pass Lot2: Pass Lot3: Pass Lot1,2,3: Bolero 256k ED performed on 100ld: Performed in ATX TEST ED AEC-Q100- Electrical Distribution 009, Freescale TEST @ RHC Cpk = or > 1.67 FG AEC-Q100- Fault Grading 007 AEC-Q003 Characterization: Performed on new technologies and part families. FG shall be = or > 98% for qual units AEC-Q100- Electro-Thermally Induced Gate Leakage; 006 155°C, 2.0 min, +400/-400 V TEST @ R CHAR GL SAE J1752/3 Radiated Emissions AEC Q100012 EMC SC SER JEDEC Unaccelerated: JESD89-1 or Accelerated: JESD89-2 & JESD89-3 STRESS TEST Reference Electromagnetic Compatibility <40dBuV (see AEC Q100 Appendix 5 for test applicability; 150kHz - 1GHz done on case-by-case basis per customer/Freescale agreement) Short Circuit Characterization Applicable to all smart power devices. This test and statistical evaluation (see section 4 of Q100012) shall be performed per agreement between user and supplier on a case-by-case basis. Soft Error Rate Applicable to devices with memory sizes 1Mbit SRAM or DRAM based cells. Either test option (unaccelerated or accelerated) can be performed, in accordance to the referenced specifications. This test and its accept criteria is performed per agreement between user and supplier on a case-bycase basis. Final test report shall include detailed test facility location and altitude data. Performed in KLM Y 99% Y Report Available Performed in EKB 6 1 6 Lot1: 0/6 Performed in KLM 1 0 0 Pass Lot1: Bolero 256k ED performed on 100ld: Performed in ATX 10 0 0 Not applicable to microcontroller 3 0 0 Not applicable to microcontroller with RAM < 1Mbit TEST GROUP F - DEFECT SCREENING TESTS Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results LotID-(#Rej/SS) NA=Not applicable PAT AEC Q001 Part Average Testing Has PAT been established for this part? implemented SBA AEC Q002 Statistical Bin Analysis Has SBYA been established for this part? implemented Generic Quartz 212209 212019 212020 212657 212658 Data: Device MPC5602P MPC5602P MPC6502P MPC6507B MPC6507B Mask 1M18Y 0M22Y 0M22Y 0M03Y 0M03Y Revision 1.0 1.1 1.2 1.3 1.4 FORMPPAP004XLS Title Bolero Pictus Pictus Bolero Boler0 256k 256k 256k 1.5M 1.5M 100ld 100ld 64ld 176ld 144ld NPI Qualification NPI Qualification NPI Qualification Qualifiaction Qualification Revision Date 29th April 2009 15th April 2011 6th June 2011 4th Oct 2011 13th Oct 2011 Fab FSL-ATMC FSL-ATMC FSL-ATMC FSL-ATMC FSL-ATMC Assembly FSL-KLM FSL-KLM FSL-TJN ASE-CL FSL-KLM Mould SUMITOMO EME-G700E SUMITOMO EME-G700E CEL9200HF10M HITACHI CEL-9240 SUMITOMO EME-G700E Description Original issue Updated Cycling Requirements Updated Qual locations Added results Added approvals Die Size 3.778x3.411x0.3302 3.737x3.564x0.3302 3.737x3.564x0.3302 5.082x5.301x0.33mm 5.082x5.301x0.33mm Comments CAB 09191268M 09201374M 09201375M 11161323M 11161323M Douglas Blackwood Douglas Blackwood Douglas Blackwood Douglas Blackwood Douglas Blackwood 3 of 3 Freescale Rev U