214265

AEC-Q100G Tier Qualification Results
Objective: S12G64_Grayling_TSMC18LL
Freescale PN: S12G64 Grayling
Part Name:
NPI Qualification
Customer Name(s): Name or "Varies"
PN(s): PB or "Varies"
Technology: Tech Code / ULL18 0.18um Tech
Package: Package Code / 64LQFP 10x10
Fab / Assembly /
Final Test Sites: ATMC / TJN / TJN
N75C
Maskset#: 0
Rev#:
Die Size (in mm)
W x L x T 2.666mm x 2.445mm w/o scribe
Part Operating
Temp. Grade:
Grade 1
Plan or Results: Refer to below
Revision # & Date:
Nie Daniel-R65798
Design Engr: +86-512-68056925
Tan Chen Tat-B34790
Product Engr: +6037872804
QUARTZ Tracking #: 214265
(Signature/Date shown below
may be electronic)
GAO Approval (for Lim Jasmine-B18239
DIM/BOM results) 19-Jan-12
Signature & Date:
Chew Kim Seong-B36347
NPI PRQE Approval Signature & Date: 19-Jan-12
GAO(Global Assembly Lim Jasmine-B18239
Aperation) Engr: 603 78734386
Chew Kim Seong-B36347
NPI PRQE: +60378732723
LOT A
LOT B
LOT C
8EME0065LL0 8EME0065S10 8EME00660P0
Trace/DateCode:
0
0
0
-40 °C to +125 °C
CAB Approval 10312375M
Signature & Date: 20-Feb-12
LOT D
LOT E
LOT F
8EME005YAN 8EME005YHS 8EME005YTE0
00
00
0
Customer Approval
Signature & Date: May be N/A
Example: TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY
This testing is performed by Freescale Reliability Lab (KLM) unless otherwise noted in the Comments.
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
Stress Test
Reference
JESD22A113
J-STD-020
PC
JESD22A101
A110
HAST
End Point
Requirements
Test Conditions
Minimum
Sample Size
TEST @ RH
Preconditioning (PC) :
PC required for SMDs only.
MSL 3 @ 260°C, +5/-0°C (or document otherwise
with justification)
# of Lots
Total Units
including
spares
All surface mount devices prior to THB, HAST,
AC, UHST, TC, PC+PTC and as required per
test conditions.
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Comments or Generic Data
pass
Generic Data:
Garfish 9S12G128, 64LQFP,
Q205780,
Lot A - 0/231
Lot B - 0/231
Lot C - 0/231
TEST @ RH
77
0
0
pass
Generic Data:
Garfish 9S12G128, 64LQFP,
Q205780
Lot A - 0/77
Lot B - 0/77
Lot C - 0/77
Highly Accelerated Stress Test (HAST):
PC before HAST (for SMDs only): Required
HAST = 130°C/85%RH for 96 hrs.
Bias = Max Vdd (or justify othrwise)
Timed RO of 48hrs. MAX
JESD22A102
A118
Autoclave (AC):
PC before AC (for SMDs only): Required
AC = 121°C/100%RH/15 psig for 96 hrs
Timed RO of 2-48hrs. MAX
TEST @ R
77
0
0
pass
Generic Data:
Garfish 9S12G128, 64LQFP,
Q205780
Lot A - 0/77
Lot B - 0/77
Lot C - 0/77
JESD22A104
AEC Q100Appendix 3
Temperature Cycle (TC):
PC before TC (for SMDs only): Required
TC = -65°C to 150°C for 500 cycles.
TEST @ H
For AEC: WBP =/> 3
grams
77
0
0
pass
Generic Data:
Garfish 9S12G128, 64LQFP,
Q205780
Lot A - 0/77
Lot B - 0/77
Lot C - 0/77
AC
For AEC only: WBP after TC on 5 devices from 1
lot; 2 bonds per corner and one mid-bond per side
on each device. Record which pins were used.
TC
Post TC Wirepull:
Lot A: >min 3g
Lot B: >min 3g
Lot C: >min 3g
JESD22A103
TEST @ RH
High Temperature Storage Life (HTSL):
150°C for 1008 hrs
77
0
0
pass
Generic Data:
Garfish 9S12G128, 64LQFP,
Q205780
Lot A - 0/77
Timed RO = 96hrs. MAX
HTSL
TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS
Stress Test
Reference
JESD22A108
Test Conditions
High Temperature Operating Life (HTOL):
AEC Ta = 125°C for 1008hrs
Bias = 2.2V core, 6V io
End Point
Requirements
Minimum
Sample Size
# of Lots
77
3
Total Units
including
spares
231
AEC: 800
1
800
TEST @ RHC
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Comments or Generic Data
Lot A: 0/77
Lot B: 0/77
Lot C: 0/77
Devices incorporating NVM shall receive 'NVM
endurance preconditioning'(W/E cycling). Test R,
H, C after W/E cycling.
Timed RO of 96hrs. MAX
HTOL
AEC Q100-008
Early Life Failure Rate (ELFR):
AEC Ta = 125°C for 48 hrs
Bias = 2.2V core, 6V io
TEST @ RH
Timed RO of 48 hrs MAX
ELFR
Lot A: 0/800
Generic Data:
Garfish 9S12G128, 100LQFP,
Q194820
Lot D: 0/800
Lot E: 0/800
Lot F: 0/800
Grouper 9S12G240, 100LQFP,
Q214122
Lot A: 0/800
FORMPPAP004XLS
1 of 3
Freescale Rev T
Freescale PN: S12G64 Grayling
Part Name:
AEC Q100-005
Customer Name(s): Name or "Varies"
PN(s): PB or "Varies"
TEST @ RHC
NVM Endurance + Data Retention:
Devices incorporating NVM shall receive 'NVM
endurance preconditioning'(W/E cycling). Test R,
H, C after W/E cycling.
DRB Temp = 150C for 168hrs
77
Plan or Results: Refer to below
Revision # & Date:
1
77
Lot A: 0/77
Generic Data:
Garfish 9S12G128, 100LQFP,
Q194820, 1008hrs
Lot A: 0/77
Lot B: 0/77
Lot C: 0/77
Timed RO of 96hrs. MAX
EDR
Grouper 9S12G240, 100LQFP,
Q214122, 168hrs
Lot A - 0/77
Lot B - 0/77
Lot C - 0/77
TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS
Stress Test
AEC Q100-001
Wire Bond shear (WBS)
Cpk = or > 1.67
30 bonds
from minimum
5 units
3
Total Units
including
spares
15
MilStd8832011
Wire Bond Pull (WBP):
Cond. C or D
Cpk = or > 1.67
30 bonds
from minimum
5 units
3
15
Lot D - Cpk >1.67
Lot E - Cpk >1.67
Lot F - Cpk >1.67
Performed by Assembly Site
during qual lot builds - PE to
include this requirement in the
qual lot build ERF
JESD22B102
Solderability (SD):
8hr.(1 hr. for Au-plated leads) Steam age prior to
test.
If production burn-in is done, samples must also
undergo burn-in prior to SD.
>95% lead coverage
of critical areas
15
3
45
Lot D - pass
Lot E - pass
Lot F - pass
Generic data is acceptable
JESD22B100
Physical Dimensions(PD):
PD per FSL 98A drawing
Cpk = or > 1.67
10
3
30
Lot D - Cpk > 1.67
Lot E - Cpk > 1.67
Lot F - Cpk > 1.67
Performed by Assembly Site
during qual lot builds - PE to
include the PD requirement in the
qual lot build ERF
Reference
End Point
Requirements
Test Conditions
WBS
WBP
SD
Minimum
Sample Size
# of Lots
PD
AEC-Q100-010
SBS
LI
JESD22B105
Comments or Generic Data
Performed by Assembly Site
during qual lot builds - PE to
include this requirement in the
qual lot build ERF
DIM:
BOM:
Dimensional (DIM):
GAO to verify PD results against valid 98A
drawing.
BOM Verification (BOM):
GAO to verify qual lot ERF BOM is accurate.
DIM
&
BOM
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Lot D - Cpk >1.67
Lot E - Cpk >1.67
Lot F - Cpk >1.67
Solder Ball Shear (SBS):
Performed on all solder ball mounted packages
e.g. PBGA, Chip Scale, Micro Lead Frame (but
NOT Flip Chip).
Two reflow cycles at MSL reflow temperature
before shear.
Cpk = or >1.67
10
(5 balls from a
min. of 10
devices)
0
0
Lead Integrity (LI):
Not required for surface mount devices;
Only required for through-hole devices.
No lead breakage or
cracks
5
(10 leads from
each of 5
parts)
0
0
For solder ball mounted packages
only; NOT for Flip Chips.
TEST GROUP D - DIE FABRICATION RELIABILITY TESTS
Stress Test
Reference
End Point
Requirements
Test Conditions
Minimum
Sample Size
# of Lots
Total Units
including
spares
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Comments
Electro Migration (EM)
The data, test method,
calculations and internal criteria
should be available to the
customer upon request for new
technologies.
Time Dependent Dielectric Breakdown (TDDB)
The data, test method,
calculations and internal criteria
should be available to the
customer upon request for new
technologies.
Hot Carrier Injection (HCI)
The data, test method,
calculations and internal criteria
should be available to the
customer upon request for new
technologies.
Stress Migration (SM)
The data, test method,
calculations and internal criteria
should be available to the
customer upon request for new
technologies.
Negative Bias Temperature Instability (NBTI)
The data, test method,
calculations and internal criteria
should be available to the
customer upon request for new
technologies.
EM
TDDB
HCI
SM
NBTI
TEST GROUP E - ELECTRICAL VERIFICATION TESTS
Stress Test
Reference
Test Conditions
Freescale 48A
Pre- and Post Functional / Parametrics (TEST):
For AEC, test software shall meet requirements of
AEC-Q100-007.
Testing performed to the limits of device
specification in temperature and limit value.
TEST
HBM
MM
FORMPPAP004XLS
End Point
Requirements
Minimum
Sample Size
# of Lots
0 Fails
All
All
Total Units
including
spares
All
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
See Results Summary
AEC-Q100-002 / ElectroStatic Discharge/
JESD22-A114E Human Body Model Classification (HBM):
Jan 2007
Test @ 500/1000/1500/2000 Volts
For AEC, see AEC-Q100-002 for classification
levels.
TEST @ RH
2KV min.
3 units per
Voltage level
1
12
Lot A:
500V: (0/3)
1000V: (0/3)
1500V: (0/3)
2000V: (0/3)
AEC-Q100-003
or JESD22
TEST @ RH
200V min.
3 units per
Voltage level
1
12
Lot A:
50V: (0/3)
100V: (0/3)
150V: (0/3)
200V: (0/3)
ElectroStatic Discharge/
Machine Model Classification m(MM):
Test @ 50/100/150/200 Volts
For AEC, see AEC-Q100-003 for classification
levels.
2 of 3
Comments or Generic Data
This action refers to Final Testing
of all qualification units.
Freescale Rev T
Freescale PN: S12G64 Grayling
Part Name:
AEC-Q100-011
CDM
LU
JESD78
plus
AEC-Q100004 for AEC
Customer Name(s): Name or "Varies"
PN(s): PB or "Varies"
ElectroStatic Discharge/
Charged Device Model Classification (CDM):
Test @ 250/500/750 Volts
For AEC, see AEC-Q100-011 for classification
levels.
Timed RO of 96hrs MAX.
TEST @ RH
All pins =/> 500V
For AEC, Corner pins
=/> 750V;
3 units per
Voltage level
1
9
Lot A:
250V: (0/3)
500V: (0/3)
750V: (0/3) Corner pins
6
1
6
Lot A: 0/6
AEC: 30
3
90
pass
Cpk >1.67
TEST @ RH
Latch-up (LU):
Test per JEDEC JESD78 with the AEC-Q100-004
requirements for AEC.
Ta= Maximum operating temperature
Vsupply = Maximum operating voltage
AEC-Q100-009, Electrical Distribution (ED)
Freescale 48A
spec
TEST @ RHC
For AEC, AECQ100-007
Fault Grading (FG)
FG shall be = or >
90% for qual units
For AEC, AECQ003
Characterization (CHAR):
Ony performed on new technologies and part
families per AEC Q003.
For AEC, AECQ100-006
Electro-Thermally Induced Gate Leakage (GL): TEST @ R
155°C, 2.0 min, +400/-400 V
Per AEC Q100 Rev G, this test is performed for
information only.
Timed RO of 96 hrs MAX.
For all failures, perform unbiased bake
(4hrs/125°C, or 2hrs/150°C) and retest; recovered
units are GL failures.
SAE J1752/3 Radiated
Emissions
Electromagnetic Compatibility (EMC)
(see AEC Q100 Appendix 5 for test applicability;
done on case-by-case basis per
customer/Freescale agreement)
<40dBuV
150KHz - 1GHz
Mask Set
Product-Qual Description / Part Number(s)
Grayling S12G64
Die Size/Fab/Polymide
2.608x2.608mm/ ATMC/
S200
Mask Set
Product-Qual Description / Part Number(s)
Grouper, S12G240
Plan or Results: Refer to below
Revision # & Date:
For AEC,
Cpk target > 1.67
ED
FG%> 95%w/Iddq
FG
CHAR
GL (for
information only)
EMC
6
1
6
Lot A: 0/6
1
1
1
Completed
Production Test requirement:
98% w/o Iddq
95% w/Iddq
100% TYPE2 faults detection
BOM Information:
Quartz #
214265
N75C
Die attach
CRM-1064MB
Mold Compound Wire Size
CEL 9200HF10M 20 um
Leadframe
17ASS23232W601 - 3.81 x 3.81mm Solid Pad
Die Size/ Fab/ Polymide
Die Attach
Mold Compound
3.85x3.21mm / ATMC/
S200
2.75 x 2.73mm/ ATMC/
S200/ E018AFX5
CRM-1064MB
CEL 9200HF10M 20um
5.1 x 5.1mm, Solid-flag
CRM-1064MB
CEL 9200HF10M 20um
Cu 3.81 x 3.81 solid-flag
Generic Data List:
Quartz #
214122
N95B
205780
N51A
Revision
Rev O
Rev 1.0
Rev 1.1
Rev 1.2
Rev 1.3
Rev 1.4
FORMPPAP004XLS
Garfish, S12G128
Date
27-Jul-10
25-May-11
8-Aug-11
15-Jan-12
17-Apr-12
11-Nov-12
Wire Size
Comments
Initial Qual plan
Update qual plan sample size after generic data available
Updated EMC stress and result.
Qualification result summary
HTOL re-run result update
Removed ATD failure from HTOL after lot with 6.9V MIM test completed without failure.
3 of 3
Leadframe
Author
Miza Ismail
Chew Kim Seong
Chew Kim Seong
Chew Kim Seong
Chew Kim Seong
Chew Kim Seong
Freescale Rev T