214052

AEC-Q100G Tier Qual Results
Objective: MPC5645C_BOLERO3M
Freescale PN: MPC5645C
Part Name: Bolero3M
Automotive NPI Qualification
Customer Name(s): Various
PN(s): Various
Technology: H009FXX6 / C09NVM
Package: 8268 / 208LQFP 28x28x1.4
Fab / Assembly /
Final Test Sites: ATMC / ASECL / KLM
Pathak Akshay-B00221
Design Engr: +91 120 3952282
1
QUARTZ Tracking #: 214052
Product Engr: E.A.H. Enazlinda-R63711/ Nazri Hafeez-B32792
Maskset#: N32E
Rev#: 0
Die Size (in mm) 6.699 x 6.536 x 0.011
W xLxT
Part Operating
Temp. Grade:
Plan or Results:
Revision # & Date: Refer below for details
(Signature/Date shown below may be electronic)
PPE Approval (for
DIM/BOM results) Jasmine Lim-B18239
Signature & Date: 10 Sept 2012
Nurazah Ahmad- R63712
NPI PRQE Approval Signature & Date: 10 Sept 2012
Jasmine Lim-B18239
Prod. Package Engr: 603 78734386
Miza Ismail/ Nurazah Ahmad-R63712
NPI PRQE: 603 78732723
- 40°C to + 125°C
Trace/DateCode:
LOT A
DD93615.81H
XXA1133
LOT B
DD94168_1R_4
XXA1135
LOT C
DD93873_1K_7
XXA1136
CAB Approval 09332293M
Signature & Date: 10 Sept 2012
Customer Approval
Signature & Date: Not Applicable
Example: TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY
Example: This preliminary qual plan is provided for planning purposes only and may be modified until Freescale CAB and customer approved.
This testing is performed by Freescale Reliability Lab KLM unless otherwise noted in the Comments.
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
Stress Test
Reference
JESD22A113
J-STD-020
AC
TC
End Point Requirements
Minimum Sample Size
# of Lots
Total Units
including
spares
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Preconditioning (PC) :
PC required for SMDs only.
MSL 3 @ 260°C, +5/-0°C (or document otherwise with
justification)
TEST @ RHC
JESD22A101
A110
Highly Accelerated Stress Test (HAST):
PC before HAST (for SMDs only): Required
HAST = 130°C/85%RH for 96 hrs.
Bias = 5.5V for Vdd1 and 1.2 for Vdd2
Timed RO of 48hrs. MAX
TEST @ RH
77
3
231
Lot A: 0/77
Lot B: 0/77
Lot C: 0/77
JESD22A102
A118
Autoclave (AC):
PC before AC (for SMDs only): Required
AC = 121°C/100%RH/15 psig for 96 hrs
Timed RO of 2-48hrs. MAX
TEST @ R
77
3
231
Lot A: 0/77
Lot B: 0/77
Lot C: 0/77
Temperature Cycle (TC):
PC before TC (for SMDs only): Required
TC = -65°C to 150°C for 500 cycles.
For AEC only: WBP after TC on 5 devices from 1 lot; 2 bonds
per corner and one mid-bond per side on each device. Record
which pins were used.
TEST @ RHC
For AEC: WBP =/> 3 grams
77
3
231
Lot A: 0/77
Lot B: 0/77
Lot C: 0/77
High Temperature Storage Life (HTSL):
150°C for 1008 hrs
(Devices incorporating NVM shall receive 'NVM endurance
preconditioning'(EDR) prior to this test, and special NVM test
sequencing after this test; see AEC-Q100 for details)
Timed RO = 96hrs. MAX
TEST @ RHC
PC
HAST
Test Conditions
JESD22A104
AEC Q100Appendix 3
JESD22A103
HTSL
Comments or Generic Data
All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and
as required per test conditions.
Wire pull min.> 3grams
77
1
77
See EDR
TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS
Stress Test
Reference
JESD22A108
Test Conditions
High Temperature Operating Life (HTOL):
AEC Ta = 125°C for 168hrs, 1008hrs
Bias = Vdd I/O= 5.0V nom : 6.0V Stress
Vdd core = 1.2V nom : 1.56 V Stress
End Point Requirements
TEST @ RHC
Minimum Sample Size
# of Lots
77
1
Devices incorporating NVM shall receive 'NVM endurance
preconditioning'(W/E cycling). Test R, H, C after W/E cycling.
Timed RO of 96hrs. MAX
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Lot A: 0/77
Comments or Generic Data
Generic Data:
Q173479 Bolero 1.5M/MPC5607B (0M03Y) : 0/77
Q204538 Bolero 1.5M/MPC5607B (1M03Y) : 0/77
Q168181 Pictus 512k MPC5604P 0M36W 0/77(1008hrs)
Q206081 Pictus 512k MPC5604P 1M26V 0/154 (1008hrs)
0 231 Bolero1.5M MPC5607B 0M03Y (1008hrs)
Q213012- Bolero 1.5 (1M03Y): 0/154
Q199981- Pictus (1M26V): 0/77
HTOL
FORMPPAP004XLS
Total Units
including
spares
77
1 of 5
Freescale Rev T
Freescale PN: MPC5645C
Part Name: Bolero3M
Customer Name(s): Various
PN(s): Various
AEC Q100-008 Early Life Failure Rate (ELFR):
AEC Ta = 125°C for 48 hrs
TEST @ RHC
Plan or Results:
Revision # & Date: Refer below for details
800
1
800
Lot A: 0/800
Q163078 Bolero 512k/ MPC5604B 144ld 0M27V: 0/1600
Q175437 Bolero 1.5M/MPC5607B 144ld 0M03Y: 0/800
Q159917 Pictus 512k/ PPC5604 100ld 0M26V: 0/685
Bias = Vdd I/O= 5.0V nom : 6.0V Stress
Vdd core = 1.2V nom : 1.56V Stress
ELFR
Generic Data:
Devices incorporating NVM shall receive 'NVM endurance
preconditioning'(W/E cycling). Test R, H, C after W/E cycling.
Timed RO of 48 hrs MAX
AEC Q100-005 NVM Endurance at Hot, Data Retention, and Operational Life TEST @ RHC
(EDR):
Write Erase cycling perfrom at 125C
77
1
77
Lot A: 0/77
Generic Data:
Q175437 Bolero 1.5M/MPC5607B (0M03Y) : 0/231
Q168181 Pictus 512k MPC5604P 0M36W 0/231
DRB @ 150 for 168 hrs
Devices incorporating NVM shall receive 'NVM endurance
preconditioning'(W/E cycling). Test R, H, C after W/E cycling.
Timed RO of 96hrs. MAX
EDR
FORMPPAP004XLS
2 of 5
Freescale Rev T
Freescale PN: MPC5645C
Part Name: Bolero3M
Customer Name(s): Various
PN(s): Various
Plan or Results:
Revision # & Date: Refer below for details
TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS
Stress Test
Reference
Test Conditions
AEC Q100-001 Wire Bond shear (WBS)
Minimum Sample Size
# of Lots
Cpk = or > 1.67
30 bonds
from minimum 5 units
3
Total Units
including
spares
15
Cpk = or > 1.67
30 bonds
from minimum 5 units
3
15
Lot A: Cpk> 1.67
Lot B: Cpk> 1.67
Lot C: Cpk> 1.67
End Point Requirements
WBS
WBP
MilStd8832011
JESD22B102
>95% lead coverage of critical
Solderability (SD):
areas
8hr.(1 hr. for Au-plated leads) Steam age prior to test.
If production burn-in is done, samples must also undergo burn-in
prior to SD.
15
3
45
Lot A: Pass
Lot B: Pass
Lot C: Pass
JESD22B100
Physical Dimensions(PD):
PD per FSL 98A drawing
30
3
90
Lot A: Cpk> 1.67
Lot B: Cpk> 1.67
Lot C: Cpk> 1.67
SD
PD
LI
Cpk = or > 1.67
Dimensional (DIM):
PPE to verify PD results against valid 98A drawing.
BOM Verification (BOM):
PPE to verify qual lot ERF BOM is accurate.
DIM
&
BOM
SBS
Wire Bond Pull (WBP):
Cond. C or D
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Lot A: Cpk> 1.67
Lot B: Cpk> 1.67
Lot C: Cpk> 1.67
DIM: Pass
BOM: Pass
AEC-Q100-010 Solder Ball Shear (SBS):
Cpk = or >1.67
Performed on all solder ball mounted packages e.g. PBGA, Chip
Scale, Micro Lead Frame (but NOT Flip Chip).
Two reflow cycles at MSL reflow temperature before shear.
JESD22B105
Lead Integrity (LI):
Not required for surface mount devices;
Only required for through-hole devices.
Comments or Generic Data
No lead breakage or cracks
10
(5 balls from a min. of 10
devices)
0
0
5
(10 leads from each of 5
parts)
0
0
For solder ball mounted packages only; NOT for Flip Chips.
TEST GROUP D - DIE FABRICATION RELIABILITY TESTS
Stress Test
Reference
Test Conditions
End Point Requirements
Minimum Sample Size
# of Lots
Total Units
including
spares
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
Comments
Electro Migration (EM)
The data, test method, calculations and internal criteria should be
available to the customer upon request for new technologies.
Time Dependent Dielectric Breakdown (TDDB)
The data, test method, calculations and internal criteria should be
available to the customer upon request for new technologies.
Hot Carrier Injection (HCI)
The data, test method, calculations and internal criteria should be
available to the customer upon request for new technologies.
Stress Migration (SM)
The data, test method, calculations and internal criteria should be
available to the customer upon request for new technologies.
EM
TDDB
HCI
SM
Negative Bias Temperature Instability (NBTI)
NBTI
FORMPPAP004XLS
Complete :
1. Pattern Determination
2. NBTI Shift Characterisation
1 lot
1. Pattern Definition :
Method A : 30 units per
split
Method B : 70 units (HTOL
1yr) + 25 ctrl
Method C : see CZ
Pending for approval from ATX PRQE Generic Data:
Q169563: 0/77 Bolero1.5M 176ld 0M03Y
Q169368: 0/77 Bolero1.5M 176ld 0M03Y
Q169999: 0/77 Bolero1.5M 176ld 0M03Y
2. NBTI CZ :
Method A : 120 units (90
HTOL + 30 ctrl)
Method B : 315 units (240
HTOL + 75 ctrl- refer to
HTOL set )
Method C : 280 units (210
HTOL + 70 ctrl)
3 of 5
Freescale Rev T
Freescale PN: MPC5645C
Part Name: Bolero3M
Customer Name(s): Various
PN(s): Various
Plan or Results:
Revision # & Date: Refer below for details
TEST GROUP E - ELECTRICAL VERIFICATION TESTS
Stress Test
Reference
Freescale 48A
TEST
Test Conditions
End Point Requirements
Minimum Sample Size
# of Lots
0 Fails
All
All
Total Units
including
spares
All
Pre- and Post Functional / Parametrics (TEST):
For AEC, test software shall meet requirements of AEC-Q100007.
Testing performed to the limits of device specification in
temperature and limit value.
Results
Lot ID-(#Rej/SS)
NA=Not Applicable
See Results Summary
Comments or Generic Data
This action refers to Final Testing of all qualification units.
TEST @ RH
2KV min.
3 units per Voltage level
1
12
HBM
AEC-Q100-002 / ElectroStatic Discharge/
JESD22-A114E Human Body Model Classification (HBM):
Jan 2007
Test @ 500/1000/1500/2000Volts
For AEC, see AEC-Q100-002 for classification levels.
Lot A:
500V: 0/3
1000V: 0/3
1500V: 0/3
2000V:0/3
TEST @ RH
200V min.
3 units per Voltage level
1
9
MM
AEC-Q100-003 ElectroStatic Discharge/
or JESD22
Machine Model Classification m(MM):
Test @ 50/100/200Volts
For AEC, see AEC-Q100-003 for classification levels.
Lot A:
50V: 0/3
100V: 0/3
200V: 0/3
AEC-Q100-011 ElectroStatic Discharge/
Charged Device Model Classification (CDM):
Test @ 250/500/750cp Volts
For AEC, see AEC-Q100-011 for classification levels.
Timed RO of 96hrs MAX.
TEST @ RH
All pins =/> 500V
For AEC, Corner pins =/> 750V;
3 units per Voltage level
1
9
Lot A:
250V: 0/3
500V: 0/3
750V: 0/3
6
1
6
Lot: 0/6
30
1
30
Lot A: Cpk > 1.67
Generic Data:
Q173479 Bolero 1.5M/MPC5607B (0M03Y), Cpk>1.67
Q204538 Bolero 1.5M/MPC5607B (1M03Y) : Cpk>1.67
Q168181 Pictus 512k MPC5604P 0M36W Cpk>1.67
Q206081 Pictus 512k MPC5604P 1M26V Cpk>1.67
Q213012- Bolero 1.5 (1M03Y) Cpk>1.67
Q199981- Pictus (1M26V) Cpk>1.67
FG%= 95%
Production Test requirement:
98% w/o Iddq
95% w/Iddq
100% TYPE2 faults detection
CDM
LU
JESD78
plus
AEC-Q100004 for AEC
Latch-up (LU):
TEST @ RH
Test per JEDEC JESD78 with the AEC-Q100-004 requirements
for AEC.
Ta= Maximum operating temperature
Vsupply = Maximum operating voltage
AEC-Q100-009, Electrical Distribution (ED)
Freescale 48A
spec
TEST @ RHC
For AEC, AEC- Fault Grading (FG)
Q100-007
FG shall be = or > 90% for qual
units
For AEC,
Cpk target > 1.67
ED
FG
CHAR
For AEC, AEC- Characterization (CHAR):
Q003
Ony performed on new technologies and part families per AEC
Q003.
For AEC, AEC- Electro-Thermally Induced Gate Leakage (GL):
TEST @ R
Q100-006
155°C, 2.0 min, +400/-400 V
Per AEC Q100 Rev G, this test is performed for information only.
Timed RO of 96 hrs MAX.
GL (for
For all failures, perform unbiased bake (4hrs/125°C, or
information only)
2hrs/150°C) and retest; recovered units are GL failures.
EMC
SAE J1752/3 Radiated
Emissions
Electromagnetic Compatibility (EMC)
(see AEC Q100 Appendix 5 for test applicability; done on caseby-case basis per customer/Freescale agreement)
AEC Q100-012 Short Circuit Characterization (SC)
Required for smart power devices
6
1
6
Lot A: 0/6
<40dBuV
150KHz - 1GHz
1
1
1
Pass
TEST @
10
0
0
3
0
0
Result available upon request.
SC
SER
FORMPPAP004XLS
Jedec 89-1 or
Accelerated
Jedec 89-2/3.
Soft Error Rate (SER)
Required for devices with >1Mbit SRAM or DRAM memory
sizes. Unaccelerated or accelerated data may be provided.
4 of 5
not required. SRAM < 1<bit
Freescale Rev T
Freescale PN: MPC5645C
Part Name: Bolero3M
Plan or Results:
Revision # & Date: Refer below for details
Die Generic Data
Quartz
Device number
Qualification Title
Moo Number
Die Size (WXLXT) mm
Wafer Fab
Mold Compound
CAB number
173479
MPC5607B
Bolero 1.5M NPI Qualification
0M03Y
5.082 x 5.301 x 0.3302
ATMC
MPC5607B
Bolero 1.5M NPI Qualification
1M03Y
5.082 x 5.301 x 0.3302
ATMC
163078
PC5604B
0M27V Bolero 512k 144ld NPI Qual
0M27V
4.261 x 4.471 x 0.33
ATMC
163099
PC5604B
1M27V Bolero 512k 144ld NPI Qual
1M27V
4.261 x 4.471 x 0.33
ATMC
159917
PC5604P
0M26V Pictus 512k 100ld NPI Qual
0M26V
4.351 x 4.062 x 0.33
ATMC
166258
PC5604B
1M27V Bolero 512k 100ld NPI Qual
1M27V
4.261 x 4.471 x 0.33
ATMC
213012
MPC5607B
Bolero 1.5M low DT Qualification
1M03Y
5.082 x 5.301 x 0.3302
ATMC
199981
PC5604P
Pictus Low DT Qualification
1M26V
4.351 x 4.062 x 0.33
ATMC
SUMITOMO EMEG700E
SUMITOMO EMEG700E
SUMITOMO EMEG700E
SUMITOMO EMEG700E
SUMITOMO EMEG700E
SUMITOMO EMEG700E
SUMITOMO EMEG700E
SUMITOMO EMEG700E
09412905M
204538
Date
22-Mar-12
20-Dec-12
Comments
Final Qualification report
Edit Technology Code and description and complete HTOL 1008hrs readpoint
Reference
Revision
Rev 8
Rev 1
FORMPPAP004XLS
Customer Name(s): Various
PN(s): Various
5 of 5
10383042M
08462238M
08462238M
08462222M
08462239M
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Author
Nurazah Ahmad
Nurazah Ahmad
Freescale Rev T