Document No. 002-09995 Rev. ** ECN #: 5019830 Cypress Semiconductor Package Qualification Report QTP# 153701 VERSION ** November, 2015 24-FBGA Package SAC 305, CuPd MSL3, 260C Reflow BKK / Thailand FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Becky Thomas Reliability Engineer Reviewed By: Lorena Zapanta Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 002-09995 Rev. ** ECN #: 5019830 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 153701 New Package Qualification of the 24 FBGA Package assembled at BKK, Thailand, using 0.8mil CuPd bond wire, KMC-3580LVA mold compound, CRM-1577DB die attach, with SAC 305 leadfinish, at MSL3 and 260C reflow temperature, with 1M nvSRAM, using S8 technology from CMI Fab4 Nov 2015 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No. 002-09995 Rev. ** ECN #: 5019830 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: BK24A Mold Compound Flammability Rating: 24 FBGA KMC-3580LVA / Shinetsu UL-94 V-0 Mold Compound Alpha Emission Rate: <0.1 Oxygen Rating Index: >28% 40% Substrate Material: DS7409HGB Core and AUS320 solder resist Lead Finish, Composition / Thickness: SAC 305 Die Backside Preparation Method: Backgrind Die Separation Method: Saw Die Attach Supplier: Sumitomo Die Attach Material: CRM-1577DB Bond Diagram Designation 001-98371 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8 mil Thermal Resistance Theta JA C/W: 32 C/W Package Cross Section Yes/No: No Assembly Process Flow: F02-001.6 Name/Location of Assembly (prime) facility: BKK / Thailand MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: ClassTest & Finish: CML, Philippines Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No. 002-09995 Rev. ** ECN #: 5019830 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Acoustic Microscopy Ball Shear Bond Pull Constructional Analysis Die Shear Test Condition (Temp/Bias) JEDEC STD 22-A110: 110C, 85%RH, 3.6V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-A102: 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-A103: 150 C, no bias Result P/F P P P P J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-B116A Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package P MIL-STD-883, Method 2019 P P P P Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P BGA Solder Ball Shear Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack JESD22-B117B Cpk : 1.33, Ppk : 1.66 MIL-STD-883-2014 Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P X-Ray MIL-STD-883 - 2012 P Dye Penetrant Test Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P Document No. 002-09995 Rev. ** ECN #: 5019830 Reliability Test Data QTP #: 153701 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH ACCELERATED SATURATION TEST (HAST), 110C, 85%RH, 3.60V, with MSL3 Preconditioning CY14V101QS-BK108XQES 4523443 611528520 BKK-S 264 25 0 CY14V101QS-BK108XQES 4523443 611528521 BKK-S 264 25 0 CY14V101QS-BK108XQES 4523443 611528522 BKK-S 264 25 0 STRESS: PRESSURE COOKER TEST, at 121 C, 100%RH, 15 PSIG, with MSL3 Preconditioning CY14V101QS-BK108XQES 4523443 611528520 BKK-S 168 80 0 CY14V101QS-BK108XQES 4523443 611528520 BKK-S 288 80 0 STRESS: TEMPERATURE CYCLE TEST, Condition C, -65 C to 150 C, with MSL3 Preconditioning CY14V101QS-BK108XQES 4523443 611528520 BKK-S 500 80 0 CY14V101QS-BK108XQES 4523443 611528520 BKK-S 1000 80 0 CY14V101QS-BK108XQES 4523443 611528521 BKK-S 500 80 0 CY14V101QS-BK108XQES 4523443 611528521 BKK-S 1000 80 0 CY14V101QS-BK108XQES 4523443 611528522 BKK-S 500 80 0 CY14V101QS-BK108XQES 4523443 611528522 BKK-S 1000 80 0 STRESS: HIGH TEMPERATURE STORAGE, 150 C CY14V101QS-BK108XQES 4523443 611525644 BKK-S 500 78 0 CY14V101QS-BK108XQES 4523443 611525644 BKK-S 1000 78 0 STRESS: ACOUSTIC MICROSCOPY / before and after MSL3 Preconditioning CY14V101QS-BK108XQES 4523443 611528520 BKK-S COMP 15 0 CY14V101QS-BK108XQES 4523443 611528521 BKK-S COMP 15 0 CY14V101QS-BK108XQES 4523443 611528522 BKK-S COMP 15 0 611528520 BKK-S COMP 30 0 STRESS: BALL SHEAR CY14V101QS-BK108XQES 4523443 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No. 002-09995 Rev. ** ECN #: 5019830 Reliability Test Data QTP #: 153701 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: BOND PULL CY14V101QS-BK108XQES 4523443 611528520 BKK-S COMP 30 0 611528520 BKK-S COMP 10 0 UTL - UT COMP 10 0 STRESS: CONSTRUCTIONAL ANALYSIS CY14V101QS-BK108XQES 4523443 STRESS: DIE SHEAR CY14B101Q3A-SFXI 4429594 611515683 STRESS: DIE PENETRATION TEST CY14V101QS-BK108XQES 4523443 611528520 BKK-S COMP 15 0 CY14V101QS-BK108XQES 4523443 611528521 BKK-S COMP 15 0 CY14V101QS-BK108XQES 4523443 611528522 BKK-S COMP 15 0 CY14V101QS-BK108XQES 4523443 611528520 BKK-S COMP 25 0 CY14V101QS-BK108XQES 4523443 611528521 BKK-S COMP 25 0 CY14V101QS-BK108XQES 4523443 611528522 BKK-S COMP 25 0 611528520 BKK-S COMP 5 0 CY14V101QS-BK108XQES 4523443 611528520 BKK-S COMP 648 0 CY14V101QS-BK108XQES 4523443 611528521 BKK-S COMP 646 0 CY14V101QS-BK108XQES 4523443 611528522 BKK-S COMP 653 0 611528520 BKK-S COMP 30 0 STRESS: BGA SOLDER BALL SHEAR STRESS: INTERNAL VISUAL CY14V101QS-BK108XQES 4523443 STRESS: FINAL VISUAL INSPECTION STRESS: PHYSICAL DIMENSION CY14V101QS-BK108XQES 4523443 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No. 002-09995 Rev. ** ECN #: 5019830 Reliability Test Data QTP #: 153701 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: X-RAY CY14V101QS-BK108XQES 4523443 611528520 BKK-S COMP 10 0 CY14V101QS-BK108XQES 4523443 611528521 BKK-S COMP 10 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No. 002-09995 Rev. ** ECN #: 5019830 Document History Page Document Title: QTP# 153701: New Package Qualification of the BKK 24 FBGA, with CuPd, KMC-3580LVA, CRM-1577DB, SAC 305, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4 Document Number: 002-09995 Rev. ECN Orig. of No. Change ** 5019830 BECK Description of Change Initial Release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8