Document No.001-61138 Rev. *C ECN # 4775775 Cypress Semiconductor Package Qualification Report QTP# 092002 VERSION*C May, 2015 32-Lead - Saw QFN (Quad Flat No-Lead) (5 x 5 x 0.6mm) NiPdAu, MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-61138 Rev. *C ECN # 4775775 PACKAGE QUALIFICATION HISTORY QTP Number 092002 DESCRIPTION OF QUALIFICATION PURPOSE Qualify 32-Lead Saw -QFN (5 x 5 x 0.6mm), Preplated NiPdAu, using EMC Hitachi CEL9220HF13 Mold Compound, QMI509 Epoxy, MSL3, 260C Reflow assembled at CML-RA Company Confidential A printed copy of this document is considered uncontrolled. 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Page 2 of 7 Date May 09 Document No.001-61138 Rev. *C ECN # 4775775 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: LQ32 32-Lead Saw Quad Flat No Lead (QFN) Hitachi CEL 9220HF13 V-O per UL94 Oxygen Rating Index: None Lead Frame Material: C190 NiPdAu Lead Finish, Composition Thickness: Die Backside Preparation Method/Metallization: / Grinding Die Separation Method: Blade Sawing Die Attach Supplier: Dexter Die Attach Material: QMI509 Die Attach Method: Epoxy Bond Diagram Designation 001-25899 Wire Bond Method: Thermosonic Wire Material/Size: AuPd/0.8mil Thermal Resistance Theta JA °C/W: 22 C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-20029 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Note: Please contact a Cypress Representative for other packages availability. 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Page 3 of 7 Document No.001-61138 Rev. *C ECN # 4775775 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Ball Shear J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) JESD22-B116 Bond Pull MIL-STD-883 – Method 2011 Acoustics Microscopy Constructional Analysis Die Shear Dye Penetration Criteria: Meet external and internal characteristics of a package MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Criteria: No Package Crack Result P/F P P P P P P External Visual JESD22-B101 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C, 85% RH, 5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P Physical Dimension MIL-STD-1835, JESD22-B100 P Pressure Cooker Test Solderability, Steam Aged Temperature Cycle Thermal Shock X-ray JESD22-A102: 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-002, JESD22-B102 95% solder coverage minimum MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883, Method 1011, Condition B, -55C to 125C and JESD22-A106, Condition C, -55C to 125C MIL-STD-883 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P P P P P Document No.001-61138 Rev. *C ECN # 4775775 Reliability Test Data QTP #: Device Mechanism 092002 Fab Lot # Assy Lot # Assy Loc Duration Samp CY8C21434 (8C21434AC) 4846546 610904297TV1 CML-RA COMP 15 0 CY8C21434 (8C21434AC) 4846546 610904297TV2 CML-RA COMP 15 0 CY8C21434 (8C21434AC) 4846546 610904297TV3 CML-RA COMP 15 0 4846546 610904297TV1 CML-RA COMP 10 0 4846546 610904297TV1 CML-RA COMP 10 0 4846546 610904297TV1 CML-RA COMP 5 0 4846546 610904297TV1 CML-RA COMP 15 0 Rej Failure STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR CY8C21434 (8C21434AC) STRESS: BOND PULL CY8C21434 (8C21434AC) STRESS: CONSTRUCTIONAL ANALYSIS CY8C21434 (8C21434AC) STRESS: DIE SHEAR CY8C21434 (8C21434AC) STRESS: DYE PENETRANT TEST CY8C21434 (8C21434AC) 4846546 610904297TV1 CML-RA COMP 15 0 CY8C21434 (8C21434AC) 4846546 610904297TV2 CML-RA COMP 15 0 CY8C21434 (8C21434AC) 4846546 610904297TV3 CML-RA COMP 15 0 4846546 610904297TV1 CML-RA COMP 324 0 STRESS: EXTERNAL VISUAL CY8C21434 (8C21434AC) STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434 (8C21434AC) 4846546 610904297TV1 CML-RA 128 75 0 610904297TV1 CML-RA COMP 30 0 STRESS: PHYSICAL DIMENSION CY8C21434 (8C21434AC) 4846546 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434 (8C21434AC) 4846546 610904297TV1 CML-RA 168 80 0 CY8C21434 (8C21434AC) 4846546 610904297TV1 CML-RA COMP 5 0 CY8C21434 (8C21434AC) 4846546 610904297TV2 CML-RA COMP 5 0 CY8C21434 (8C21434AC) 4846546 610904297TV3 CML-RA COMP 3 0 STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-61138 Rev. *C ECN # 4775775 Reliability Test Data QTP #: Device Mechanism Fab Lot # Assy Lot # 092002 Assy Loc Duration Samp Rej Failure STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434 (8C21434AC) 4846546 610904297TV1 CML-RA 500 80 0 CY8C21434 (8C21434AC) 4846546 610904297TV2 CML-RA 500 80 0 CY8C21434 (8C21434AC) 4846546 610904297TV3 CML-RA 500 80 0 STRESS: THERMAL SHOCK COND. B – 55C TO 125C CY8C21434 (8C21434AC) 4846546 610904297TV1 CML-RA 200 80 0 CY8C21434 (8C21434AC) 4846546 610904297TV1 CML-RA COMP 15 0 CY8C21434 (8C21434AC) 4846546 610904297TV2 CML-RA COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-61138 Rev. *C ECN # 4775775 Document History Page Document Title: 092002: 32-LEAD - SAW QFN (QUAD FLAT NO-LEAD) (5 X 5 X 0.6MM) NIPDAU, MSL3, 260C REFLOW CML-RA 001-61138 Document Number: Rev. ECN No. ** 2920108 *A 4003017 Orig. of Change HGA JYF *B 4384761 JYF *C 4775775 JYF Description of Change Initial spec release Deleted Version 1.0 in QTP title page; Removed referenced Cypress specs and replaced with industry standards in Reliability Test Performed Table and deleted “3IR” in reflow steps of PCT, HAST and TCT. Sunset review: Updated QTP title page for template alignment. Sunset review: Updated reference for Reliability Director in QTP title page; Updated Reliability Tests Performed table for template alignment (Acoustic, Ball Shear, Die Shear, HAST, Bond Pull, Solderability,TCT) and arranged stresses/tests in alphabetical order for easy reference. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7