Document No.001-88444 Rev. *A ECN # 4450632 Cypress Semiconductor Package Qualification Report QTP# 093803 VERSION *A July 2014 32-Lead Saw QFN (Quad Flat No-Lead) (5 x 5 x 1mm) NiPdAu, MSL3, 260°C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-88444 Rev. *A ECN # 4450632 PACKAGE QUALIFICATION HISTORY QUAL REPORT 093803 DESCRIPTION OF QUALIFICATION PURPOSE Qualify 32-Lead Saw QFN (5 x 5 x 1mm), NiPdAu, using Nitto GE7470LA Mold Compound, QMI519 Epoxy, MSL3, 260C Reflow using Lithium Device with >10% larger die size than the previous qualified device of 32L Saw QFN Package assembled at CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 DATE COMP. Dec 2009 Document No.001-88444 Rev. *A ECN # 4450632 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT32 Package Outline, Type, or Name: 32-Lead Saw Quad Flat No Lead (QFN) Mold Compound Name/Manufacturer: Nitto GE7470LA Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: 0.003-0.002 cm /h Oxygen Rating Index: >28% N/A Lead Frame Material: Copper base NiPdAu Lead Finish, Composition / Thickness: 2 Die Backside Preparation Method/Metallization: Die Separation Method: Grinding Die Attach Supplier: Henkel Die Attach Material: QMI519 Die Attach Method: Epoxy Bond Diagram Designation 001-51824 Wire Bond Method: Thermosonic Wire Material/Size: AuPd/0.8mil Thermal Resistance Theta JA °C/W: 46 °C/W Package Cross Section Yes/No: No Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C Blade Sawing ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA,KYEC, ASE-G Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-88444 Rev. *A ECN # 4450632 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Test Condition (Temp/Bias) Stress/Test Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65 C to 150 Result P/F P C Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C Pressure Cooker Test 121°C, 100%RH, 15 Psig P Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C High Accelerated Saturation Test (HAST) 130°C, 5.25V, 85% RH P Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C High Temp Storage 150C, no bias P Acoustic Microscopy J-STD-020 P Ball Shear JESD22-B116A P Bond Pull MIL-STD-883 – Method 2011, P Constructional Analysis Criteria: Meet external and internal characteristics of P Cypress package Die Shear Dye Penetration MIL-STD-883, Method 2019 Test to determine the existence and extent of cracks, P P Criteria: No Package Crack Final Visual JESD22-B101B P Internal Visual MIL-STD-883-2014 P Solderability J-STD-002, JESD22-B102 P Thermal Shock MIL-STD-883C, Method 1011 P X-ray MIL-STD-883 2012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 Document No.001-88444 Rev. *A ECN # 4450632 Reliability Test Data QTP #:093803 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C24423A5 (8C244235K) 5931061 610936379 CML-RA COMP 15 0 CY8C24423A5 (8C244235K) 5931061 610936379M CML-RA COMP 15 0 CY8C24423A5 (8C244235K) 5931061 610936379M1 CML-RA COMP 15 0 5931061 610936379 CML-RA COMP 10 0 CY8C24423A5 (8C244235K) 5931061 610936379 CML-RA COMP 10 0 CY8C24423A5 (8C244235K) 5931061 610936379M CML-RA COMP 10 0 5931061 610936379 CML-RA COMP 5 0 5931061 610936379 CML-RA COMP 15 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR CY8C24423A5 (8C244235K) STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8C24423A5 (8C244235K) STRESS: DIE SHEAR CY8C24423A5 (8C244235K) STRESS: DYE PENETRANT TEST CY8C24423A5 (8C244235K) 5931061 610936379 CML-RA COMP 15 0 CY8C24423A5 (8C244235K) 5931061 610936379M CML-RA COMP 15 0 CY8C24423A5 (8C244235K) 5931061 610936379M1 CML-RA COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C24423A5 (8C244235K) 5931061 610936379 CML-RA 128 80 0 STRESS: HIGH TEMP STORAGE CY8C24423A5 (8C244235K) 5931061 610936379M1 CML-RA 500 80 0 CY8C24423A5 (8C244235K) 5931061 610936379M1 CML-RA 1000 80 0 5931061 610936379 COMP 5 0 STRESS: INTERNAL VISUAL CY8C24423A5 (8C244235K) CML-RA STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C24423A5 (8C244235K) 5931061 610936379 CML-RA 168 80 0 CY8C24423A5 (8C244235K) 5931061 610936379 CML-RA COMP 3 0 CY8C24423A5 (8C244235K) 5931061 610936379M CML-RA COMP 3 0 CY8C24423A5 (8C244235K) 5931061 610936379M1 CML-RA COMP 3 0 STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-88444 Rev. *A ECN # 4450632 Reliability Test Data QTP #:093803 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C24423A5 (8C244235K) 5931061 610936379 CML-RA 500 80 0 CY8C24423A5 (8C244235K) 5931061 610936379M CML-RA 500 80 0 CY8C24423A5 (8C244235K) 5931061 610936379M1 CML-RA 500 80 0 CY8C24423A5 (8C244235K) 5931061 610936379 CML-RA 200 80 0 CY8C24423A5 (8C244235K) 5931061 610936379 CML-RA 1000 80 0 5931061 610936379 CML-RA COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY CY8C24423A5 (8C244235K) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-88444 Rev. *A ECN # 4450632 Document History Page Document Title: QTP#093803: 32-Lead Saw QFN (Quad Flat No-Lead) (5 x 5 x 1mm) NiPdAu, MSL3, 260C Reflow CMLRA Document Number: 001-88444 Rev. ECN Orig. of No. Change ** 4064129 HSTO *A 4450632 HSTO Description of Change Initial Spec Release Qualification report published on Cypress.com is documented on memo HGA-1040 and was transferred to qualification report spec template. Align qualification report based on the new template in the front page Deleted obsolete specs 11-20099 Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7