QTP 9380 32-Lead Saw QFN (Quad Flat No-Lead) (5 x 5 x 1mm) NiPdAu,MSL3, 260°C Reflow CML-RA .pdf

Document No.001-88444 Rev. *A
ECN # 4450632
Cypress Semiconductor
Package Qualification Report
QTP# 093803 VERSION *A
July 2014
32-Lead Saw QFN (Quad Flat No-Lead)
(5 x 5 x 1mm)
NiPdAu, MSL3, 260°C Reflow
CML-RA
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-88444 Rev. *A
ECN # 4450632
PACKAGE QUALIFICATION HISTORY
QUAL
REPORT
093803
DESCRIPTION OF QUALIFICATION PURPOSE
Qualify 32-Lead Saw QFN (5 x 5 x 1mm), NiPdAu, using Nitto GE7470LA Mold
Compound, QMI519 Epoxy, MSL3, 260C Reflow using Lithium Device with >10%
larger die size than the previous qualified device of 32L Saw QFN Package assembled
at CML-RA
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
DATE
COMP.
Dec 2009
Document No.001-88444 Rev. *A
ECN # 4450632
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
LT32
Package Outline, Type, or Name:
32-Lead Saw Quad Flat No Lead (QFN)
Mold Compound Name/Manufacturer:
Nitto GE7470LA
Mold Compound Flammability Rating:
V-O per UL94
Mold Compound Alpha Emission Rate:
0.003-0.002 cm /h
Oxygen Rating Index: >28%
N/A
Lead Frame Material:
Copper base
NiPdAu
Lead Finish, Composition / Thickness:
2
Die Backside Preparation
Method/Metallization:
Die Separation Method:
Grinding
Die Attach Supplier:
Henkel
Die Attach Material:
QMI519
Die Attach Method:
Epoxy
Bond Diagram Designation
001-51824
Wire Bond Method:
Thermosonic
Wire Material/Size:
AuPd/0.8mil
Thermal Resistance Theta JA °C/W:
46 °C/W
Package Cross Section Yes/No:
No
Name/Location of Assembly (prime) facility:
CML-RA
MSL Level
3
Reflow Profile
260C
Blade Sawing
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-RA,KYEC, ASE-G
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No.001-88444 Rev. *A
ECN # 4450632
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Test Condition
(Temp/Bias)
Stress/Test
Temperature Cycle
MIL-STD-883C, Method 1010, Condition C, -65 C to 150
Result
P/F
P
C Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs, 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C
Pressure Cooker Test
121°C, 100%RH, 15 Psig
P
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs, 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C
High Accelerated Saturation Test
(HAST)
130°C, 5.25V, 85% RH
P
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs, 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C
High Temp Storage
150C, no bias
P
Acoustic Microscopy
J-STD-020
P
Ball Shear
JESD22-B116A
P
Bond Pull
MIL-STD-883 – Method 2011,
P
Constructional Analysis
Criteria: Meet external and internal characteristics of
P
Cypress package
Die Shear
Dye Penetration
MIL-STD-883, Method 2019
Test to determine the existence and extent of cracks,
P
P
Criteria: No Package Crack
Final Visual
JESD22-B101B
P
Internal Visual
MIL-STD-883-2014
P
Solderability
J-STD-002, JESD22-B102
P
Thermal Shock
MIL-STD-883C, Method 1011
P
X-ray
MIL-STD-883 2012
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 7
Document No.001-88444 Rev. *A
ECN # 4450632
Reliability Test Data
QTP #:093803
Device
Fab Lot #
Assy Lot # Assy Loc Duration
Samp
Rej
CY8C24423A5 (8C244235K)
5931061
610936379
CML-RA
COMP
15
0
CY8C24423A5 (8C244235K)
5931061
610936379M CML-RA
COMP
15
0
CY8C24423A5 (8C244235K)
5931061
610936379M1 CML-RA
COMP
15
0
5931061
610936379
CML-RA
COMP
10
0
CY8C24423A5 (8C244235K)
5931061
610936379
CML-RA
COMP
10
0
CY8C24423A5 (8C244235K)
5931061
610936379M CML-RA
COMP
10
0
5931061
610936379
CML-RA
COMP
5
0
5931061
610936379
CML-RA
COMP
15
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
CY8C24423A5 (8C244235K)
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C24423A5 (8C244235K)
STRESS: DIE SHEAR
CY8C24423A5 (8C244235K)
STRESS: DYE PENETRANT TEST
CY8C24423A5 (8C244235K)
5931061
610936379
CML-RA
COMP
15
0
CY8C24423A5 (8C244235K)
5931061
610936379M CML-RA
COMP
15
0
CY8C24423A5 (8C244235K)
5931061
610936379M1 CML-RA
COMP
15
0
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY8C24423A5 (8C244235K)
5931061
610936379
CML-RA
128
80
0
STRESS: HIGH TEMP STORAGE
CY8C24423A5 (8C244235K)
5931061
610936379M1 CML-RA
500
80
0
CY8C24423A5 (8C244235K)
5931061
610936379M1 CML-RA
1000
80
0
5931061
610936379
COMP
5
0
STRESS: INTERNAL VISUAL
CY8C24423A5 (8C244235K)
CML-RA
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CY8C24423A5 (8C244235K)
5931061
610936379
CML-RA
168
80
0
CY8C24423A5 (8C244235K)
5931061
610936379
CML-RA
COMP
3
0
CY8C24423A5 (8C244235K)
5931061
610936379M CML-RA
COMP
3
0
CY8C24423A5 (8C244235K)
5931061
610936379M1 CML-RA
COMP
3
0
STRESS: SOLDERABILITY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No.001-88444 Rev. *A
ECN # 4450632
Reliability Test Data
QTP #:093803
Device
Fab Lot #
Assy Lot # Assy Loc Duration
Samp
Rej
Failure Mechanism
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CY8C24423A5 (8C244235K)
5931061
610936379
CML-RA
500
80
0
CY8C24423A5 (8C244235K)
5931061
610936379M CML-RA
500
80
0
CY8C24423A5 (8C244235K)
5931061
610936379M1 CML-RA
500
80
0
CY8C24423A5 (8C244235K)
5931061
610936379
CML-RA
200
80
0
CY8C24423A5 (8C244235K)
5931061
610936379
CML-RA
1000
80
0
5931061
610936379
CML-RA
COMP
15
0
STRESS: THERMAL SHOCK
STRESS: X-RAY
CY8C24423A5 (8C244235K)
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-88444 Rev. *A
ECN # 4450632
Document History Page
Document Title: QTP#093803: 32-Lead Saw QFN (Quad Flat No-Lead) (5 x 5 x 1mm) NiPdAu, MSL3, 260C Reflow CMLRA
Document Number: 001-88444
Rev. ECN
Orig. of
No.
Change
**
4064129 HSTO
*A
4450632 HSTO
Description of Change
Initial Spec Release
Qualification report published on Cypress.com is documented on
memo HGA-1040 and was transferred to qualification report spec
template.
Align qualification report based on the new template in the front page
Deleted obsolete specs 11-20099
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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