Document No.001-89021 Rev. *D ECN # 5143938 Cypress Semiconductor Package Qualification Report QTP# 133308 VERSION*D February 2016 QFN48L (7x7x1.0mm) / QFN68L(8x8x1.0mm) NiPdAu, CuPd Wire MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-89021 Rev. *D ECN # 5143938 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 133308 Qualification of QFN48L (7x7x1.0mm) / QFN68L 8x8x1.0mm in CMLAUTOLINE assembly using 0.8mil CuPd wire, G700Y / G700SY mold comp, QMI519 die attach epoxy with NiPdAu lead finish. This will use ASM Leadframe with Hitachi tape and plasma process. Aug 2013 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.001-89021 Rev. *D ECN # 5143938 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: QFN68L Package Outline, Type, or Name: Oxygen Rating Index: >28% QFN68L (8x8x1.0mm) G700Y / Sumitomo G700SY / Sumitomo V-0 / UL94 G700Y / n/a G700SY / 0.001 54% (typical) Lead Frame Designation: RMP (with slots) Lead Frame Material: Copper Substrate Material: n/a Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Dexter Die Attach Material: QMI519 Bond Diagram Designation 001-75838 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8mil Thermal Resistance Theta JA C/W: 14.17 C/W Package Cross Section Yes/No: n/a Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL LEVEL 3 REFLOW PROFILE 260C Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML ® Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.001-89021 Rev. *D ECN # 5143938 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Pressure Cooker Test Temperature Cycle Acoustic Microscopy Test Condition (Temp/Bias) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Result P/F P P P X-Ray Criteria: Meet external and internal characteristics of package JEDEC STD 22-A110, 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow MIL-STD-883 – 2012 Ball Shear JESD22-B116A, Cpk : 1.33, Ppk : 1.66 P Internal Visual MIL-STD-883-2014 P High Temp Storage JESD22-A103: 150 C, no bias P Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and JESD22-A106B MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis High Accelerated Saturation Test (HAST) Thermal Shock Bond Pull Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P P P P P Document No.001-89021 Rev. *D ECN # 5143938 Reliability Test Data QTP #: 133308 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA COMP 15 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA COMP 15 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA COMP 15 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA COMP 35 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA COMP 35 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA COMP 35 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA COMP 35 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA COMP 35 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA COMP 35 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA COMP 5 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA COMP 5 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA COMP 5 0 STRESS: DYE PENETRANT TEST CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA COMP 15 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA COMP 15 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA 128 56 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA 128 55 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA 128 56 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-89021 Rev. *D ECN # 5143938 Reliability Test Data QTP #: 133308 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMPERATURE STORAGE CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA 500 80 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA 1000 79 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA 500 80 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA 1000 80 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA 500 80 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA 1000 80 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA COMP 5 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA COMP 5 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA 168 80 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA 288 79 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA 168 80 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA 288 80 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA 168 80 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA 288 79 0 STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA 500 80 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA 1000 78 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA 500 80 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA 1000 79 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA 500 80 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA 1000 80 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA 200 80 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA 1000 80 0 STRESS: THERMAL SHOCK Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-89021 Rev. *D ECN # 5143938 Reliability Test Data QTP #: 133308 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: XRAY CY8C5868LTI (8CC560681AC) LT68A 4304019 611314333 CML-RA COMP 15 0 CY8C5868LTI (8CC560681AC) LT68A 4304019 611314319 CML-RA COMP 15 0 CY8C5868AXI (8C561001AC) LT68A 4304019 611314324 CML-RA COMP 15 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-89021 Rev. *D ECN # 5143938 Document History Page Document Title:QTP#133308:QFN48L(7x7x1.0mm) / QFN68L(8x8x1.0mm) NiPdAu, CuPd Wire MSL3, 260C Reflow, CML-RA Document Number: 001-89021 Rev. ECN No. ** 4112352 *A 4121081 *B 4216876 *C 4495798 *D 5143938 Orig. of Change HSTO HSTO HSTO HSTO HSTO MEL Description of Change Initial spec release Updated the package information in page 1 & 2. Updated Package Qualification History table in page 2. Align qualification report based on the new template in the front page Update contact person for Reliability Director Add G700SY mold compound in Major Package Information table Removed distribution and posting from the document history page. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8