Document No.001-89578 Rev. *A ECN # 4526822 Cypress Semiconductor Package Qualification Report QTP# 082902 VERSION*A October, 2014 32-Lead Saw QFN (Quad Flat No-Lead) (5 x 5 x 0.93mm) NiPdAu, MSL3, 260°C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-89578 Rev. *A ECN # 4526822 PACKAGE QUALIFICATION HISTORY QTP Number 082902 Description of Qualification Purpose Qualify 32-Lead Saw -QFN (5 x 5 x 0.93mm), Preplated NiPdAu, using EMC Hitachi CEL9220HF13 Mold Compound, QMI509 Epoxy, MSL3, 260C Reflow assembled at CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Date Jul 08 Document No.001-89578 Rev. *A ECN # 4526822 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: LT32 32-Lead Saw Quad Flat No Lead (QFN) Hitachi CEL 9220HF13 V-O per UL94 Oxygen Rating Index: None Lead Frame Material: C194 NiPdAu Lead Finish, Composition / Thickness: Die Backside Preparation Method/Metallization: Die Separation Method: Grinding Die Attach Supplier: Dexter Die Attach Material: QMI509 Die Attach Method: Epoxy Bond Diagram Designation 001-47086 Wire Bond Method: Thermosonic Wire Material/Size: AuPd/0.8mil Thermal Resistance Theta JA °C/W: 22 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-20029 Name/Location of Assembly (prime) facility: MSL Level CML-RA Reflow Profile 260C Blade Sawing 3 ELECTRICAL TEST/FINISH DESCRIPTION Test Location CML-RA Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-89578 Rev. *A ECN # 4526822 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Temperature Cycle Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P JESD22-A102: 121°C, 100%RH, 15 Psig Pressure Cooker Test Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P JEDEC STD 22-A110: 130°C, 5.25V, 85% RH High Accelerated Saturation Test (HAST) Precondition: JESD22 Moisture Sensitivity MSL3 P 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C J-STD-020 Acoustics Microscopy Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C P Die Shear MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Ball Shear JESD22-B116, Cpk : 1.33, Ppk : 1.66 P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009 P Bond Pull MIL-STD-883 – Method 2011, 1.33, Ppk : 1.66 P X-ray MIL-STD-883 2012 P J-STD-002, JESD22-B102 Solderability, Steam Aged 95% solder coverage minimum P Criteria: Meet external and internal characteristics of Constructional Analysis Dye Penetration Physical Dimension Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-1835, JESD22-B100 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P P P Document No.001-89578 Rev. *A ECN # 4526822 Reliability Test Data QTP #:082902 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C21434 (8C21434AC) 4741654 610816488D CML-RA COMP 80 0 CY8C21434 (8C21434AC) 4741654 610816488E CML-RA COMP 80 0 CY8C21434 (8C21434AC) 4741654 610816488F CML-RA COMP 80 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434 (8C21434AC) 4741654 610816488D CML-RA 128 79 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434 (8C21434AC) 4741654 610816488D CML-RA 168 77 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434 (8C21434AC) 4741654 610816488D CML-RA 500 79 0 CY8C21434 (8C21434AC) 4741654 610816488D CML-RA 1000 79 0 CY8C21434 (8C21434AC) 4741654 610816488E CML-RA 500 80 0 CY8C21434 (8C21434AC) 4741654 610816488E CML-RA 1000 80 0 CY8C21434 (8C21434AC) 4741654 610816488F CML-RA 500 80 0 CY8C21434 (8C21434AC) 4741654 610816488F CML-RA 1000 80 0 STRESS: THERMAL SHOCK COND. B – 55C TO 125C CY8C21434 (8C21434AC) 4741654 610816488D CML-RA 200 78 0 CY8C21434 (8C21434AC) 4741654 610816488D CML-RA 1000 78 0 4741654 610816488D CML-RA COMP 30 0 4741654 610816488D CML-RA COMP 30 0 4741654 610816488D CML-RA COMP 30 0 4741654 610816488D CML-RA COMP 30 0 STRESS: PHYSICAL DIMENSION CY8C21434 (8C21434AC) STRESS: BALL SHEAR CY8C21434 (8C21434AC) STRESS: BOND PULL CY8C21434 (8C21434AC) STRESS: DIE SHEAR CY8C21434 (8C21434AC) STRESS: CONSTRUCTIONAL ANALYSIS CY8C21434 (8C21434AC) 4741654 610816488D CML-RA COMP 5 0 CY8C21434 (8C21434AC) 4741654 610816488E CML-RA COMP 5 0 CY8C21434 (8C21434AC) 4741654 610816488F CML-RA COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-89578 Rev. *A ECN # 4526822 Reliability Test Data QTP #:082902 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: DYE PENETRANT TEST CY8C21434 (8C21434AC) 4741654 610816488D CML-RA COMP 10 0 CY8C21434 (8C21434AC) 4741654 610816488E CML-RA COMP 10 0 CY8C21434 (8C21434AC) 4741654 610816488F CML-RA COMP 10 0 4741654 610816488D CML-RA COMP 324 0 CY8C21434 (8C21434AC) 4741654 610816488D CML-RA COMP 3 0 CY8C21434 (8C21434AC) 4741654 610816488E CML-RA COMP 3 0 CY8C21434 (8C21434AC) 4741654 610816488F CML-RA COMP 3 0 CY8C21434 (8C21434AC) 4741654 610816488D CML-RA COMP 30 0 CY8C21434 (8C21434AC) 4741654 610816488E CML-RA COMP 30 0 CY8C21434 (8C21434AC) 4741654 610816488F CML-RA COMP 30 0 STRESS: EXTERNAL VISUAL CY8C21434 (8C21434AC) STRESS: SOLDERABILITY STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-89578 Rev. *A ECN # 4526822 Document History Page Document Title: QTP# 082902:32-LEAD SAW QFN (QUAD FLAT NO-LEAD) (5 X 5 X 0.93MM), NIPDAU, MSL3 260C REFLOW, CML-RA 001-89578 Document Number: Rev. ECN No. ** 4149083 *A 4526822 Orig. of Change JYF JYF Description of Change Initial Spec Release. Sunset review: Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7