Document No.001-71360 Rev. *B ECN # 4470790 Cypress Semiconductor Package Qualification Report QTP# 102610 VERSION*B August, 2014 48-Lead QFN (7x7x1.0 mm) NiPdAu, MSL3, 260°°C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-71360 Rev. *B ECN # 4470790 PACKAGE QUALIFICATION HISTORY QTP Number 102610 Description of Qualification Purpose Qualification of 48L QFN (7x7x1.0mm) using GE-7470 Mold Compound, QMI 519 Die Attach Epoxy and NiPdAu L/F at MSL3 260C Assembled in Autoline (RA-CML) Date Feb 2011 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.001-71360 Rev. *B ECN # 4470790 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT48D Package Outline, Type, or Name: 48 – Quad Flat No Lead (QFN) Mold Compound Name/Manufacturer: Nitto GE-7470 Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% N/A Lead Frame Designation: Full Metal Pad Lead Frame Material: A194 Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafersaw Die Attach Supplier: Henkel Die Attach Material: QMI 519 Bond Diagram Designation 001-59997, 001-60398 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: 95 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML_RA MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.001-71360 Rev. *B ECN # 4470790 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Ball Shear Bond Pull Constructional Analysis Die Shear Test Condition (Temp/Bias) JEDEC STD 22-A110: 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A102: 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A103:150 C, no bias (2200V) JEDEC EIA/JESD22-A114 (500V) JESD22-C101 J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-B116 Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011 Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: • • • Dye Penetrant Test Result P/F P P P P P P P P P P P <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to P Thermal Shock P 125C Solderability, Steam Aged J-STD-002, JESD22-B102 P 95% solder coverage minimum X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P Document No.001-71360 Rev. *B ECN # 4470790 Reliability Test Data QTP #: 102610 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA COMP 15 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA COMP 15 0 CY8C3866LTI (8C386612B) 4944706 611023571 CML-RA COMP 15 0 CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA COMP 30 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA COMP 30 0 4944706 611023570 CML-RA COMP 30 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL CY8C3866LTI (8C386612B) STRESS: CONSTRUCTIONAL ANALYIS CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA COMP 5 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA COMP 5 0 STRESS: DYE PENETRATION TEST CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA COMP 15 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA COMP 15 0 CY8C3866LTI (8C386612B) 4944706 611023571 CML-RA COMP 15 0 CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA COMP 10 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA COMP 10 0 CML-RA COMP 9 0 COMP 8 0 STRESS: DIE SHEAR STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C28645 (8C28645A) 4945314 611030271 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V CY8C28645 (8C28645A) 4945314 611030271 CML-RA STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA 128 77 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA 128 76 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-71360 Rev. *B ECN # 4470790 Reliability Test Data QTP #: 102610 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP STORAGE, 150C CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA 500 77 0 CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA 1000 76 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA 500 80 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA 1000 80 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA 1500 80 0 CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA COMP 5 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA 128 77 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA 128 77 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA 288 77 0 STRESS: PHYSICAL DIMENSION CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA COMP 30 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA COMP 30 0 CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA COMP 3 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA COMP 3 0 CY8C3866LTI (8C386612B) 4944706 611023571 CML-RA COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA 500 77 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA 500 77 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA 1000 77 0 CY8C3866LTI (8C386612B) 4944706 611023571 CML-RA 500 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-71360 Rev. *B ECN # 4470790 Reliability Test Data QTP #: 102610 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA 200 77 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA 200 77 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA 1000 77 0 CY8C3866LTI (8C386612B) 4944706 611023570 CML-RA COMP 15 0 CY8C28645 (8C28645A) 4945314 611030271 CML-RA COMP 15 0 Failure Mechanism STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-71360 Rev. *B ECN # 4470790 Document History Page Document Title: Document Number: Rev. ECN No. ** 3311289 *A 4087924 *B QTP 102610: 48-LEAD QFN (7X7X1.0 MM) NIPDAU, MSL3, 260C REFLOW CML-RA 001-71360 Orig. of Change NSR JYF 4470790 JYF Description of Change Initial spec release Sunset Review: Deleted Version 1.0 in QTP title page; Updated Reliability Tests Performed table to delete Cypress’ spec references and replaced with industry standards. Sunset Review: Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8