SCAN18541T Non-Inverting Line Driver with TRI-STATE ® Outputs General Description The SCAN18541T is a high speed, low-power line driver featuring separate data inputs organized into dual 9-bit bytes with byte-oriented paired output enable control signals. This device is compliant with IEEE 1149.1 Standard Test Access Port and Boundary Scan Architecture with the incorporation of the defined boundary-scan test logic and test access port consisting of Test Data Input (TDI), Test Data Out (TDO), Test Mode Select (TMS), and Test Clock (TCK). Features n n n n n n n n n Dual output enable signals per byte TRI-STATE outputs for bus-oriented applications 9-bit data busses for parity applications Reduced-swing outputs source 24 mA/sink 48 mA (Mil) Guaranteed to drive 50Ω transmission line to TTL input levels of 0.8V and 2.0V TTL compatible inputs 25 mil pitch Cerpack packaging Includes CLAMP and HIGHZ instructions Standard Microcircuit Drawing (SMD) 5962-9311601 n IEEE 1149.1 (JTAG) Compliant Connection Diagram Pin Names Description AOE1, AOE2 TRI-STATE Output Enable Input Pins, A Side BOE1, BOE2 TRI-STATE Output Enable Input Pins, B Side AO(0–8) Output Pins, A Side AO(0–8) Output Pins, B Side DS100324-1 Pin Names Pin Names Description AI(0–8) Input Pins, A Side BI(0–8) Input Pins, B Side TRI-STATE ® is a registered trademark of National Semiconductor Corporation. © 1998 National Semiconductor Corporation DS100324 www.national.com SCAN18541T Non-Inverting Line Driver with TRI-STATE Outputs September 1998 Truth Tables Inputs AOE1 AO (0–8) AOE2 AI (0–8) L L H H X X Z X H X Z L L L Inputs H L BO (0–8) BOE1 BOE2 BI (0–8) L L H H X X Z X H X Z L L L L H H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance Block Diagrams Byte A DS100324-2 Tap Controller DS100324-3 www.national.com 2 Block Diagrams (Continued) Byte B DS100324-4 Note: BSR stands for Boundary Scan Register. 3 www.national.com Description of Boundary-Scan Circuitry device. SCAN CMOS Test Access Logic devices do not include the IEEE 1149.1 optional identification register. Therefore, this unique captured value can be used as a “pseudo ID” code to confirm that the correct device is placed in the appropriate location in the boundary scan chain. The scan cells used in the BOUNDARY-SCAN register are one of the following two types depending upon their location. Scan cell TYPE1 is intended to solely observe system data, while TYPE2 has the additional ability to control system data. (See IEEE Standard 1149.1 Figure10–11 for a further description of scan cell TYPE1 and Figure 10–12 for a further description of scan cell TYPE2.) Instruction Register Scan Chain Definition Scan cell TYPE1 is located on each system input pin while scan cell TYPE2 is located at each system output pin as well as at each of the two internal active-high output enable signals. AOE controls the activity of the A-outputs while BOE controls the activity of the B-outputs. Each will activate their respective outputs by loading a logic high. DS100324-10 The BYPASS register is a single bit shift register stage identical to scan cell TYPE1. It captures a fixed logic low. MSB→LSB Instruction Code Bypass Register Scan Chain Definition Logic 0 DS100324-9 The INSTRUCTION register is an 8-bit register which captures the default value of 10000001. The two least significant bits of this captured value (01) are required by IEEE Std 1149.1. The upper six bits are unique to the SCAN18541T www.national.com 4 Instruction 00000000 EXTEST 10000001 SAMPLE/PRELOAD 10000010 CLAMP 00000011 HIGH-Z All Others BYPASS Description of Boundary-Scan Circuitry (Continued) Scan Cell TYPE1 DS100324-7 Scan Cell TYPE2 DS100324-8 5 www.national.com Description of Boundary-Scan Circuitry (Continued) Boundary-Scan Register Scan Chain Definition (42 Bits in Length) DS100324-23 www.national.com 6 Description of Boundary-Scan Circuitry (Continued) Boundary-Scan Register Definition Index Bit No. Pin Name Pin No. Pin Type 41 AOE1 3 Input TYPE1 Scan Cell Type 40 AOE2 54 Input TYPE1 39 AOE Internal TYPE2 38 BOE1 26 Input TYPE1 37 BOE2 31 Input TYPE1 36 BOE Internal TYPE2 35 AI0 55 Input TYPE1 34 AI1 53 Input TYPE1 33 AI2 52 Input TYPE1 32 AI3 50 Input TYPE1 31 AI4 49 Input TYPE1 30 AI5 47 Input TYPE1 29 AI6 46 Input TYPE1 28 AI7 44 Input TYPE1 27 AI8 43 Input TYPE1 26 BI0 42 Input TYPE1 25 BI1 41 Input TYPE1 24 BI2 39 Input TYPE1 23 BI3 38 Input TYPE1 22 BI4 36 Input TYPE1 21 BI5 35 Input TYPE1 20 BI6 33 Input TYPE1 19 BI7 32 Input TYPE1 18 BI8 30 Input TYPE1 17 AO0 2 Output TYPE2 16 AO1 4 Output TYPE2 15 AO2 5 Output TYPE2 14 AO3 7 Output TYPE2 13 AO4 8 Output TYPE2 12 AO5 10 Output TYPE2 11 AO6 11 Output TYPE2 10 AO7 13 Output TYPE2 9 AO8 14 Output TYPE2 8 BO0 15 Output TYPE2 7 BO1 16 Output TYPE2 6 BO2 18 Output TYPE2 5 BO3 19 Output TYPE2 4 BO4 21 Output TYPE2 3 BO5 22 Output TYPE2 2 BO6 24 Output TYPE2 1 BO7 25 Output TYPE2 0 BO8 27 Output TYPE2 7 Control Signals A–in B–in A–out B–out www.national.com Absolute Maximum Ratings (Note 1) ESD (Min) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) DC Input Diode Current (IIK) VI = −0.5V VI = VCC +0.5V DC Output Diode Current (IOK) VO = −0.5V VO = VCC +0.5V DC Output Voltage (VO) DC Output Source/Sink Current (IO) DC VCC or Ground Current Per Output Pin Junction Temperature Cerpack Storage Temperature 2000V Recommended Operating Conditions −0.5V to +7.0V Supply Voltage (VCC) SCAN Products Input Voltage (VI) Output Voltage (VO) Operating Temperature (TA) Military Minimum Input Edge Rate dV/dt VIN from 0.8V to 2.0V VCC @ 4.5V, 5.5V −20 mA +20 mA −20 mA +20 mA −0.5V to VCC +0.5V ± 70 mA 4.5V to 5.5V 0V to VCC 0V to VCC −55˚C to +125˚C 125 mV/ns Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. National does not recommend operation of SCAN circuits outside databook specifications. ± 70 mA +175˚C −65˚C to +150˚C DC Electrical Characteristics Symbol Parameter VCC (V) Military TA = −55˚C to +125˚C Units Conditions Guaranteed Limits VIH VIL VOH VOL IIN Minimum High 4.5 2.0 Input Voltage 5.5 2.0 Maximum Low 4.5 0.8 Input Voltage 5.5 0.8 Minimum High 4.5 3.15 Output Voltage 5.5 4.15 4.5 2.4 5.5 2.4 Maximum Low 4.5 0.1 Output Voltage 5.5 0.1 4.5 0.55 5.5 0.55 5.5 ± 1.0 Maximum Input V VOUT = 0.1V V or VCC −0.1V VOUT = 0.1V V or VCC −0.1V IOUT = −50 µA V V VIN = VIL or VIH IOH = −24 mA IOUT = 50 µA V VIN = VIL or VIH IOL = 48 mA µA VI = VCC, GND Leakage Current IIN Maximum Input TDI, TMS Leakage Minimum Input 5.5 5.5 3.7 µA −385 µA −160 µA VI = VCC VI = GND VI = GND 63 mA VOLD = 0.8V Max Leakage IOLD Minimum Dynamic (Note 2) IOHD Output Current IOZ Maximum Output 5.5 −27 mA 5.5 ± 10.0 µA VOHD = 2.0V Min VI (OE) = VIL, VIH 5.5 −100 mA VO = 0V Leakage Current IOS Output Short Circuit Current ICC Maximum Quiescent (min) 5.5 168 µA 5.5 930 µA Supply Current VO = Open TDI, TMS = VCC VO = Open TDI, TMS = GND www.national.com 8 DC Electrical Characteristics Symbol Parameter (Continued) Military TA = −55˚C to +125˚C VCC (V) Units Conditions Guaranteed Limits ICCt Maximum ICC 5.5 2.0 Per Input 5.5 2.15 VI = VCC–2.1V VI = VCC–2.1V mA mA TDI/TMS Pin, Test One with the Other Floating Note 2: Maximum test duration 2.0 ms, one output loaded at a time. Note 3: All outputs loaded; thresholds associated with output under test. Noise Specifications Symbol Military TA = −55˚C to +125˚C Units Parameter VCC (V) Maximum High 5.0 0.8 V 5.0 -0.8 V Guaranteed Limits VOLP Output Noise (Notes 4, 5) VOLV Minimum Low Output Noise (Notes 4, 5) Note 4: Maximum number of outputs that can switch simultaneously is n. (n-1) outputs are switched LOW and one output held LOW. Note 5: Maximum number of outputs that can switch simultaneously is n. (n-1) outputs are switched HIGH and one output held HIGH. AC Electrical Characteristics Normal Operation Symbol Parameter tPLH, Propagation Delay tPHL Data to Q tPLZ, Disable Time Military TA = VCC (V) (Note 6) −55˚C to +125˚C CL = 50 pF 5.0 5.0 tPHZ tPZL, Enable Time Units 5.0 tPZH Min Max 2.5 10.5 2.5 10.5 1.5 11.2 1.5 11.2 2.0 14.0 2.0 12.0 ns ns ns Note 6: Voltage Range 5.0 is 5.0V ± 0.5V. 9 www.national.com AC Electrical Characteristics Scan Test Operation Symbol Parameter tPLH, Propagation Delay tPHL TCK to TDO tPLZ, Disable Time tPHZ TCK to TDO tPZL, Enable Time tPZH TCK to TDO tPLH, Propagation Delay tPHL TCK to Data Out Military TA = VCC (V) (Note 7) Units −55˚C to +125˚C CL = 50 pF 5.0 5.0 5.0 5.0 Min Max 3.5 15.8 3.5 15.8 2.5 13.2 2.5 13.2 ns ns 3.0 17.0 3.0 17.0 ns 5.0 21.7 5.0 21.7 5.0 21.2 5.0 21.2 ns ns ns During Update-DR State tPLH, Propagation Delay tPHL TCK to Data Out 5.0 During Update-IR State tPLH, Propagation Delay tPHL TCK to Data Out 5.0 During Test Logic 5.5 23.0 5.5 23.0 4.0 19.6 4.0 19.6 5.0 22.4 5.0 22.4 ns ns Reset State tPLZ, Propagation Delay tPHZ TCK to Data Out 5.0 ns During Update-DR State tPLZ, Propagation Delay tPHZ TCK to Data Out 5.0 During Update-IR State tPLZ, Propagation Delay tPHZ TCK to Data Out 5.0 During Test Logic 5.0 23.3 5.0 23.3 5.0 22.6 5.0 22.6 6.5 26.2 6.5 26.2 ns 7.0 27.4 ns 7.0 27.4 Reset State tPZL, Propagation Delay tPZH TCK to Data Out 5.0 ns During Update-DR State tPZL, Propagation Delay tPZH TCK to Data Out 5.0 During Update-IR State tPZL, Propagation Delay tPZH TCK to Data Out 5.0 During Test Logic Reset State Note 7: Voltage Range 5.0 is 5.0V ± 0.5V. Note 8: All Propagation Delays involving TCK are measured from the falling edge of TCK. www.national.com 10 AC Operating Requirements Scan Test Operation Symbol Parameter VCC (V) (Note 9) Military TA = −55˚C to +125˚C CL = 50 pF Units Guaranteed Minimum tS Setup Time, H or L 5.0 3.0 ns 5.0 5.0 ns 5.0 3.0 ns 5.0 4.5 ns 5.0 3.0 ns 5.0 3.0 ns 5.0 8.0 ns 5.0 2.0 ns 5.0 4.0 ns 5.0 4.5 ns H 12.0 ns L 5.0 Data to TCK (Note 10) tH Hold Time, H or L TCK to Data (Note 10) tS Setup Time, H or L AOEn, BOEn to TCK (Note 12) tH Hold Time, H or L TCK to AOEn, BOEn (Note 12) tS Setup Time, H or L Internal AOE, BOE, to TCK (Note 11) tH Hold Time, H or L TCK to Internal AOE, BOE (Note 11) tS Setup Time, H or L TMS to TCK tH Hold Time, H or L TCK to TMS tS Setup Time, H or L TDI to TCK tH Hold Time, H or L TCK to TDI tW fmax Pulse Width TCK 5.0 Maximum TCK 5.0 25 MHz 5.0 100 ns 0.0 100 ms Clock Frequency TPU Wait Time, Power Up to TCK TDN Power Down Delay Note 9: Voltage Range 5.0 is 5.0V ± 0.5V. All Input Timing Delays involving TCK are measured from the rising edge of TCK. Note 10: This delay represents the timing relationship between the data input and TCK at the associated scan cells numbered 0-8, 9-17, 18-26 and 27-35. Note 11: This delay represents the timing relationship between AOE/BOE and TCK for scan cells 36 and 39 only. Note 12: Timing pertains to BSR 37, 38, 40 and 41 only. 11 www.national.com Capacitance Symbol Max Units Input Pin Capacitance 5.0 pF COUT Output Pin Capacitance 15.0 pF CPD Power Dissipation 35.0 pF CIN Parameter Capacitance www.national.com 12 Conditions VCC = 5.0V VCC = 5.0V VCC = 5.0V 13 SCAN18541T Non-Inverting Line Driver with TRI-STATE Outputs Physical Dimensions inches (millimeters) unless otherwise noted 56-Lead Ceramic Flatpak (F) NS Package Number WA56A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. 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