QTP 92103 Automotive 56-Lead QFN (Quad Flat No-Lead) Pure Sn, MSL3, 260C Reflow, Amkor-Korea (L).pdf

Document No.001-89592 Rev. *A
ECN # 4535338
Cypress Semiconductor
Package Qualification Report
QTP# 092103 VERSION*A
October, 2014
Automotive 56-Lead QFN (Quad Flat No-Lead)
Pure Sn, MSL3, 260°C Reflow,
Amkor-Korea (L)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
Document No.001-89592 Rev. *A
ECN # 4535338
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
092103
Qualify 56L QFN package on Automotive application using EME-G700 (Sumitomo Bakelite)
Mold Compound, 8290 (Ablestik) Epoxy, Pure Sn at MSL 3,260C
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
Date
Jun 09
Document No.001-89592 Rev. *A
ECN # 4535338
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
LY56
Package Outline, Type, or Name:
56-Lead QFN
Mold Compound Name/Manufacturer:
Sumitomo EME-G700
Mold Compound Flammability Rating:
V-0 per UL94
Mold Compound Alpha Emission Rate:
N/A
Oxygen Rating Index:
V-0
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Wafer Saw
Die Attach Supplier:
Ablestik
Die Attach Material:
8290
Die Attach Method:
Epoxy
Bond Diagram Designation:
10-06451
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au, 1.0mil
Thermal Resistance Theta JA °C/W:
30°C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
49-10994
Name/Location of Assembly (prime) facility:
Amkor-Korea (L)
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST/FINISH DESCRIPTION
Test Location
CML-R
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No.001-89592 Rev. *A
ECN # 4535338
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
J-STD-020
Acoustic Microscopy
Precondition: JESD22 Moisture Sensitivity MSL3
P
192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C
Ball Shear
AEC-Q100-010
P
Bond Pull
Mil-Std 883, Method 2011
P
Electrical Distribution
AEC Q100-009
P
High Temperature Operating Life
Early Failure Rate
AEC-Q100-008 and JESD22-A108
Dynamic Operating Condition, Vcc Max = 3.8V, 125°C
P
High Temperature Operating Life
Latent Failure Rate
Electrostatic Discharge Human Body
Model (ESD-HBM)
Electrostatic Discharge Charge Device
Model (ESD-CDM)
JESD22-A108
Dynamic Operating Condition, Vcc Max = 3.8V, 125°C
P
AEC–Q100–002
P
AEC–Q100–011
P
High Accelerated Saturation Test
(HAST)
JESD22-A110, 130°C, 3.63V, 85%RH
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs 30°C/60%RH+ Reflow, 260°C+0, -5°C
High Temp Storage
JESD22-A103, 150C
Pressure Cooker Test
JESD22-A102, 121°C, 100%RH, 15 Psig
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs 30°C/60%RH+ Reflow, 260°C+0, -5°C
P
P
P
Physical Dimension
JESD22B100 and B108
P
Post Temp Cycle Bond Pull
Mil-Std 883, Method 2011
P
Static Latch-up
AEC-Q100-004
P
Solderability
JESD22-B102
P
Temperature Cycle
JESD22-A104, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs 30°C/60%RH+ Reflow, 260°C+0, -5°C
Company Confidential
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Page 4 of 8
P
Document No.001-89592 Rev. *A
ECN # 4535338
Reliability Test Data
QTP #:092103
Device
Fab Lot#
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
COMP
22
0
CY7C65630 (7C65630CC)
4639823
610712725
L-KOREA
COMP
22
0
CY7C65630 (7C65630CC)
4638322
610717719
L-KOREA
COMP
22
0
4642838
610709630
L-KOREA
COMP
5
0
4642838
610709630
L-KOREA
COMP
5
0
STRESS: BALL SHEAR
CY7C65630 (7C65630CC)
STRESS: BOND PULL
CY7C65630 (7C65630CC)
STRESS: ELECTRICAL DISTRIBUTION
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
COMP
30
0
CY7C65630 (7C65630CC)
4639823
610712725
L-KOREA
COMP
30
0
CY7C65630 (7C65630CC)
4638322
610717719
L-KOREA
COMP
30
0
L-KOREA
COMP
3
0
L-KOREA
COMP
3
0
COMP
3
0
COMP
3
0
COMP
3
0
COMP
3
0
STRESS: ESD-CHARGE DEVICE MODEL, 200V
CY7C65630 (7C65630CC)
4642838
610709630
STRESS: ESD-CHARGE DEVICE MODEL, 500V
CY7C65630 (7C65630CC)
4642838
610709630
STRESS: ESD-CHARGE DEVICE MODEL, 750V, Corner Pins Only
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 500V
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 1,000V
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 1,500V
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 2,000V
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
COMP
3
0
STRESS: HIGH TEMP STORAGE LIFE TEST
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
500
85
0
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
1000
85
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Document No.001-89592 Rev. *A
ECN # 4535338
Reliability Test Data
QTP #:092103
Device
Fab Lot#
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: STATIC LATCH-UP TESTING, 125C, 5.2V, +/100mA
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
COMP
6
0
STRESS: PHYSICAL DIMENSIONS
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
COMP
10
0
CY7C65630 (7C65630CC)
4639823
610712728
L-KOREA
COMP
10
0
CY7C65630 (7C65630CC)
4638322
610716238
L-KOREA
COMP
10
0
L-KOREA
COMP
15
0
STRESS: POST TEMP CYCLE WIRE BOND PULL
CY7C65630 (7C65630CC)
4638322
610717719
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
96
85
0
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
168
85
0
CY7C65630 (7C65630CC)
4639823
610712725
L-KOREA
96
84
0
CY7C65630 (7C65630CC)
4639823
610712725
L-KOREA
168
84
0
CY7C65630 (7C65630CC)
4638322
610717719
L-KOREA
96
85
0
CY7C65630 (7C65630CC)
4638322
610717719
L-KOREA
168
85
0
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 192 HR 30C/60%RH, MSL3
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
96
76
0
CY7C65630 (7C65630CC)
4639823
610712728
L-KOREA
96
75
0
CY7C65630 (7C65630CC)
4638322
610717719
L-KOREA
96
73
0
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
COMP
15
0
CY7C65630 (7C65630CC)
4639823
610712725
L-KOREA
COMP
15
0
CY7C65630 (7C65630CC)
4638322
610717719
L-KOREA
COMP
15
0
STRESS: SOLDERABILITY
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
500
90
0
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
1000
85
0
CY7C65630 (7C65630CC)
4639823
610712725
L-KOREA
500
85
0
CY7C65630 (7C65630CC)
4639823
610712725
L-KOREA
1000
85
0
CY7C65630 (7C65630CC)
4638322
610717719
L-KOREA
500
85
0
CY7C65630 (7C65630CC)
4638322
610717719
L-KOREA
1000
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Document No.001-89592 Rev. *A
ECN # 4535338
Reliability Test Data
QTP #:092103
Device
Fab Lot#
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE – EARLY FAILURE RATE, 125C, 3.8V Vcc Max
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
48
85
0
CY7C65630 (7C65630CC)
4642838
610711410P2
L-KOREA
48
290
0
CY7C65630 (7C65630CC)
4642838
610711416P2
L-KOREA
48
867
0
CY7C65630 (7C65630CC)
4642838
610711410P1
L-KOREA
48
839
0
CY7C65630 (7C65630CC)
4642838
610709630P3
L-KOREA
48
875
0
CY7C65630 (7C65630CC)
4642838
610711410P3
L-KOREA
48
30
0
CY7C65630 (7C65630CC)
4642838
610711416P1
L-KOREA
48
278
0
CY7C65630 (7C65630CC)
4642838
610709630P5
L-KOREA
48
190
0
CY7C65630 (7C65630CC)
4642838
610711416P3
L-KOREA
48
40
0
CY7C65630 (7C65630CC)
4639823
610712725P2
L-KOREA
48
127
0
CY7C65630 (7C65630CC)
4639823
610712728P1
L-KOREA
48
955
0
CY7C65630 (7C65630CC)
4639823
610712728P3
L-KOREA
48
194
0
CY7C65630 (7C65630CC)
4639823
610712725P1
L-KOREA
48
153
0
CY7C65630 (7C65630CC)
4639823
610712729P1
L-KOREA
48
280
0
CY7C65630 (7C65630CC)
4639823
610712729P2
L-KOREA
48
870
0
CY7C65630 (7C65630CC)
4639823
610712725P3
L-KOREA
48
869
0
CY7C65630 (7C65630CC)
4639822
610717719P2
L-KOREA
48
862
0
CY7C65630 (7C65630CC)
4639822
610717719P1
L-KOREA
48
84
0
CY7C65630 (7C65630CC)
4639822
610717719P3
L-KOREA
48
37
0
CY7C65630 (7C65630CC)
4639822
610716238P2
L-KOREA
48
375
0
CY7C65630 (7C65630CC)
4639822
610716238P1
L-KOREA
48
870
0
CY7C65630 (7C65630CC)
4639822
610717719P4
L-KOREA
48
161
0
CY7C65630 (7C65630CC)
4639822
610716671P1
L-KOREA
48
870
0
CY7C65630 (7C65630CC)
4639822
610716671P2
L-KOREA
48
105
0
CY7C65630 (7C65630CC)
4639822
610716671P3
L-KOREA
48
161
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE – LATENT FAILURE RATE, 125C, 3.8V Vcc Max
CY7C65630 (7C65630CC)
4642838
610709630
L-KOREA
1000
84
0
CY7C65630 (7C65630CC)
4639823
610712725
L-KOREA
1000
84
0
CY7C65630 (7C65630CC)
4638322
610717719
L-KOREA
1000
83
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Document No.001-89592 Rev. *A
ECN # 4535338
Document History Page
Document Title:
QTP# 092103: AUTOMOTIVE 56-LEAD QFN (QUAD FLAT NO-LEAD) PURE SN, MSL3, 260C
REFLOW, AMKOR-KOREA (L)
001-89592
Document Number:
Rev. ECN
No.
**
4149293
*A
4535338
Orig. of
Change
JYF
JYF
Description of Change
Initial Spec Release.
Updated QTP title page for template alignment.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
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