QTP 130503 Automotive 28L SOIC (300 mils), NiPdAu (Ru), MSL3, 260°C Reflow, JCET-China (JT).pdf

Document No. 001-87292 Rev. *A
ECN #4353962
Cypress Semiconductor Automotive
Package Qualification Report
QTP# 130503 VERSION *A
April 2014
Automotive 28L SOIC (300 mils)
NiPdAu (Ru), MSL3, 260C Reflow
JCET-China (JT)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Lorena R. Zapanta (ILZ)
Reliability Engineer
Reviewed By:
Rene Rodgers (RT)
Reliability Manager
Approved By:
Richard Oshiro(RGO)
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
Document No. 001-87292 Rev. *A
ECN #4353962
PRODUCT QUALIFICATION HISTORY
QTP
Number
130503
Description of Qualification Purpose
Qualification of SOIC 28LD (300Mils) Package for Automotive
Application Assembled at JCET , China
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
Date
April 2013
Document No. 001-87292 Rev. *A
ECN #4353962
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
SZ283
Package Outline, Type, or Name:
28L SOIC
Mold Compound Name/Manufacturer:
EMEG620B /Sumitomo
Mold Compound Flammability Rating:
UL94 V0
Mold Compound Alpha Emission Rate:
0.002 CPH/cm2
Oxygen Rating Index: >28%
N/A
Lead Frame Designation:
Reduced Metal Pad
Lead Frame Material:
Copper: Samsung Techwin
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
NiPdAu (Roughened)
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Wafersaw
Die Attach Supplier:
Sumitomo
Die Attach Material:
CRM1076WD
Bond Diagram Designation
001-72856
Wire Bond Method:
Thermosonic
Wire Material/Size:
1.0 mil / Au
Thermal Resistance Theta JA C/W:
N/A
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
001-67698 / M
Name/Location of Assembly (prime) facility:
JT-JCET China
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No. 001-87292 Rev. *A
ECN #4353962
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Electrostatic Discharge
Human Body Model (ESD-HBM)
Electrostatic Discharge
Charge Device Model (ESD-CDM)
Latch-up Sensitivity
High Temperature Operating Life
Early Failure Rate
Test Condition (Temp/Bias)
Result
P/F
AEC-Q100-002
P
AEC-Q100-011
P
AEC-Q100-004
AEC-Q100-008 and JESD22-A108, 150 C
Dynamic Operating Condition, Vcc = 5.2V
P
High Temperature Operating Life
Latent Failure Rate
JESD22-A108, 150 C /125C
Dynamic Operating Condition, Vcc = 5.75V
P
High Accelerated Saturation Test
(HAST)
JESD22-A110,130 C, 85%RH, 5.2V
Precondition: JESD22-A113 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH)
JESD22-A103, 150 C
P
JESD22- A104, -65 C to 150 C
Precondition: JESD22-A113 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH)
Mil-Std 883, Method 2011
P
P
Wire Bond Shear
JESD22-A102, 121 C, 100%RH, 15 PSIG
Precondition: JESD22-A113 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH)
AEC Q100-001
Wire Bond Pull
Mil-Std 883, Method 2011
P
Solderability
JESD22-B102
P
Electrical Distributions
AEC Q100-009
P
Physical Dimensions
JESD22B100 and B108
P
High Temperature Storage Life
Test
Temperature Cycle
Post Temperature Cycle
Wire Bond Pull
Pressure Cooker Test
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 8
P
P
P
P
Document No. 001-87292 Rev. *A
ECN #4353962
Reliability Test Data
QTP #: 130503
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
CY7C199D (7A199NC)
4226590
611300481
JT-CHINA
COMP
22
0
CY7C199D (7A199NC)
4226590
611300482
JT-CHINA
COMP
22
0
CY7C199D (7A199NC)
4226590
611300483
JT-CHINA
COMP
22
0
4226590
611300481
JT-CHINA
COMP
5
0
4226590
611300481
JT-CHINA
COMP
5
0
611300481
JT-CHINA
COMP
5
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BOND SHEAR
CY7C199D (7A199NC)
STRESS: BOND PULL
CY7C199D (7A199NC)
STRESS: CONSTRUCTIONAL ANALYIS
CY7C199D (7A199NC)
4226590
STRESS: DYE PENETRATION TEST
CY7C199D (7A199NC)
4226590
611300481
JT-CHINA
COMP
15
0
CY7C199D (7A199NC)
4226590
611300482
JT-CHINA
COMP
15
0
CY7C199D (7A199NC)
4226590
611300483
JT-CHINA
COMP
15
0
611300481
JT-CHINA
COMP
30
0
JT-CHINA
COMP
3
0
JT-CHINA
COMP
3
0
JT-CHINA
COMP
3
0
COMP
3
0
COMP
3
0
COMP
3
0
STRESS: ELECTRICAL DISTRIBUTION
CY7C199D (7A199NC)
4226590
STRESS: ESD-CHARGE DEVICE MODEL, 250V
CY7C199D (7A199NC)
4142187
611202758
STRESS: ESD-CHARGE DEVICE MODEL, 500V
CY7C199D (7A199NC)
4142187
611202758
STRESS: ESD-CHARGE DEVICE MODEL, 750V
CY7C199D (7A199NC)
4142187
611202758
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (500V)
CY7C199D (7A199NC)
4142187
611202758
JT-CHINA
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (1000V)
CY7C199D (7A199NC)
4142187
611202758
JT-CHINA
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (1500V)
CY7C199D (7A199NC)
4142187
611202758
JT-CHINA
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Document No. 001-87292 Rev. *A
ECN #4353962
Reliability Test Data
QTP #: 130503
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (2000V)
CY7C199D (7A199NC)
4142187
611202758
JT-CHINA
COMP
3
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 5.2V, Vcc Core
CY7C199D (7A199NC)
4226590
611302812
JT-CHINA
48
800
0
CY7C199D (7A199NC)
4226590
611302813
JT-CHINA
48
800
0
CY7C199D (7A199NC)
4226590
611302814
JT-CHINA
48
800
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 5.75V, Vcc Core
CY7C199D (7A199NC)
4226590
611300481
JT-CHINA
408
77
0
CY7C199D (7A199NC)
4226590
611300482
JT-CHINA
408
73
0
JT-CHINA
COMP
6
0
STRESS: STATIC LATCH-UP TESTING, 125C, +/-140ma
CY7C199D (7A199NC)
4142187
611202758
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.2V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY7C199D (7A199NC)
4226590
611300481
JT-CHINA
96
76
0
CY7C199D (7A199NC)
4226590
611300482
JT-CHINA
96
77
0
CY7C199D (7A199NC)
4226590
611300483
JT-CHINA
96
77
0
611300481
JT-CHINA
1000
77
0
STRESS: HIGH TEMP STORAGE
CY7C199D (7A199NC)
4226590
STRESS: PHYSICAL DIMENSION
CY7C199D (7A199NC)
4226590
611300481
JT-CHINA
COMP
10
0
CY7C199D (7A199NC)
4226590
611300482
JT-CHINA
COMP
10
0
CY7C199D (7A199NC)
4226590
611300483
JT-CHINA
COMP
10
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Document No. 001-87292 Rev. *A
ECN #4353962
Reliability Test Data
QTP #: 130503
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY7C199D (7A199NC)
4226590
611300481
JT-CHINA
96
77
0
CY7C199D (7A199NC)
4226590
611300481
JT-CHINA
168
77
0
CY7C199D (7A199NC)
4226590
611300482
JT-CHINA
96
77
0
CY7C199D (7A199NC)
4226590
611300482
JT-CHINA
168
77
0
CY7C199D (7A199NC)
4226590
611300483
JT-CHINA
96
77
0
CY7C199D (7A199NC)
4226590
611300483
JT-CHINA
168
77
0
CY7C199D (7A199NC)
4226590
611302812
JT-CHINA
COMP
15
0
CY7C199D (7A199NC)
4226590
611302813
JT-CHINA
COMP
15
0
CY7C199D (7A199NC)
4226590
611302814
JT-CHINA
COMP
15
0
STRESS: SOLDERABILITY
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CY7C199D (7A199NC)
4226590
611300481
JT-CHINA
500
77
0
CY7C199D (7A199NC)
4226590
611300481
JT-CHINA
1000
77
0
CY7C199D (7A199NC)
4226590
611300482
JT-CHINA
500
77
0
CY7C199D (7A199NC)
4226590
611300482
JT-CHINA
1000
77
0
CY7C199D (7A199NC)
4226590
611300483
JT-CHINA
500
77
0
CY7C199D (7A199NC)
4226590
611300483
JT-CHINA
1000
77
0
611300481
JT-CHINA
COMP
5
0
STRESS: POST TCT BOND PULL
CY7C199D (7A199NC)
4226590
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Document No. 001-87292 Rev. *A
ECN #: 4353962
Document History Page
Document Title:
QTP 130503: AUTOMOTIVE 28LD SOIC (3000 MILS) NIPDAU (Roughened), MSL3, 260C
REFLOW JCET-CHINA (JT) QUALIFICATION REPORT
Document Number:
001-87292
Rev. ECN
No.
**
3979128
*A
4353962
Orig. of
Change
ILZ
ILZ
Description of Change
Initial Spec Release
Sunset spec review
Updated front page to reflect new qual report template per
Spec 001-57716
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
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