Document No. 002-11990 Rev. ** ECN #: 5199937 Cypress Semiconductor Automotive Package Qualification Report QTP# 152603 VERSION ** April 2016 128-Lead TQFP (14x20x1.4mm) Pure Sn Leadfinish, Au Wire MSL3, 260C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] : OR VIA LINK A CYLINK CRM CASE Prepared By: Honesto Sintos (HSTO) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Engineer MTS Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 002-11990 Rev. ** ECN #: 5199937 PACKAGE QUALIFICATION HISTORY QTP Number 152603 Description of Qualification Purpose Qualification of Automotive 128-Lead TQFP (14x20x1.4mm) Package in ASEK-Taiwan (G) using 0.8mil Au wire with G631 mold compound, CRM-1076 die attach material, Copper with Ag plating leadframe and Pure Sn leadfinish at MSL3, 260C Reflow Temperature. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date Mar.2016 Document No. 002-11990 Rev. ** ECN #: 5199937 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: AZ128 Package Outline, Type, or Name: 128L TQFP 14x20x1.4mm Mold Compound Name/Manufacturer: EME-G631 / Sumitomo Mold Compound Flammability Rating: Class V-0 Mold Compound Alpha Emission Rate: N/A, not low alpha Oxygen Rating Index: 54% Lead Frame Designation: FMP Lead Frame Material: Copper with Ag plating Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Wafer backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Sumitomo Die Attach Material: CRM-1076 Die Attach Method: Epoxy Bond Diagram Designation: 001-97920 Wire Bond Method: Thermosonic Wire Material/Size: Au / 0.8mil Thermal Resistance Theta JA °C/W: 33C/W Package Cross Section Yes/No: No Assembly Process Flow: 49-41999M Name/Location of Assembly (prime) facility: ASEK-Taiwan (G) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No. 002-11990 Rev. ** ECN #: 5199937 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result P/F J-STD-020 Precondition: JESD22-A113 Moisture Sensitivity MSL 3 (192 Hrs., 30C, 60% RH, 260C Reflow) P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Dye Penetrant Test Criteria: No Package Crack P Electrostatic Discharge Human Body Model (ESD-HBM) AEC-Q100-002 500V/1000V/1500V/2000V/4000V P Electrostatic Discharge Charge Device Model (ESD-CDM) AEC-Q100-011 250V/500V/ 750V (corner pins) P Final Visual JESD22-B101B P High Accelerated Saturation Test (HAST) JESD22-A110, 130C, 5.5V, 85%RH Precondition: JESD22-A113 Moisture Sensitivity MSL 3 (192 Hrs., 30C, 60% RH, 260C Reflow) P High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate AEC-Q100-008 and JESD22-A108, 150°C Dynamic Operating Condition, Vcc Max = 2.07V JESD22-A108, 150°C Dynamic Operating Condition, Vcc Max =2.07V Physical Dimensions JESD22B100 and B108 P Pressure Cooker JESD22-A102, 121C, 100%RH, 15 Psig Precondition: JESD22-A113 Moisture Sensitivity MSL 3 (192 Hrs., 30C, 60% RH, 260C Reflow) P Acoustic Microscopy P P Post Temperature Cycle Wire Bond Pull Mil-Std 883, Method 2011 Solderability JESD22-B102 P Temperature Cycle JESD22-A104, -65C to 150C Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C P Wire Ball Shear AEC-Q100-001 P Wire Bond Pull Mil-Std 883, Method 2011 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P Document No. 002-11990 Rev. ** ECN #: 5199937 Reliability Test Data QTP #: 152603 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 22 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 21 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 22 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 150 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 150 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 150 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 150 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 150 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 150 0 5532014 611534014 ASEK-G COMP 5 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 15 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 15 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 15 0 Failure Mechanism STRESS: ACOUSTICS STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CYAT81688 (8A206803AH) STRESS: DYE PENETRANT STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.07V, Vcc Max CYAT81688 (8A206803AH) 5527015 611534013 ASEK-G 48 3233 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 48 207 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 48 3424 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 48 3438 0 STRESS: ESD-CHARGE DEVICE MODEL CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 250 3 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 500 3 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 750 3 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No. 002-11990 Rev. ** ECN #: 5199937 Reliability Test Data QTP #: 152603 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 500 3 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 1000 3 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 2000 3 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 4000 3 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 1637 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 7761 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 7193 0 STRESS: FINAL VISUAL STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.5V, PRE COND 192 HR 30C/60%RH, MSL3 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 96 80 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 96 80 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 96 79 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.07V, Vcc Max CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 408 82 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 408 82 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 408 82 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 96 80 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 168 80 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 96 80 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 168 79 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 96 80 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 168 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No. 002-11990 Rev. ** ECN #: 5199937 Reliability Test Data QTP #: 152603 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PHYSICAL DIMENSION CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 10 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 10 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 10 0 ASEK-G 500 5 0 STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL CYAT81688 (8A206803AH) 5532014 611534015 STRESS: PRE /POST LFR CRITICAL PARAMETER CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 80+2 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 80+2 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 80+2 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 15 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 15 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 15 0 STRESS: SOLDERABILITY STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 500 84 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 1000 79 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 500 82 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 1000 81 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 500 85 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 1000 85 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No. 002-11990 Rev. ** ECN #: 5199937 Document History Page Document Title: Document Number: QTP#152603: Automotive 128-Lead TQFP (14x20x1.4mm) Pure Sn Leadfinish, Au Wire MSL3, 260C Reflow ASEK-Taiwan (G) 002-11990 Rev. ECN Orig. of No. Change ** 5199937 HSTO Description of Change Initial spec release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8