QTP#152603:Automotive 128-Lead TQFP (14x20x1.4mm) Pure Sn Leadfinish, Au Wire MSL3, 260C Reflow ASEK-Taiwan (G)

Document No. 002-11990 Rev. **
ECN #: 5199937
Cypress Semiconductor Automotive
Package Qualification Report
QTP# 152603 VERSION **
April 2016
128-Lead TQFP (14x20x1.4mm)
Pure Sn Leadfinish, Au Wire
MSL3, 260C Reflow
ASEK-Taiwan (G)
FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] :
OR VIA LINK A CYLINK CRM CASE
Prepared By:
Honesto Sintos (HSTO)
Reliability Engineer
Reviewed By:
Rene Rodgers (RT)
Reliability Engineer MTS
Approved By:
Don Darling (DCDA)
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
Document No. 002-11990 Rev. **
ECN #: 5199937
PACKAGE QUALIFICATION HISTORY
QTP
Number
152603
Description of Qualification Purpose
Qualification of Automotive 128-Lead TQFP (14x20x1.4mm) Package in ASEK-Taiwan
(G) using 0.8mil Au wire with G631 mold compound, CRM-1076 die attach material,
Copper with Ag plating leadframe and Pure Sn leadfinish at MSL3, 260C Reflow
Temperature.
Company Confidential
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Page 2 of 8
Date
Mar.2016
Document No. 002-11990 Rev. **
ECN #: 5199937
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
AZ128
Package Outline, Type, or Name:
128L TQFP 14x20x1.4mm
Mold Compound Name/Manufacturer:
EME-G631 / Sumitomo
Mold Compound Flammability Rating:
Class V-0
Mold Compound Alpha Emission Rate:
N/A, not low alpha
Oxygen Rating Index:
54%
Lead Frame Designation:
FMP
Lead Frame Material:
Copper with Ag plating
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Wafer backgrind
Die Separation Method:
Wafer Saw
Die Attach Supplier:
Sumitomo
Die Attach Material:
CRM-1076
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-97920
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au / 0.8mil
Thermal Resistance Theta JA °C/W:
33C/W
Package Cross Section Yes/No:
No
Assembly Process Flow:
49-41999M
Name/Location of Assembly (prime) facility:
ASEK-Taiwan (G)
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-RA
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No. 002-11990 Rev. **
ECN #: 5199937
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
J-STD-020
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
Constructional Analysis
Criteria: Meet external and internal characteristics of Cypress
package
P
Dye Penetrant Test
Criteria: No Package Crack
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
AEC-Q100-002
500V/1000V/1500V/2000V/4000V
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
AEC-Q100-011
250V/500V/ 750V (corner pins)
P
Final Visual
JESD22-B101B
P
High Accelerated Saturation Test
(HAST)
JESD22-A110, 130C, 5.5V, 85%RH
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
High Temperature Operating Life
Early Failure Rate
High Temperature Operating Life
Latent Failure Rate
AEC-Q100-008 and JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.07V
JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max =2.07V
Physical Dimensions
JESD22B100 and B108
P
Pressure Cooker
JESD22-A102, 121C, 100%RH, 15 Psig
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
Acoustic Microscopy
P
P
Post Temperature Cycle
Wire Bond Pull
Mil-Std 883, Method 2011
Solderability
JESD22-B102
P
Temperature Cycle
JESD22-A104, -65C to 150C
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C
P
Wire Ball Shear
AEC-Q100-001
P
Wire Bond Pull
Mil-Std 883, Method 2011
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 8
P
Document No. 002-11990 Rev. **
ECN #: 5199937
Reliability Test Data
QTP #: 152603
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
22
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
21
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
22
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
150
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
150
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
150
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
150
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
150
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
150
0
5532014
611534014
ASEK-G
COMP
5
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
15
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
15
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
15
0
Failure Mechanism
STRESS: ACOUSTICS
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CYAT81688 (8A206803AH)
STRESS: DYE PENETRANT
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.07V, Vcc Max
CYAT81688 (8A206803AH)
5527015
611534013
ASEK-G
48
3233
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
48
207
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
48
3424
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
48
3438
0
STRESS: ESD-CHARGE DEVICE MODEL
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
250
3
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
500
3
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
750
3
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Document No. 002-11990 Rev. **
ECN #: 5199937
Reliability Test Data
QTP #: 152603
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
500
3
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
1000
3
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
2000
3
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
4000
3
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
1637
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
7761
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
7193
0
STRESS: FINAL VISUAL
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.5V, PRE COND 192 HR 30C/60%RH, MSL3
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
96
80
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
96
80
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
96
79
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.07V, Vcc Max
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
408
82
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
408
82
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
408
82
0
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
96
80
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
168
80
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
96
80
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
168
79
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
96
80
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
168
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Document No. 002-11990 Rev. **
ECN #: 5199937
Reliability Test Data
QTP #: 152603
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: PHYSICAL DIMENSION
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
10
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
10
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
10
0
ASEK-G
500
5
0
STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL
CYAT81688 (8A206803AH)
5532014
611534015
STRESS: PRE /POST LFR CRITICAL PARAMETER
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
80+2
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
80+2
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
80+2
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
15
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
15
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
15
0
STRESS: SOLDERABILITY
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
500
84
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
1000
79
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
500
82
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
1000
81
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
500
85
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
1000
85
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Document No. 002-11990 Rev. **
ECN #: 5199937
Document History Page
Document Title:
Document Number:
QTP#152603: Automotive 128-Lead TQFP (14x20x1.4mm) Pure Sn Leadfinish, Au Wire MSL3,
260C Reflow ASEK-Taiwan (G)
002-11990
Rev. ECN
Orig. of
No.
Change
**
5199937 HSTO
Description of Change
Initial spec release
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
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