QTP 94101 56-Lead QFN (Quad Flat No-Lead) (8 x 8 x 1.0 mm) NiPdAu-Ag, MSL3, 260C Reflow, Amkor- Philippines (MB).pdf

Document No.001-89593 Rev. *A
ECN # 4535020
Cypress Semiconductor
Package Qualification Report
QTP# 094101 VERSION*A
October, 2014
56-Lead QFN (Quad Flat No-Lead)
(8 x 8 x 1.0 mm)
NiPdAu-Ag, MSL3, 260°C Reflow,
Amkor- Philippines (MB)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-89593 Rev. *A
ECN # 4535020
PACKAGE QUALIFICATION HISTORY
QTP
Number
094101
Description of Qualification Purpose
Qualify 56 QFN 8x8x1.0mm Saw Type Pb-Free using AMK-06 Epoxy, Nitto 7470-LA
Mold Compound and NiPdAu-Ag Lead Finish at MSL3/260 °C Reflow Temperature.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
Date
Apr 10
Document No.001-89593 Rev. *A
ECN # 4535020
MAJOR PACKAGE INFORMATION FOR THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
LT56
56-Lead QFN
Nitto 7470-LA
UL-94
Oxygen Rating Index:
NA
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
NiPdAu-Ag
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Sawing
Die Attach Supplier:
Henkel
Die Attach Material:
AMK-06
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-47984
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au/0.8 mil
Thermal Resistance Theta JA °C/W:
23.27°C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
001-20659
Name/Location of Assembly (prime) facility:
Amkor-Philippines (MB)
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST/FINISH DESCRIPTION
Test Location
CML-R
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No.001-89593 Rev. *A
ECN # 4535020
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
Acoustic Microscopy
J-STD-020
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C
P
Ball Shear
JESD22-B116, Cpk : 1.33, Ppk : 1.66
P
Bond Pull
MIL-STD-883 – Method 2011, 1.33, Ppk : 1.66
P
Constructional Analysis
Die Shear
Criteria: Meet external and internal characteristics of
Cypress package
P
MIL-STD-883, Method 2019
Per die size:
<3000 sq. mils = 1.2 kgf
30001-5000 sq. mils = 1.2 kgf
>5001 sq. mils = 1.2 kgf
P
Test to determine the existence and extent of cracks,
Dye Penetration
Criteria: No Package Crack
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V
JESD22-C101
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
2,200V
JEDEC EIA/JESD22-A114
P
High Accelerated Saturation Test
(HAST)
JEDEC STD 22-A110: 130°C, 5.0V, 85% RH
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C
P
Internal Visual
MIL-STD-883-2014
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Pressure Cooker
JESD22-A102: 121°C, 100%RH, 15 Psig
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C
P
Solderability, Steam Aged
J-STD-002, JESD22-B102
95% solder coverage minimum
Temperature Cycle
Thermal Shock
MIL-STD-883, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C
P
MIL-STD-883, Method 1011, Condition B, -55 C to
125C and JESD22-A106, Condition C, -55 C to 125C
X-Ray
P
MIL-STD-883 2012
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 7
P
P
Document No.001-89593 Rev. *A
ECN # 4535020
Reliability Test Data
QTP #:094101
Device
Fab Lot#
Assy Lot # Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
COMP
15
0
CY7C65640A (7C65642EC)
4823626
610841285
MB-Phil
COMP
15
0
CYWUSB6934 (7B6934BC)
4803351
610839924
MB-Phil
COMP
15
0
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
COMP
10
0
CY7C65640A (7C65642EC)
4823626
610841285
MB-Phil
COMP
10
0
4823626
610841281
MB-Phil
COMP
10
0
4823626
610841281
MB-Phil
COMP
5
0
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
COMP
10
0
CY7C65640A (7C65642EC)
4823626
610841285
MB-Phil
COMP
10
0
STRESS: BALL SHEAR
STRESS: BOND PULL
CY7C65640A (7C65642EC)
STRESS: CONSTRUCTIONAL ANALYSIS
CY7C65640A (7C65642EC)
STRESS: DIE SHEAR
STRESS: DYE PENETRANT TEST
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
COMP
15
0
CY7C65640A (7C65642EC)
4823626
610841285
MB-Phil
COMP
15
0
CYWUSB6934 (7B6934BC)
4803351
610839924
MB-Phil
COMP
15
0
STRESS: ESD-CHARGE DEVICE MODEL, 500V
CY7C65640A (7C65642EC)
4846647
0
MB-Phil
COMP
9
0
CY7C65640A (7C65642EC)
4846647
0
MB-Phil
COMP
9
0
8
0
STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (2,200V)
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
COMP
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.0V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
128
77
0
CYWUSB6934 (7B6934BC)
4803351
610839924
MB-Phil
128
77
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No.001-89593 Rev. *A
ECN # 4535020
Reliability Test Data
QTP #:094101
Device
Fab Lot#
Assy Lot # Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: INTERNAL VISUAL
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
COMP
5
0
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
168
77
0
CYWUSB6934 (7B6934BC)
4803351
610839924
MB-Phil
168
77
0
STRESS: PHYSICAL DIMENSION
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
COMP
30
0
CY7C65640A (7C65642EC)
4823626
610841285
MB-Phil
COMP
30
0
CYWUSB6934 (7B6934BC)
4803351
610839924
MB-Phil
COMP
30
0
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
COMP
5
0
CY7C65640A (7C65642EC)
4823626
610841285
MB-Phil
COMP
5
0
CYWUSB6934 (7B6934BC)
4803351
610839924
MB-Phil
COMP
5
0
STRESS: SOLDERABILITY
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
500
77
0
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
1000
77
0
CY7C65640A (7C65642EC)
4823626
610841285
MB-Phil
500
77
0
CY7C65640A (7C65642EC)
4823626
610841285
MB-Phil
1000
77
0
CYWUSB6934 (7B6934BC)
4803351
610839924
MB-Phil
500
77
0
CYWUSB6934 (7B6934BC)
4803351
610839924
MB-Phil
1000
77
0
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
200
77
0
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
1000
77
0
CY7C65640A (7C65642EC)
4823626
610841281
MB-Phil
COMP
15
0
CY7C65640A (7C65642EC)
4823626
610841285
MB-Phil
COMP
15
0
STRESS: THERMAL SHOCK
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-89593 Rev. *A
ECN # 4535020
Document History Page
Document Title:
QTP# 094101: 56-LEAD QFN (QUAD FLAT NO-LEAD) (8X8X1.0MM),NIPDAU-AG, MSL3, 260C,
AMKOR-PHILIPPINES (MB)
001-89593
Document Number:
Rev. ECN
No.
**
4149321
*A
4535020
Orig. of
Change
JYF
JYF
Description of Change
Initial Spec Release.
Updated QTP title page for template alignment.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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