Document No.001-89593 Rev. *A ECN # 4535020 Cypress Semiconductor Package Qualification Report QTP# 094101 VERSION*A October, 2014 56-Lead QFN (Quad Flat No-Lead) (8 x 8 x 1.0 mm) NiPdAu-Ag, MSL3, 260°C Reflow, Amkor- Philippines (MB) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-89593 Rev. *A ECN # 4535020 PACKAGE QUALIFICATION HISTORY QTP Number 094101 Description of Qualification Purpose Qualify 56 QFN 8x8x1.0mm Saw Type Pb-Free using AMK-06 Epoxy, Nitto 7470-LA Mold Compound and NiPdAu-Ag Lead Finish at MSL3/260 °C Reflow Temperature. Company Confidential A printed copy of this document is considered uncontrolled. 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Page 2 of 7 Date Apr 10 Document No.001-89593 Rev. *A ECN # 4535020 MAJOR PACKAGE INFORMATION FOR THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: LT56 56-Lead QFN Nitto 7470-LA UL-94 Oxygen Rating Index: NA Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Sawing Die Attach Supplier: Henkel Die Attach Material: AMK-06 Die Attach Method: Epoxy Bond Diagram Designation: 001-47984 Wire Bond Method: Thermosonic Wire Material/Size: Au/0.8 mil Thermal Resistance Theta JA °C/W: 23.27°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-20659 Name/Location of Assembly (prime) facility: Amkor-Philippines (MB) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST/FINISH DESCRIPTION Test Location CML-R Note: Please contact a Cypress Representative for other packages availability. 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Page 3 of 7 Document No.001-89593 Rev. *A ECN # 4535020 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P Ball Shear JESD22-B116, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, 1.33, Ppk : 1.66 P Constructional Analysis Die Shear Criteria: Meet external and internal characteristics of Cypress package P MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Test to determine the existence and extent of cracks, Dye Penetration Criteria: No Package Crack P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V JESD22-C101 P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V JEDEC EIA/JESD22-A114 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C, 5.0V, 85% RH Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P Pressure Cooker JESD22-A102: 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P Solderability, Steam Aged J-STD-002, JESD22-B102 95% solder coverage minimum Temperature Cycle Thermal Shock MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C X-Ray P MIL-STD-883 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P P Document No.001-89593 Rev. *A ECN # 4535020 Reliability Test Data QTP #:094101 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil COMP 15 0 CY7C65640A (7C65642EC) 4823626 610841285 MB-Phil COMP 15 0 CYWUSB6934 (7B6934BC) 4803351 610839924 MB-Phil COMP 15 0 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil COMP 10 0 CY7C65640A (7C65642EC) 4823626 610841285 MB-Phil COMP 10 0 4823626 610841281 MB-Phil COMP 10 0 4823626 610841281 MB-Phil COMP 5 0 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil COMP 10 0 CY7C65640A (7C65642EC) 4823626 610841285 MB-Phil COMP 10 0 STRESS: BALL SHEAR STRESS: BOND PULL CY7C65640A (7C65642EC) STRESS: CONSTRUCTIONAL ANALYSIS CY7C65640A (7C65642EC) STRESS: DIE SHEAR STRESS: DYE PENETRANT TEST CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil COMP 15 0 CY7C65640A (7C65642EC) 4823626 610841285 MB-Phil COMP 15 0 CYWUSB6934 (7B6934BC) 4803351 610839924 MB-Phil COMP 15 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY7C65640A (7C65642EC) 4846647 0 MB-Phil COMP 9 0 CY7C65640A (7C65642EC) 4846647 0 MB-Phil COMP 9 0 8 0 STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (2,200V) CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil COMP STRESS: HI-ACCEL SATURATION TEST, 130C, 5.0V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil 128 77 0 CYWUSB6934 (7B6934BC) 4803351 610839924 MB-Phil 128 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-89593 Rev. *A ECN # 4535020 Reliability Test Data QTP #:094101 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: INTERNAL VISUAL CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil COMP 5 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil 168 77 0 CYWUSB6934 (7B6934BC) 4803351 610839924 MB-Phil 168 77 0 STRESS: PHYSICAL DIMENSION CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil COMP 30 0 CY7C65640A (7C65642EC) 4823626 610841285 MB-Phil COMP 30 0 CYWUSB6934 (7B6934BC) 4803351 610839924 MB-Phil COMP 30 0 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil COMP 5 0 CY7C65640A (7C65642EC) 4823626 610841285 MB-Phil COMP 5 0 CYWUSB6934 (7B6934BC) 4803351 610839924 MB-Phil COMP 5 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil 500 77 0 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil 1000 77 0 CY7C65640A (7C65642EC) 4823626 610841285 MB-Phil 500 77 0 CY7C65640A (7C65642EC) 4823626 610841285 MB-Phil 1000 77 0 CYWUSB6934 (7B6934BC) 4803351 610839924 MB-Phil 500 77 0 CYWUSB6934 (7B6934BC) 4803351 610839924 MB-Phil 1000 77 0 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil 200 77 0 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil 1000 77 0 CY7C65640A (7C65642EC) 4823626 610841281 MB-Phil COMP 15 0 CY7C65640A (7C65642EC) 4823626 610841285 MB-Phil COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-89593 Rev. *A ECN # 4535020 Document History Page Document Title: QTP# 094101: 56-LEAD QFN (QUAD FLAT NO-LEAD) (8X8X1.0MM),NIPDAU-AG, MSL3, 260C, AMKOR-PHILIPPINES (MB) 001-89593 Document Number: Rev. ECN No. ** 4149321 *A 4535020 Orig. of Change JYF JYF Description of Change Initial Spec Release. Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7