Document No. 001-85278 Rev. *A ECN #: 4621572 Cypress Semiconductor Package Qualification Report QTP# 063711 VERSION*A January, 2015 20/28-Lead (SSOP) (209mils) NiPdAu, MSL3, 260C Solder Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro (RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No. 001-85278 Rev. *A ECN #: 4621572 PRODUCT QUALIFICATION HISTORY QTP Number 063711 Description of Qualification Purpose Qualify CML-RA #9 for 20/28-Lead SSOP (209mils), MSL3, 260C Solder Reflow Temperature Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Date Comp. Oct 06 Document No. 001-85278 Rev. *A ECN #: 4621572 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: SP28 28-Lead Shrunk Small Outline Package (SSOP) KE G3000DA V-O per UL 94 Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Sawing Die Attach Supplier: Dexter Die Attach Material: QMI 509 Die Attach Method: Epoxy Bond Diagram Designation Not Applicable Wire Bond Method: Thermosonic Wire Material/Size: Au. 1.0 mil Thermal Resistance Theta JA °C/W: 96°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: Not Applicable Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No. 001-85278 Rev. *A ECN #: 4621572 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) P Ball Shear JESD22-B116 P Bond Pull MIL-STD-883 – Method 2011 P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Dye Penetration Test to determine the existence and extent of cracks, Criteria: No Package Crack P External Visual MIL-PRF-38535, MIL-STD-883, METHOD 2009 P Glue Adhesion JESD22-A111 P Physical Dimension MIL-STD-1835, JESD22-B100 P Internal Visual MIL-STD-883-2014 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C, 5.25V, 85%RH Precondition: JESD22 Moisture Sensitivity Level P (192 Hrs., 30°C, 60% RH, 260°C Reflow) JESD22-A102: 121°C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) P Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) P X-Ray MIL-STD-883-2012 P Pressure Cooker Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 Document No. 001-85278 Rev. *A ECN #: 4621572 Reliability Test Data QTP #: Device 063711 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C29466 (8C29466A) 2552819 610652214 CML-RA COMP 15 0 CY8C29466 (8C29466A) 2552819 610652198 CML-RA COMP 15 0 CY8C29466 (8C29466A) 2552819 610652199 CML-RA COMP 15 0 2552819 610652214 CML-RA COMP 10 0 2552819 610652214 CML-RA COMP 10 0 CY8C29466 (8C29466A) 2552819 610652214 CML-RA COMP 15 0 CY8C29466 (8C29466A) 2552819 610652198 CML-RA COMP 15 0 CY8C29466 (8C29466A) 2552819 610652199 CML-RA COMP 15 0 CY8C29466 (8C29466A) 2552819 610652214 CML-RA COMP 15 0 CY8C29466 (8C29466A) 2552819 610652198 CML-RA COMP 15 0 CY8C29466 (8C29466A) 2552819 610652199 CML-RA COMP 15 0 2552819 610652214 CML-RA COMP 15 0 CY8C29466 (8C29466A) 2552819 610652214 CML-RA COMP 5 0 CY8C29466 (8C29466A) 2552819 610652198 CML-RA COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR CY8C29466 (8C29466A) STRESSBOND PULL CY8C29466 (8C29466A) STRESS: DYE PENTRATION STRESS: GLUE ADHESION STRESS: EXTERNALVISUAL CY8C29466 (8C29466A) STRESS: INTERNAL VISUAL STRESS: PHYSICAL DIMENSION CY8C29466 (8C29466A) 2552819 610652214 CML-RA COMP 5 0 CY8C29466 (8C29466A) 2552819 610652199 CML-RA COMP 5 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HRS, 30C/60%RH, MSL3 CY8C29466 (8C29466A) 2552819 610652214 CML-RA 128 44 0 STRESS: PRESSURE COOKER TEST, 121C 100%RH, 15 Psig, PRE COND 192 HRS, 30C/60%RH, MSL3 CY8C29466 (8C29466A) 2552819 610652214 CML-RA 168 45 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No. 001-85278 Rev. *A ECN #: 4621572 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 063711 Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC CONDITION C, -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CY8C29466 (8C29466A) 2552819 610652214 CML-RA 300 45 0 CY8C29466 (8C29466A) 2552819 610652198 CML-RA 300 44 0 CY8C29466 (8C29466A) 2552819 610652199 CML-RA 300 45 0 CY8C29466 (8C29466A) 2552819 610652214 CML-RA COMP 15 0 CY8C29466 (8C29466A) 2552819 610652198 CML-RA COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No. 001-85278 Rev. *A ECN #: 4621572 Document History Page Document Title: Document Number: Rev. ECN No. ** 3840215 *A 4621572 QTP No. 063711: 20/28-Lead (SSOP) (209 mils), NiPdAu, MSL3, 260C, CML-RA 001-85278 Orig. of Change HLR JYF Description of Change Initial Spec Release. Sunset review: Updated QTP title page and Reliability Tests Performed table (Acoustic,Ball Shear, Bond Pull, EVI/IVI, Physical Dimension, HAST,PCT,TCT) for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7