Document No.001-89589 Rev. *A ECN # 4535338 Cypress Semiconductor Package Qualification Report QTP# 092006 VERSION*A October, 2014 56-Lead Saw QFN (Quad Flat No-Lead) (8 x 8 x 1.0mm) NiPdAu, MSL3, 260°C Reflow, CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-89589 Rev. *A ECN # 4535338 PACKAGE QUALIFICATION HISTORY QTP Number 092006 Description of Qualification Purpose Qualify 56-Lead Saw QFN (8 x 8 x 1mm), NiPdAu, using Nitto GE7470LA Mold Compound, QMI519 Epoxy, MSL3, 260C Reflow assembled at CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date May 09 Document No.001-89589 Rev. *A ECN # 4535338 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate: LT56 32-Lead Saw Quad Flat No Lead (QFN) Nitto GE7470LA V-O per UL94 2 0.003-0.002 cm /h Oxygen Rating Index: >28% Lead Frame Material: Copper based - CDA 194 Full Hard Lead Finish, Composition / Thickness: NiPdAu / Ni-20 to 80, Pd-0.8min, Au-0.2-0.5 micro inch Die Backside Preparation Method/Metallization: Die Separation Method: Grinding Die Attach Supplier: Henkel Die Attach Material: QMI519 Die Attach Method: Epoxy Wire Bond Method: Thermosonic Wire Material/Size: AuPd/0.8mil Thermal Resistance Theta JA °C/W: 8.38°C/W Package Cross Section Yes/No: No Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C Blade Sawing ELECTRICAL TEST/FINISH DESCRIPTION Test Location CML-RA Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 8 Document No.001-89589 Rev. *A ECN # 4535338 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Temperature Cycle Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P JESD22-A102: 121°C, 100%RH, 15 Psig Pressure Cooker Test Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P JEDEC STD 22-A110: 130°C, 3.8V, 85% RH High Accelerated Saturation Test (HAST) Precondition: JESD22 Moisture Sensitivity MSL3 P 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C JESD22-A103:150C, no bias High Temp Storage P J-STD-020 Acoustics Microscopy Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P Ball Shear JESD22-B116, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, 1.33, Ppk : 1.66 P Criteria: Meet external and internal characteristics of Constructional Analysis Die Shear Cypress package MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P P Test to determine the existence and extent of cracks, Dye Penetration Criteria: No Package Crack P Final Visual JESD22-B101 P Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P J-STD-002, JESD22-B102 Solderability, Steam Aged 95% solder coverage minimum P MIL-STD-883, Method 1011, Condition B, -55 C to Thermal Shock X-ray 125C and JESD22-A106, Condition C, -55 C to 125C MIL-STD-883 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P Document No.001-89589 Rev. *A ECN # 4535338 Reliability Test Data QTP #:092006 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902567-2 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902567-3 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902568-2 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902568-3 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 10 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA COMP 10 0 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 10 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA COMP 10 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 5 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA COMP 5 0 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902567-2 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902568-2 CML-RA COMP 15 0 STRESS: DIE SHEAR STRESS: DYE PENETRANT TEST CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 5 0 CY7C65640A (7C65642EC) 4841890 610902567-2 CML-RA COMP 5 0 CY7C65640A (7C65642EC) 4841890 610902567-3 CML-RA COMP 5 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA COMP 5 0 CY7C65640A (7C65642EC) 4841890 610902568-2 CML-RA COMP 5 0 CY7C65640A (7C65642EC) 4841890 610902568-3 CML-RA COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-89589 Rev. *A ECN # 4535338 Reliability Test Data QTP #:092006 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: FINAL VISUAL CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 499 0 CY7C65640A (7C65642EC) 4841890 610902567-2 CML-RA COMP 285 0 CY7C65640A (7C65642EC) 4841890 610902567-3 CML-RA COMP 200 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA COMP 498 0 CY7C65640A (7C65642EC) 4841890 610902568-2 CML-RA COMP 248 0 CY7C65640A (7C65642EC) 4841890 610902568-3 CML-RA COMP 200 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 3.8V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA 128 77 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA 128 77 0 STRESS: HIGH TEMP STORAGE CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA 500 76 0 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA 1000 76 0 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 5 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA 168 80 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA 168 80 0 STRESS: PHYSICAL DIMENSION CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 30 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA COMP 30 0 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 3 0 CY7C65640A (7C65642EC) 4841890 610902567-2 CML-RA COMP 3 0 CY7C65640A (7C65642EC) 4841890 610902567-3 CML-RA COMP 3 0 STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-89589 Rev. *A ECN # 4535338 Reliability Test Data QTP #:092006 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA 500 80 0 CY7C65640A (7C65642EC) 4841890 610902567-2 CML-RA 500 79 0 CY7C65640A (7C65642EC) 4841890 610902567-3 CML-RA 500 80 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA 500 80 0 CY7C65640A (7C65642EC) 4841890 610902568-2 CML-RA 500 80 0 CY7C65640A (7C65642EC) 4841890 610902568-3 CML-RA 500 80 0 4841890 610902567-1 CML-RA 200 80 0 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902567-2 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902568-1 CML-RA COMP 15 0 CY7C65640A (7C65642EC) 4841890 610902568-2 CML-RA COMP 15 0 STRESS: THERMAL SHOCK CY7C65640A (7C65642EC) STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-89589 Rev. *A ECN # 4535338 Document History Page Document Title: QTP# 092006:56-LEAD SAW QFN (QUAD FLAT NO-LEAD) (8 X 8 X 1.0MM) NIPDAU, MSL3, 260C REFLOW, CML-RA 001-89589 Document Number: Rev. ECN No. ** 4149284 *A 4535338 Orig. of Change JYF JYF Description of Change Initial Spec Release. Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8