Document No. 001-91144 Rev. *B ECN #: 4624766 Cypress Semiconductor Product Qualification Report QTP # 140703 VERSION*B January 2014 PSoC®4 Family S8PF-10P Technology, Fab 4 CMI CY8C4013 CY8C4014 Programmable System-on-Chip (PSoC) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Zhaomin Ji Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 PRODUCT QUALIFICATION HISTORY QTP Number 083401 113905 123502 140703 Description of Qualification Purpose Qualify SONOS S8DI-5R Technology in Fab 4 using PsoC 8C20066BC Krypton Device Qualify device 8C20400BC S8P12-10P Technology Fabricated at Fab4 (CMI) Qualification of PSoC4A Device 8C44200AC, S8PF-10P Technology in CMI (Fab 4) Qualification of CY8C4013/ CY8C4014 PSoC4 Family, S8PF-10P Technology in CMI (Fab 4) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 19 Date Comp Jan 09 Jan 12 Apr 13 Feb 14 Document No. 001-91144 Rev. *B ECN #: 4624766 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: To qualify CY8CMBR3 CapSense Controller device family, S8PF-10P Technology in CMI (Fab 4) Marketing Part #: CY8C4013, CY8C4014 Device Description: 1.8V core, Commercial/ Industrial Programmable System on a Chip Cypress Division: Cypress Semiconductor – Programmable Systems Division TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 5 Metal Composition: Passivation Type and Thickness: Metal 1: 100A Ti / 3200A Al-0.5%Cu / 300A TiW Metal 2: 100A Ti / 3200A Al-0.5% Cu/ 350A TiW Metal 3: 150A Ti / 7200A Al-0.5%Cu / 350A TiW Metal 4: 150A Ti / 7200A Al-0.5%Cu / 350A TiW Metal 5: 300A Ti / 12000A Al-0.5%Cu / 300A TiW 1000A NFUSOX / 6000A Nitride Generic Process Technology/Design Rule (-drawn): S8 / 0.13um SiO2 / 32A & SiO2 / 120A Gate Oxide Material/Thickness (MOS): Name/Location of Die Fab (prime) Facility: Fab 4, CMI-Minnesota Die Fab Line ID/Wafer Process ID: S8PF-10P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Oxygen Rating Index: Lead Frame Material: Lead Finish, Composition / Thickness: Die Backside Preparation Method/Metallization: Die Separation Method: Die Attach Material: Die Attach Method: Wire Bond Method: CML Autoline (RA) QFN16 (LQ16A) CML Autoline (RA) – Nitto 7470 , CEL9220 UL94 – V0 None CML Autoline (RA) – Copper CML Autoline – NiPdAu Backgrind Wire Material/Size: 100% Saw CML Autoline (RA) – Dexter QMI519 CML Autoline (RA) – Epoxy Thermosonic 0.8mil CuPd Name/Location of Assembly (prime) facility: MSL Level Reflow Profile CML-RA 3 260C MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Oxygen Rating Index: Lead Frame Material: Lead Finish, Composition / Thickness: Die Backside Preparation Method/Metallization: Die Separation Method: Die Attach Material: Die Attach Method: Wire Bond Method: ASE-KH (G) QFN16 (LQ16A) ASE-KH (G) – G700 UL94 – V0 None ASE-KH (G) – Copper ASE-KH – Pure Sn Backgrind Wire Material/Size: 100% Saw ASE-KH (G) – FH900 ASE-KH (G) - Film Thermosonic 0.8mil CuPd Name/Location of Assembly (prime) facility: MSL Level Reflow Profile ASE-KH 3 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA, ASE-KH Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 PACKAGE AVAILABILITY PACKAGE ASSEMBLY FACILITY SITE WIRE QTP NUMBER 16-Lead QFN CML-RA CuPd 140804 16-Lead QFN ASE-K CuPd 134505 16/24 -Lead QFN UTL-UT CuPd 141704 8-Lead SOIC UTL-UT CuPd 134513 16-Lead SOIC UTL-UT CuPd 134506 28-Lead SSOP CML-RA CuPd 145006 28-Lead SSOP JCET-JT CuPd 145005 Note: Please contact a Cypress Representative for other package availability Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Temperature Steady State life Low Temperature Operating Life Low Temperature Storage Life High Accelerated Saturation Test (HAST) Temperature Cycle Pressure Cooker Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc Max=2.1V/2.07V, 150°C JESD22-A-108 Dynamic Operating Condition, Vcc Max=2.1V/2.07, 150°C JESD22-A-108 150°C, 2.1V, Vcc Max JESD22-A-108 -30°C, 2.1V JESD22-A-108 -40°C, No Bias 130°C, 5.25V, 85%RH, JESD22-A-110 Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C -650C to 1500C, JESD22-A-104 Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C 121°C, 100%RH, 15 Psig, JESD22-A102 Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C Result P/F P P P P P P P P Acoustic Microscopy J-STD-020 P Age Bond Strength 200C, 4hrs MIL-STD-883, Method 883-2011 P Ball Shear JESD22-B116 P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Current Density Meets the Technology Device Level Reliability Specifications P Data Retention 150°C, No Bias JESD22-A117 and JESD22-A103 P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V/3,300V/5000V/6000V/7,000V/8,000V JESD22, Method A114 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V/1,000V/1,250V/1,500V/1,750V JESD22-C101 P Endurance Test MIL-STD-883, Method 883-1033/ JESD22-A117 P Static Latch-up 125C, +/- 140mA, 85C,+/-180mA, 85C,+/-300mA JESD 78 P SEM Analysis MIL-STD-883, Method 2018 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 RELIABILITY FAILURE RATE SUMMARY Stress/Test 1. 2. Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate High Temperature Operating Life Early Failure Rate 3,025 Devices 1 N/A N/A 330 PPM High Temperature Operating Life Long Term Failure Rate 778,000 DHRs 0 0.7 170 7 FIT 1 2 EFR devices number is based on QTP#132802 EFR data only LFR device hours is based on QTP#083401, QTP#113905, QTP#123502 and QTP132802 LFR data. 3 2 3 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T2 T1 where: EA =The Activation Energy of the defect mechanism. -5 K = Boltzmann’s constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 15 0 STRESS: AGE BOND STRENGTH CY8C20566 (8C20566AC) 4827949 610844164 CML-R COMP 3 0 CY8C20466 (8C20466AC) 4804681 610822808 Malaysia-CA COMP 3 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 3 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 78 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 500 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 1000 78 0 CY8C20566 (8C20566AC) 4810486 610830786 CML-R 168 77 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 168 77 0 CY8C20566 (8C20566AC) 4827949 610844164 CML-R 168 79 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 168 76 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 500 9 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 9 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 9 0 N/A N/A COMP 1 0 STRESS: SEM CROSS SECTION CY8C20066 (8C20066AC) 4810486 STRESS: STATIC LATCH-UP (85C, 8.25V) CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4837410 410.23.02 Promex 6 0 COMP Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 2200 8 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 2200 8 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 2200 8 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (3,300V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 3300 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 3300 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 3300 3 0 STRESS: ESD-MACHINE MODEL, (200V) CY8C20236A (8C202662A) 4126494 611143319 KOREA-L 200 5 0 CY8C20236A (8C202662A) 4125077 611143627 PHIL-MB 200 5 0 STRESS: ESD-MACHINE MODEL, (220V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 220 6 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 220 6 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 220 6 0 STRESS: ESD-MACHINE MODEL, (275V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 275 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 275 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 275 3 0 STRESS: ESD-MACHINE MODEL, (330V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 330 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 330 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 330 3 0 STRESS: DYNAMIC LATCH-UP (125C, 8.5V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8C20566 (8C20566AC) 4827949 610844164 CML-R 48 1002 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 48 1008 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 48 1004 1 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 48 1004 0 STRESS: Read NV Latch (1) HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 5V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 48 45 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 48 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 5V, Vcc Max) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 96 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 500 390 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.1V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 80 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 77 0 STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V CY8C20566 (8C20566AC) 4815537 610835437 CML-R 500 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 500 77 0 (1) Destroyed during failure analysis Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 256 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 128 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 333 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 288 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 288 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 77 0 Reliability Test Data ER114031 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: LOW TEMPERATURE STORAGE, -40C, No Bias CY8C20236A (8C202662A) 4137730 611155459 L-KOREA 1000 100 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA COMP 15 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN COMP 10 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN COMP 10 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN COMP 10 0 STRESS: BOND PULL STRESS: DATA RETENTION, 150C CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 1000 80 0 4130520 611147744 G-TAIWAN COMP 15 0 4130520 611147744 G-TAIWAN 168 80 0 CML-RA COMP 9 0 3 0 8 0 STRESS: DYE PENETRANT TEST CY8CTMA443 (8C20401A) STRESS : ENDURANCE CY8CTMA443 (8C20401A) STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8CTMA443 (8C20401B) 4140358 611153802 STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114-B, (1100V) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA COMP STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114-B, (1600V) CY8CTMA443 (8C20401B) 4140358 611153801 CML-RA COMP STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 128 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 128 78 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (150C, 6.0V, Vcc Max) CY8CTMA443 (8C20401A) 4130520 611147745 G-TAIWAN 48 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 48 1492 0 CY8CTMA443 (8C20401B) 4140358 611153800 CML-RA 48 1074 2 ISB Deep Sleep, CAR#201201012 CY8CTMA443 (8C20401B) 4140358 611153800 CML-RA 48 418 1 ISB Deep Sleep, CAR#201201012 CY8CTMA443 (8C20401B) 4141585 611156224 G-TAIWAN 48 1500 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 48 1000 0 CY8CTMA443 (8C20401A) 4131142 611148870 G-TAIWAN 48 500 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 80 116 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 500 116 0 4130520 611147744 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL CY8CTMA443 (8C20401A) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 168 77 0 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 288 77 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 168 80 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 288 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 168 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 288 80 0 STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 500 83 0 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 1000 83 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 500 79 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 1000 79 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 1000 80 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN 1000 80 0 G-TAIWAN 200 80 0 G-TAIWAN COMP 2 0 COMP 6 0 STRESS: THERMAL SHOCK (COND. B, -55C TO 125C) CY8CTMA443 (8C20401A) 4130520 611147744 STRESS: THERMAL JUNCTION MEASUREMENT CY8CTMA443 (8C20401A) 4130520 611147744 STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, +/-140mA) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 123502 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: DATA RETENTION, PLASTIC, 150C CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 500 70 0 CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 1000 70 0 CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 168 80 0 CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 500 80 0 611302905 TAIWAN-G COMP 9 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C4245 (8CC44200A) 4251883 CY8C4245 (8CC44200A) 4251883 611303718 TAIWAN-G COMP 9 0 CY8C4245 (8CC44200A) 4251883 611302173 CML-RA COMP 9 0 611302905 TAIWAN-G COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, (1000V) CY8C4245 (8CC44200A) 4251883 CY8C4245 (8CC44200A) 4251883 611303718 TAIWAN-G COMP 3 0 CY8C4245 (8CC44200A) 4251883 611302173 CML-RA COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, (1250V) CY8C4245 (8CC44200A) 4251883 611302905 TAIWAN-G COMP 3 0 CY8C4245 (8CC44200A) 4251883 611303718 TAIWAN-G COMP 3 0 CY8C4245 (8CC44200A) 4251883 611302173 CML-RA 3 0 9 0 TAIWAN-G COMP 3 0 TAIWAN-G COMP 6 0 TAIWAN-G COMP 2 0 TAIWAN-G COMP 2 0 COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8C4245 (8CC44200A) 4251883 611302905 TAIWAN-G COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (3,300V) CY8C4245 (8CC44200A) 4251883 611302905 STRESS: STATIC LATCH-UP (85C, 140mA) CY8C4245 (8CC44200A) 4251883 611302905 STRESS: STATIC LATCH-UP (85C, 180mA) CY8C4245 (8CC44200A) 4251883 611302905 STRESS: STATIC LATCH-UP (125C, 140mA) CY8C4245 (8CC44200A) 4251883 611302905 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CY8C4245 (8CC44200A) 4251883 611303750 TAIWAN-G 48 189 0 CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 48 1111 0 CY8C4245 (8CC44200A) 4251883 611307128N TAIWAN-G 48 1093 0 CY8C4245 (8CC44200A) 4251883 611308275 TAIWAN-G 48 1049 0 CY8C4245 (8CC44200A) 4251883 611308282 TAIWAN-G 48 1049 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 2.07V, Vcc Max) CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 48 39 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 80 151 0 CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 500 151 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 123502 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej 32 0 Failure Mechanism STRESS: PRE/POST LFR PARAMETER ASSESSMENT CY8C4245 (8CC44200A) 4251883 611303750 TAIWAN-G COMP STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 168 77 0 CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 288 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 500 77 0 CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 1000 76 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 132802 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: DATA RETENTION, PLASTIC, 150C CY8CMBR (8C44300A) 4339140 611341917 CML-RA 500 80 0 CY8CMBR (8C44300A) 4339140 611341917 CML-RA 1000 79 0 STRESS: ENDURANCE+DRET CY8CMBR (8C44300A) 4339140 611341917 CML-RA Cycling 62 0 CY8CMBR (8C44300A) 4339140 611341917 CML-RA 168 62 0 CY8CMBR (8C44300A) 4339140 611341917 CML-RA 500 62 0 CY8CMBR (8C44300A) 4339140 611341917 CML-RA 168 18 0 CY8CMBR (8C44300A) 4339140 611341917 CML-RA 500 18 0 STRESS: ESD-CHARGE DEVICE MODEL(500V) CY8CMBR (8C44300A) 4339140 611341917 CML-RA COMP 9 0 CY8CMBR (8C44300A) 4339140 611341918 CML-RA COMP 9 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP 9 0 CY8CMBR (8C44300A) 4339216 611343474 CML-RA COMP 9 0 STRESS: ESD-CHARGE DEVICE MODEL, (1000V) CY8CMBR (8C44300A) 4339140 611341917 CML-RA COMP 3 0 CY8CMBR (8C44300A) 4339140 611341918 CML-RA COMP 3 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP 3 0 CY8CMBR (8C44300A) 4339216 611343474 CML-RA COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, (1250V) CY8CMBR (8C44300A) 4339140 611341917 CML-RA COMP 3 0 CY8CMBR (8C44300A) 4339140 611341918 CML-RA COMP 3 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP 3 0 CY8CMBR (8C44300A) 4339216 611343474 CML-RA COMP 3 0 CML-RA COMP 5 0 CML-RA COMP 5 0 STRESS: ESD-CHARGE DEVICE MODEL, (1500V) CY8CMBR (8C44300A) STRESS: 4339140 611341913 ESD-CHARGE DEVICE MODEL, (1750V) CY8CMBR (8C44300A) 4339216 611343474 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (1,100V) CY8CMBR (8C44300A) 4339140 611341917 CML-RA COMP 3 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8CMBR (8C44300A) 4339140 611341917 CML-RA COMP 8 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (3,300V) CY8CMBR (8C44300A) 4339140 611341917 CML-RA COMP 3 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP 3 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 16 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 132802 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (5,000V) CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP 5 0 5 0 5 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (6,000V) CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (7,000V) CY8CMBR (8C44300A) 4339216 611343474 CML-RA COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (8,000V) CY8CMBR (8C44300A) 4339216 611343474 CML-RA COMP 5 0 STRESS: STATIC LATCH-UP (85C, +/-140mA) CY8CMBR (8C44300A) 4339140 611341917 CML-RA COMP 6 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP 6 0 STRESS: STATIC LATCH-UP (85C, +/-180mA) CY8CMBR (8C44300A) 4339140 611341917 CML-RA COMP 2 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP 2 0 CML-RA COMP 6 0 CML-RA COMP 6 0 STRESS: STATIC LATCH-UP (85C, +/-300mA) CY8CMBR (8C44300A) 4339140 611341913 STRESS: STATIC LATCH-UP (85C, +/-360mA) CY8CMBR (8C44300A) 4339140 611341913 STRESS: STATIC LATCH-UP (125C, +/-140mA) CY8CMBR (8C44300A) 4339140 611341917 CML-RA COMP 2 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA COMP 2 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 2.07V, Vcc Max) CY8CMBR (8C44300A) 4339140 611341918 CML-RA 48 50 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CY8CMBR (8C44300A) 4339140 611341918 CML-RA 48 1521 1 CY8CMBR (8C44300A) 4339126 611342408 CML-RA 48 1504 0 132802-2E1, NVD STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8CMBR (8C44300A) 4339216 611342408 CML-RA 500 119 0 CML-RA COMP 10 0 STRESS: PRE/POST LFR PARAMETER ASSESSMENT CY8CMBR (8C44300A) 4339140 611341913 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 168 HR 30C/60%RH (MSL3) CY8CMBR (8C44300A) 4339140 611341917 CML-RA 168 80 0 CY8CMBR (8C44300A) 4339140 611341917 CML-RA 288 80 0 CY8CMBR (8C44300A) 4339140 611341918 CML-RA 168 79 0 CY8CMBR (8C44300A) 4339140 611341918 CML-RA 288 79 0 CY8CMBR (8C44300A) 4339140 611341918 CML-RA 168 75 0 CY8CMBR (8C44300A) 4339140 611341918 CML-RA 288 75 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 17 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 132802 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8CMBR (8C44300A) 4339140 611341917 CML-RA 500 79 0 CY8CMBR (8C44300A) 4339140 611341917 CML-RA 1000 79 0 CY8CMBR (8C44300A) 4339140 611341918 CML-RA 500 79 0 CY8CMBR (8C44300A) 4339140 611341918 CML-RA 1000 79 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA 500 80 0 CY8CMBR (8C44300A) 4339140 611341913 CML-RA 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 18 of 19 Document No. 001-91144 Rev. *B ECN #: 4624766 Document History Page Document Title: Document Number: QTP 140703: QUALIFICATION OF CY8C4013/ CY8C4014 PSOC4 DEVICE FAMILY, S8PF-10P TECHNOLOGY IN CMI FAB4 001-91144 Rev. ECN Orig. of No. Change ** 4279883 ZIJ Description of Change *A 4290622 HSTO *B 4624766 HSTO Updated qualification report template in front page. Deleted mold compound suffix in page4 Added Au wire Package QTP (#135107 and 135108) in Package Availability in page 4. Align qualification report based on the new template in the front page Deleted “CY8CMBR3” in Product Description table. Update Package Availability table - Remove Au wire option - Added 8L/16L SOIC package - Added 28-Lead SSOP packae - Added UTL-UT as qualified site for 16/24 Lead QFN - Update assembly site name from ASE-G to ASE-K Initial spec release Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 19 of 19