48-FBGA (6 x 10 mm) Stack Die Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BK B1 – 136.4298 mg B2 – 130.6399 mg Body Size (mil/mm) Package Weight – Site 2 6 x 10 mm N/A SUMMARY The 48-BGA Stack Die Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 052502 / 092602 / 132705 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note2) CoA-BK48CASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-91180 Rev. ** Page 1 of 5 48-FBGA (6 x 10 mm) Stack Die Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING DIE ATTACH EPOXY Material Purpose of Use Substance Composition SiO2 Acrylic Epoxy Substrate Base Material Solder Ball External Plating Die Attach 1 Adhesive Die attach 2 Die Attach 3 Adhesive Adhesive Die1 Die2 Die3 Circuit Spacer Circuit Wire Interconnect Mold Compound Encapsulation Bisphenol Triazol Cu Ni Au Sn Ag Cu Fused silica Epoxy Resin Acrylic resin Acrylate monomer Bismaleimide monomer Proprietary filler Proprietary Bismaleimide Proprietary Methacrylates Proprietary Divinyl Ether Proprietary polymer Fused silica Epoxy Resin Acrylic resin Acrylate monomer Bismaleimide monomer Si Si Si Au Ion Impurities Silica Fused Epoxy Resin A Phenol resin CAS Number 60676-86-0 Trade Secret 29690-82-2, 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 60676-86-0 Trade Secret Trade Secret Trade Secret Trade Secret 3.3400 3.0364 % weight of substance per Homogenous material 11.0000% 10.0001% 2.4291 4.5545 5.3136 11.0675 0.4555 0.1670 4.7870 0.2005 0.0251 1.4842 0.2295 0.0918 Weight by mg 0.2295 PPM % weight of substance per package 24,481 22,256 2.4481% 2.2256% 8.0000% 17,805 1.7805% 15.0000% 17.4999% 36.4499% 1.5001% 0.5500% 95.4994% 3.9999% 0.5007% 48.5001% 7.4995% 2.9998% 33,383 38,948 81,122 3,339 1,224 35,088 1,470 184 10,879 1,682 673 3.3383% 3.8948% 8.1122% 0.3339% 0.1224% 3.5088% 0.1470% 0.0184% 1.0879% 0.1682% 0.0673% 1,682 0.1682% 44.9993% 7,514 7,523 0.7514% 0.7523% 7.4995% 33.5011% 9002-84-0 1.0252 1.0263 Trade Secret 0.7983 35.0024% 5,852 0.5852% Trade Secret 0.3421 14.9998% 2,508 0.2508% Trade Secret 0.0912 3.9988% 668 0.0668% Trade Secret 0.0228 0.9997% 167 0.0167% 60676-86-0 Trade Secret Trade Secret 1.4842 0.2295 0.0918 48.5001% 7.4995% 2.9998% 10,879 1,682 673 1.0879% 0.1682% 0.0673% 1,682 0.1682% 7,514 82,778 49,014 82,778 15,372 1 399,769 24,705 24,705 0.7514% 8.2778% 4.9014% 8.2778% 1.5372% 0.0001% 39.9769% 2.4705% 2.4705% % Total: 100.0000 Trade Secret Trade Secret 7440-21-3 7440-21-3 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret Trade Secret Package Weight (mg): 0.2295 1.0252 11.2934 6.6869 11.2934 2.0972 0.0002 54.5404 3.3705 3.3705 136.4298 7.4995% 33.5011% 100.0000% 100.0000% 100.0000% 99.9905% 0.0095% 89.0000% 5.5000% 5.5000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-91180 Rev. ** Page 2 of 5 48-FBGA (6 x 10 mm) Stack Die Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING DIE ATTACH FILM Material Purpose of Use 3.3400 3.0364 % weight of substance per Homogenous material 11.0000% 10.0001% 25,566 23,242 2.5566% 2.3242% 2.4291 8.0000% 18,594 1.8594% 4.5545 5.3136 11.0675 0.4555 0.1670 4.7870 0.2005 0.0251 15.0000% 17.4999% 36.4499% 1.5001% 0.5500% 95.4994% 3.9999% 0.5007% 34,863 40,674 84,718 3,487 1,278 36,643 1,535 192 3.4863% 4.0674% 8.4718% 0.3487% 0.1278% 3.6643% 0.1535% 0.0192% 37382-79-9 0.4123 42.4657% 3,156 Trade Secret Trade Secret 0.2668 0.0728 27.4797% 7.4982% 2,042 557 67762-90-7 0.0730 7.5188% 559 2530-83-8 29348 0.0730 0.0730 7.5188% 7.5188% 559 559 37382-79-9 0.2848 42.5455% 2,180 Trade Secret Trade Secret 0.1843 0.0503 27.5321% 7.5142% 1,410 385 67762-90-7 0.0500 7.4694% 383 2530-83-8 29348 0.0500 0.0500 7.4694% 7.4694% 383 383 37382-79-9 0.4123 42.4657% 3,156 Trade Secret Trade Secret 0.2668 0.0728 27.4797% 7.4982% 2,042 557 67762-90-7 0.0730 7.5188% 559 2530-83-8 29348 7440-21-3 7440-21-3 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret Trade Secret 0.0730 0.0730 11.2934 6.6869 11.2934 2.0972 0.0002 54.5404 3.3705 3.3705 7.5188% 7.5188% 100.0000% 100.0000% 100.0000% 99.9905% 0.0095% 89.0000% 5.5000% 5.5000% 559 559 86,447 51,186 86,447 16,053 1 417,486 25,800 25,800 0.0559% 0.0559% 0.0559% 8.6447% 5.1186% 8.6447% 1.6053% 0.0001% 41.7486% 2.5800% 2.5800% Package Weight (mg): 130.6399 % Total: 100.0000 Substance Composition SiO2 Acrylic Epoxy Substrate Base Material Solder Ball External Plating Die Attach1 Die Attach2 Die Attach3 Die1 Die2 Die3 Wire Mold Compound Film Film Film Circuit Spacer Circuit Interconne ct Encapsula tion Bisphenol Triazol Cu Ni Au Sn Ag Cu Cresol-epichlorohydrinformaldehyde polymer Rubber modified epoxy Aromatic amine Silica, hydriogibuc anirohiysfumed Silicon-based glycidyl ether lsopropylidenediphenol Cresol-epichlorohydrinformaldehyde polymer Rubber modified epoxy Aromatic amine Silica, hydriogibuc anirohiysfumed Silicon-based glycidyl ether lsopropylidenediphenol Cresol-epichlorohydrinformaldehyde polymer Rubber modified epoxy Aromatic amine Silica, hydriogibuc anirohiysfumed Silicon-based glycidyl ether lsopropylidenediphenol Si Si Si Au Ion Impurities Silica Fused Epoxy Resin A Phenol resin CAS Number 60676-86-0 Trade Secret 29690-82-2, 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Weight by mg PPM % weight of substance per package 0.3156% 0.2042% 0.0557% 0.0559% 0.0559% 0.0559% 0.2180% 0.1410% 0.0385% 0.0383% 0.0383% 0.0383% 0.3156% 0.2042% 0.0557% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-91180 Rev. ** Page 3 of 5 48-FBGA (6 x 10 mm) Stack Die Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM PBDE PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-91180 Rev. ** Page 4 of 5 48-FBGA (6 x 10 mm) Stack Die Pb-Free Package Document History Page Document Title: Document Number: Rev. ** 48FBGA (6X10MM) STACK DIE PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-91180 ECN No. Orig. of Change 4281045 ZJL Description of Change New document Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-91180 Rev. ** Page 5 of 5