QTP_064001

Document No. 001-87926 Rev. **
ECN #: 4027024
Cypress Semiconductor
Product Qualification Report
QTP# 064001
June 2013
WIRELESS MICROCONTROLLER
DEVICE FAMILY (enCoRe II)
S4AD-5 TECHNOLOGY, FAB5
CY7C60323
CY7C60333
Mixed Signal Array
with On-Chip
Controller
CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
Zhaomin Ji
Principal Reliability Engineer
(408) 432-7021
Mira Ben-Tzur
Quality Engineering Director
(408) 943-2675
Company Confidential
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Page 1 of 11
Document No. 001-87926 Rev. **
ECN #: 4027024
PRODUCT QUALIFICATION HISTORY
Qual
Report
Description of Qualification Purpose
Date
Comp
060605
Qualify GSMC using PSoC Device Product Family on S4AD-5 Technology
Aug 06
062509
Neutron Device Product Family on S4AD-5 Technology transfer to GSMC
Aug 06
064001
Qualified by extension Wireless Microcontroller Device Family (enCoRe II) on S4AD-5
Technology transfer to GSMC
Oct 06
Company Confidential
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Page 2 of 11
Document No. 001-87926 Rev. **
ECN #: 4027024
PRODUCT DESCRIPTION (for qualification)
Qualification Purpose: Qualified by extension transfer Wireless Microcontroller Device Family (enCoRe II) in S4D-5
Technology at GSMC Foundry
Marketing Part #:
CY7C60323, CY7C60333
Device Description:
3.3V and 5V Industrial 24Mhz Programmable System on Chip
Cypress Division:
Cypress Semiconductor - Consumer and Computation Division
TECHNOLOGY/FAB PROCESS DESCRIPTION S4AD-5
Number of Metal Layers:
2
Metal
Composition:
Metal 1: 250A TiN/5,800A Al/700A TiN
Metal 2: 500A TiN/8,000A Al/250A TiN
Passivation Type and Materials:
7,000A TeOs /6,000A Si3N4
Generic Process Technology/Design Rule (-drawn):
Single Poly, Double Metal, 0.35 m
Gate Oxide Material/Thickness (MOS):
SiO2 / 110A
Name/Location of Die Fab (prime) Facility:
GSMC/Shanghai-China
Die Fab Line ID/Wafer Process ID:
S4AD-5 GSMC SONOS
PACKAGE AVAILABILITY
PACKAGE
ASSEMBLY SITE FACILITY
28-Lead SSOP
PHIL-M, TAIWN-T, CML-RA
32-Lead QFN
SEOL-L, CML-RA, TAIWAN-G
Note: Package Qualification details upon request.
Company Confidential
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Page 3 of 11
Document No. 001-87926 Rev. **
ECN #: 4027024
MAJOR PACKAGE INFORMATION FOR THIS QUALIFICATION
Package Designation:
SP28
Package Outline, Type, or Name:
28-Lead Shrunk Small Outline Package (SSOP)
Mold Compound Name/Manufacturer:
G600 - Sumitomo
Mold Compound Flammability Rating:
V-0 PER UL-94
Oxygen Rating Index:
>28%
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
100% Saw
Die Attach Supplier:
Ablestik
Die Attach Material:
Ablebond 8290
Die Attach Method:
Epoxy
Bond Diagram Designation:
10-06220
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au. 1.0mil
Thermal Resistance Theta JA °C/W:
95.0°C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
001-00365
Name/Location of Assembly (prime) facility:
Amkor-Phil
MSL Level
1
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-RA, KYEC,Taiwan
Fault Coverage:
100%
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
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Page 4 of 11
Document No. 001-87926 Rev. **
ECN #: 4027024
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
High Temperature Operating Life
Early Failure Rate
Dynamic Operating Condition, Vcc Max=5.5V, 125C
P
High Temperature Operating Life
Latent Failure Rate
Dynamic Operating Condition, Vcc Max=5.5V, 125C
P
High Temperature Steady State life
125C, 5.5V, Vcc Max
P
Low Temperature Operating Life
-30C, 5.5V
P
High Accelerated Saturation Test
(HAST)
130C, 5.25V, 85%RH
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH+3IR-Reflow, 260C+0, -5C
P
Temperature Cycle
MIL-STD-883C, Method 1010, Condition C, -65C to 150C
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH+3IR-Reflow, 260C+0, -5C
P
Pressure Cooker
121C, 100%RH, 15 Psig
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH+3IR-Reflow, 260C+0, -5C
P
Acoustic Microscopy
J-STD-020
P
Age Bond Strength
200C, 4hrs
MIL-STD-883, Method 883-2011
P
Data Retention
150C ,No Bias
P
Dynamic Latch-up
125C, 8.5V
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
2,200V
JESD22, Method A114-B
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
2,200V
MIL-STD-883, Method 3015.7
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V, JESD22-C101C
P
Endurance Test
MIL-STD-883, Method 883-1033
P
Static Latch-up
125C, 200mA
In accordance with JEDEC 17
P
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Page 5 of 11
Document No. 001-87926 Rev. **
ECN #: 4027024
RELIABILITY FAILURE RATE SUMMARY
Stress/Test
1
2
3
Device Tested/
Device Hours
# Fails
Activation
Energy
Thermal3
A.F
Failure
Rate
High Temperature Operating Life
Early Failure Rate1
1,000 Devices
0
N/A
N/A
0 PPM
High Temperature Operating Life1, 2
Long Term Failure Rate
720,000DHRs
0
0 .7
55
23 FIT
Assuming an ambient temperature of 55C and a junction temperature rise of 15C.
Chi-squared 60% estimations used to calculate the failure rate.
Thermal Acceleration Factor is calculated from the Arrhenius equation
E  1 1  
AF = exp  A  -  
 k  T 2 T1  
Where:
EA =The Activation Energy of the defect mechanism. k = Boltzmann's constant = 8.62x10-5 eV/Kelvin.
T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use
conditions.
Company Confidential
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Page 6 of 11
Document No. 001-87926 Rev. **
ECN #: 4027024
Reliability Test Data
QTP #: 060605
Device
STRESS:
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
COMP
15
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
COMP
15
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
COMP
15
0
STRESS:
AGE BOND STRENGTH
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
COMP
10
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
COMP
10
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
COMP
10
0
STRESS:
DATA RETENTION, PLASTIC, 150C
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
336
256
0
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
1000
256
0
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
1500
256
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
336
256
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
1000
256
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
336
256
0
9621713
610632687A
PHIL-M
COMP
47
0
STRESS:
ENDURANCE
CY8C24494 (8C24494A)
STRESS:
ESD-CHARGE DEVICE MODEL, (500V)
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
COMP
9
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
COMP
9
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
COMP
9
0
CY8C24494 (8C24494A)
9623715
610635880
PHIL-M
COMP
9
0
CY8C24494 (8C24795A)
9623716
610639349
SEOL-L
COMP
9
0
CY8C24494 (8C24995A)
9623716
610639350
SEOL-L
COMP
9
0
STRESS:
Failure Mechanism
ACOUSTIC, MSL1
ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V)
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
COMP
9
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
COMP
9
0
CY8C24494 (8C24494A)
9623715
610635880
PHIL-M
COMP
9
0
CY8C24494 (8C24995A)
9623716
610639350
SEOL-L
COMP
9
0
Company Confidential
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Page 7 of 11
Document No. 001-87926 Rev. **
ECN #: 4027024
Reliability Test Data
QTP #: 060605
Device
STRESS:
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
Failure Mechanism
ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015, (2,200V)
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
COMP
3
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
COMP
3
0
CY8C24494 (8C24494A)
9623715
610635880
PHIL-M
COMP
3
0
CY8C24494 (8C24995A)
9623716
610639350
SEOL-L
COMP
3
0
COMP
3
0
3
0
STRESS: STATIC LATCH-UP TESTING (125C, 8.5V, +/-200mA)
CY8C24494 (8C24494A)
9623716
CY8C24494 (8C24994A)
9621713
CY8C24494 (8C24494A)
9623715
610638054
SEOL-L
COMP
3
0
CY8C24494 (8C24995A)
9623716
610639350
SEOL-L
COMP
3
0
PHIL-M
COMP
2
0
STRESS:
PHIL-M
C-USA
COMP
DYNAMIC LATCH-UP (125C, 8.5V)
CY8C24494 (8C24494A)
STRESS:
610639767
9621713
610632687
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 5.5V, Vcc Max)
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
96
1005
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
96
1144
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
96
908
1
STRESS:
HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 5.5V, Vcc Max)
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
168
180
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
1000
1800
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
168
180
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
1000
180
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
168
180
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
1000
180
0
CY8C24494 (8C24494A)
9623716
610639767A
PHIL-M
1000
180
0
STRESS:
0
HIGH TEMP STEADY STATE LIFE TEST (125C, 5.5V)
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
168
80
0
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
336
80
0
500
45
0
STRESS:
LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 5.5V
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
Company Confidential
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Page 8 of 11
CAPACITOR DEFECT
Document No. 001-87926 Rev. **
ECN #: 4027024
Reliability Test Data
QTP #: 060605
Device
STRESS:
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
Failure Mechanism
HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 168 HR 85C/85%RH (MSL1)
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
128
49
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
128
49
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
128
49
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 168 HR 85C/85%RH (MSL1)
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
168
50
0
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
288
50
0
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
500
47
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
168
50
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
168
50
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
288
50
0
STRESS:
TC COND. C -65C TO 150C, PRE COND 168 HRS 85C/85%RH (MSL1)
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
300
50
0
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
500
50
0
CY8C24494 (8C24494A)
9621713
610632687
PHIL-M
1000
50
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
300
50
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
500
49
0
CY8C24494 (8C24494A)
9623715
610635580
PHIL-M
1000
49
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
300
50
0
CY8C24494 (8C24494A)
9623716
610639767
PHIL-M
500
49
0
Company Confidential
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Page 9 of 11
Document No. 001-87926 Rev. **
ECN #: 4027024
Reliability Test Data
QTP #: 062509
Device
STRESS:
Fab Lot #
Duration
Samp
Rej
Failure Mechanism
9628722
610642654
PHIL-M
COMP
9
0
9
0
COMP
3
0
PHIL-M
COMP
3
0
PHIL-M
500
300
0
ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V)
CY7C60323 (7C603235A)
STRESS:
Assy Loc
ESD-CHARGE DEVICE MODEL, (500V)
CY7C60323 (7C603235A)
STRESS:
Assy Lot #
9628722
610642654
PHIL-M
COMP
ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015, (2,200V)
CY7C60323 (7C603235A)
9628722
610642654
PHIL-M
STRESS: STATIC LATCH-UP TESTING (125C, 8.5V, +/-200mA)
CY7C60323 (7C603235A)
STRESS:
9628722
610642654
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 5.5V, Vcc Max)
CY7C60323 (7C603235A)
STRESS:
610642654
DATA RETENTION, PLASTIC, 150C
CY7C60323 (7C603235A)
STRESS:
9628722
9628722
610642654
PHIL-M
96
1000
0
HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 5.5V, Vcc Max)
CY7C60323 (7C603235A)
9628722
610642654
PHIL-M
168
180
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 168 HR 85C/85%RH (MSL1)
CY7C60323 (7C603235A)
STRESS:
9628722
610642654
PHIL-M
168
45
0
50
0
TC COND. C -65C TO 150C, PRE COND 168 HRS 85C/85%RH (MSL1)
CY7C60323 (7C603235A)
9628722
610642654
PHIL-M
168
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Page 10 of 11
Document No. 001-87926 Rev. **
ECN #: 4027024
Document History Page
Document Title:
QTP # 064001 : WIRELESS MICROCONTROLLER DEVICE FAMILY (enCoRe II) CY7C60323/ CY7C60333, S4AD-5 TECHNOLOGY, FAB5
Document Number:
001-87926
Rev. ECN
Orig. of
No.
Change
**
4027024 ILZ
Description of Change
Initial Spec Release
Qualification report published on Cypress.com is documented on
memo LGQ-585 in spec format.
Initiated spec for QTP 064001 and all data from Memo LGQ-585 was
transferred to qualification report spec template.
Deleted package qualification details on package qualification history
table
Deleted Cypress reference Spec and replaced with Industry Standards
Updated package availability based on current qualified test &
assembly site
Distribution: WEB
Posting:
None
Company Confidential
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Page 11 of 11