Document No. 001-76340 Rev. *A ECN #: 4310910 Cypress Semiconductor Indirect Material Qualification Report QTP# 120702 VERSION *A March 2014 Qualification of Chip Trays H20-102X110-22 for Devices CY7C60445 / CY7C60455 and H20-094X106-22 for Devices CY7C63823 / CYRF8935A (Die Sales) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 001-76340 Rev. *A ECN #: 4310910 INDIRECT MATERIAL QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 120702 Qualification of Chip Trays H20-102X110-22 for Devices CY7C60445 / CY7C60455 and H20-094X106-22 for Devices CY7C63823 / CYRF8935A (Die Sales) Feb 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No. 001-76340 Rev. *A ECN #: 4310910 MAJOR MATERIAL INFORMATION USED IN THIS QUALIFICATION MATERIAL IDENTIFICATION Material Designation: Chip Trays Tray Part No: H20-102X110-22 & H20-094X106-22 Surface Resistivity: 105 – 1012 Material Name: Conductive PSU Compound ABS (Acrylonitrile-Butadiene-Styrene Copolymer); Antistatic Chemical Name: Additives Content: ABS 95~60%; Antistatic Additives: 5~40% Formula: ABS - (C3H3N,C4H6,C8H8)n; Antistatic Additives - Proprietary CAS no.: ABS - 9003-56-9; Antistatic Additives - Proprietary Impurities contributing to None Hazards: PHYSICAL DATA Appearance: Solid Pellets Melting Temperature: Above 85℃ Solubility in Water: Insoluble in water Specific Gravity: 1.02~1.07 g/cm3 STABILITY AND REACTIVITY Reactivity: Not reactive with water Stable and non-reactive under normal handling and storage Stability: condition. Thermal Decomposition Gases CO, CO2, HCN, AN, SM and NO TOXICOLOGICAL INFORMATION Fumes or vapors generated from decomposing resin may be Irritation irritant to: irritant to eyes Acute oral toxicity (LD50): Not determined Mutagenicity Not determined ECOLOGICAL INFORMATION To avoid being taken by ocean species or birds, disposal of the Ecotoxicity waste to the ocean and water sources is inhibited. HAZARD IDENTIFICATION Most Important Hazards: None Adverse Human Health Effects None Environmental Effects None Physical and Chemical None Hazards Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No. 001-76340 Rev. *A ECN #: 4310910 TABLE III MAJOR MATERIAL INFORMATION USED IN THIS QUALIFICATION FIRST AID MEASURES In case of gases evolving from melted resin, move subject to fresh air.Treat symptomatically In case of pellets or powder, wash with water. Skin Contact In case of melt, wash affected skin area and clothing with plenty of (soap and) water. Seek medical advice. In case of pellets or powder, flush with plenty of water for at least 15 minutes. Seek medical advice if any dust particles still remain. Eye Contact In case of gases evolving from melted resin of high temperature, flush with plenty of water for at least 15 minutes. Seek medical advice if necessary. Induce vomiting. Rinse mouth with water. Seek medical Ingestion advice if necessary. FIRE-FIGHTING MEASURES Extinguishing Media Water, Foam, Dry chemical powder Special Fire-Fighting Procedure Self contained breathing apparatus Inhalation Fire and Explosion Hazards None ACCIDENTAL RELEASE MEASURES Methods for Cleaning up Recovery if not contaminated or Disposal Personal Precautions Pellets or powder remained on ground may cause slipping Gather pellets and powder thoroughly to avoid birds or fishes Environmental precautions taking from draining water. HANDLING AND STORAGE Prevent from fire around handling area. Maintain good housekeeping standards to prevent accumulation of dust. To avoid dust explosion resulting from the existence of powder, Handling electrostatics eliminators and grounding should be fixed to such equipment as air transferring pipes, bag filters and hoppers. Use electrically conductive filters for bag filters. Keep the materials at a cool dry place. Protect from direct Storage sunlight, rain and violent temperature fluctuation. Fire is inhibited around storage area. EXPOSURE CONTROLS / PERSONAL PROTECTION Ventilation Necessary to exclude dust, fumes and gases. Eye - Wear safety glasses for general purpose. Wear chemical goggles for cleaning molding machines. Personal Protection Respiratory - Wear masks for cleaning molding machines. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 Document No. 001-76340 Rev. *A ECN #: 4310910 Gloves - Necessary for handling melted resin. Methods of disposal DISPOSAL CONSIDERATIONS Controlled incineration or landfill according to local, state or national laws and regulations concerning health and pollution. Inadequate incineration may generate toxic gases such as CO, CO2, HCN, AN and SM. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No. 001-76340 Rev. *A ECN #: 4310910 TABLE IV PROCESS ENGINEERING QUALIFICATION PERFORMED PER SPECIFICATION REQUIREMENTS Test Test Condition (Reference Specifications) Result P/F CADFIT Analysis Pass POD & End flash Criteria P Dimensional Measurement POD Drawing-JESD22-B100B P Substance Check European Union RoHS 2002/95/E REACH XVII P 5 Surface Resistivity Measurement Conductive Packing/shipping material: 10 Ω/sq Static dissipative Packing/shipping material: 105-1012 Ω/sq P Functionality Test Pass Manufacturability P Drop Test Non-Dry Packed Material: No tears & punctures Boxes: No Complete structural damage, No progressive crumpling/deformed, no tears & punctures. P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No. 001-76340 Rev. *A ECN #: 4310910 Reliability Test Data QTP #: 120702 Device Assy Lot # Chip Tray Site Duration Samp Rej Failure Mechanism STRESS: DROP TEST CY7C60445 N/A Aspree H20-102X110-2 CML-R COMP 30 0 CYRF8935A N/A Aspree H20-94X106-22 CML-R COMP 30 0 STRESS: DIMENSIONAL MEASUREMENT CY7C60445 N/A Aspree H20-102X110-2 CML-R COMP 10 0 CYRF8935A N/A Aspree H20-94X106-22 CML-R COMP 10 0 STRESS: SURFACE RESISTIVITY CY7C60445 N/A Aspree H20-102X110-2 CML-R COMP 5 0 CYRF8935A N/A Aspree H20-94X106-22 CML-R COMP 5 0 STRESS: FUNCTIONALITY TEST CY7C60445 N/A Aspree H20-102X110-2 CML-R COMP 15 0 CYRF8935A N/A Aspree H20-94X106-22 CML-R COMP 15 0 STRESS: CADFIT ANALYSIS CY7C60445 N/A Aspree H20-102X110-2 CML-R COMP PASS CYRF8935A N/A Aspree H20-94X106-22 CML-R COMP PASS STRESS: SUBSTANCE CHECK CY7C60445 N/A Aspree H20-102X110-2 CML-R COMP PASS CYRF8935A N/A Aspree H20-94X106-22 CML-R COMP PASS Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No. 001-76340 Rev. *A ECN #: 4310910 Document History Page Document Title: QTP 120702: QUALIFICATION OF CHIP TRAYS H20-102X110-22 FOR DEVICES CY7C60445 / CY7C60455 AND H20-094X106-22 FOR DEVICES CY7C63823 / CYRF8935A (DIE SALES) Document Number: 001-76340 Rev. ECN No. ** 3545697 *A 4310910 Orig. of Change NSR HSTO Description of Change Initial Spec Release Align qualification report based on the new template in the front page Deleted Cypress reference specs 03-00029, 22-00113, and 42-00002 and retained with industry standard. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8