Document No.001-75584 Rev. *A ECN # 4662501 Cypress Semiconductor Package Qualification Report QTP# 114907 VERSION*A February, 2015 32 QFN (5x5x1.0mm) NiPdAu, 100% Cu Wire MSL3, 260C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro (RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-75584 Rev. *A ECN # 4662501 PACKAGE QUALIFICATION HISTORY QTP Number 114907 Description of Qualification Purpose Qualification of Copper wire bond on 32 QFN 5x5x1mm package dimensions (LT32B) at ASEKH (G) using G631 mold compound and EN4900 Date Jan 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.001-75584 Rev. *A ECN # 4662501 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT32B Package Outline, Type, or Name: 32 Quad Flat Not Lead (QFN) 5x5x1mm Package Dimension Mold Compound Name/Manufacturer: G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN4900 Bond Diagram Designation 001-68160, 001-69569, 001-69568 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Cu Thermal Resistance Theta JA C/W: 22°C/W, 120°C/W, 14.5°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-70515M / 49-41999M Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: KY Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.001-75584 Rev. *A ECN # 4662501 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Test Condition (Temp/Bias) JEDEC STD 22-A110: 130 C, 85%RH, 5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) JESD22-A102: 121C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) JESD22-A103:150°C No bias Acoustic Microscopy Ball Shear Bond Pull Constructional Analysis Dye Penetrant Test J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) JESD22-B116 Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack Result P/F P P P P P P P P P Internal Visual MIL-STD-883-2014 P Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P Solderability, Steam Aged Thermal Shock J-STD-002, JESD22-B102 95% solder coverage minimum MIL-STD-883, Method 1011, Condition B, -55°C to 125°C and JESD22-A106, Condition C, -55°C to 125°C P P X-Ray MIL-STD-883 - 2012 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Shear MIL-STD-883 - 2011 P Electrical Characterization AEC-Q100-009 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 Document No.001-75584 Rev. *A ECN # 4662501 Reliability Test Data QTP #: 114907 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN COMP 15 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN COMP 15 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN COMP 15 0 CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN COMP 5 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN COMP 5 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN COMP 5 0 CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN COMP 5 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN COMP 5 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN COMP 5 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN COMP 5 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN COMP 15 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN COMP 15 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN COMP 15 0 STRESS: ELECTRICAL CHARACTERIZATION CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN COMP 30 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN COMP 30 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN 128 78 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-75584 Rev. *A ECN # 4662501 Reliability Test Data QTP #: 114907 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP STORAGE, 150C CY8C20466A (8C2046625AK) 5104069 611128980 G-TAIWAN 1000 80 0 CY8C20466A (8C2046625AK) 5104069 611128981 G-TAIWAN 1000 80 0 CY8CTMA301E (8C20313DC) 4102579 611121438 G-TAIWAN 1000 80 0 CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN COMP 5 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN COMP 5 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN 168 120 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN 168 126 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN 168 120 0 STRESS: PHYSICAL DIMENSION CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN COMP 5 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN COMP 5 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN COMP 5 0 611155536 G-TAIWAN COMP 3 0 611155536 G-TAIWAN COMP 3 0 G-TAIWAN COMP 15 0 STRESS: POST MSL3 BALL SHEAR CY8C21434 (8C21434A) 4127102 STRESS: POST MSL3 BOND PULL CY8C21434 (8C21434A) 4127102 STRESS: POST MSL3 CONSTRUCTIONAL ANALYSIS CY8C21434 (8C21434A) 4127102 611155536 STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN 128 5 0 STRESS: POST HIGH TEMP STORAGE BALL SHEAR CY8C20466A (8C2046625AK) 5104069 611128980 G-TAIWAN 1000 5 0 CY8CTMA301E (8C20313DC) 4102579 611121438 G-TAIWAN 1000 5 0 168 5 0 STRESS: POST PRESSURE COOKER TEST BALL SHEAR TEST CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-75584 Rev. *A ECN # 4662501 Reliability Test Data QTP #: 114907 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: POST TC BALL SHEAR CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN 500 5 0 STRESS: POST HIGH TEMP STORAGE BOND PULL CY8C20466A (8C2046625AK) 5104069 611128980 G-TAIWAN 1000 5 0 CY8CTMA301E (8C20313DC) 4102579 611121438 G-TAIWAN 1000 5 0 128 5 0 STRESS: POST HI-ACCEL SATURATION TEST BOND PULL CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN STRESS: POST PRESSURE COOKER TEST BOND PULL TEST CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN 168 5 0 611155536 G-TAIWAN 500 5 0 STRESS: POST TC BOND PULL CY8C21434 (8C21434A) 4127102 STRESS: SOLDERABILITY TEST CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN COMP 3 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN COMP 3 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN COMP 3 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN 500 120 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN 500 126 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN 500 120 0 4127102 611155536 G-TAIWAN 200 99 0 CY8C21434 (8C21434A) 4127102 611155536 G-TAIWAN COMP 15 0 CY22391LT (7C84980B) 4101229 611155534 G-TAIWAN COMP 15 0 CY7C63833 (7C63821B) 5127096 611155535 G-TAIWAN COMP 15 0 STRESS: THERMAL SHOCK CY8C21434 (8C21434A) STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-75584 Rev. *A ECN # 4662501 Document History Page Document Title: TAIWAN (G) Document Number: Rev. ECN No. ** 3490665 *A 4662501 QTP 114907: 32 QFN (5X5X1.0MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW ASEK001-75584 Orig. of Change NSR JYF Description of Change Initial spec release Sunset review: Updated QTP title page and Reliability Tests Performed table (HAST,PCT,HTS,Acoustic,Ball Shear,Bond Pull,CA,DPT,IVI,FVI, Physical Dimension,Solderability Test,Thermal Shock) for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8