CY7C008V CY7C018V CY7C009V CY7C019V 3.3 V 128 K × 8 Dual-Port Static RAM CY7C009V 3.3 V 128 K × 8 Dual-Port Static RAM 3.3 V 128 K × 8 Dual-Port Static RAM Features ■ True dual-ported memory cells which allow simultaneous access of the same memory location ■ 128 K × 8 organization (CY7C009) ■ 0.35-micron CMOS for optimum speed/power ■ High-speed access: 15/20/25 ns ■ Low operating power ❐ Active: ICC = 115 mA (typical) ❐ Standby: ISB3 = 10 A (typical) ■ Expandable data bus to 16 bits or more using Master/Slave chip select when using more than one device ■ On-chip arbitration logic ■ Semaphores included to permit software handshaking between ports ■ INT flag for port-to-port communication ■ Dual chip enables ■ Pin select for Master or Slave ■ Commercial and industrial temperature ranges ■ Fully asynchronous operation ■ Available in 100-pin TQFP ■ Automatic power-down ■ Pb-free packages available For a complete list of related documentation, click here. Logic Block Diagram R/WL R/WR CE0L CE1L CEL CE0R CE1R CER OEL OER 8 8 I/O0L–I/O8L I/O Control 17 A0L–A16L Address Decode Address Decode True Dual-Ported RAM Array 17 17 A0R–A16R 17 A0L–A16L CEL OEL R/WL SEML BUSYL INTL I/O0R–I/O8R I/O Control A0R–A16R CER OER R/WR SEMR Interrupt Semaphore Arbitration [1] [1] BUSYR INTR M/S Note 1. BUSY is an output in master mode and an input in slave mode. Cypress Semiconductor Corporation Document Number: 38-06044 Rev. *H • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised November 26, 2014 CY7C009V Functional Description The CY7C009V is a low-power CMOS 64 K, 128 K × 8 dual-port static RAM. Various arbitration schemes are included on the devices to handle situations when multiple processors access the same piece of data. Two ports are provided permitting independent, asynchronous access for reads and writes to any location in memory. The devices can be utilized as standalone 8/9-bit dual-port static RAMs or multiple devices can be combined in order to function as a 16/18-bit or wider master/slave dual-port static RAM. An M/S pin is provided for implementing 16/18-bit or wider memory applications without the need for separate master and slave devices or additional discrete logic. Application areas include interprocessor/multiprocessor designs, communications status buffering, and dual-port video/graphics memory. Document Number: 38-06044 Rev. *H Each port has independent control pins: chip enable (CE), read or write enable (R/W), and output enable (OE). Two flags are provided on each port (BUSY and INT). BUSY signals that the port is trying to access the same location currently being accessed by the other port. The interrupt flag (INT) permits communication between ports or systems by means of a mail box. The semaphores are used to pass a flag, or token, from one port to the other to indicate that a shared resource is in use. The semaphore logic is comprised of eight shared latches. Only one side can control the latch (semaphore) at any time. Control of a semaphore indicates that a shared resource is in use. An automatic power-down feature is controlled independently on each port by a chip select (CE) pin. The CY7C009V is available in 100-pin Thin Quad Plastic Flatpacks (TQFP). Page 2 of 23 CY7C009V Contents Selection Guide ................................................................ 4 Pin Configurations ........................................................... 4 Pin Definitions .................................................................. 5 Architecture ...................................................................... 5 Functional Overview ........................................................ 5 Write Operation ........................................................... 5 Read Operation ........................................................... 5 Interrupts ..................................................................... 5 Busy ............................................................................ 5 Master/Slave ............................................................... 5 Semaphore Operation ................................................. 6 Maximum Ratings ............................................................. 8 Operating Range ............................................................... 8 Electrical Characteristics ................................................. 8 Capacitance ...................................................................... 9 AC Test Loads and Waveforms ....................................... 9 Data Retention Mode ........................................................ 9 Document Number: 38-06044 Rev. *H Timing ................................................................................ 9 Switching Characteristics .............................................. 10 Switching Waveforms .................................................... 12 Ordering Information ...................................................... 18 128 K × 8, 3.3 V Asynchronous Dual-Port SRAM ..... 18 Ordering Code Definitions ......................................... 18 Package Diagram ............................................................ 19 Acronyms ........................................................................ 20 Document Conventions ................................................. 20 Units of Measure ....................................................... 20 Document History Page ................................................. 21 Sales, Solutions, and Legal Information ...................... 23 Worldwide Sales and Design Support ....................... 23 Products .................................................................... 23 PSoC® Solutions ...................................................... 23 Cypress Developer Community ................................. 23 Technical Support ..................................................... 23 Page 3 of 23 CY7C009V Selection Guide CY7C009V –15 Description CY7C009V –20 CY7C009V –25 Unit Maximum access time 15 20 25 ns Typical operating current 125 120 115 mA Typical standby current for ISB1 (both ports TTL level) 35 35 30 mA Typical standby current for ISB3 (both ports CMOS level) 10 10 10 A Pin Configurations NC NC A6R A5R A4R A3R A2R A1R INTR A0R BUSYR M/S GND BUSYL INTL NC A0L A1L A2L A3L A4L A5L A6L NC NC Figure 1. 100-pin TQFP pinout (Top View) 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 NC 1 75 NC NC 2 74 NC A7L 3 73 A7R A8L 4 72 A8R A9L 5 71 A9R A10L 6 70 A10R A11L 7 69 A11R A12L 8 68 A12R A13L 9 67 A13R A14L 10 66 A14R 65 A15R 64 A16R 63 GND A15L 11 A16L 12 VCC 13 NC 14 62 NC NC 15 61 NC NC 16 60 NC NC 17 59 NC CY7C009V (128 K × 8) CE0L 18 58 CE0R CE1L 19 57 CE1R SEML 20 56 SEMR R/WL 21 55 R/WR OEL 22 54 OER GND 23 53 GND NC 24 52 GND NC 25 51 NC Document Number: 38-06044 Rev. *H NC NC NC I/O7R I/O6R I/O5R I/O4R I/O3R VCC I/O2R I/01R I/O0R GND VCC I/O0L I/O1L GND I/O2L I/O3L I/O4L I/O5L I/O6L I/O7L NC GND 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Page 4 of 23 CY7C009V Pin Definitions Left Port Right Port Description CE0L, CE1L CE0R, CE1R Chip enable (CE is LOW when CE0VIL and CE1 VIH) R/WL R/WR Read/Write enable OEL OER Output enable A0L–A16L A0R–A16R Address I/O0L–I/O7L I/O0R–I/O7R Data bus input/output SEML SEMR Semaphore enable INTL INTR Interrupt flag BUSYL BUSYR Busy flag M/S Master or slave select VCC Power GND Ground NC No Connect Architecture The CY7C009V consists of an array of 128 K words of 8 bits each of dual-port RAM cells, I/O and address lines, and control signals (CE, OE, R/W). These control pins permit independent access for reads or writes to any location in memory. To handle simultaneous writes/reads to the same location, a BUSY pin is provided on each port. Two interrupt (INT) pins can be utilized for port-to-port communication. Two semaphore (SEM) control pins are used for allocating shared resources. With the M/S pin, the devices can function as a master (BUSY pins are outputs) or as a slave (BUSY pins are inputs). The devices also have an automatic power-down feature controlled by CE. Each port is provided with its own output enable control (OE), which allows data to be read from the device. Functional Overview Write Operation Data must be set up for a duration of tSD before the rising edge of R/W in order to guarantee a valid write. A write operation is controlled by either the R/W pin (see Write Cycle No. 1 waveform) or the CE pin (see Write Cycle No. 2 waveform). Required inputs for non-contention operations are summarized in Table 1 on page 6. If a location is being written to by one port and the opposite port attempts to read that location, a port-to-port flowthrough delay must occur before the data is read on the output; otherwise the data read is not deterministic. Data will be valid on the port tDDD after the data is presented on the other port. Read Operation When reading the device, the user must assert both the OE and CE pins. Data will be available tACE after CE or tDOE after OE is asserted. If the user wishes to access a semaphore flag, then the SEM pin must be asserted instead of the CE pin, and OE must also be asserted. Document Number: 38-06044 Rev. *H Interrupts The upper two memory locations may be used for message passing. The highest memory location (1FFFF for the CY7C009) is the mailbox for the right port and the second-highest memory location (1FFFE for the CY7C009) is the mailbox for the left port. When one port writes to the other port’s mailbox, an interrupt is generated to the owner. The interrupt is reset when the owner reads the contents of the mailbox. The message is user defined. Each port can read the other port’s mailbox without resetting the interrupt. The active state of the busy signal (to a port) prevents the port from setting the interrupt to the winning port. Also, an active busy to a port prevents that port from reading its own mailbox and, thus, resetting the interrupt to it. If an application does not require message passing, do not connect the interrupt pin to the processor’s interrupt request input pin. The operation of the interrupts and their interaction with Busy are summarized in Table 2 on page 6. Busy The CY7C009V provide on-chip arbitration to resolve simultaneous memory location access (contention). If both ports’ CEs are asserted and an address match occurs within tPS of each other, the busy logic will determine which port has access. If tPS is violated, one port will definitely gain permission to the location, but it is not predictable which port will get that permission. BUSY will be asserted tBLA after an address match or tBLC after CE is taken LOW. Master/Slave A M/S pin is provided in order to expand the word width by configuring the device as either a master or a slave. The BUSY output of the master is connected to the BUSY input of the slave. This will allow the device to interface to a master device with no external components. Writing to slave devices must be delayed until after the BUSY input has settled (tBLC or tBLA), otherwise, Page 5 of 23 CY7C009V the slave chip may begin a write cycle during a contention situation. When tied HIGH, the M/S pin allows the device to be used as a master and, therefore, the BUSY line is an output. BUSY can then be used to send the arbitration outcome to a slave. Semaphore Operation The CY7C009V provide eight semaphore latches, which are separate from the dual-port memory locations. Semaphores are used to reserve resources that are shared between the two ports.The state of the semaphore indicates that a resource is in use. For example, if the left port wants to request a given resource, it sets a latch by writing a zero to a semaphore location. The left port then verifies its success in setting the latch by reading it. After writing to the semaphore, SEM or OE must be deasserted for tSOP before attempting to read the semaphore. The semaphore value will be available tSWRD + tDOE after the rising edge of the semaphore write. If the left port was successful (reads a zero), it assumes control of the shared resource, otherwise (reads a one) it assumes the right port has control and continues to poll the semaphore. When the right side has relinquished control of the semaphore (by writing a one), the left side will succeed in gaining control of the semaphore. If the left side no longer requires the semaphore, a one is written to cancel its request. Semaphores are accessed by asserting SEM LOW. The SEM pin functions as a chip select for the semaphore latches (CE must remain HIGH during SEM LOW). A0–2 represents the semaphore address. OE and R/W are used in the same manner as a normal memory access. When writing or reading a semaphore, the other address pins have no effect. When writing to the semaphore, only I/O0 is used. If a zero is written to the left port of an available semaphore, a one will appear at the same semaphore address on the right port. That semaphore can now only be modified by the side showing zero (the left port in this case). If the left port now relinquishes control by writing a one to the semaphore, the semaphore will be set to one for both sides. However, if the right port had requested the semaphore (written a zero) while the left port had control, the right port would immediately own the semaphore as soon as the left port released it. Table 3 on page 7 shows sample semaphore operations. When reading a semaphore, all data lines output the semaphore value. The read value is latched in an output register to prevent the semaphore from changing state during a write from the other port. If both ports attempt to access the semaphore within tSPS of each other, the semaphore will definitely be obtained by one side or the other, but there is no guarantee which side will control the semaphore. Table 1. Non-Contending Read/Write Inputs Outputs Operation CE R/W OE SEM H X X H High Z Deselected: Power-down H H L L Data out Read data in semaphore flag X X H X High Z I/O lines disabled X L Data in Write into semaphore flag H L H Data out Read L L X H Data in L X X L H L I/O0–I/O8 Write Not allowed Table 2. Interrupt Operation Example (assumes BUSYL = BUSYR = HIGH) Function Left Port Right Port R/WL CEL OEL A0L–16L INTL R/WR CER OER A0R–16R INTR Set Right INTR Flag L L X 1FFFF X X X X X L[2] Reset Right INTR Flag X X X X X X L L 1FFFF H[3] Set Left INTL Flag X X X X L[3] L L X 1FFFE X Reset Left INTL Flag X L L 1FFFE H[2] X X X X X Notes 2. If BUSYL = L, then no change. 3. If BUSYR = L, then no change. Document Number: 38-06044 Rev. *H Page 6 of 23 CY7C009V Table 3. Semaphore Operation Example Function I/O0–I/O8 Left I/O0–I/O8Right Status No action 1 1 Semaphore free Left port writes 0 to semaphore 0 1 Left port has semaphore token Right port writes 0 to semaphore 0 1 No change. Right side has no write access to semaphore Left port writes 1 to semaphore 1 0 Right port obtains semaphore token Left port writes 0 to semaphore 1 0 No change. Left port has no write access to semaphore Right port writes 1 to semaphore 0 1 Left port obtains semaphore token Left port writes 1 to semaphore 1 1 Semaphore free Right port writes 0 to semaphore 1 0 Right port has semaphore token Right port writes 1 to semaphore 1 1 Semaphore free Left port writes 0 to semaphore 0 1 Left port has semaphore token Left port writes 1 to semaphore 1 1 Semaphore free Document Number: 38-06044 Rev. *H Page 7 of 23 CY7C009V Maximum Ratings DC input voltage ................................. –0.5 V to VCC + 0.5 V Exceeding maximum ratings [4] may shorten the useful life of the device. User guidelines are not tested. Output current into outputs (LOW) ............................. 20 mA Static discharge voltage ......................................... > 1100 V Storage temperature ................................ –65 °C to +150 °C Latch-up current ................................................... > 200 mA Ambient temperature with power applied .......................................... –55 C to +125 C Operating Range Supply voltage to ground potential ..............–0.5 V to +4.6 V Range DC voltage applied to outputs in high Z State ........................ –0.5 V to VCC + 0.5 V Commercial Industrial [5] Ambient Temperature VCC 0 °C to +70 °C 3.3 V ± 300 mV –40 °C to +85 °C 3.3 V ± 300 mV Electrical Characteristics Over the Operating Range CY7C009V Parameter Description Min -15 -20 -25 Typ Max Min Typ Max Min Typ Max VOH Output HIGH voltage (VCC = Min, IOH = –4.0 mA) 2.4 – 2.4 – 2.4 – V VOL Output LOW voltage (VCC = Min, IOH = +4.0 mA) – 0.4 – 0.4 – 0.4 V VIH Input HIGH voltage 2.2 – 2.2 – 2.2 – V VIL Input LOW voltage – 0.8 – 0.8 – 0.8 V IIX Input leakage current –5 5 –5 5 –5 5 A IOZ Output leakage current –10 10 –10 10 –10 10 A ICC Operating current (VCC = Max, IOUT = 0 mA) outputs disabled Commercial 185 – 120 175 – 165 mA 140 195 Standby current (both ports TTL level) CEL and CER VIH, f = fMAX Commercial 35 45 45 55 Standby current (one port TTL level) CEL | CER VIH, f = fMAX Commercial ISB1 ISB2 ISB3 ISB4 – – 125 Industrial – 35 Industrial – 80 Industrial 10 Standby current (one port CMOS level) CEL | CER VIH, f = fMAX[6] 75 Industrial 120 – Commercial Standby current (both ports CMOS level) Industrial CEL and CER VCC 0.2 V, f = 0 Commercial 50 250 – 105 – – Unit 75 110 85 120 10 250 10 250 70 95 80 105 – 115 – 30 mA 40 – 65 mA 95 – 10 A A – 80 – mA mA 250 60 mA mA mA Notes 4. The voltage on any input or I/O pin cannot exceed the power pin during power-up. 5. Industrial parts are available in CY7C009V. 6. fMAX = 1/tRC = All inputs cycling at f = 1/tRC (except output enable). f = 0 means no address or control lines change. This applies only to inputs at CMOS level standby ISB3. Document Number: 38-06044 Rev. *H Page 8 of 23 CY7C009V Capacitance Parameter [7] Description CIN Input capacitance COUT Output capacitance Test Conditions TA = 25 °C, f = 1 MHz, VCC = 3.3 V Max Unit 10 pF 10 pF AC Test Loads and Waveforms Figure 2. AC Test Loads and Waveforms 3.3 V 3.3 V R1 = 590 C = 30 pF RTH = 250 OUTPUT OUTPUT R1 = 590 OUTPUT C = 30 pF R2 = 435 (a) Normal Load (Load 1) (c) Three-State Delay (Load 2) (Used for tLZ, tHZ, tHZWE, & tLZWE including scope and jig) (b) Thévenin Equivalent (Load 1) ALL INPUT PULSES 3.0 V GND 10% 90% 10% 90% 3 ns 3 ns Data Retention Mode The CY7C009V is designed with battery backup in mind. Data retention voltage and supply current are guaranteed over temperature. The following rules ensure data retention: 1. Chip enable (CE) must be held HIGH during data retention, within VCC to VCC – 0.2 V. 2. CE must be kept between VCC – 0.2 V and 70% of VCC during the power-up and power-down transitions. 3. The RAM can begin operation > tRC after VCC reaches the minimum operating voltage (3.0 V). R2 = 435 C = 5 pF VTH = 1.4 V Timing Data Retention Mode VCC CE Parameter ICCDR1 3.0 V VCC 2.0 V 3.0 V VCC to VCC – 0.2 V Test Conditions [8] @ VCCDR = 2 V tRC V IH Max Unit 50 A Notes 7. Tested initially and after any design or process changes that may affect these parameters. 8. CE = VCC, Vin = GND to VCC, TA = 25C. This parameter is guaranteed but not tested. Document Number: 38-06044 Rev. *H Page 9 of 23 CY7C009V Switching Characteristics Over the Operating Range CY7C009V Parameter [9] Description -15 -20 -25 Unit Min Max Min Max Min Max READ CYCLE tRC Read cycle time 15 – 20 – 25 – ns tAA Address to data valid – 15 – 20 – 25 ns tOHA Output hold from address change 3 – 3 – 3 – ns tACE[10] CE LOW to data valid – 15 – 20 – 25 ns tDOE OE LOW to data valid – 10 – 12 – 13 ns OE LOW to low Z 3 – 3 – 3 – ns OE HIGH to high Z – 10 – 12 – 15 ns CE LOW to low Z 3 – 3 – 3 – ns CE HIGH to high Z – 10 – 12 – 15 ns CE LOW to power-up 0 – 0 – 0 – ns CE HIGH to power-down – 15 – 20 – 25 ns Byte enable access time – 15 – 20 – 25 ns 15 – 20 – 25 – ns tLZOE [11, 12, 13] tHZOE[11, 12, 13] tLZCE[11, 12, 13] tHZCE[11, 12, 13] tPU[13] tPD[13] tABE[10] WRITE CYCLE tWC Write cycle time tSCE[10] CE LOW to write end 12 – 16 – 20 – ns tAW Address valid to write end 12 – 16 – 20 – ns tHA Address hold from write end 0 – 0 – 0 – ns tSA[10] Address set-up to write start 0 – 0 – 0 – ns tPWE Write pulse width 12 – 17 – 22 – ns tSD Data set-up to write end 10 – 12 – 15 – ns tHD Data hold from write end 0 – 0 – 0 – ns tHZWE[12, 13] tLZWE[12, 13] tWDD[14] tDDD[14] R/W LOW to high Z – 10 – 12 – 15 ns R/W HIGH to low Z 3 – 3 – 3 – ns Write pulse to data delay – 30 – 40 – 50 ns Write data valid to read data valid – 25 – 30 – 35 ns Notes 9. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 to 3.0 V, and output loading of the specified IOI/IOH and 30 pF load capacitance. 10. To access RAM, CE = L, SEM = H. To access semaphore, CE = H and SEM = L. Either condition must be valid for the entire tSCE time. 11. At any given temperature and voltage condition for any given device, tHZCE is less than tLZCE and tHZOE is less than tLZOE. 12. Test conditions used are Load 2. 13. This parameter is guaranteed by design, but it is not production tested.For information on port-to-port delay through RAM cells from writing port to reading port, refer to Read Timing with Busy waveform. 14. For information on port-to-port delay through RAM cells from writing port to reading port, refer to Read Timing with Busy waveform. Document Number: 38-06044 Rev. *H Page 10 of 23 CY7C009V Switching Characteristics (continued) Over the Operating Range CY7C009V Parameter [9] Description -15 -20 -25 Unit Min Max Min Max Min Max – 15 – 20 – 20 BUSY TIMING [15] tBLA BUSY LOW from address match tBHA BUSY HIGH from address mismatch – 15 – 20 – 20 ns tBLC BUSY LOW from CE LOW – 15 – 20 – 20 ns tBHC BUSY HIGH from CE HIGH – 15 – 16 – 17 ns tPS Port set-up for priority 5 – 5 – 5 – ns tWB R/W HIGH after BUSY (Slave) 0 – 0 – 0 – ns tWH R/W HIGH after BUSY HIGH (Slave) 13 – 15 – 17 – ns tBDD[16] BUSY HIGH to data valid – 15 – 20 – 25 ns INTERRUPT TIMING ns [15] tINS INT set time – 15 – 20 – 20 ns tINR INT reset time – 15 – 20 – 20 ns 10 – 10 – 12 – ns SEMAPHORE TIMING tSOP SEM flag update pulse (OE or SEM) tSWRD SEM flag write to read time 5 – 5 – 5 – ns tSPS SEM flag contention window 5 – 5 – 5 – ns tSAA SEM address access time – 15 – 20 – 25 ns Notes 15. Test conditions used are Load 1. 16. tBDD is a calculated parameter and is the greater of tWDD–tPWE (actual) or tDDD–tSD (actual). Document Number: 38-06044 Rev. *H Page 11 of 23 CY7C009V Switching Waveforms Figure 3. Read Cycle No.1 (Either Port Address Access) [17, 18, 19] tRC ADDRESS tOHA DATA OUT tAA tOHA PREVIOUS DATA VALID DATA VALID Figure 4. Read Cycle No.2 (Either Port CE/OE Access) [17, 20, 21] tACE CE tHZCE tDOE OE tHZOE tLZOE DATA VALID DATA OUT tLZCE tPU tPD ICC CURRENT ISB Figure 5. Read Cycle No. 3 (Either Port) [17, 19, 20, 21] tRC ADDRESS tAA tOHA tLZCE tABE CE tHZCE tACE tLZCE DATA OUT Notes 17. R/W is HIGH for read cycles. 18. Device is continuously selected CE = VIL. This waveform cannot be used for semaphore reads. 19. OE = VIL. 20. Address valid prior to or coincident with CE transition LOW. 21. To access RAM, CE = VIL, SEM = VIH. To access semaphore, CE = VIH, SEM = VIL. Document Number: 38-06044 Rev. *H Page 12 of 23 CY7C009V Switching Waveforms (continued) Figure 6. Write Cycle No. 1: R/W Controlled Timing [22, 23, 24, 25] tWC ADDRESS tHZOE [26] OE tAW CE [27] tPWE[25] tSA tHA R/W tHZWE[26] DATA OUT tLZWE NOTE 28 NOTE 28 tSD tHD DATA IN Figure 7. Write Cycle No. 2: CE Controlled Timing [22, 23, 24, 29] tWC ADDRESS tAW CE [27] tSA tSCE tHA R/W tSD tHD DATA IN Notes 22. R/W must be HIGH during all address transitions. 23. A write occurs during the overlap (tSCE or tPWE) of a LOW CE or SEM. 24. tHA is measured from the earlier of CE or R/W or (SEM or R/W) going HIGH at the end of write cycle. 25. If OE is LOW during a R/W controlled write cycle, the write pulse width must be the larger of tPWE or (tHZWE + tSD) to allow the I/O drivers to turn off and data to be placed on the bus for the required tSD. If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified tPWE. 26. Transition is measured 500 mV from steady state with a 5 pF load (including scope and jig). This parameter is sampled and not 100% tested. 27. To access RAM, CE = VIL, SEM = VIH. 28. During this period, the I/O pins are in the output state, and input signals must not be applied. 29. If the CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the high-impedance state. Document Number: 38-06044 Rev. *H Page 13 of 23 CY7C009V Switching Waveforms (continued) Figure 8. Semaphore Read After Write Timing, Either Side [30] tOHA tSAA A0–A2 VALID ADRESS VALID ADRESS tAW tACE tHA SEM tSCE tSOP tSD I/O 0 DATAIN VALID tSA tPWE DATAOUT VALID tHD R/W tSWRD tDOE tSOP OE WRITE CYCLE READ CYCLE Figure 9. Timing Diagram of Semaphore Contention [31, 32, 33] A0L–A2L MATCH R/WL SEML tSPS A0R–A2R MATCH R/WR SEMR Notes 30. CE = HIGH for the duration of the above timing (both write and read cycle). 31. I/O0R = I/O0L = LOW (request semaphore); CER = CEL = HIGH. 32. Semaphores are reset (available to both ports) at cycle start. 33. If tSPS is violated, the semaphore will definitely be obtained by one side or the other, but which side will get the semaphore is unpredictable. Document Number: 38-06044 Rev. *H Page 14 of 23 CY7C009V Switching Waveforms (continued) Figure 10. Timing Diagram of Read with BUSY (M/S = HIGH) [34] tWC ADDRESSR MATCH tPWE R/WR tSD DATA INR tHD VALID tPS ADDRESSL MATCH tBLA tBHA BUSYL tBDD tDDD DATAOUTL VALID tWDD Figure 11. Write Timing with Busy Input (M/S = LOW) tPWE R/W BUSY tWB tWH Note 34. CEL = CER = LOW. Document Number: 38-06044 Rev. *H Page 15 of 23 CY7C009V Switching Waveforms (continued) Figure 12. Busy Timing Diagram No. 1 (CE Arbitration) [35] CEL Valid First: ADDRESSL,R ADDRESS MATCH CEL tPS CER tBLC tBHC BUSYR CER Valid First: ADDRESSL,R ADDRESS MATCH CER tPS CEL tBLC tBHC BUSYL Figure 13. Busy Timing Diagram No. 2 (Address Arbitration) [35] Left Address Valid First: tRC or tWC ADDRESSL ADDRESS MATCH ADDRESS MISMATCH tPS ADDRESSR tBLA tBHA BUSYR Right Address Valid First: tRC or tWC ADDRESSR ADDRESS MATCH ADDRESS MISMATCH tPS ADDRESSL tBLA tBHA BUSYL Note 35. If tPS is violated, the busy signal will be asserted on one side or the other, but there is no guarantee to which side BUSY will be asserted. Document Number: 38-06044 Rev. *H Page 16 of 23 CY7C009V Switching Waveforms (continued) Figure 14. Interrupt Timing Diagrams Left Side Sets INTR: ADDRESSL tWC WRITE 1FFFF tHA[36] CEL R/WL INTR tINS [37] Right Side Clears INTR: tRC READ 1FFFF ADDRESSR CER tINR [37] R/WR OER INTR Right Side Sets INTL: tWC ADDRESSR WRITE 1FFFE tHA[36] CER R/WR INTL [37] tINS Left Side Clears INTL: tRC READ 1FFFE ADDRESSR CEL tINR[37] R/WL OEL INTL Notes 36. tHA depends on which enable pin (CEL or R/WL) is deasserted first. 37. tINS or tINR depends on which enable pin (CEL or R/WL) is asserted last. Document Number: 38-06044 Rev. *H Page 17 of 23 CY7C009V Ordering Information 128 K × 8, 3.3 V Asynchronous Dual-Port SRAM Speed (ns) Package Name Ordering Code Package Type Operating Range 15 CY7C009V-15AXC A100 100-pin TQFP Pb-free Commercial 20 CY7C009V-20AXI A100 100-pin TQFP Pb-free Industrial 25 CY7C009V-25AXC A100 100-pin TQFP Pb-free Commercial Ordering Code Definitions CY 7 C 00 9 V - XX A X X Operating Range: X = C or I C = Commercial; I = Industrial Pb-free Package: A = 100-pin TQFP Speed Bin: XX = 15 or 20 or 25 3.3 V part 64 K / 128 K Dual Port Family 00 = × 8 Technology Code: C = CMOS Marketing Code: 7 = SRAM Company ID: CY = Cypress Document Number: 38-06044 Rev. *H Page 18 of 23 CY7C009V Package Diagram Figure 15. 100-pin TQFP (14 × 14 × 1.4 mm) A100SA Package Outline, 51-85048 51-85048 *I Document Number: 38-06044 Rev. *H Page 19 of 23 CY7C009V Acronyms Document Conventions Acronym Description Units of Measure CMOS Complementary Metal Oxide Semiconductor CE Chip Enable °C degree Celsius I/O Input/Output MHz megahertz INT Interrupt µA microampere OE Output Enable mA milliampere SEM Semaphore ms millisecond SRAM Static Random Access Memory mV millivolt TQFP Thin Quad Flat Pack ns nanosecond TTL Transistor-Transistor Logic pF picofarad V volt W watt Document Number: 38-06044 Rev. *H Symbol Unit of Measure Page 20 of 23 CY7C009V Document History Page Document Title: CY7C009V, 3.3 V 128 K × 8 Dual-Port Static RAM Document Number: 38-06044 Rev. ECN No. Issue Date Orig. of Change ** 110192 09/29/01 SZV Change from Spec number: 38-00669 to 38-06044 *A 113541 04/15/02 OOR Updated Pin Configurations (Changed pin 85 from BUSYL to BUSYR in the figure “100-pin TQFP (Top View)” (corresponding to CY7C018V/019V)). Description of Change *B 122294 12/27/02 RBI Updated Maximum Ratings (Added Power up requirements). *C 393440 See ECN YIM Added Pb-free Logo Updated Ordering Information (Added Pb-free parts (CY7C008V-25AXC, CY7C009V-15AXC, CY7C009V-20AXI, CY7C009V-25AXC, CY7C019V-15AXC, CY7C019V-20AXC, CY7C019V-20AXI, CY7C019V-25AXC)). *D 2896038 03/19/10 RAME Updated Ordering Information (Removed inactive parts). Updated Package Diagram. *E 3081242 11/09/2010 ADMU Added Ordering Code Definitions. Added Acronyms and Units of Measure. Minor edits and updated in new template. *F 3816114 11/19/2012 SMCH Updated Document Title to read “CY7C009V, 3.3 V 128 K × 8 Dual-Port Static RAM”. Updated Features (Removed CY7C008V, CY7C018V, CY7C019V related information). Updated Logic Block Diagram (Removed CY7C008V, CY7C018V, CY7C019V related information, removed Notes “I/O0–I/O7 for × 8 devices; I/O0–I/O8 for × 9 devices.” and “A0–A15 for 64 K devices; A0–A16 for 128 K.” and their references in Logic Block DIagram). Updated Functional Description (Removed CY7C008V, CY7C018V, CY7C019V related information). Updated Selection Guide (Removed CY7C008V, CY7C018V, CY7C019V related information). Updated Pin Configurations (Updated Figure 1 (Removed CY7C008V related information, removed the Note “This pin is NC for CY7C008V.” and its reference in the same figure), removed the figure “100-pin TQFP (Top View)”, removed the Note “This pin is NC for CY7C018V.”). Updated Pin Definitions (Removed CY7C008V, CY7C018V, CY7C019V related information). Updated Architecture (Removed CY7C008V, CY7C018V, CY7C019V related information). Updated Functional Overview (Updated Interrupts (Removed CY7C008V, CY7C018V, CY7C019V related information), updated Busy (Removed CY7C008V, CY7C018V, CY7C019V related information), updated Semaphore Operation (Removed CY7C008V, CY7C018V, CY7C019V related information), updated Table 2 (Removed CY7C008V, CY7C018V, CY7C019V related information), removed the Note “A0L–16L and A0R–16R, 1FFFF/1FFFE for the CY7C009V/19V.” and its reference in the same table)). Updated Operating Range (Updated Note 5 (Removed CY7C019V related information)). Updated Electrical Characteristics (Removed CY7C008V, CY7C018V, CY7C019V related information, removed the Note “Industrial parts are available in CY7C009V and CY7C019V only.” and its reference in Electrical Characteristics). Updated Data Retention Mode (Removed CY7C008V, CY7C018V, CY7C019V related information). Updated Switching Characteristics (Removed CY7C008V, CY7C018V, CY7C019V related information, updated Note 10 (Removed UB = L)). Document Number: 38-06044 Rev. *H Page 21 of 23 CY7C009V Document History Page (continued) Document Title: CY7C009V, 3.3 V 128 K × 8 Dual-Port Static RAM Document Number: 38-06044 Rev. ECN No. Issue Date Orig. of Change Description of Change *F (cont.) 3816114 11/19/2012 SMCH Updated Switching Waveforms (Updated Figure 14 (Removed CY7C019V related information)). Updated Package Diagram (spec 51-85048 (Changed revision from *D to *G)). *G 4194765 11/18/2013 SMCH Updated Pin Definitions: Replaced “CER, CE1R” with “CE0R, CE1R” in “Right Port” column. Updated Switching Waveforms: Updated Figure 14. Updated Package Diagram: spec 51-85048 – Changed revision from *G to *H. Updated in new template. Completing Sunset Review. *H 4580622 11/26/2014 SMCH Added related documentation hyperlink in page 1. Updated Figure 15 in Package Diagram (spec 51-85048 *H to *I). Document Number: 38-06044 Rev. *H Page 22 of 23 CY7C009V Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Automotive Clocks & Buffers Interface Lighting & Power Control cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/plc Memory cypress.com/go/memory PSoC cypress.com/go/psoc Touch Sensing PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training Technical Support cypress.com/go/support cypress.com/go/touch USB Controllers Wireless/RF psoc.cypress.com/solutions cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2001-2014. The information contained herein is subject to change without notice. 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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 38-06044 Rev. *H Revised November 26, 2014 All products and company names mentioned in this document may be the trademarks of their respective holders. Page 23 of 23