QTP 102308:49-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (3.2 X 3.2 X 0.5 MM) MSL1, 260C AMKOR KOREA-K4 (GQ)

Document No.001-63544 Rev. *D
ECN # 4489422
Cypress Semiconductor
Package Qualification Report
QTP#102308 VERSION *D
September 2014
49-Ball Wafer Level Chip Scale Package (WLCSP)
(3.2 x 3.2 x 0.5 mm)
MSL1, 260C
Amkor-Korea (GQ)
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 10
Document No.001-63544 Rev. *D
ECN # 4489422
PACKAGE QUALIFICATION HISTORY
QUAL
REPORT
DESCRIPTION OF QUALIFICATION PURPOSE
DATE
COMP.
100603
Qualify Amkor Korea for 81-ball WLCSP (Wafer Level Chip Scale Package) Package
Technology at MSL1, 260C
Jun 10
100302
Qualify Amkor (T5/T3) for S8 Indium WLCSP49 3.2x3.2x0.5mm
Jun 10
102308
103504
Qualify RDL / BUMP Process at Amkor Korea –K4 (GQ) using S8 Indium (8C20324B)
WLCSP 49 (49FNXI - 3.215 x 3.215 x 0.5mm)
Qualify Indium WLCSP using GSMC-Fab’ed Wafer at Amkor Korea (K4) for RDL/Bump
and Amkor Taiwan (T3) for Backend Die Processing
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 10
Aug 10
Dec 10
Document No.001-63544 Rev. *D
ECN # 4489422
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
FN49
Package Outline, Type, or Name:
49-Ball Wafer Level Chip Scale Package
Die Separation Method:
Saw
Solder Ball/Bump Material:
SnAgCu
Bond Diagram Designation
001-60020
Thermal Resistance Theta JA °C/W:
18.86°C/W
Redistribution Material:
Copper
Assembly Process Flow:
001-61572
Name/Location of Assembly (prime) facility:
Amkor Korea- K4 (GQ)
MSL Level
1
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML, KYEC
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 10
Document No.001-63544 Rev. *D
ECN # 4489422
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
Acoustic Microscopy Test
J-STD-020
P
Constructional Analysis
Criteria: Meet external and internal characteristics of Cypress
package
P
Electrostatic Discharge
Charge Device Model (ESDCDM)
500V
JESD22-C101
P
External Visual
MIL-PRF-38535, MILSTD-883, METHOD 2009
P
Final Visual
JESD22-B101B
P
JEDEC STD 22-A110, 130°C, 3.63V, 85%RH
Precondition: JESD22 Moisture Sensitivity Level 1
P
Highly Accelerated Saturation Test
(HAST)
168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C
High Temperature Storage
JESD22-A103, 150°C, no bias
P
Internal Visual
MIL-STD-883-2014
P
Pressure Cooker
JESD22-A102, 121°C, 100%RH, 15 Psig
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Solder Ball Shear
JESD22-B117
P
Thermal Shock
MIL-STD-883C, Method 1011, Condition B, -55 C to 125C
JESD22-A106B, Condition C, -55 C to 125C
P
Temperature Cycle
MIL-STD-883C, Method 1010, Condition B, -55°C to 125°C
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C
Company Confidential
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Page 4 of 10
P
Document No.001-63544 Rev. *D
ECN # 4489422
Reliability Test Data
QTP #:
Device
Fab Lot #
100603
Assy Lot #
Assy Loc
Duration
Samp
Rej
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
COMP
15
0
CYWB0125ABX (7C071001BK) 4953165
611003749
AMKOR-GQ
COMP
15
0
CYWB0125ABX (7C071001BK) 4952624
611003750
AMKOR-GQ
COMP
15
0
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
COMP
5
0
CYWB0125ABX (7C071001BK) 4953165
611003749
AMKOR-GQ
COMP
5
0
611003748
AMKOR-GQ
COMP
15
0
Failure Mechanism
STRESS: ACOUSTIC, MSL1
STRESS: CONSTRUCTIONAL ANALYSIS
STRESS: EXTERNAL VISUAL
CYWB0125ABX (7C071001BK) 4953170
STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, PRE COND 168 HR 85C/85%RH, MSL1
CYWB0124ABX (7C071001AC) 4746765
610812072
AMKOR-GQ
128
71
0
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1
CYWB0125ABX (7C071001BK) 4953170
AMKOR-GQ
168
87
0
610812072
AMKOR-GQ
168
87
0
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
COMP
5
0
CYWB0125ABX (7C071001BK) 4953165
611003749
AMKOR-GQ
COMP
5
0
CYWB0125ABX (7C071001BK) 4952624
611003750
AMKOR-GQ
COMP
5
0
CYWB0124ABX (7C071001AC) 4746765
611003748
STRESS: SOLDER BALL SHEAR
STRESS: TC COND. B -55C TO 125C, PRE COND 168 HRS 85C/85%RH, MSL1
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
500
70
0
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
1000
70
0
CYWB0125ABX (7C071001BK) 4953165
611003749
AMKOR-GQ
500
77
0
CYWB0125ABX (7C071001BK) 4953165
611003749
AMKOR-GQ
1000
77
0
CYWB0125ABX (7C071001BK) 4952624
611003750
AMKOR-GQ
500
77
0
CYWB0125ABX (7C071001BK) 4952624
611003750
AMKOR-GQ
1000
77
0
AMKOR-GQ
200
80
0
STRESS: THERMAL SHOCK
CYWB0125ABX (7C071001BK) 4953170
611003748
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 10
Document No.001-63544 Rev. *D
ECN # 4489422
Reliability Test Data
QTP #:
Device
Fab Lot#
100302
Assy Lot #
Assy Loc
Duration
Samp
Rej
CY8CTMA300EES (8C20324DC) 4937898
610939627
AU-TAIWAN
COMP
5
0
CY8CTMA300EES (8C20324DC) 4937898
610939626
AU-TAIWAN
COMP
5
0
AU-TAIWAN
COMP
5
0
610939626
AU-TAIWAN
COMP
9
0
CY8CTMA300EES (8C20324DC) 4937898
610939627
AU-TAIWAN
COMP
252
0
CY8CTMA300EES (8C20324DC) 4937898
610939626
AU-TAIWAN
COMP
180
0
AU-TAIWAN
COMP
79
0
Failure Mechanism
STRESS: CONSTRUCTIONAL ANALYSIS
CY8CTMA300EES (8C20324DC) 4937898
STRESS: ESD-CHARGE DEVICE MODEL (500V)
CY8CTMA300EES (8C20324DC) 4937898
STRESS: FINAL VISUAL
CY8CTMA300EES (8C20324DC) 4937898
STRESS: HIGH TEMPERATURE STORAGE, 150C, no bias
CY8CTMA300EES (8C20324DC) 4937898
610939627
AU-TAIWAN
500
98
0
CY8CTMA300EES (8C20324DC) 4937898
610939627
AU-TAIWAN
1000
96
0
CY8CTMA300EES (8C20324DC) 4937898
610939627
AU-TAIWAN
COMP
5
0
CY8CTMA300EES (8C20324DC) 4937898
610939626
AU-TAIWAN
COMP
5
0
AU-TAIWAN
COMP
5
0
STRESS: INTERNAL VISUAL
CY8CTMA300EES (8C20324DC) 4937898
STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 168 HRS, 85C/85%RH, MSL1)
CY8CTMA300EES (8C20324DC) 4937898
610939627
CY8CTMA300EES (8C20324DC) 4937898
AU-TAIWAN
96
77
0
AU-TAIWAN
96
76
0
STRESS: PHYSICAL DIMENSION
CY8CTMA300EES (8C20324DC) 4937898
610939627
AU-TAIWAN
COMP
5
0
CY8CTMA300EES (8C20324DC) 4937898
610939626
AU-TAIWAN
COMP
5
0
AU-TAIWAN
COMP
5
0
CY8CTMA300EES (8C20324DC) 4937898
STRESS: SEM ANALYSIS
CY8CTMA300EES (8C20324DC) 4937898
610939627
AU-TAIWAN
COMP
30
0
CY8CTMA300EES (8C20324DC) 4937898
610939626
AU-TAIWAN
COMP
30
0
AU-TAIWAN
COMP
30
0
CY8CTMA300EES (8C20324DC) 4937898
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 10
Document No.001-63544 Rev. *D
ECN # 4489422
Reliability Test Data
QTP #:
Device
Fab Lot#
Assy Lot #
100302
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: TC COND. B –55C TO 125C, PRE COND 168 HRS, 85C/85%RH, MSL1
CY8CTMA300EES (8C20324DC) 4937898
610939627
AU-TAIWAN
500
77
0
CY8CTMA300EES (8C20324DC) 4937898
610939627
AU-TAIWAN
1000
76
0
CY8CTMA300EES (8C20324DC) 4937898
610939626
AU-TAIWAN
500
84
0
CY8CTMA300EES (8C20324DC) 4937898
610939626
AU-TAIWAN
1000
83
0
CY8CTMA300EES (8C20324DC) 4937898
AU-TAIWAN
500
79
0
CY8CTMA300EES (8C20324DC) 4937898
AU-TAIWAN
1000
79
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 10
Document No.001-63544 Rev. *D
ECN # 4489422
Reliability Test Data
QTP #:
Device
Fab Lot#
102308
Assy Lot #
Assy Loc
Duration
Samp
Rej
WAFER1
AMKOR-GQ
COMP
5
0
Failure Mechanism
STRESS: CONSTRUCTIONAL ANALYSIS
CY8CTMA300D (8C20324B)
4008269
STRESS: SOLDER BALL SHEAR
CY8CTMA300D (8C20324B)
4008269
WAFER1
AMKOR-GQ
COMP
30
0
CY8CTMA300D (8C20324B)
4008269
WAFER2
AMKOR-GQ
COMP
30
0
CY8CTMA300D (8C20324B)
4946408
WAFER3
AMKOR-GQ
COMP
30
0
CY8CTMA300D (8C20324B)
4946408
WAFER6
AMKOR-GQ
COMP
30
0
CY8CTMA300D (8C20324B)
4946408
WAFER7
AMKOR-GQ
COMP
30
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 10
Document No.001-63544 Rev. *D
ECN # 4489422
Reliability Test Data
QTP #:
Device
Fab Lot#
103504
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: CONSTRUCTIONAL ANALYSIS
CY8CTMA3405 (8C203245DK)
4037935
611048747
AMKOR-GQ
COMP
5
0
CY8CTMA300E5 (8C203245DK)
4037935
611048743
AMKOR-GQ
COMP
5
0
CY8CTMA3405 (8C203245DK)
4037935
611048747
AMKOR-GQ
COMP
30
0
CY8CTMA300E5 (8C203245DK)
4037935
611048743
AMKOR-GQ
COMP
30
0
CY8CTMA300E5 (8C203245DK)
4037935
611048744
AMKOR-GQ
COMP
30
0
CY8CTMA3405 (8C203245DK)
4037935
611048746
AMKOR-GQ
COMP
30
0
CY8CTMA3405 (8C203245DK)
4037935
611048745
AMKOR-GQ
COMP
30
0
STRESS: SOLDER BALL SHEAR
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 9 of 10
Document No.001-63544 Rev. *D
ECN # 4489422
Document History Page
Document Title:
QTP 102308: 49-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (3.2 X 3.2 X 0.5 MM)
MSL1, 260C AMKOR KOREA-K4 (GQ)
001-63544
Document Number:
Rev. ECN
No.
**
3005165
*A
3113618
*B
3719678
Orig. of
Change
NRG
NSR
NSR
*C
4104482
HSTO
*D
4489422 HSTO
Description of Change
Initial spec release
Added QTP#103504 Data
Removed reference Cypress specs in the reliability tests performed
table and replaced with reference Industry standards.
Removed version 2.0 in the title page.
Sunset Review
Updated test location facility based on current qualified test site
Align qualification report based on the new template in the front page
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 10 of 10
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