Document No.001-63544 Rev. *D ECN # 4489422 Cypress Semiconductor Package Qualification Report QTP#102308 VERSION *D September 2014 49-Ball Wafer Level Chip Scale Package (WLCSP) (3.2 x 3.2 x 0.5 mm) MSL1, 260C Amkor-Korea (GQ) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 10 Document No.001-63544 Rev. *D ECN # 4489422 PACKAGE QUALIFICATION HISTORY QUAL REPORT DESCRIPTION OF QUALIFICATION PURPOSE DATE COMP. 100603 Qualify Amkor Korea for 81-ball WLCSP (Wafer Level Chip Scale Package) Package Technology at MSL1, 260C Jun 10 100302 Qualify Amkor (T5/T3) for S8 Indium WLCSP49 3.2x3.2x0.5mm Jun 10 102308 103504 Qualify RDL / BUMP Process at Amkor Korea –K4 (GQ) using S8 Indium (8C20324B) WLCSP 49 (49FNXI - 3.215 x 3.215 x 0.5mm) Qualify Indium WLCSP using GSMC-Fab’ed Wafer at Amkor Korea (K4) for RDL/Bump and Amkor Taiwan (T3) for Backend Die Processing Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 10 Aug 10 Dec 10 Document No.001-63544 Rev. *D ECN # 4489422 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: FN49 Package Outline, Type, or Name: 49-Ball Wafer Level Chip Scale Package Die Separation Method: Saw Solder Ball/Bump Material: SnAgCu Bond Diagram Designation 001-60020 Thermal Resistance Theta JA °C/W: 18.86°C/W Redistribution Material: Copper Assembly Process Flow: 001-61572 Name/Location of Assembly (prime) facility: Amkor Korea- K4 (GQ) MSL Level 1 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML, KYEC Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 10 Document No.001-63544 Rev. *D ECN # 4489422 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy Test J-STD-020 P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Electrostatic Discharge Charge Device Model (ESDCDM) 500V JESD22-C101 P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009 P Final Visual JESD22-B101B P JEDEC STD 22-A110, 130°C, 3.63V, 85%RH Precondition: JESD22 Moisture Sensitivity Level 1 P Highly Accelerated Saturation Test (HAST) 168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C High Temperature Storage JESD22-A103, 150°C, no bias P Internal Visual MIL-STD-883-2014 P Pressure Cooker JESD22-A102, 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C P Physical Dimension MIL-STD-1835, JESD22-B100 P Solder Ball Shear JESD22-B117 P Thermal Shock MIL-STD-883C, Method 1011, Condition B, -55 C to 125C JESD22-A106B, Condition C, -55 C to 125C P Temperature Cycle MIL-STD-883C, Method 1010, Condition B, -55°C to 125°C Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 10 P Document No.001-63544 Rev. *D ECN # 4489422 Reliability Test Data QTP #: Device Fab Lot # 100603 Assy Lot # Assy Loc Duration Samp Rej CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ COMP 15 0 CYWB0125ABX (7C071001BK) 4953165 611003749 AMKOR-GQ COMP 15 0 CYWB0125ABX (7C071001BK) 4952624 611003750 AMKOR-GQ COMP 15 0 CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ COMP 5 0 CYWB0125ABX (7C071001BK) 4953165 611003749 AMKOR-GQ COMP 5 0 611003748 AMKOR-GQ COMP 15 0 Failure Mechanism STRESS: ACOUSTIC, MSL1 STRESS: CONSTRUCTIONAL ANALYSIS STRESS: EXTERNAL VISUAL CYWB0125ABX (7C071001BK) 4953170 STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, PRE COND 168 HR 85C/85%RH, MSL1 CYWB0124ABX (7C071001AC) 4746765 610812072 AMKOR-GQ 128 71 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1 CYWB0125ABX (7C071001BK) 4953170 AMKOR-GQ 168 87 0 610812072 AMKOR-GQ 168 87 0 CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ COMP 5 0 CYWB0125ABX (7C071001BK) 4953165 611003749 AMKOR-GQ COMP 5 0 CYWB0125ABX (7C071001BK) 4952624 611003750 AMKOR-GQ COMP 5 0 CYWB0124ABX (7C071001AC) 4746765 611003748 STRESS: SOLDER BALL SHEAR STRESS: TC COND. B -55C TO 125C, PRE COND 168 HRS 85C/85%RH, MSL1 CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ 500 70 0 CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ 1000 70 0 CYWB0125ABX (7C071001BK) 4953165 611003749 AMKOR-GQ 500 77 0 CYWB0125ABX (7C071001BK) 4953165 611003749 AMKOR-GQ 1000 77 0 CYWB0125ABX (7C071001BK) 4952624 611003750 AMKOR-GQ 500 77 0 CYWB0125ABX (7C071001BK) 4952624 611003750 AMKOR-GQ 1000 77 0 AMKOR-GQ 200 80 0 STRESS: THERMAL SHOCK CYWB0125ABX (7C071001BK) 4953170 611003748 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 10 Document No.001-63544 Rev. *D ECN # 4489422 Reliability Test Data QTP #: Device Fab Lot# 100302 Assy Lot # Assy Loc Duration Samp Rej CY8CTMA300EES (8C20324DC) 4937898 610939627 AU-TAIWAN COMP 5 0 CY8CTMA300EES (8C20324DC) 4937898 610939626 AU-TAIWAN COMP 5 0 AU-TAIWAN COMP 5 0 610939626 AU-TAIWAN COMP 9 0 CY8CTMA300EES (8C20324DC) 4937898 610939627 AU-TAIWAN COMP 252 0 CY8CTMA300EES (8C20324DC) 4937898 610939626 AU-TAIWAN COMP 180 0 AU-TAIWAN COMP 79 0 Failure Mechanism STRESS: CONSTRUCTIONAL ANALYSIS CY8CTMA300EES (8C20324DC) 4937898 STRESS: ESD-CHARGE DEVICE MODEL (500V) CY8CTMA300EES (8C20324DC) 4937898 STRESS: FINAL VISUAL CY8CTMA300EES (8C20324DC) 4937898 STRESS: HIGH TEMPERATURE STORAGE, 150C, no bias CY8CTMA300EES (8C20324DC) 4937898 610939627 AU-TAIWAN 500 98 0 CY8CTMA300EES (8C20324DC) 4937898 610939627 AU-TAIWAN 1000 96 0 CY8CTMA300EES (8C20324DC) 4937898 610939627 AU-TAIWAN COMP 5 0 CY8CTMA300EES (8C20324DC) 4937898 610939626 AU-TAIWAN COMP 5 0 AU-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL CY8CTMA300EES (8C20324DC) 4937898 STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 168 HRS, 85C/85%RH, MSL1) CY8CTMA300EES (8C20324DC) 4937898 610939627 CY8CTMA300EES (8C20324DC) 4937898 AU-TAIWAN 96 77 0 AU-TAIWAN 96 76 0 STRESS: PHYSICAL DIMENSION CY8CTMA300EES (8C20324DC) 4937898 610939627 AU-TAIWAN COMP 5 0 CY8CTMA300EES (8C20324DC) 4937898 610939626 AU-TAIWAN COMP 5 0 AU-TAIWAN COMP 5 0 CY8CTMA300EES (8C20324DC) 4937898 STRESS: SEM ANALYSIS CY8CTMA300EES (8C20324DC) 4937898 610939627 AU-TAIWAN COMP 30 0 CY8CTMA300EES (8C20324DC) 4937898 610939626 AU-TAIWAN COMP 30 0 AU-TAIWAN COMP 30 0 CY8CTMA300EES (8C20324DC) 4937898 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 10 Document No.001-63544 Rev. *D ECN # 4489422 Reliability Test Data QTP #: Device Fab Lot# Assy Lot # 100302 Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. B –55C TO 125C, PRE COND 168 HRS, 85C/85%RH, MSL1 CY8CTMA300EES (8C20324DC) 4937898 610939627 AU-TAIWAN 500 77 0 CY8CTMA300EES (8C20324DC) 4937898 610939627 AU-TAIWAN 1000 76 0 CY8CTMA300EES (8C20324DC) 4937898 610939626 AU-TAIWAN 500 84 0 CY8CTMA300EES (8C20324DC) 4937898 610939626 AU-TAIWAN 1000 83 0 CY8CTMA300EES (8C20324DC) 4937898 AU-TAIWAN 500 79 0 CY8CTMA300EES (8C20324DC) 4937898 AU-TAIWAN 1000 79 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 10 Document No.001-63544 Rev. *D ECN # 4489422 Reliability Test Data QTP #: Device Fab Lot# 102308 Assy Lot # Assy Loc Duration Samp Rej WAFER1 AMKOR-GQ COMP 5 0 Failure Mechanism STRESS: CONSTRUCTIONAL ANALYSIS CY8CTMA300D (8C20324B) 4008269 STRESS: SOLDER BALL SHEAR CY8CTMA300D (8C20324B) 4008269 WAFER1 AMKOR-GQ COMP 30 0 CY8CTMA300D (8C20324B) 4008269 WAFER2 AMKOR-GQ COMP 30 0 CY8CTMA300D (8C20324B) 4946408 WAFER3 AMKOR-GQ COMP 30 0 CY8CTMA300D (8C20324B) 4946408 WAFER6 AMKOR-GQ COMP 30 0 CY8CTMA300D (8C20324B) 4946408 WAFER7 AMKOR-GQ COMP 30 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 10 Document No.001-63544 Rev. *D ECN # 4489422 Reliability Test Data QTP #: Device Fab Lot# 103504 Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: CONSTRUCTIONAL ANALYSIS CY8CTMA3405 (8C203245DK) 4037935 611048747 AMKOR-GQ COMP 5 0 CY8CTMA300E5 (8C203245DK) 4037935 611048743 AMKOR-GQ COMP 5 0 CY8CTMA3405 (8C203245DK) 4037935 611048747 AMKOR-GQ COMP 30 0 CY8CTMA300E5 (8C203245DK) 4037935 611048743 AMKOR-GQ COMP 30 0 CY8CTMA300E5 (8C203245DK) 4037935 611048744 AMKOR-GQ COMP 30 0 CY8CTMA3405 (8C203245DK) 4037935 611048746 AMKOR-GQ COMP 30 0 CY8CTMA3405 (8C203245DK) 4037935 611048745 AMKOR-GQ COMP 30 0 STRESS: SOLDER BALL SHEAR Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 10 Document No.001-63544 Rev. *D ECN # 4489422 Document History Page Document Title: QTP 102308: 49-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (3.2 X 3.2 X 0.5 MM) MSL1, 260C AMKOR KOREA-K4 (GQ) 001-63544 Document Number: Rev. ECN No. ** 3005165 *A 3113618 *B 3719678 Orig. of Change NRG NSR NSR *C 4104482 HSTO *D 4489422 HSTO Description of Change Initial spec release Added QTP#103504 Data Removed reference Cypress specs in the reliability tests performed table and replaced with reference Industry standards. Removed version 2.0 in the title page. Sunset Review Updated test location facility based on current qualified test site Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 10