QTP# 150414:48 VFBGA (6X8X1.0MM) SAC 105 SOLDER BALL FINISH, CUPD WIRE, MSL3, 260C REFLOW, CML-RA

Document No.002-12584 Rev. **
ECN # 5230544
Cypress Semiconductor
Package Qualification Report
QTP# 150414 VERSION**
April 2016
48 VFBGA (6x8x1.0mm)
SAC 105 Solder Ball Finish, CuPd Wire
MSL3, 260C Reflow
CML-RA
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda (JYF)
Sr. Reliability Engineer
Reviewed By:
Rene Rodgers (RT)
Sr. MTS Reliability Engineer
Approved By:
Don Darling (DCDA)
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
Document No.002-12584 Rev. **
ECN # 5230544
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
140204
Qualification of 48 VFBGA (6x8x1.0 mm) at CML-RA using GR9810-1PLA
Mold Compound, QMI-506 Die Attach Epoxy, SAC-105 Solder Ball Finish, 0.8 mil
CuPd Wire, with MSL 3, 260°C Reflow Temperature
March 2014
150414
Qualification of 48 VFBGA (6x8x1.0 mm) at CML-RA using GR9810-1PLA
Mold Compound, QMI-506 Die Attach Epoxy, SAC-105 Solder Ball Finish, 0.8 mil
CuPd Wire, with MSL 3, 260°C Reflow Temperature
June 2015
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
Document No.002-12584 Rev. **
ECN # 5230544
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
BZ48A
VFBGA (Very Fine Ball Grid Array)
GR9810-1PLA/Henkel
V-0 / UL94
Oxygen Rating Index:
54 (Typical) / 28 (Min. value)
Substrate Material:
BT resin
Lead Finish, Composition / Thickness:
SAC105
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Saw
Die Attach Supplier:
Henkel
Die Attach Material:
QMI 506
Bond Diagram Designation:
001-95770
Wire Bond Method:
Thermosonic
Wire Material/Size:
CuPd, 0.8 mil
Thermal Resistance Theta JA °C/W:
31.35°C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
001-80721
Name/Location of Assembly (prime) facility:
CML-RA
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R, CML-RA, Chipmos-GO
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No.002-12584 Rev. **
ECN # 5230544
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
Acoustic Microscopy
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
Ball Shear
JESD22-B116
P
Bond Pull
MIL-STD-883 – Method 2011
P
Constructional Analysis
Criteria: Meet external and internal characteristics of
Cypress package
MIL-STD-883, Method 2019
Per die size:
<3000 sq. mils = 1.2 kgf
Die Shear
P
P
30001-5000 sq. mils = 1.2 kgf
>5001 sq. mils = 1.2 kgf
Dye Penetrant Test
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V/1,000V/1,250V
JESD22-C101
P
Final Visual
JESD22-B101
P
High Accelerated Saturation Test
(HAST)
JEDEC STD 22-A110: 110°C, 85%RH, 3.65V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
High Temperature Storage
JESD22-A103:150°C No bias
P
Internal Visual
MIL-STD-883-2014
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Pressure Cooker
JESD22-A102: 121C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
Solder Ball Shear
JESD22-B117
P
Temperature Cycle
MIL-STD-883, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
X-Ray
MIL-STD-883 - 2012
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 8
Document No.002-12584 Rev. **
ECN # 5230544
Reliability Test Data
QTP #: 140204
Device
Fab Lot #
Assy Lot #
Ass Loc
Duration
Samp
Rej Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
COMP
170
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
COMP
15
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
COMP
15
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
COMP
30
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
COMP
30
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
COMP
30
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
COMP
30
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
COMP
30
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
COMP
30
0
611348182
CML-RA
COMP
5
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
COMP
15
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
COMP
15
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
COMP
15
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
COMP
15
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
COMP
15
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
COMP
15
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
500
9
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
1000
3
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
1250
3
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
COMP
834
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
COMP
805
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
COMP
528
0
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY7C1061G30 (7CC171061A) 9313001
STRESS: DIE SHEAR
STRESS: DYE PENETRANT TEST
STRESS: ESD-CHARGE DEVICE MODEL
STRESS: FINAL VISUAL
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Document No.002-12584 Rev. **
ECN # 5230544
Reliability Test Data
QTP #: 140204
Device
Fab Lot #
Assy Lot #
Ass Loc
Duration
Samp
Rej Failure Mechanism
STRESS: HI-ACCEL SATURATION TEST, 110C, 85%RH, 3.65V, PRE COND 192 HR 30C/60%RH, MSL3
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
264
30
0
STRESS: HIGH TEMPERATURE STORAGE, PLASTIC, 150C
CY7C1061G30 (7CC171061A
9313001
611333088
CML-RA
500
79
0
CY7C1061G30 (7CC171061A
9313001
611333088
CML-RA
1000
79
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
COMP
5
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
COMP
30
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
COMP
30
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
COMP
30
0
STRESS: INTERNAL VISUAL
STRESS: PHYSICAL DIMENSION
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CY7C1061G30 (7CC171061A
9313001
611333088
CML-RA
168
78
0
CY7C1061G30 (7CC171061A
9313001
611333088
CML-RA
288
78
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
COMP
150
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
COMP
150
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
COMP
150
0
STRESS: SOLDER BALL SHEAR
STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
500
80
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
1000
78
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
500
80
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
1000
79
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
500
80
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
1000
80
0
CY7C1061G30 (7CC171061A) 9313001
611348182
CML-RA
COMP
15
0
CY7C1061G30 (7CC171061A) 9313001
611348183
CML-RA
COMP
15
0
CY7C1061G30 (7CC171061A) 9313001
611348184
CML-RA
COMP
15
0
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Document No.002-12584 Rev. **
ECN # 5230544
Reliability Test Data
QTP #: 150414
Device
Fab Lot #
Assy Lot #
Ass Loc
Duration
Samp
Rej Failure Mechanism
CY7S1041GE30 (7CP1710416A) 9507001
611513220
CML-RA
COMP
15
0
CY7C1041G30 (7CP171041A)
9507001
611513219
CML-RA
COMP
15
0
CY62147GE30 (7CP1721473A)
9507001
611514757
CML-RA
COMP
15
0
CY7S1041GE30 (7CP1710416A) 9507001
611513220
CML-RA
COMP
5
0
CY7C1041G30 (7CP171041A)
9507001
611513219
CML-RA
COMP
5
0
CY62147GE30 (7CP1721473A)
9507001
611514757
CML-RA
COMP
5
0
CY7S1041GE30 (7CP1710416A) 9507001
611513220
CML-RA
COMP
15
0
CY7C1041G30 (7CP171041A)
9507001
611513219
CML-RA
COMP
15
0
CY62147GE30 (7CP1721473A)
9507001
611514757
CML-RA
COMP
15
0
STRESS: ACOUSTIC
STRESS: CONSTRUCTIONAL ANALYSIS
STRESS: DYE PENETRANT TEST
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Document No.002-12584 Rev. **
ECN # 5230544
Document History Page
Document Title:
Document Number:
QTP# 150414:48 VFBGA (6X8X1.0MM) SAC 105 SOLDER BALL FINISH, CUPD WIRE, MSL3,
260C REFLOW, CML-RA
002-12584
Rev. ECN
Orig. of
No.
Change
**
5230544 JYF
Description of Change
Initial spec release.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
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