QTP#150202:44L/52L TQFP (10X10X1.4MM/1.0MM) PURE SN LEADFINISH, CUPD WIRE MSL3, 260C REFLOW AMKOR-PHILIPPINES (M).pdf

Document No.001-97306 Rev. *B
ECN # 4399360
Cypress Semiconductor
Package Qualification Report
QTP# 150202 VERSION *B
May 2016
44L TQFP (10x10x1.4mm/1.0mm)
52L TQFP (10x10x1.4mm/1.0mm)
Pure Sn Leadfinish, CuPd Wire
MSL3, 260C Reflow
Amkor-Philippines (M)
FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] :
OR VIA LINK A CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Don Darling
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 9
Document No.001-97306 Rev. *B
ECN # 4399360
PACKAGE QUALIFICATION HISTORY
QTP
Number
150202
Description of Qualification Purpose
Qualification of 44L TQFP (10x10x1.4mm) Package, using 0.8mil
CuPd wire, G631 mold compound, AP4200 die attach material and
Pure Sn leadfinish at MSL3, 260C Reflow Temperature
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 9
Date
Apr
2015
Document No.001-97306 Rev. *B
ECN # 4399360
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
AZ44
Package Outline, Type, or Name:
44L TQFP (10x10x1.4mm)
Mold Compound Name/Manufacturer:
G631HQ / Sumitomo
Mold Compound Flammability Rating:
V-0 / UL94
Mold Compound Alpha Emission Rate:
N/A (not low alpha mold compound)
Oxygen Rating Index: >28%
>28% typical value
Lead Frame Designation:
Full Metal Pad
Lead Frame Material:
C194
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Grinding
Die Separation Method:
Wafer Saw
Die Attach Supplier:
Evertech Enterprise
Die Attach Material:
AP4200
Bond Diagram Designation
001-91463
Wire Bond Method:
Thermosonic
Wire Material/Size:
CuPd / 0.8 mil
Thermal Resistance Theta JA C/W:
60°C/W
Package Cross Section Yes/No:
No
Assembly Process Flow:
001-97022
Name/Location of Assembly (prime) facility:
Amkor-Philippines (M)
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
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Page 3 of 9
Document No.001-97306 Rev. *B
ECN # 4399360
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Temperature Operating Life
Latent Failure Rate (LFR)
Pressure Cooker Test
Temperature Cycle
Acoustic Microscopy
Test Condition (Temp/Bias)
Dynamic Operating Condition, 150°C, 2.3V, 500 Hours
JESD22-A-108-B
JESD22-A102, 121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C , 60% RH, 260C Reflow)
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C , 60% RH, 260C Reflow)
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C , 60% RH, 260C Reflow)
Result
P/F
P
P
P
P
Constructional Analysis
Criteria: Meet external and internal
characteristics of package
P
High Temp Storage
JESD22-A103: 150 C, no bias
P
X-Ray
MIL-STD-883 – 2012
P
Internal Visual
MIL-STD-883-2014
P
Final Visual Inspection
JESD22-B101B
P
Bond Pull
MIL-STD-883 – Method 2011
P
Ball Shear
JESD22-B116A
P
High Accelerated Saturation Test
(HAST)
JEDEC STD 22-A110, 130 C, 85%RH, 5.25V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
No Package Crack
Dye Penetrant Test
P
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
Physical Dimension
500V, JESD22-C101
MIL-STD-1835, JESD22-B100
P
Solderability
J-STD-002, JESD22-B102
P
Post Stress Ball Shear
JESD22-A116
P
Post Stress Bond Pull
MIL-STD-883 – Method 2011
P
Die Shear
MIL-STD-883, Method 2019
Per die size:
<3000 sq. mils = 1.2 kgf
30001-5000 sq. mils = 1.2 kgf
>5001 sq. mils = 1.2 kgf
Company Confidential
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Page 4 of 9
P
P
Document No.001-97306 Rev. *B
ECN # 4399360
Reliability Test Data
QTP #: 150202
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
15
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
COMP
15
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
COMP
15
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
150
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
COMP
150
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
COMP
150
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
150
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
COMP
150
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
COMP
150
0
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
5
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
COMP
5
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
COMP
5
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
15
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
COMP
15
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
COMP
15
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
15
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
COMP
15
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
COMP
15
0
STRESS: DIE SHEAR
STRESS: DYE PENETRANT
STRESS: ESD-CHARGE DEVICE MODEL
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
500
9
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
3
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 9
Document No.001-97306 Rev. *B
ECN # 4399360
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1250
3
0
Reliability Test Data
QTP #: 150202
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: FINAL VISUAL INSPECTION
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
796
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
794
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
603
0
STRESS: HIGH ACCELERATED SATURATION TEST 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH (MSL3)
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
96
30
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
96
30
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
96
30
0
CY7B995AXIKP (7CP87B995)
AZ44
8430008
611522027
AMKOR-M
192
77
0
STRESS: HIGH TEMPERATURE STORAGE
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
500
79
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
79
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
500
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
1000
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
500
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
1000
80
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.3V, Vcc Max
7C08323CC
AZ120 4430901
611438709
AMKOR-M
500
80
0
7C08323CC
AZ120 4430901
611438708
AMKOR-M
500
80
0
7C08323CC
AZ120 4430901
611438707
AMKOR-M
500
80
0
STRESS: PRESSURE COOKER TEST
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
168
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
288
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
168
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
288
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
168
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 9
Document No.001-97306 Rev. *B
ECN # 4399360
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
288
80
0
Reliability Test Data
QTP #: 150202
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: PHYSICAL DIMENSION
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
30
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
COMP
30
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
COMP
30
0
96
5
0
96
5
0
AMKOR-M
1000
5
0
AMKOR-M
1000
5
0
AMKOR-M
288
5
0
AMKOR-M
288
5
0
AMKOR-M
1000
5
0
STRESS: POST HIGH ACCELERATED SATURATION TEST BALL SHEAR TEST
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
STRESS: POST HIGH ACCELERATED SATURATION TEST BOND PULL
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
STRESS: POST HIGH TEMPERATURE STORAGE BALL SHEAR TEST
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
STRESS: POST HIGH TEMPERATURE STORAGE BOND PULL
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
STRESS: POST PRESSURE COOKER TEST BALL SHEAR
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
STRESS: POST PRESSURE COOKER TEST BOND PULL
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
STRESS: POST TEMPERATURE CYCLE BALL SHEAR
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
STRESS: POST TEMPERATURE CYCLE CONSTRUCTIONAL ANALYSIS
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
5
0
STRESS: POST TEMPERATURE CYCLE BOND PULL
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
5
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
3
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
COMP
3
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
COMP
3
0
STRESS: SOLDERABILITY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 9
Document No.001-97306 Rev. *B
ECN # 4399360
Reliability Test Data
QTP #: 150202
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: TEMPERATURE CYCLE
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
500
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
500
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
1000
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
500
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
1000
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
COMP
15
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
COMP
15
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
COMP
15
0
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 9
Document No.001-97306 Rev. *B
ECN # 4399360
Document History Page
Document Title: QTP#150202: 44L/52L TQFP (10X10X1.4MM/1.0MM) PURE SN LEADFINISH, CUPD WIRE MSL3,
260C REFLOW AMKOR-PHILIPPINES (M)
Document Number:
001-97306
Rev. ECN
No.
**
4733403
*A
4794191
*B
4399360
Orig. of
Change
HSTO
HSTO
HSTO
Description of Change
DCON
-Removed Distribution and posting information from Document history
page.
-Updated Cypress logo with the new tagline.
Initial spec release
Update Electrical Test/Finish Description Table
Update contact person for Reliability Director
Added HAST extended readpoint result.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 9 of 9
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