QTP#153009:120L TQFP (14x14x1.4mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow Amkor-Philippines (M).pdf

Document No.002-12533 Rev. **
ECN # 5226437
Cypress Semiconductor
Package Qualification Report
QTP# 153009 VERSION **
April 2016
120L TQFP (14x14x1.4mm)
Pure Sn Leadfinish, CuPd Wire
MSL3, 260C Reflow
Amkor-Philippines (M)
FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] :
OR VIA LINK A CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Don Darling
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 9
Document No.002-12533 Rev. **
ECN # 5226437
PACKAGE QUALIFICATION HISTORY
QTP
Number
153009
Description of Qualification Purpose
Qualification of 120L TQFP (14x14x1.4mm) Package using 1.2mil
CuPd wire, G631 mold compound, AP4200 die attach material, CuAg
leadframe and Pure Sn leadfinish at MSL3, 260C Reflow
Temperature.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 9
Date
Apr
2016
Document No.002-12533 Rev. **
ECN # 5226437
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
AZ0AE
Package Outline, Type, or Name:
120L TQFP (14x14x1.4mm)
Mold Compound Name/Manufacturer:
G631HQ / Sumitomo
Mold Compound Flammability Rating:
V-0 / UL94
Mold Compound Alpha Emission Rate:
N/A (not low alpha mold compound)
Oxygen Rating Index: >28%
>28% typical value
Lead Frame Designation:
Full Metal Pad
Lead Frame Material:
CuAg (C194)
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Grinding
Die Separation Method:
Wafer Saw
Die Attach Supplier:
Evertech Enterprise
Die Attach Material:
AP4200
Bond Diagram Designation
001-91280
Wire Bond Method:
Thermosonic
Wire Material/Size:
CuPd / 1.2 mil
Thermal Resistance Theta JA C/W:
31°C/W
Package Cross Section Yes/No:
No
Assembly Process Flow:
49-24999
Name/Location of Assembly (prime) facility:
Amkor-Philippines (M)
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 9
Document No.002-12533 Rev. **
ECN # 5226437
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Temperature Operating Life
Latent Failure Rate (LFR)
Pressure Cooker Test
Temperature Cycle
Acoustic Microscopy
Test Condition (Temp/Bias)
Dynamic Operating Condition, 150°C, 2.3V, 500 Hours
JESD22-A-108-B
JESD22-A102, 121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
Result
P/F
P
P
P
P
Constructional Analysis
Criteria: Meet external and internal
characteristics of package
P
High Temp Storage
JESD22-A103: 150 C, no bias
P
X-Ray
MIL-STD-883 – 2012
P
Internal Visual
MIL-STD-883-2014
P
Final Visual Inspection
JESD22-B101B
P
Bond Pull
MIL-STD-883 – Method 2011
P
Ball Shear
JESD22-B116A
P
High Accelerated Saturation Test
(HAST)
JEDEC STD 22-A110, 130 C, 85%RH, 3.63V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
No Package Crack
Dye Penetrant Test
P
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
Physical Dimension
500V, JESD22-C101
MIL-STD-1835, JESD22-B100
P
Post Stress Ball Shear
JESD22-A116
P
Post Stress Bond Pull
MIL-STD-883 – Method 2011
P
Solderability
J-STD-002, JESD22-B102
P
Die Shear
MIL-STD-883, Method 2019
Per die size:

<3000 sq. mils = 1.2 kgf

30001-5000 sq. mils = 1.2 kgf

>5001 sq. mils = 1.2 kgf
P
Company Confidential
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Page 4 of 9
P
Document No.002-12533 Rev. **
ECN # 5226437
Reliability Test Data
QTP #: 153009
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY7C0832AV (7C08323CC)
AZ120
4450242
611512169
AMKOR-M
COMP
15
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512160
AMKOR-M
COMP
15
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512161
AMKOR-M
COMP
15
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512169
AMKOR-M
COMP
150
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512160
AMKOR-M
COMP
150
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512161
AMKOR-M
COMP
150
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512169
AMKOR-M
COMP
150
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512160
AMKOR-M
COMP
150
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512161
AMKOR-M
COMP
150
0
AZ120
4430901
611438709
AMKOR-M
COMP
5
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512169
AMKOR-M
COMP
15
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512160
AMKOR-M
COMP
15
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512161
AMKOR-M
COMP
15
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
COMP
15
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438708
AMKOR-M
COMP
15
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438707
AMKOR-M
COMP
15
0
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY7C0832AV (7C08323CC)
STRESS: DIE SHEAR
STRESS: DYE PENETRANT
STRESS: ESD-CHARGE DEVICE MODEL
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
500
9
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
1000
3
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
1250
3
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 9
Document No.002-12533 Rev. **
ECN # 5226437
Reliability Test Data
QTP #: 153009
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: FINAL VISUAL
CY7C0832AV (7C08323CC)
AZ120
4450242
611512169
AMKOR-M
COMP
274
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512160
AMKOR-M
COMP
142
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512161
AMKOR-M
COMP
146
0
STRESS: HIGH ACCELERATED SATURATION TEST 130C, 3.63V, 85%RH, PRE COND 192 HR 30C/60%RH (MSL3)
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
96
29
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438708
AMKOR-M
96
30
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438707
AMKOR-M
96
30
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.3V, Vcc Max
CY7C0832AV (7C08323CC)
AZ120 4430901
611438709
AMKOR-M
500
80
0
CY7C0832AV (7C08323CC)
AZ120 4430901
611438708
AMKOR-M
500
80
0
CY7C0832AV (7C08323CC)
AZ120 4430901
611438707
AMKOR-M
500
80
0
STRESS: HIGH TEMPERATURE STORAGE
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
500
79
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
79
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
500
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
1000
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
500
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
1000
80
0
STRESS: INTERNAL VISUAL
CY7C0832AV (7C08323CC)
AZ120
4450242
611512169
AMKOR-M
COMP
150
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512160
AMKOR-M
COMP
150
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512161
AMKOR-M
COMP
150
0
STRESS: PRESSURE COOKER TEST
CY7C0832AV (7C08323CC)
AZ120
4450242
611512169
AMKOR-M
168
78
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512160
AMKOR-M
168
79
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512161
AMKOR-M
168
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 9
Document No.002-12533 Rev. **
ECN # 5226437
Reliability Test Data
QTP #: 153009
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: PHYSICAL DIMENSIONS
CY7C0832AV (7C08323CC)
AZ120
4450242
611512169
AMKOR-M
COMP
30
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512160
AMKOR-M
COMP
30
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512161
AMKOR-M
COMP
30
0
96
5
0
STRESS: POST HIGH ACCELERATED SATURATION TEST BALL SHEAR TEST
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
STRESS: POST HIGH ACCELERATED SATURATION TEST BOND PULL
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
96
5
0
4430901
611438709
AMKOR-M
COMP
1
0
4430901
611438709
AMKOR-M
COMP
1
0
4450242
611512169
AMKOR-M
168
5
0
4450242
611512169
AMKOR-M
168
5
0
STRESS: POST MSL BALL SHEAR TEST
CY7C0832AV (7C08323CC)
AZ120
STRESS: POST MSL BOND PULL
CY7C0832AV (7C08323CC)
AZ120
STRESS: POST PCT BALL SHEAR
CY7C0832AV (7C08323CC)
AZ120
STRESS: POST PCT BOND PULL
CY7C0832AV (7C08323CC)
AZ120
STRESS: POST TCT BALL SHEAR
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
500
5
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
1000
5
0
STRESS: POST TCT BOND PULL
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
500
5
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
1000
5
0
STRESS: POST HIGH TEMPERATURE STORAGE BALL SHEAR TEST
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
5
0
AMKOR-M
1000
5
0
STRESS: POST HIGH TEMPERATURE STORAGE BOND PULL
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 9
Document No.002-12533 Rev. **
ECN # 5226437
Reliability Test Data
QTP #: 153009
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: SOLDERABILITY
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
COMP
3
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438708
AMKOR-M
COMP
3
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438707
AMKOR-M
COMP
3
0
STRESS: TEMPERATURE CYCLE
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
500
82
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438709
AMKOR-M
1000
72
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438708
AMKOR-M
500
83
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438708
AMKOR-M
1000
83
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438707
AMKOR-M
500
85
0
CY7C0832AV (7C08323CC)
AZ120
4430901
611438707
AMKOR-M
1000
85
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512169
AMKOR-M
COMP
15
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512160
AMKOR-M
COMP
15
0
CY7C0832AV (7C08323CC)
AZ120
4450242
611512161
AMKOR-M
COMP
15
0
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 9
Document No.002-12533 Rev. **
ECN # 5226437
Document History Page
Document Title: QTP#153009: 120L TQFP (14x14x1.4mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow AmkorPhilippines (M)
Document Number:
002-12533
Rev. ECN
Orig. of
No.
Change
**
5226437 HSTO
Description of Change
Initial spec release
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 9 of 9
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