Document No. 002-03311 Rev. *E ECN # 5234707 Cypress Semiconductor Package Qualification Report QTP# 152916 VERSION *E April 2016 TSOP I 48LD (12x18.4x1.0mm) Pure Sn Leadfinish, Cu Wire MSL3, 260C Reflow BKK-Thailand (SB) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Sr. Reliability Engineer Reviewed By: Rene Rodgers (RT) Sr. MTS Reliability Engineer Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 002-03311 Rev. *E ECN # 5234707 PACKAGE QUALIFICATION HISTORY QTP Number 152916 Description of Qualification Purpose Date Qualification of TSOPI 48LD (12x18.4x1.0MM) using 0.9mil Cu Wire, CRM1150B Die Attach epoxy, CEL9200HF10-U Mold Compound with Pure Sn Sept. 2015 Leadfinish at MSL3, 260C Reflow Temperature Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No. 002-03311 Rev. *E ECN # 5234707 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: ZT48A TSOP I 48LD CEL9200HF10-U/ HITACHI UL-94-V-0 Oxygen Rating Index: >54% Leadframe Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Sumitomo Die Attach Material: CRM-1150B Bond Diagram Designation: 001-97408/001-97409 Wire Bond Method: Thermosonic Wire Material/Size: Cu/ 0.9 Mil Thermal Resistance Theta JA °C/W: 34.64°C/W Package Cross Section Yes/No: No Assembly Process Flow: 001-97055 Name/Location of Assembly (prime) facility: BKK-Thailand (SB) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CHIPMOS Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No. 002-03311 Rev. *E ECN # 5234707 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P Ball Shear JESD22-B116 P Bond Pull MIL-STD-883 – Method 2011 P Constructional Analysis Die Shear Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Criteria: No Package Crack P P P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V/1,000V/1,250V JESD22-C101 P Final Visual JESD22-B101 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C, 85% RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P High Temperature Storage JESD22-A103:150°C No bias P Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P Pressure Cooker JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P Solder Ball Shear JESD22-B117 P Solderability J-STD-002, JESD22-B102 P Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P X-Ray MIL-STD-883 - 2012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 Document No. 002-03311 Rev. *E ECN # 5234707 Reliability Test Data QTP #: 152916 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej STRESS: ACOUSTIC, MSL3 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand COMP 15 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand COMP 15 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand COMP 15 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand COMP 30 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand COMP 30 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand COMP 30 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand COMP 30 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand COMP 30 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand COMP 30 0 4506409 611518707 SB-Thailand COMP 5 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand COMP 10 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand COMP 10 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand COMP 10 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand COMP 15 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand COMP 15 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand COMP 15 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 500 9 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 1000 3 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 1250 3 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand COMP 614 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand COMP 822 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand COMP 1400 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY62167EV30LL (7CC62167FC) STRESS: DIE SHEAR STRESS: DYE PENETRANT TEST STRESS: ESD-CHARGE DEVICE MODEL STRESS: FINAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Failure Mechanism Document No. 002-03311 Rev. *E ECN # 5234707 Reliability Test Data QTP #: 152916 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 96 26 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 192 24 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand 96 27 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand 192 27 0 STRESS: HIGH TEMPERATURE STORAGE, PLASTIC, 150C CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 500 80 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 1000 80 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand COMP 15 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand COMP 15 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand COMP 15 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand COMP 30 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand COMP 30 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand COMP 30 0 STRESS: INTERNAL VISUAL STRESS: PHYSICAL DIMENSION STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3) CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 168 80 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 288 78 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand COMP 3 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand COMP 3 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand COMP 3 0 STRESS: SOLDERABILITY TEST Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Failure Mechanism Document No. 002-03311 Rev. *E ECN # 5234707 Reliability Test Data QTP #: 152916 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 500 80 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand 1000 80 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand 500 80 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand 1000 80 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand 500 79 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand 1000 78 0 CY62167EV30LL (7CC62167FC) 4506409 611518707 SB-Thailand COMP 25 0 CY62167DV30LL (7CC62164DC) 4509501 611518709 SB-Thailand COMP 25 0 CY62157EV30LL (7CC62157FC) 4511440 611518708 SB-Thailand COMP 25 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Failure Mechanism Document No.002-03311 Rev. *E ECN # 5234707 Document History Page Document Title: Document Number: Rev. ECN No. ** 4912991 *A 4951274 QTP #152916 : TSOP I 48LD (12X18.4X1.0MM) PURE SN LEADFINISH, 0.9MIL CU WIRE, MSL3, 260C REFLOW, BKK-THAILAND(SB) 002-03311 Orig. of Change ILZ ILZ *B *C 5005211 ILZ 5027846 ILZ *D *E 5050625 ILZ 5234707 JYF Description of Change Initial spec release. Corrected Flammability Rating From : UL94 To : UL-94-V-0 Corrected Wire Type from CuPd to Cu on Front Page Corrected Wire Size from 0.8Mil to 0.9Mil on Page 2 (PACKAGE QUALIFICATION HISTORY),page 3 (MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION) and spec title. Added 192 Hour HAST Data Added “0” reject on 1000 TCT of lot 611518709. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8